KR200405561Y1 - Burn-in Testing For Feed-Through Board PCB Guide - Google Patents

Abstract

The present invention relates to a coupling structure of a feed-through substrate and a contact surface of a burn-in board required for a burn-in inspection chamber of a semiconductor device.

The main structure of the present invention is a conventional guide coupled to the front of the feed-through substrate so that the burn-in board is accurately coupled to the feed-through board when the contact surface of the burn-in board combined with a plurality of semiconductor elements is combined with the feed-through board In the above, the upper and lower guide surface is formed to be inclined inwardly on the upper and lower sides of the insertion hole and at the same time, the contact surface of the burn-in board is precisely formed to be inclined inward on the left and right sides of the insertion hole. Characterized by forming a left and right guide surface to guide to be coupled.

Therefore, the present invention, even if the burn-in board is coupled to the burn-in board rack in a crooked state coupled to the insert hole of the feed-through board, even if the contact surface is guided by the right and left guide surface and the upper and lower guide surface of the guide It is correctly inserted into the insertion hole and is precisely coupled to the insertion hole of the feed-through board, so that the feed-through board (F, T-board) and the burn-in board are electrically stable and perfectly connected.

Burn-in inspection, PCB, contact surface, feed-through board, main board, burn-in board, guide

Description

Burn-in Testing For Feed-Through Board PCB Guide}

1 is a perspective view showing the main configuration of the general burn-in inspection apparatus

Figure 2 is a perspective view showing the configuration of the burn-in board used in the burn-in inspection apparatus

3 is a perspective view showing a guide coupled to a conventional feed-through substrate

Figure 4 is a side view showing a state in which the contact surface of the burn-in board is coupled to the conventional feed-through board

5 is a plan view showing a state in which the contact surface of the burn-in board is coupled to the conventional feed-through board

Figure 6 is a perspective view of the subject innovation guide

Figure 7 is a side view showing a state coupled to the contact surface of the burn-in board to the feed-through board by the subject innovation guide

8 is a plan view showing a state in which the contact surface of the burn-in board is coupled to the feed-through board by the present invention guide

<Explanation of symbols for the main parts of the drawings>

1-Motherboard 20-Feedthrough Board

30-Burn-in Board Rack 40-Burn-in Board

50-Contecchi 100-Guide

101-Insertion 102-Top and Bottom Guide

110-Protrusion 111-Left and Right Guides

The present invention relates to a coupling structure of a feed-through substrate and a contact surface of a burn-in board required for a criminal inspection chamber of a semiconductor device. More specifically, it is coupled to the front side of the feed-through board PCB and guides the contact points on both sides of the insertion hole of the guide that guides the contact-edge PCB of the burn-in board PCB. By forming the inclined surface to guide the tail surface precisely to the inside, the contact surface is inserted into the insertion hole of the guide precisely so that it can be firmly combined with the feed-through board and stable electrical connection can be made. It is to provide a feed-through board guide for burn-in inspection to prevent damage to the feed-through board.

A general burn-in test is a type of reliability test for detecting an initial defective device before supplying a semiconductor integrated circuit device to a consumer or mounting it in a system. It is common to go through the package and proceed. The burn-in test is roughly described by placing the device in a specific environmental stress state and removing the device that is likely to be defective or faulty or immediately defective.

As described above, the burn-in test applies thermal stress to the device at a high temperature of about 80 to 125 ° C. During the burn-in test, the semiconductor device operates under a high temperature and a high electric field, thereby accelerating the failure mechanism. Therefore, early defective devices that do not have a long life cannot tolerate harsh conditions and cause failures during burn-in inspection. A good device that has passed these burn-in tests can guarantee a long lifespan, thus improving the reliability of the system.

The burn-in inspection apparatus for performing burn-in inspection will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing the main configuration of the general burn-in inspection apparatus, Figure 2 is a perspective view showing the configuration of the burn-in board used in the burn-in inspection apparatus, Figure 3 is a perspective view showing a guide coupled to a conventional feed-through substrate, 4 is a side view showing a state in which the contact surface of the burn-in board is coupled to the conventional feed-through board, Figure 5 is a plan view showing a state in which the contact surface of the burn-in board is coupled to the conventional feed-through board.

As shown in the figure, the burn-in board 40 to which the plurality of semiconductor elements 41 are coupled is provided with a contact surface 50 at the rear thereof, and a plurality of burn-in boards 40 to the square box-shaped burn-in board rack 30. ) Is inserted into the burn-in board rack 30 is coupled to the feed-through substrate 20 of the burn-in inspection device to test whether the semiconductor device 41 is defective.

At this time, the contact surface 50 of the burn-in board 40 and the feed-through board 20 of the main board 1 are coupled, in order to facilitate the coupling of the feed-through board 20 in front of the guide 10 is coupled so that the contact surface 50 of the burn-in board 40 is accurately coupled to the feed-through substrate 20.

In addition, the burn-in board 40 in which the plurality of semiconductor elements 41 are coupled protects the contact surface 50 on its rear surface 42, and the contact surface 50 is connected to the feed-through substrate 20. Protruding piece provided with grooves 44 extending above and below the contact surface 50 so that the contact surface 50 is correctly coupled to the feed-through substrate 20 while being guided by the guide 10 during the engagement. 43 is formed.

At this time, the guide 10 is inserted between the protruding pieces 43 so that the contact surface 50 is accurately inserted into the insertion hole 21 of the feed-through substrate 20 through the insertion hole 13 of the guide 10. To be combined.

In addition, the guide 10 is formed with an insertion hole 13 into which the contact surface 50 of the burn-in board 40 is inserted, and the upper and lower portions of the insertion hole 13 are moved from the front surface 11 to the inside. The inclined top and bottom guide surface 12 is formed, as shown in Figures 4 and 5, it is guided so that the contact surface 50 is inserted into the insertion hole 13 accurately.

Thermal stress on the semiconductor device 41 at a high temperature of about 80 to 125 ° C. in the state where the feed through substrate 20 of the main board 1 and the contact surface 50 of the burn-in board 40 are coupled as described above. On the other hand, by applying a high electric field and an irregular electric field to the semiconductor element 41 to detect the defective semiconductor element 41.

However, as described above, the burn-in board 40 is coupled to the feed-through board 20 of the main board 1 in a state of being fitted to the burn-in board rack 30, so that the burn-in board 40 burn-in board rack 30. If the crookedly coupled to the contact surface of the burn-in board 40, 50 and the feed-through substrate 20 is not correctly coupled will occur.

That is, even when the burn-in board 40 is coupled to the burn-in board rack 30 at an upward and downward angle, the contact surface 50 is guided by the upper and lower guide surfaces 12 of the guide 10, Inserted correctly into the insertion hole 13 can be coupled to the insertion hole 21 of the feed-through substrate 20, but when the burn-in board 40 is coupled to the burn-in board rack 30 to the left and right to be twisted guide ( 10) is not formed any configuration to guide this in the contact surface 50 will be broken by hitting the insertion hole 13 outside of the guide (10).

At this time, since the process of inserting the burn-in board 40 into the burn-in board rack 30 is a manual labor by the worker, burn-in board 40, burn-in board rack to the left, right or up and down as described above ( In many cases, the process is coupled to the feed-in board 20 of the main board 1 and the contact surface 50 of the burn-in board rack 30 by moving the burn-in walk rack 30. Is made by a mechanical device.

Therefore, even if an operator incorrectly inserts the burn-in board 40 into the burn-in board rack 30, the mechanical device does not check it and pushes the burn-in board rack 30 backward with a set force, and then hits the contact 50 with the set force. Since the feed through substrate 20 is coupled, the contact surface 50 of the burn-in board 40 is damaged or a shock is applied to the guide 10, causing the feed through substrate 20 to be broken.

If the contact surface 50 is damaged, the burn-in board 40 provided with the damaged contact surface 50 cannot be used, and the disposal board is discarded and a new burn-in board 40 is purchased. Since the burn-in inspection of the) is to be carried out, the cost is incurred, and the burn-in inspection cannot be performed during the replacement time, resulting in a huge loss.

In addition, even if only the damaged contact surface 50 is to be replaced because the cost of the contact surface 50 is expensive, there is a loss of the cost, there is a problem that the burn-in inspection can not proceed during the replacement time .

Then, the length of the contact surface 50 protruding from the back 42 of the burn-in board 40 and the front surface 11 of the guide 10 at the inner end of the insertion hole 21 of the feed-through board 20. Since the length up to the same is made, when the contact surface 50 of the burn-in board 40 is inserted into the insertion hole 21 of the feed-through board 20 by a mechanical device, the contact surface 50 ) Is hit by the inner end of the insertion hole 21 of the feed-through substrate 20 and the contact surface is damaged (50) or the feed-through substrate 20 also occurs.

The present invention was devised to solve the above problems, and even if the burn-in board is inserted into the burn-in board rack at an upside, downside and right side, the contact surface can be combined with the feed-through board by a mechanical device. The guide provides a feed-through board guide for burn-in inspection, in which the guide guides the contact surface precisely not only to the upper and lower sides, but also to the left and right sides, so that the contact surface and the feed-through board can be accurately combined without being damaged. There is this.

In addition, when the contact surface is coupled to the feedthrough substrate by the mechanical device, the end of the contact surface is prevented from hitting the inner end of the insertion hole of the feedthrough substrate, so that the contact surface and the feedthrough substrate are not damaged accurately. There is also a purpose to be able to combine.

In addition, as described above, since the contact surface and the feed-through substrate are not damaged, burn-in inspection can be continuously performed, as well as the purpose of eliminating cost and time caused by the damaged substrate.

The purpose of the present invention and many of the accompanying effects will be readily understood by the following detailed description.

The present invention has the following features to achieve the above object.

The present invention guides the contact surface of the burn-in board in which a plurality of semiconductor devices are combined with the feed-through board of the main board so that the contact surface is accurately coupled to the feed-through board so that the contact surface of the burn-in board is coupled to the feed-through board. In the conventional guide coupled to the upper and lower guide surfaces formed inclined inwardly on the upper and lower sides of the insertion hole, and formed inclined inwardly on the left and right sides of the insertion hole to contact the contact hole in the insertion hole of the feed-through substrate. Characterized by forming a left and right guide surface for guiding the tail surface is coupled accurately.

Then, when the contact surface of the burn-in board is coupled to the feed-through board, the front end of the guide is protruded on both sides of the guide so as to prevent the end of the contact surface from contacting the inner end of the insertion hole of the feed-through board. It is preferable to further include a protrusion contacting the rear surface of the burn-in board before the end of the contact surface is in contact with the inner end of the hole to prevent the contact surface from being inserted anymore.

Further, in order to precisely correct the position of the burn-in board before the contact surface is inserted into the insertion hole of the guide, a fitting portion protruding from the upper and lower portions of the guide is further provided to correspond to the groove formed in the protrusion of the burn-in board. It is preferable to.

Hereinafter, with reference to the accompanying drawings an embodiment of the present invention to which the feature is applied will be described in detail.

Figure 6 is a perspective view showing the subject innovation guide, Figure 7 is a side view showing a state in which the contact surface of the burn-in board is coupled to the feedthrough substrate by the subject innovation guide, Figure 8 is a feedthrough substrate by the subject innovation guide This is a plan view showing the state where the contact surface of burn-in board is coupled.

As shown in the drawing, the subject innovation guide 100 has upper and lower guide surfaces 102 on the upper and lower sides of the insertion hole 103 and left and right guide surfaces 111 formed to be inclined inward to the left and right sides of the insertion hole 103. The guide surface 50 of the burn-in board is provided so that it can be inserted correctly when inserted into the insertion hole (103).

That is, since the upper and lower guide surfaces 12 are formed only on the upper and lower sides of the insertion hole 13 in the conventional guide 10, the burn-in board 40 is coupled to the burn-in board rack 30 in an upward and downward direction. When the contact surface 50 is inserted into the insertion hole 13 of the guide 10 in a closed state, the contact surface 50 is correctly inserted into the insertion hole 13 by the guide of the upper and lower guide surfaces 12. Could be

However, if the contact surface 50 is inserted into the insertion hole 13 of the guide 10 in a state in which the burn-in board 40 is coupled to the burn-in board rack 30 to the left and right, the guide, The contact surface 50 hits the left and right sides of the insertion hole 13 of the insertion hole 13, and the contact surface 50 is broken, and the short circuit occurs in the internal circuit of the burn-in board 40 due to the impact. Of course, the feed-through substrate 20 and the main board 1 are also subjected to an impact, which causes enormous damage that causes disconnection of the internal circuit.

Therefore, the left and right guide surface 111 is also formed on the left and right sides of the insertion hole 103 in the subject innovation guide 100, so that the burn-in board 40 is coupled to the burn-in board rack 30 upwardly or downwardly. When the contact surface 50 is inserted into the contact hole 103 of the guide 100 in a state in which it is coupled to the left and right sides, the contact surface is formed by the upper and lower guide surfaces 102 and the left and right guide surfaces 111. 50 is guided to accurately insert into the insertion hole 103 of the guide 100, and accordingly the contact surface 50 is correctly coupled to the insertion hole 21 of the feed-through substrate 20, the main board ( 1) and burn-in board 40 is a complete electrical connection is made.

And the upper and lower portions of the guide 100 to form a fitting portion 101 protruding upward and downward, respectively, the size of the fitting portion 101 is formed in the protrusion 43 of the burn-in board 40 Formed in the same manner as 44, before the contact surface 50 is inserted into the insertion hole 103, first, the fitting portion 101 is fitted into the groove 44 of the burn-in board 40 and burn-in board ( The engagement position of 40) can be corrected.

That is, when the burn-in board 40 reverses by a mechanical device and tries to couple the contact surface 50 to the feed-through substrate 20, the contact surface 50 is inserted into the insertion hole 103. Since the fitting portion 101 of the guide 100 is first inserted into the groove 44 formed in the protruding piece 43 of the burn-in board 40, the burn-in board 40 is twisted burn-in board rack ( Even if it is coupled to the back 30, the crooked state is corrected by the fitting portion 101 of the guide 100 and the groove 43 of the burn-in board 40 to be corrected, and the contact surface 50 is inserted into the insertion hole ( 103) to help insert more accurately.

In addition, by forming a protrusion 110 protruding forward on both front sides of the guide 10, the contact surface 50 through the insertion hole 103 of the insertion hole 21 of the feed-through substrate 20 When it is inserted into the contact surface 50 before the end of the hitting the inner end of the insertion hole 21, first, the projection 110 of the guide 10 is to hit the back 42 of the burn-in board 40 Burn-in board 40 is no longer backwards to prevent contact with the contact surface 50 and the feed-through board 20 is prevented from being damaged.

In this case, the protrusion 110 may be formed in the front center of the guide 100, and the protruding shape and size of the contact surface 50 may be formed at the inner end of the insertion hole 21 of the feedthrough substrate 20. Since the size is such that it does not hit the end, of course, it is not limited to the shape and size as shown.

As described above, with respect to the feedthrough board guide for burn-in inspection of the present invention, various design changes of each part within the scope of the present invention are considered to be included in the scope of the technical idea of the present invention.

As described above, the present invention is coupled to the front of the feed-through substrate to form a left and right guide surface inclined inward at the left and right side of the insertion hole of the guide so that the contact surface is electrically connected to the feed-through substrate accurately. Thus, even though the burn-in board is coupled to the burn-in board rack in a state in which the contact surface is coupled to the insertion hole of the feed-through board, the contact surface is guided by the left and right guide surfaces and the upper and lower guide surfaces of the guide. By being inserted correctly and correctly coupled to the insertion hole of the feed-through board, there is an effect that the main board and the burn-in board are electrically stable and connected perfectly.

And, by forming protrusions protruding on both sides of the front of the guide, before the end of the contact surface hits the inner end of the insertion hole of the feed-through board, the protrusion hits the rear surface of the burn-in board, the end of the contact surface It is possible to prevent damage to the contact surface or feed-through board due to the impact generated by impacting the inner end of the insertion hole of the feed-through board as well as to prevent the circuit of the main board and the burn-in board from being cut due to the impact. There is also an effect.

In addition, the upper and lower portions of the guide are formed to protrude, respectively, before the contact surface is inserted into the insertion hole of the guide, the insertion portion of the guide is inserted into the groove formed in the protrusion of the burn-in board, and the burn-in board is coupled. By correcting the position, the contact surface can be more precisely coupled to the insertion hole of the feed-through substrate through the insertion hole of the guide.

Therefore, damage or disconnection does not occur when the contact surface is combined with the feed-through substrate, thereby reducing time and cost due to replacement of the board and replacement of the board, and continuously working to improve work efficiency. It is a useful design to make.

Claims (3)

When the contact surface 50 of the burn-in board 40 in which a plurality of semiconductor elements 41 are coupled is coupled with the feed-through substrate 20 of the main board 1, the contact surface 50 guides the contact surface 50. In the conventional burn-in inspection feed-through board 20 guide that is coupled to the front of the feed-through board 20 so that the edge surface 50 is accurately coupled to the feed-through board 20, The upper and lower guide surfaces 102 are formed to be inclined inwardly on the upper and lower sides of the insertion hole 103, and are inclined inwards to the left and right sides of the insertion hole 103 to feed through the substrate 20. Burn-in test feed-through substrate guide, characterized in that the left and right guide surface 111 to guide the contact surface 50 is coupled to the insertion hole 21 of the contact accurately. The method of claim 1, When the contact surface 50 is coupled to the feedthrough substrate 20, the guide 100 prevents the end of the contact surface 50 from contacting the inner end of the insertion hole 21 of the feedthrough substrate 20. Protruded on both sides of the front side, and contact with the rear surface 42 of the burn-in board 40 before the end of the contact surface 50 is in contact with the inner end of the insertion hole 21 of the feed-through substrate 20 Burn-in test feed-through substrate guide, characterized in that it further comprises a protrusion 110 to prevent the edge surface 50 is inserted anymore. The method of claim 1, In order to precisely correct the position of the burn-in board 40 before the contact surface 50 is inserted into the insertion hole 103 of the guide 100, the protrusion piece 43 of the burn-in board 40 Burn-in inspection feed-through substrate guide further comprises a fitting portion 101 protruding from the upper and lower portions of the guide 100 to correspond to the formed groove 44.

Images