KR20040100729A - Integrated image sensor module - Google Patents

Integrated image sensor module Download PDF

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Publication number
KR20040100729A
KR20040100729A KR1020030033177A KR20030033177A KR20040100729A KR 20040100729 A KR20040100729 A KR 20040100729A KR 1020030033177 A KR1020030033177 A KR 1020030033177A KR 20030033177 A KR20030033177 A KR 20030033177A KR 20040100729 A KR20040100729 A KR 20040100729A
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South Korea
Prior art keywords
substrate
image sensor
photosensitive chip
sensor module
transparent layer
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KR1020030033177A
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Korean (ko)
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잭슨 흐시에
우지첸
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킹팍 테크놀로지 인코포레이티드
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Priority to KR1020030033177A priority Critical patent/KR20040100729A/en
Publication of KR20040100729A publication Critical patent/KR20040100729A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE: An integrated image sensor module is provided to reduce remarkably the size, to simplify manufacturing processes and to reduce fabrication cost by forming an arc-shaped protrusion for focusing an optical signal on a transparent layer. CONSTITUTION: An integrated image sensor module includes a substrate, a frame layer, a photosensitive chip, a plurality of electric elements, a plurality of wires, and a transparent layer. The substrate(40) includes an upper end(50) and a lower end(52). The frame layer(42) with a first surface(58) and a second surface(60) is installed on the substrate to form a cavity(62) together with the substrate. The photosensitive chip(44) with a plurality of bonding pads(64) is mounted on the substrate within the cavity. The electric elements(47) are mounted on the substrate in the cavity. The wires(46) are used for connecting electrically the bonding pads of the chip with the substrate. The transparent layer(48) includes an arc-shaped protrusion(66) corresponding to the chip.

Description

집적 화상 센서 모듈{INTEGRATED IMAGE SENSOR MODULE}Integrated Image Sensor Module {INTEGRATED IMAGE SENSOR MODULE}

본 발명은 집적 화상 센서 모듈에 관한 것이며, 구체적으로는 낮은 단가로 쉽게 생산할 수 있는 단순한 구조를 가진 화상 센서 모듈에 관한 것이다.The present invention relates to an integrated image sensor module, and more particularly, to an image sensor module having a simple structure that can be easily produced at low cost.

도 1에 의하면, 종래의 화상 센서 모듈은 렌즈홀더(10), 렌즈배럴(20), 및 화상센서(30)를 포함한다. 렌즈홀더(10)는 윗면(12), 아랫면(14) 및 렌즈홀더(10)을 윗면(12)에서부터 아랫면(14)까지 관통하는 체임버(16)를 가진다. 렌즈홀더 (10)의 체임버(16)는 내부 쓰레드(18)로 구성되어 있고, 렌즈배럴(20)은 렌즈홀더 (10)의 윗면(12)에서부터 체임버(16)에 삽입되어 렌즈홀더(10)의 내부 쓰레드(18)에 나사모양으로 결합된 외부쓰레드(22)로 구성되어 있다. 렌즈배럴(20)은 투명공간(24)으로 구성되며, 비구면 렌즈(26)는 체임버(16) 내부와 투명공간(24) 아래에 배치되어 있다. 적외선필터(28) 또한 체임버(16) 내부와 비구면렌즈(26) 사이에 배치되어 있고, 화상 센서(30)은 제 1면(32)와 제 2면(24)를 가진다. 제 1면(32)은 투명 레이어(36)과 함께 제공되며, 화상센서(30)의 투명레이어(36)는 렌즈홀더 (10)의 아랫면(14)에 부착되어 있다. 렌즈배럴(20)의 비구면 렌즈(26)와 화상센서 (30)의 투명 레이어(36)의 초점거리는 렌즈배럴(20)과 렌즈홀더(10)의 나사모양으로 결합된 길이를 조정함으로써 조절할 수 있다.According to FIG. 1, a conventional image sensor module includes a lens holder 10, a lens barrel 20, and an image sensor 30. The lens holder 10 has an upper surface 12, a lower surface 14, and a chamber 16 penetrating the lens holder 10 from the upper surface 12 to the lower surface 14. The chamber 16 of the lens holder 10 is composed of an internal thread 18, and the lens barrel 20 is inserted into the chamber 16 from the upper surface 12 of the lens holder 10 to be the lens holder 10. It consists of an outer thread (22) coupled to the inner thread (18) of the screw. The lens barrel 20 is composed of a transparent space 24, and the aspherical lens 26 is disposed inside the chamber 16 and below the transparent space 24. The infrared filter 28 is also disposed between the chamber 16 and the aspherical lens 26, and the image sensor 30 has a first surface 32 and a second surface 24. The first surface 32 is provided with the transparent layer 36, and the transparent layer 36 of the image sensor 30 is attached to the lower surface 14 of the lens holder 10. The focal length of the aspheric lens 26 of the lens barrel 20 and the transparent layer 36 of the image sensor 30 can be adjusted by adjusting the length of the lens barrel 20 and the lens holder 10 coupled to each other. .

도 2에 따르면, 종래의 화상 센서 모듈이 사용될 때에는 대체로 수개의 전기 소자(38 : 능동소자, 수동소자, 및 이와 동등물)가 실장된 인쇄회로기판(37)에 설치된다.According to Fig. 2, when a conventional image sensor module is used, generally several electric elements 38 (active elements, passive elements, and equivalents) are mounted on a printed circuit board 37 mounted thereon.

그러나, 상기 화상 센서 모듈은 다음과 같은 단점을 가진다.However, the image sensor module has the following disadvantages.

1. 화상센서(30)이 패키징된 후 렌즈홀더(10) 및 렌즈배럴(20)과 결합해서 화상센서(30)가 비구면렌즈(26)에서 집속된 광학신호를 수신할 수 있도록 모듈을 형성하기 때문에 제조공정이 복잡하다. 따라서, 화상 센서 모듈의 구조가 복잡하고 전체적인 부피가 크다.1. After the image sensor 30 is packaged, it is combined with the lens holder 10 and the lens barrel 20 to form a module so that the image sensor 30 can receive the focused optical signal from the aspherical lens 26. Therefore, the manufacturing process is complicated. Therefore, the structure of the image sensor module is complicated and the overall volume is large.

2. 투명레이어(36)는 렌즈홀더(10)의 아랫면(14)에 접착제로 부착되어 있기 때문에, 접착제가 투명레이어(36)의 표면을 오염시킬수 있으며, 화상 센서가 광학신호를 정상적으로 수신하지 못할 수가 있다.2. Since the transparent layer 36 is attached to the lower surface 14 of the lens holder 10 with an adhesive, the adhesive may contaminate the surface of the transparent layer 36 and the image sensor may not receive the optical signal normally. There is a number.

3. 모듈이 결합될 때, 투명 레이어(36)은 정교하게 비구면 렌즈(26)와 정렬되어야 하고, 그 다음 비구면 렌즈(26)에 부착되어야 한다. 부착공정 이후에는 투명레이어(36)와 비구면 렌즈(26)가 올바르게 정렬되지 않았어도 분리하거나 재결합될 수 없으며, 모듈은 폐기물로 처리되어야 한다.3. When the modules are combined, the transparent layer 36 must be precisely aligned with the aspherical lens 26 and then attached to the aspheric lens 26. After the attachment process, the transparent layer 36 and the aspherical lens 26 cannot be separated or recombined even if they are not correctly aligned, and the module must be disposed of as waste.

4. 인쇄회로기판에 다른 전기 소자들이 추가적으로 실장되어야 하기 때문에 생산에 있어 불편하다.4. It is inconvenient in production because other electric elements have to be additionally mounted on the printed circuit board.

본 발명의 하나의 목적은 낮은 단가로 쉽게 제조할 수 있는 집적 화상 센서 모듈을 제공하는 것이다.One object of the present invention is to provide an integrated image sensor module that can be easily manufactured at low cost.

본 발명의 또하나의 목적은 소형화된 집적 화상 센서 모듈을 제공하는 것이다.Another object of the present invention is to provide a miniaturized integrated image sensor module.

상기의 목적을 달성하기 위하여, 본 발명은 상단과 하단을 가진 기판, 제 1면과 제 2면을 가진 프레임 레이어, 감광성 칩, 다수개의 전기소자, 다수개의 배선, 및 투명 레이어를 포함하는 집적 화상 센서 모듈을 제공한다. 프레임 레이어의 제 1면은 기판의 상단에 실장되어 있으며, 기판과 프레임레이어 사이에 공동이 형성되어 있다. 감광성 칩은 다수개의 본딩패드를 가지고 있으며 기판의 상단과 공동의 내부에 실장되어 있으며, 전기소자들은 기판의 상단과 공동의 내부에 실장되어 있다. 배선들은 감광성 칩의 본딩패드와 기판을 전기적으로 연결한다. 투명레이어는 감광성 칩과 전기소자들을 덮고 있으며 감광성 칩에 대응하는 볼록한 부분을 포함하여 구성된다.In order to achieve the above object, the present invention provides an integrated image comprising a substrate having a top and a bottom, a frame layer having a first side and a second side, a photosensitive chip, a plurality of electric elements, a plurality of wirings, and a transparent layer. Provide a sensor module. The first surface of the frame layer is mounted on the top of the substrate, and a cavity is formed between the substrate and the frame layer. The photosensitive chip has a plurality of bonding pads and is mounted inside the cavity and the top of the substrate, and electrical elements are mounted inside the cavity and the top of the substrate. The wires electrically connect the bonding pad of the photosensitive chip and the substrate. The transparent layer covers the photosensitive chip and the electrical elements and includes a convex portion corresponding to the photosensitive chip.

따라서, 감광성 칩은 투명레이어의 볼록한 부분에 의해 집속된집속광학신호(focused optical signal)를 수신한다.Thus, the photosensitive chip receives a focused optical signal focused by the convex portion of the transparent layer.

도 1은 종래의 화상 센서 모듈의 단면도이고,1 is a cross-sectional view of a conventional image sensor module,

도 2는 종래의 화상 센서 모듈의 구현예의 단면도이고,2 is a cross-sectional view of an embodiment of a conventional image sensor module,

도 3은 본 발명의 첫 번째 실시예에 따른 집적 이미지 센서 모듈의 단면도이고,3 is a cross-sectional view of an integrated image sensor module according to a first embodiment of the present invention;

도 4는 본 발명의 두 번째 실시예에 따른 집적 이미지 센서 모듈의 단면도이다.4 is a cross-sectional view of an integrated image sensor module according to a second embodiment of the present invention.

도 3에 의하면, 본 발명의 첫 번째 실시예에 따른 집적 화상 센서 모듈은 기판(40), 프레임 레이어(46), 감광성 칩(44), 다수개의 배선(46), 다수개의 전기소자(47), 및 투명 레이어(48)를 포함한다.Referring to FIG. 3, the integrated image sensor module according to the first embodiment of the present invention includes a substrate 40, a frame layer 46, a photosensitive chip 44, a plurality of wires 46, and a plurality of electrical elements 47. , And a transparent layer 48.

기판(40)은 상단(50) 및 하단(52)를 가진다. 상단(50)은 다수개의 제 1 접속점(54)을 포함하여 구성되며, 하단(52)은 인쇄 회로 기판(53)에 전기적으로 연결되기 위한 다수개의 제 2 접속점(56)을 포함하여 구성된다.The substrate 40 has a top 50 and a bottom 52. The upper end 50 comprises a plurality of first connection points 54, and the lower end 52 comprises a plurality of second connection points 56 for electrically connecting to the printed circuit board 53.

프레임 레이어(42)는 제 1면(58) 및 제 2면(60)을 가진다. 제 1면(58)은 기판(40)의 상단(50)에 실장되고, 공동(62)는 기판(40)과 프레임 레이어(42) 사이에 형성된다.The frame layer 42 has a first face 58 and a second face 60. The first surface 58 is mounted on the top 50 of the substrate 40, and a cavity 62 is formed between the substrate 40 and the frame layer 42.

다수개의 본딩패드(64)를 가진 감광성 칩(44)은 기판(40)의 상단에 실장되고, 공동(62) 내부에 위치한다.The photosensitive chip 44 having a plurality of bonding pads 64 is mounted on top of the substrate 40 and is located inside the cavity 62.

배선(46)은 감광성 칩(44)의 본딩패드(64)와 기판(40)의 제 1 접속점(54)를 전기적으로 연결한다. 따라서, 감광성 칩(44)에서 나온 신호는 기판(40)으로 전달될 수 있다.The wiring 46 electrically connects the bonding pad 64 of the photosensitive chip 44 and the first connection point 54 of the substrate 40. Thus, the signal from photosensitive chip 44 can be transferred to substrate 40.

전기소자(47)들은 능동소자, 수동소자, 및 이와 동등물일 수 있으며, 기판 (40)의 상단(50)에 실장되고 공동(62)의 내부에 위치한다.The electrical elements 47 may be active, passive, and equivalents, mounted on the top 50 of the substrate 40 and located inside the cavity 62.

투명 레이어(48)는 감광성 칩(44)과 전기소자(47)을 덮기위한 프레임 레이어 (42)의 제 2면(60) 위에 배치된 투명 유리이다. 투명 레이어(48)는 감광성 칩(44)에 대응하는 볼록한 부분(66)을 포함하여 구성된다. 볼록한 부분(66)은 광학적 신호를 감광성 칩(44)위로 집속하기 위하여 호형(arc-shaped)의 구조를 가진다.The transparent layer 48 is a transparent glass disposed on the second surface 60 of the frame layer 42 for covering the photosensitive chip 44 and the electrical element 47. The transparent layer 48 comprises a convex portion 66 corresponding to the photosensitive chip 44. The convex portion 66 has an arc-shaped structure for focusing the optical signal onto the photosensitive chip 44.

도 4를 참고로 할 때, 투명 레이어(48)는 감광성 칩(44)과 전기소자(47)를 캡슐처럼 둘러싸기 위하여 기판(40)과 프레임 레이어(42)사이의 공동(62)을 채우는 투명한 접착제(glue)일수 있다.Referring to FIG. 4, the transparent layer 48 is transparent to fill the cavity 62 between the substrate 40 and the frame layer 42 to encapsulate the photosensitive chip 44 and the electrical element 47. It may be a glue.

투명 레이어(48)은 또한 감광성 칩(44)에 대응하는 볼록한 부분(66)을 포함하여 구성된다. 볼록한 부분(66)은 광학적 신호를 감광성 칩(44)위에 집속하기 위한 호형 구조를 가지고 있다.The transparent layer 48 also comprises a convex portion 66 corresponding to the photosensitive chip 44. The convex portion 66 has an arc structure for focusing an optical signal on the photosensitive chip 44.

본 발명의 투명 레이어(48)의 볼록한 부분(66)이 광학적 신호를 집속시킬수 있기 때문에 화상 센서에 렌즈 모듈이 부착될 필요가 없다.The lens module does not need to be attached to the image sensor because the convex portion 66 of the transparent layer 48 of the present invention can focus the optical signal.

제품의 크기는 효과적으로 줄어들 수 있고, 제조 공정도 단순화 되며, 제조 단가도 효과적으로 낮아질수 있다. 게다가, 화상 센서 모듈이 제조될 때 전기소자 (47)가 패키징되므로, 제조 공정이 더욱 편리하게 수행될 수 있다.The size of the product can be effectively reduced, the manufacturing process can be simplified, and the manufacturing cost can be effectively lowered. In addition, since the electric element 47 is packaged when the image sensor module is manufactured, the manufacturing process can be performed more conveniently.

비록 본 발명을 바람직한 실시예에 의거하여 설명하였지만, 본 발명이 실시예에 한정된다고 볼 수 없으며, 오히려 다양한 변형들을 모두 포함한다. 따라서, 첨부되는 청구항의 범위는 모든 변형을 포함할 수 있도록 가장 넓게 해석되어져야 한다.Although the present invention has been described based on the preferred embodiment, the present invention is not limited to the embodiment, but rather includes all of the various modifications. Accordingly, the scope of the appended claims should be construed broadly to encompass all such variations.

Claims (5)

집적 화상 센서 모듈에 있어서,An integrated image sensor module, 상단과 하단을 가진 기판;A substrate having a top and a bottom; 제 1면, 제 2면 및 기판과 프레임 레이어 사이에 형성된 공동을 가진 프레임 레이어에 있어, 제 1면은 기판의 상단에 실장되는 것을 특징으로 하는 프레임 레이어;A frame layer having a first surface, a second surface, and a cavity formed between the substrate and the frame layer, the first surface being mounted on top of the substrate; 다수개의 본딩패드를 가진 감광성 칩으로서, 기판의 상단 및 공동의 내부에 실장되는 것을 특징으로 하는 감광성 칩;A photosensitive chip having a plurality of bonding pads, comprising: a photosensitive chip mounted on an upper end of a substrate and inside a cavity; 기판의 상단에 실장되고 공동의 내부에 위치하는 다수개의 전기소자;A plurality of electric elements mounted on the top of the substrate and positioned inside the cavity; 감광성 칩의 본딩패드를 기판에 전기적으로 연결하기 위한 다수개의 배선; 및A plurality of wires for electrically connecting the bonding pads of the photosensitive chip to the substrate; And 감광성 칩과 전기소자를 덮기위한 감광성 칩에 대응하는 볼록한 부분을 포함하여 구성되는 투명 레이어를 구비하는 것을 특징으로 하는 집적 화상 센서 모듈.And a transparent layer comprising a convex portion corresponding to the photosensitive chip and the photosensitive chip for covering the electric element. 제 1항에 있어서,The method of claim 1, 상기 투명 레이어의 볼록한 부분이 호형구조를 가지는 것을 특징으로하는 집적 화상 센서 모듈.And the convex portion of the transparent layer has an arc structure. 제 1항에 있어서,The method of claim 1, 상기 전기 소자가 능동소자 또는 수동소자인 것을 특징으로 하는 집적 화상 센서 모듈.And said electric element is an active element or a passive element. 제 1항에 있어서,The method of claim 1, 상기 투명 레이어가 프레임 레이어의 제 2면위에 배치된 한 장의 투명 유리인 것을 특징으로 하는 집적 화상 센서 모듈.And the transparent layer is a sheet of transparent glass disposed on a second surface of the frame layer. 제 1항에 있어서,The method of claim 1, 상기 투명 레이어가 공동에 채워진 접착제인 것을 특징으로 하는 집적 화상 센서 모듈.And said transparent layer is an adhesive filled in the cavity.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210018160A (en) * 2019-08-07 2021-02-17 주식회사 세스코 Sensing module and air purifier comprising the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210018160A (en) * 2019-08-07 2021-02-17 주식회사 세스코 Sensing module and air purifier comprising the same

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