KR20040100013A - Pick & place apparatus for package - Google Patents

Pick & place apparatus for package Download PDF

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Publication number
KR20040100013A
KR20040100013A KR1020030032208A KR20030032208A KR20040100013A KR 20040100013 A KR20040100013 A KR 20040100013A KR 1020030032208 A KR1020030032208 A KR 1020030032208A KR 20030032208 A KR20030032208 A KR 20030032208A KR 20040100013 A KR20040100013 A KR 20040100013A
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KR
South Korea
Prior art keywords
wafer ring
tray
pick
package
alignment
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KR1020030032208A
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Korean (ko)
Inventor
이점동
Original Assignee
주식회사 하이닉스반도체
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Priority to KR1020030032208A priority Critical patent/KR20040100013A/en
Publication of KR20040100013A publication Critical patent/KR20040100013A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A pick and place apparatus is provided to align exactly a wafer ring by using two-step aligning processes and to load precisely a package on a tray by using an align jig. CONSTITUTION: A pick and place apparatus includes a wafer ring transfer unit(20), a wafer ring alignment unit, a pick-up unit(40), a transfer robot(50), and a tray transfer unit(70). The wafer ring alignment unit includes stoppers, a left/right align clamp, and a rear align clamp. The stoppers are used for performing a first wafer ring alignment. The left/right align clamp and the rear align clamp are used for performing a second wafer ring alignment. An align jig(62) is installed on a tray to load exactly a package on the tray.

Description

패키지용 픽 엔 플레이스 장치{Pick ＆ place apparatus for package}Pick & place apparatus for package

본 발명은 패키지용 픽 엔 플레이스(pick & place) 장치에 관한 것으로, 특히, 웨이퍼 링의 정확한 정렬을 이룰 수 있음은 물론 트레이에의 패키지 안착이 정확하게 이루어지도록 할 수 있는 패키지용 픽 엔 플레이스 장치에 관한 것이다.The present invention relates to a pick & place device for a package, and more particularly, to a pick and place device for a package that can achieve accurate alignment of the wafer ring, as well as to allow the package to be accurately seated on the tray. It is about.

일련의 반도체 제조 공정을 통해 제조된 반도체 칩들은 조립(assembly) 공정을 거쳐 패키지화되며, 이러한 패키지들은 소잉(sawing) 공정을 통해 개별 패키지들로 분리된 후, 트레이(tray)에 적재되어 제품으로 출하된다.Semiconductor chips manufactured through a series of semiconductor manufacturing processes are packaged through an assembly process, and these packages are separated into individual packages through a sawing process, and then loaded into a tray and shipped to a product. do.

예컨데, F-BGA(Flash-Ball Grid Array) 패키지의 경우, 기판에 볼을 마운트한 후 상기 기판을 UV 테이프에 부착시키고, 그런다음, 상기 UV 테이프를 웨이퍼 링(wafer ring)에 부착시켜 소잉 공정을 행하거나, 또는, 볼이 마운트된 기판을 지그(jig) 위에 올려 놓은 후 이에 대한 소잉 공정을 행하며, 그리고나서, 소잉 공정을 통해 분리된 각 패키지들을 트레이에 옮겨 담는다.For example, in a flash-ball grid array (F-BGA) package, a sawing process is performed by mounting a ball on a substrate and then attaching the substrate to a UV tape and then attaching the UV tape to a wafer ring. Alternatively, the ball-mounted substrate is placed on a jig, and then sawing is performed on the jig. Then, each package separated by the sawing process is transferred to a tray.

여기서, 소잉 공정을 통해 분리된 각 패키지들을 트레이에 옮겨 담는 작업을 픽 엔 플레이스(pick & place) 공정이라 칭하며, 이를 위해, 패키지용 픽 엔 플레이스 장치가 사용된다.Here, the operation of transferring each package separated by a sawing process to a tray is called a pick & place process, and a pick and place device for a package is used for this purpose.

종래의 픽 엔 플레이스 장치는, 도시하지는 않았으나, 소잉 공정이 행해진 웨이퍼 링을 임의의 위치로 로딩 및 언로딩(loading/unloading)시키는 웨이퍼 링 이송부와, 로딩된 웨이퍼 링을 정렬시키는 웨이퍼 링 정렬부와, 정렬된 웨이퍼 링에서 소정 개의 패키지를 픽-업(pick-up)한 후 소정 위치, 즉, 트레이가 로딩되는위치로 이동하여 트레이에 패키지를 적재시키는 픽-업 유니트(pick-up unit)와, 픽-업 유니트를 이동시키는 트랜스퍼 로봇(transfer robot)과, 패키지들이 적재될 트레이를 임의의 위치로 로딩 및 언로딩시키는 트레이 이송부를 포함한다.Conventional pick and place apparatus, although not shown, a wafer ring transfer portion for loading and unloading a wafer ring subjected to a sawing process to an arbitrary position, a wafer ring alignment portion for aligning the loaded wafer ring, and A pick-up unit that picks up a predetermined package from the aligned wafer ring and then moves to a predetermined position, that is, a position at which the tray is loaded, and loads the package onto the tray; And a transfer robot for moving the pick-up unit, and a tray transfer unit for loading and unloading the tray in which the packages are to be loaded into an arbitrary position.

그러나, 종래의 픽 엔 플레이스 장치는 웨이퍼 링 이송부에 의해 로딩된 웨이퍼 링을 정확하게 정렬시키기 위해 비젼 시스템(vision system)을 이용하여 웨이퍼 링의 틀어짐을 보상하고 있으며, 아울러, 상기 비젼 시스템을 이용하여 볼에 의한 디텍트(detect) 기능을 겸해서 사용하고 있는데, 이러한 비젼 시스템을 이용한 종래의 웨이퍼 링 정렬 방법은 볼에 의한 에러가 빈번하게 발생되어 장비 가동율이 저하될 뿐만 아니라, 비용 측면에서 바람직하지 못하고, 또한, 장비 유지가 어려운 문제점이 있다.However, conventional pick-and-place devices compensate for wafer ring distortion by using a vision system to accurately align the wafer ring loaded by the wafer ring transfer unit, and also by using the vision system. In addition, the conventional wafer ring alignment method using this vision system is not only desirable in terms of cost, but also lowers equipment utilization rate due to frequent ball errors. In addition, there is a problem that is difficult to maintain equipment.

또한, 종래의 픽 엔 플레이스 장치는 패키지가 픽-업 유니트에 의해 옮겨져 트레이에 적재되는 구조를 가지므로, 상기 픽-업 유니트가 조금만 틀어지더라도 패키지의 트레이에의 안정적인 안착이 이루어지지 못하는 문제점이 있다.In addition, the conventional pick-and-place device has a structure in which the package is moved by the pick-up unit and loaded on the tray, so that even if the pick-up unit is slightly twisted, the stable seating on the tray of the package may not be achieved. have.

따라서, 본 발명은 상기와 같은 문제점을 해결하기 위해 안출된 것으로서, 웨이퍼 링의 정확한 정렬을 이룰 수 있음은 물론 패키지의 트레이에의 정확한 안착이 이루어지도록 할 수 있는 패키지용 픽 엔 플레이스 장치를 제공함에 그 목적이 있다.Accordingly, the present invention has been made to solve the above problems, to provide a pick-and-place device for a package that can achieve a precise alignment of the wafer ring, as well as to ensure that the package is correctly seated on the tray. The purpose is.

도 1은 종래의 웨이퍼 링 정렬부를 도시한 평면도.1 is a plan view showing a conventional wafer ring alignment.

도 2는 본 발명의 실시예에 따른 픽 엔 플레이스 장치를 개략적으로 도시한 도면.2 schematically illustrates a pick and place device according to an embodiment of the invention.

도 3은 본 발명의 웨이퍼 링 정렬부를 설명하기 위한 평면도.3 is a plan view for explaining a wafer ring alignment of the present invention.

도 4 및 도 5는 본 발명의 정렬 지그를 설명하기 위한 도면.4 and 5 are views for explaining the alignment jig of the present invention.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

10 : UV 테이프 12 : 기판10: UV tape 12: substrate

14 : 패키지 16 : 웨이퍼 링14 Package 16: Wafer Ring

20 : 웨이퍼 링 이송부 30 : 웨이퍼 링 정렬부20: wafer ring transfer portion 30: wafer ring alignment portion

32 : 정렬 테이블 34 : 스탑퍼32: sorting table 34: stopper

35,36 : 좌,우 정렬 클램프 38 : 후면 정렬 클램프35,36: Left and right alignment clamp 38: Rear alignment clamp

40 : 픽-업 유니트 42 : 픽-업 툴40: pick-up unit 42: pick-up tool

50 : 트랜스퍼 로봇 60 : 트레이50: transfer robot 60: tray

62 : 정렬 지그 64 : 홀62: alignment jig 64: hole

70 : 트레이 이송부70 tray feeder

상기와 같은 목적을 달성하기 위해, 본 발명은, 기판 단위로 제작된 다수개의 패키지를 UV 테이프에 부착시킨 후, 상기 UV 테이프를 웨이퍼 링에 부착시켜 소잉 공정을 행한 결과물로부터 각 패키지들을 트레이에 옮겨 담는 픽 엔 플레이스 장치로서, 임의의 위치로 웨이퍼 링을 로딩 및 언로딩시키는 웨이퍼 링 이송부와, 상기 로딩된 웨이퍼 링을 정렬시키는 웨이퍼 링 정렬부와, 상기 웨이퍼 링 상에서 소정 개의 패키지를 픽-업한 후 소정 위치로 이동하여 트레이에 패키지들을 적재시키는 픽-업 유니트와, 상기 픽-업 유니트를 이동시키는 트랜스퍼 로봇과, 상기 패키지들이 적재될 트레이를 임의의 위치들로 로딩 및 언로딩시키는 트레이 이송부를 포함하며, 상기 웨이퍼 링 정렬부는 웨이퍼 링의 상측에 구비된 홈들에 대응하는 부분들 각각에 스탑퍼(stopper)가 구비되어 1차 웨이퍼 링 정렬이 이루어지도록 함과 동시에, 웨이퍼 링의 좌,우측에는 좌우 정렬 클램프(left/right align clamp)가 설치되고 웨이퍼 링의 하측에는 후면 정렬 클램프(rear align clamp)가 설치되어 상,하,좌,우의 갭(gap)을 최소화시키는 것에 의해 2차 웨이퍼 링 정렬이 이루어지도록 하며, 상기 트레이 상부에는 픽-업 유니트로부터 패키지가 트레이에 놓여질 때 패키지의 트레이에의 정확한 안착이 가능하도록 하는 정렬 지그(align jig)가 구비된 것을 특징으로 하는 패키지용 픽 엔 플레이스 장치를 제공한다. 여기서, 상기 정렬 지그는 단위 패키지와 대응하는 크기의 홀들이 일렬로 배열된 구조이다.In order to achieve the above object, the present invention, after attaching a plurality of packages made on a substrate unit to the UV tape, the package is transferred to the tray from the result of the sawing process by attaching the UV tape to the wafer ring A pick-and-place device, comprising: a wafer ring transfer portion for loading and unloading a wafer ring to an arbitrary position, a wafer ring alignment portion for aligning the loaded wafer ring, and picking up a predetermined package on the wafer ring A pick-up unit for moving the pick-up unit to a predetermined position and stacking the packages on the tray, a transfer robot for moving the pick-up unit, and a tray transfer unit for loading and unloading the tray in which the packages are to be loaded into arbitrary positions; The wafer ring alignment portion may include a stopper (s) at each of the portions corresponding to the grooves provided on the upper side of the wafer ring. topper) to provide primary wafer ring alignment, while left / right alignment clamps are installed on the left and right sides of the wafer ring, and rear align clamps on the lower side of the wafer ring. Is installed so that secondary wafer ring alignment is achieved by minimizing gaps in the top, bottom, left and right, and on top of the tray the correct placement of the package into the tray when the package is placed on the tray from the pick-up unit. Provided is a pick and place device for a package, characterized in that an alignment jig is provided to allow seating therein. Here, the alignment jig has a structure in which holes of a size corresponding to the unit package are arranged in a line.

본 발명에 따르면, 웨이퍼 링의 좌우 및 하측에 정렬 클램프를 추가 설치해 줌으로써 웨이퍼 링의 정확한 정렬을 이룰 수 있음은 물론 비용/유지 측면에서 잇점을 가질 수 있으며, 또한, 트레이 상에 정렬 지그를 추가 장착해 줌으로써 픽-업 유니트가 틀어진 경우에도 패키지의 트레이에의 정확한 안착을 이룰 수 있다.According to the present invention, by providing an alignment clamp on the left and right sides of the wafer ring, it is possible to achieve accurate alignment of the wafer ring as well as an advantage in terms of cost / maintenance, and additionally mount the alignment jig on the tray. This ensures that the package is seated correctly in the tray even if the pick-up unit is misplaced.

(실시예)(Example)

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세하게 설명하도록 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2 내지 도 5는 본 발명의 실시예에 따른 픽 엔 플레이스 장치를 설명하기 위한 도면들로서, 도 2는 본 발명의 픽 엔 플레이스 장치를 개략적으로 도시한 도면이고, 도 3은 본 발명의 웨이퍼 링 정렬부를 설명하기 위한 평면도이며, 도 4 및 도 5는 본 발명의 정렬 지그를 설명하기 위한 도면이다.2 to 5 are views for explaining a pick and place device according to an embodiment of the present invention, Figure 2 is a view schematically showing a pick and place device of the present invention, Figure 3 is a wafer ring of the present invention 4 and 5 are diagrams for explaining the alignment jig of the present invention.

도 2를 참조하면, 본 발명에 따른 픽 엔 플레이스 장치는 기판 단위로 제작된 다수개의 패키지를 UV 테이프에 부착시킨 후, 상기 UV 테이프를 웨이퍼 링에 부착시켜 소잉 공정을 행한 결과물로부터 각 패키지들을 트레이에 옮겨 담는 장치로서, 그 구성은 다음과 같다.Referring to FIG. 2, the pick-and-place device according to the present invention attaches a plurality of packages manufactured on a substrate basis to a UV tape, and then attaches the UV tapes to a wafer ring to tray each package from the result of a sawing process. As a device to transfer to, the configuration is as follows.

도시된 바와 같이, 본 발명의 픽 엔 플레이스 장치는 소잉 공정을 거친 웨이퍼 링(16)을 임의의 위치, 즉, 트랜스퍼 로봇(50)의 일측 단부 아래로 로딩 및 언로딩(loading/unloading)시키는 웨이퍼 링 이송부(20)와, 로딩된 웨이퍼 링(16)을 정렬시키는 웨이퍼 링 정렬부(30)와, 정렬된 웨이퍼 링(16) 상에서 픽-업 툴(42)에 의해 소정 개의 패키지(14)를 픽-업한 후 소정 위치, 즉, 트레이(60)가 있는 트랜스퍼 로봇(50)의 타측 단부까지 이동하여 트레이(60)에 패키지들(14)을 적재시키는 픽-업 유니트(40)와, 상기 픽-업 유니트(40)를 이동시키는 트랜스퍼 로봇(50)과, 패키지들(14)이 적재될 트레이(60)를 임의의 위치, 즉, 트랜스퍼 로봇(50)의 타측 단부 아래로 로딩 및 언로딩시키는 트레이 이송부(70)를 포함한다.As shown, the pick-and-place apparatus of the present invention loads and unloads the wafer ring 16 subjected to the sawing process to an arbitrary position, i.e., below one end of the transfer robot 50. The predetermined number of packages 14 are removed by the ring transfer unit 20, the wafer ring alignment unit 30 for aligning the loaded wafer ring 16, and the pick-up tool 42 on the aligned wafer ring 16. A pick-up unit 40 for picking up the packages 14 in the tray 60 by moving it to a predetermined position, that is, to the other end of the transfer robot 50 having the tray 60 after pick-up; The transfer robot 50 for moving the up-up unit 40 and the tray 60 in which the packages 14 are to be loaded are loaded and unloaded under an arbitrary position, that is, under the other end of the transfer robot 50. It includes a tray transfer unit 70.

이와 같은 구성에 있어서, 상기 웨이퍼 링 정렬부(30)는, 도 3에 도시된 바와 같이, 웨이퍼 링(16)의 상측에 구비된 홈들에 대응하는 부분들 각각에 스탑퍼 (stopper : 34)를 구비하며, 특히, 도 1에 도시된 종래의 그것과 비교해서 상기 웨이퍼 링(16)의 좌우측 각각에 좌,우 정렬 클램프(left/right align clamp)를 추가 구비하고, 그리고, 웨이퍼 링(16)의 하측에 후면 정렬 클램프(rear align clamp)를 추가 구비한다.In this configuration, as shown in FIG. 3, the wafer ring alignment unit 30 may include a stopper 34 at each of the portions corresponding to the grooves provided on the upper side of the wafer ring 16. In particular, a left / right align clamp is further provided on each of the left and right sides of the wafer ring 16 as compared with the conventional one shown in FIG. 1, and the wafer ring 16 is provided. An additional rear align clamp is provided on the lower side of the module.

이러한 본 발명의 웨이퍼 링 정렬부(30)에 따르면, 웨이퍼 링 이송부(20)에 의해 트랜스퍼 로봇(50)의 일측 단부 아래인 정렬 테이블(32) 상으로 로딩된 웨이퍼 링(16)은 스탑퍼(34)에 의해 1차적으로 정렬이 이루어지며, 이후, 좌우 정렬 클램프(35,36) 및 후면 정렬 클램프(38)에 의해 상,하,좌,우의 갭(gap)을 최소화시키는 것을 통해 2차 정렬이 이루어진다.According to the wafer ring alignment portion 30 of the present invention, the wafer ring 16 loaded onto the alignment table 32 below one end of the transfer robot 50 by the wafer ring transfer portion 20 is a stopper ( The alignment is performed primarily by 34), and then the secondary alignment is achieved by minimizing the gap of the top, bottom, left and right by the left and right alignment clamps 35 and 36 and the rear alignment clamp 38. This is done.

이에 따라, 상기 웨이퍼 링(16)은 비젼 시스템을 사용하는 종래의 방법에 비해 보다 정확하게 정렬될 수 있으며, 특히, 볼에 의한 에러 발생이 적으므로 장비 가동율을 높일 수 있음은 물론 장치 유지도 용이하다.Accordingly, the wafer ring 16 can be more precisely aligned than the conventional method using the vision system. In particular, since the error of the ball is less generated, the operation rate of the equipment can be increased and the device can be easily maintained. .

계속해서, 상기와 같은 구성에 있어서 트레이(60) 상부에는, 도 4에 도시된 바와 같이, 단위 패키지(14)와 대응하는 크기의 홀들(64)이 일렬로 배열된 구조를 갖는 정렬 지그(align jig : 62)가 추가 설치된다. 이러한 정렬 지그(62)는 모든 트레이(60) 상에 개별적으로 설치되는 것은 아니며, 예컨데, 픽-업 유니트(40)가 이동되어 배치되는 상기 트랜스퍼 로봇(50)의 타측 단부 아래에 설치됨이 바람직하다.Subsequently, in the above configuration, an alignment jig having a structure in which holes 64 having a size corresponding to the unit package 14 are arranged in a row is disposed on the upper portion of the tray 60. jig: 62) is installed. The alignment jig 62 is not individually installed on all trays 60, for example, it is preferable to be installed below the other end of the transfer robot 50 in which the pick-up unit 40 is moved and disposed. .

이와 같은 정렬 지그(62)가 추가 설치됨에 따라, 도 5에 도시된 바와 같이, 패키지(14)가 픽-업 유니트(40)의 픽-업 툴(42)로부터 트레이(60)에 놓여질 때, 상기 패키지(14)는 정렬 지그(62)의 홀(64)을 통과하게 되며, 이에 따라, 픽-업 유니트(40)가 틀어졌더라도, 상기 패키지(14)는 정렬 지그(62)의 홀(64)을 통과하면서 트레이(60)에 정확하게 안착될 수 있다.As such an alignment jig 62 is additionally installed, as shown in FIG. 5, when the package 14 is placed in the tray 60 from the pick-up tool 42 of the pick-up unit 40, The package 14 passes through the hole 64 of the alignment jig 62, so that, even if the pick-up unit 40 is turned off, the package 14 is not provided with the hole () of the alignment jig 62. It can be accurately seated in the tray 60 while passing through 64.

결국, 전술한 바와 같은 본 발명의 픽 엔 플레이스 장치는 웨이퍼 링 정렬부에 좌우 정렬 클램프 및 후면 정렬 클램프를 추가 설치함에 따라 웨이퍼 링의 정확한 정렬이 이루어지도록 할 수 있으며, 아울러, 트레이 상부에 정렬 지그를 추가 설치함에 따라 패키지의 트레이에의 정확한 안착이 이루어지도록 할 수 있다.As a result, the pick-and-place device of the present invention as described above allows the alignment of the wafer rings to be precisely aligned by additionally installing the left and right alignment clamps and the rear alignment clamps in the wafer ring alignment unit, and the alignment jig on the upper part of the tray Additional installations can ensure correct seating on the tray of the package.

이상에서와 같이, 본 발명은 웨이퍼 링 정렬부에 좌우 및 후면 정렬 클램프를 추가 설치함으로써 웨이퍼 링의 정확한 정렬을 이룰 수 있음은 물론 비젼 시스템을 사용함에 따른 비용/유지의 어려움을 해결할 수 있다.As described above, the present invention can achieve accurate alignment of the wafer ring by additionally installing left and right alignment clamps on the wafer ring alignment unit, and can solve the cost / maintenance difficulty of using the vision system.

또한, 본 발명은 트레이 상에 정렬 지그를 설치해 줌으로써 패키지의 트레이에의 정확한 안착을 이룰 수 있으며, 이에 따라, 패키지의 트레이에의 불안정한 안착을 개선하기 위한 작업자의 추가 공정을 생략할 수 있다.In addition, the present invention can achieve accurate seating of the package to the tray by installing the alignment jig on the tray, and thus, an additional step of the operator can be omitted to improve the unstable seating of the package on the tray.

기타, 본 발명은 그 요지를 일탈하지 않는 범위에서 다양하게 변경하여 실시할 수 있다.In addition, this invention can be implemented in various changes within the range which does not deviate from the summary.

Claims (2)

기판 단위로 제작된 다수개의 패키지를 UV 테이프에 부착시킨 후, 상기 UV 테이프를 웨이퍼 링에 부착시켜 소잉(sawing) 공정을 행한 결과물로부터 각 패키지들을 트레이에 옮겨 담는 픽 엔 플레이스(pick & place) 장치로서,A pick and place device that attaches a plurality of packages manufactured on a substrate basis to a UV tape, and then transfers each package to a tray from the result of a sawing process by attaching the UV tape to a wafer ring. as, 임의의 위치로 웨이퍼 링을 로딩 및 언로딩시키는 웨이퍼 링 이송부와, 상기 로딩된 웨이퍼 링을 정렬시키는 웨이퍼 링 정렬부와, 상기 웨이퍼 링 상에서 소정 개의 패키지를 픽-업(pick-up)한 후 소정 위치로 이동하여 트레이에 패키지들을 적재시키는 픽-업 유니트와, 상기 픽-업 유니트를 이동시키는 트랜스퍼 로봇과, 상기 패키지들이 적재될 트레이를 임의의 위치들로 로딩 및 언로딩시키는 트레이 이송부를 포함하며,A wafer ring transfer portion for loading and unloading a wafer ring to an arbitrary position, a wafer ring alignment portion for aligning the loaded wafer ring, and picking up a predetermined package on the wafer ring, and then A pick-up unit for moving the pick-up unit to a position by placing the packages on the tray, a transfer robot for moving the pick-up unit, and a tray transfer unit for loading and unloading the tray in which the packages are to be loaded into arbitrary positions; , 상기 웨이퍼 링 정렬부는 웨이퍼 링의 상측에 구비된 홈들에 대응하는 부분들 각각에 스탑퍼(stopper)가 구비되어 1차 웨이퍼 링 정렬이 이루어지도록 함과 동시에, 웨이퍼 링의 좌,우측에는 좌우 정렬 클램프(left/right align clamp)가 설치되고 웨이퍼 링의 하측에는 후면 정렬 클램프(rear align clamp)가 설치되어 상,하,좌,우의 갭(gap)을 최소화시키는 것에 의해 2차 웨이퍼 링 정렬이 이루어지도록 하며,The wafer ring aligning portion is provided with a stopper at each of the portions corresponding to the grooves provided on the upper side of the wafer ring, so that primary wafer ring alignment is performed, and left and right alignment clamps are disposed on the left and right sides of the wafer ring. (left / right align clamp) is installed and a rear align clamp is installed on the lower side of the wafer ring to minimize the gap of upper, lower, left and right so that secondary wafer ring alignment can be done. , 상기 트레이 상부에는 픽-업 유니트로부터 패키지가 트레이에 놓여질 때 패키지의 트레이에의 정확한 안착이 가능하도록 하는 정렬 지그(align jig)가 구비된 것을 특징으로 하는 패키지용 픽 엔 플레이스 장치.And an alignment jig provided on the upper portion of the tray to allow the package to be accurately seated on the tray when the package is placed on the tray. 제 1 항에 있어서, 상기 정렬 지그는The method of claim 1, wherein the alignment jig 단위 패키지와 대응하는 크기의 홀들이 일렬로 배열된 구조인 것을 특징으로 하는 패키지용 픽 엔 플레이스 장치.The pick and place device for a package, characterized in that the structure is arranged in a line with a hole of a size corresponding to the unit package.
KR1020030032208A 2003-05-21 2003-05-21 Pick & place apparatus for package KR20040100013A (en)

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