KR20040091239A - Wafer Photoresist Coating Vision Inspection Method - Google Patents
Wafer Photoresist Coating Vision Inspection Method Download PDFInfo
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- KR20040091239A KR20040091239A KR1020030024989A KR20030024989A KR20040091239A KR 20040091239 A KR20040091239 A KR 20040091239A KR 1020030024989 A KR1020030024989 A KR 1020030024989A KR 20030024989 A KR20030024989 A KR 20030024989A KR 20040091239 A KR20040091239 A KR 20040091239A
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000007689 inspection Methods 0.000 title claims description 13
- 238000000576 coating method Methods 0.000 title abstract description 17
- 239000011248 coating agent Substances 0.000 title abstract description 15
- 229920002120 photoresistant polymer Polymers 0.000 title abstract description 11
- 238000011109 contamination Methods 0.000 claims abstract description 6
- 238000005286 illumination Methods 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 claims abstract description 4
- 238000005507 spraying Methods 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 2
- 239000003504 photosensitizing agent Substances 0.000 claims 1
- 238000002347 injection Methods 0.000 abstract description 10
- 239000007924 injection Substances 0.000 abstract description 10
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 238000005299 abrasion Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 40
- 230000007547 defect Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000000605 extraction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B25/00—Screws that cut thread in the body into which they are screwed, e.g. wood screws
- F16B25/10—Screws performing an additional function to thread-forming, e.g. drill screws or self-piercing screws
- F16B25/103—Screws performing an additional function to thread-forming, e.g. drill screws or self-piercing screws by means of a drilling screw-point, i.e. with a cutting and material removing action
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B25/00—Screws that cut thread in the body into which they are screwed, e.g. wood screws
- F16B25/0036—Screws that cut thread in the body into which they are screwed, e.g. wood screws characterised by geometric details of the screw
- F16B25/0042—Screws that cut thread in the body into which they are screwed, e.g. wood screws characterised by geometric details of the screw characterised by the geometry of the thread, the thread being a ridge wrapped around the shaft of the screw
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B25/00—Screws that cut thread in the body into which they are screwed, e.g. wood screws
- F16B25/0036—Screws that cut thread in the body into which they are screwed, e.g. wood screws characterised by geometric details of the screw
- F16B25/0084—Screws that cut thread in the body into which they are screwed, e.g. wood screws characterised by geometric details of the screw characterised by geometric details of the tip
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B35/00—Screw-bolts; Stay-bolts; Screw-threaded studs; Screws; Set screws
- F16B35/04—Screw-bolts; Stay-bolts; Screw-threaded studs; Screws; Set screws with specially-shaped head or shaft in order to fix the bolt on or in an object
- F16B35/06—Specially-shaped heads
- F16B35/065—Specially-shaped heads with self-countersink-cutting means
Abstract
Description
본 발명은 웨이퍼 감광제 도포 비전 검사 방법에 관한 것으로, 보다 상세하게는 CCD카메라를 이용하여 반도체 Lithography 공정 중 PhotoResist(PR) 도포 공정에서 도포 노즐의 공정상태 및 웨이퍼 표면상의 도포상태를 인식 확인할 수 있는 웨이퍼 감광제 도포 비전 검사 방법에 관한 것이다.The present invention relates to a method for inspecting a wafer photosensitive agent coating vision, and more specifically, a wafer capable of recognizing and confirming a process state of a coating nozzle and a coating state on a wafer surface in a photoresist (PR) coating process during a semiconductor lithography process using a CCD camera. It relates to a photosensitive agent coating vision inspection method.
일반적으로 반도체 칩을 생산하기 위해서는 실리콘 봉을 가공한 웨이퍼를 사용하는데 이 웨이퍼의 Lithography(석판인쇄) 공정 중 감광제(Photoresist)를 도포하고 빛을 이용해서 필요한 부분만 노광시키는 공정에서 감광제의 유량을 정확하게 설정 분사하여 도포하고 그 도포가 균일하게 웨이퍼 표면에 이루어져야 양질의 반도체를 생산할 수 있다.In general, a semiconductor chip is used to produce a semiconductor chip. During the lithography process, a photoresist is applied and light is used to expose only the necessary portion of the photoresist. It is possible to produce high-quality semiconductors by spraying a set spray and applying the coating uniformly on the wafer surface.
종래에는 작업자가 감광제 분사 펌프의 유량계의 수치를 확인하여 유량을 조절하고 육안으로 Suck-back(분사가 끝난 후 일정높이까지 액체를 끌어올리는 동작) 높이나 Cut-off(분사 후 액체가 끊기는 시점) 높이를 확인했으며 주기적인 샘플링 검사에 의한 조작만이 가능하였다. 이 공정은 감광제 도포 공정에서 가장 많은 불량을 유발하는 부분이며, 감광제 토출 압력변화, Air-Operation Valve의 헌팅등에 의해 불량이 유발되며, 통상적으로 정기적인 모니터링을 통해 관리함으로써 작업자 개인의 임의적인 판단에 의한 오류나 샘플링 검사에 한정되어 실제 효과적인 관리가 되지 않고 있다. In the related art, the operator checks the value of the flow meter of the photosensitive injection pump to adjust the flow rate, and visually adjusts the sock-back (operation of pulling up the liquid to a certain height after the injection) or the cut-off (the point at which the liquid is cut off after the injection). Only the operation by periodic sampling inspection was possible. This process is the part that causes the most defects in the photoresist coating process, and the defects are caused by the change in the photoresist discharge pressure and the hunting of the air-operation valve. It is limited to error and sampling inspection by the system and is not effective management.
또한 공정 중에 오류를 발견했다 하더라도 이미 투입된 웨이퍼들의 공정이 끝난 다음 발견된 오류에 대해 조치가 가능했으므로 웨이퍼의 손실이 많이 발생하였다.In addition, even if an error was found during the process, the wafer was found to be able to take action on the found error after the wafers were already processed.
상기와 같은 문제점을 해소하기 위한 것으로, 본 발명은 CCD카메라 및 특수전용렌즈, 적외선 조명을 이용하고, 공정장비에서 노즐 및 웨이퍼의 동작상태에 대한 신호를 입력받아 웨이퍼와 노즐 영역을 자동 추적 및 탐색을 한 다음, 특징값과 명암을 추출, 인식하여 공정 중에 생길 수 있는 불량 유형을 구별해 내어 실시간으로 불량을 예방할 수 있도록 경고 신호를 발생하는데 그 목적이 있다.In order to solve the above problems, the present invention uses a CCD camera, a special lens, infrared light, and receives a signal for the operating state of the nozzle and the wafer from the process equipment to automatically track and search the wafer and the nozzle area Then, it extracts and recognizes the feature value and the contrast to distinguish the types of defects that may occur during the process to generate a warning signal to prevent defects in real time.
본 발명을 이루기 위한 방법으로, 노즐이 장착된 장비의 영상 이미지를 캡춰하는 단계; 캡춰된 영상 이미지를 특징화하여 특징 추출 및 분류 기법으로 웨이퍼 및 노즐의 영역을 추적 탐색하는 단계; 탐색된 영역에서 웨이퍼와 노즐을 판단 및 분리하는 단계; 노즐 영역에서 노즐의 위치를 추출, 추적하는 단계; 추출된 노즐의 특징을 이용하여 노즐의 형태 및 크기를 측정하는 단계; 노즐의 분사를 인식하고 시간을 측정하는 단계; 액체의 Suck-back 높이를 측정하는 단계; 노즐 팁의 오염도를 측정하는 단계; 노즐 팁의 왜율 및 마모도를 측정하는 단계; 노즐의 액체를 분사하는 시작 시간과 종료시간을 측정하여 유량으로 환산하는 단계; 노즐의 분사를 종료하는 시점의 Cut-off 높이를 측정하는 단계; 각 단계에서 측정된 값을 이미 데이터베이스로 설정된 값과 비교하여 경고신호를 발생하는 단계; 노즐이 웨이퍼 위에서 벗어났는지를 판단하는 단계; 웨이퍼의 회전이 멈추었는지를 판단하는 단계; 웨이퍼의 특징 추출 분리 및 명암을 추출 분리하는 단계; 웨이퍼의 도포 상태를 검사하여 저장된 데이터베이스와 비교하여 양호한지를 검사하는 단계를 포함하여 이루어진 것을 특징으로 한다.A method for achieving the present invention, the method comprising the steps of capturing a video image of the equipment equipped with a nozzle; Characterizing the captured image to track and trace regions of the wafer and nozzle with feature extraction and classification techniques; Determining and separating the wafer and the nozzle in the searched area; Extracting and tracking the position of the nozzle in the nozzle area; Measuring the shape and size of the nozzle using the features of the extracted nozzle; Recognizing injection of the nozzle and measuring time; Measuring the suck-back height of the liquid; Measuring the degree of contamination of the nozzle tip; Measuring the distortion and wear of the nozzle tip; Measuring a start time and an end time of spraying the liquid of the nozzle and converting the flow rate into a flow rate; Measuring a cut-off height at the end of spraying the nozzle; Generating a warning signal by comparing the measured value in each step with a value already set in the database; Determining whether the nozzle is off the wafer; Determining whether the rotation of the wafer has stopped; Extracting and separating the feature extraction separation and contrast of the wafer; And checking the application state of the wafer to see if it is good compared to the stored database.
도 1은 본 발명의 일 실시예에 따른 웨이퍼 감광제 도포 비전 검사 시스템 블록도.1 is a block diagram of a wafer photosensitive agent coating vision inspection system according to an embodiment of the present invention.
도 2는 본 발명에 따른 웨이퍼 감광제 도포 비전 검사 방법의 흐름도2 is a flow chart of a wafer photosensitive agent coating vision inspection method according to the present invention
도 3은 본 발명에 따른 웨이퍼 감광제 도포 비전 검사 방법의 흐름도Figure 3 is a flow chart of the wafer photosensitive agent coating vision inspection method according to the present invention
*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
10 : CCD카메라 20 : 전용특수렌즈10: CCD camera # 20: dedicated special lens
30 : 적외선 조명 40 : 비전처리 시스템30: infrared light 40: vision processing system
50 : 공정장비 60 : 액체 분사 노즐50: process equipment 60: liquid jet nozzle
70 : 웨이퍼 80 : 모니터70: wafer # 80: monitor
이하, 본 발명의 바람직한 실시 예를 첨부된 도면을 참조하여 상세하게 살펴보면 다음과 같다.Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명의 일 실시예에 따른 웨이퍼 감광제 도포 비전 검사 시스템 블록도를 도시한 것이다.1 illustrates a block diagram of a wafer photoresist coating vision inspection system according to an embodiment of the present invention.
도 1에 도시된 바와 같이, 웨이퍼 감광제 도포 비전 검사 시스템은 CCD카메라와 렌즈, 조명, 비전처리시스템 모듈로 구성한다.As shown in FIG. 1, the wafer photosensitive agent coated vision inspection system includes a CCD camera, a lens, an illumination, and a vision processing system module.
CCD카메라(10)는 웨이퍼(70)와 노즐(60) 영역부분을 촬영한다. 렌즈(20)는 웨이퍼(70)와 노즐(60)을 선명하게 인식할 수 있도록 특수 고안되었다. 조명(30)은 웨이퍼(70)에 손상이 가지 않도록 적외선 조명을 사용한다. 비전처리시스템 모듈(40)에서는 촬영된 웨이퍼(70)와 노즐(60) 영역부분에서 웨이퍼(70)의 도포 상태를 검사하고 노즐(60)의 불량 유형을 인식 확인한다. 검사된 결과치는 설정되거나 저장된 데이터베이스와 비교하여 불량인 경우 공정장비(50)로 경고신호를 발생시킨다. 공정장비(50)에서는 웨이퍼(70)가 장탈/착되었는지, 회전중인지, 노즐(60)이 웨이퍼(70) 위에 위치했는지, 떠났는지 등의 신호를 비전처리시스템 모듈(40)로 디지털 신호를 전송한다. 모니터(80)는 검사가 진행중인 상황을 구현한다.The CCD camera 10 photographs the region of the wafer 70 and the nozzle 60. The lens 20 is specially designed to clearly recognize the wafer 70 and the nozzle 60. The illumination 30 uses infrared illumination so as not to damage the wafer 70. The vision processing system module 40 inspects the application state of the wafer 70 in the photographed wafer 70 and the nozzle 60 region and recognizes the failure type of the nozzle 60. The result of the inspection generates a warning signal to the process equipment 50 in case of failure compared to the set or stored database. The process equipment 50 transmits a digital signal to the vision processing system module 40 such as whether the wafer 70 is mounted / detached, rotated, the nozzle 60 is positioned on the wafer 70, or left. do. The monitor 80 implements a situation in which an inspection is in progress.
도 2, 도 3은 본 발명에 따른 웨이퍼 감광제 도포 비전 검사 방법의 흐름도를 도시한 것이다.2 and 3 show flowcharts of a method for inspecting a wafer photosensitive agent coating vision according to the present invention.
도 2, 도 3 에 대한 동작 흐름을 도 1을 참조하여 설명하기로 한다. 공정 라인 상에서 공정장비(50)에 웨이퍼(70)가 장착되면(130) 노즐(60)이 웨이퍼(70) 중앙에 위치(150)하게 되고 그 신호를 공정장비(50)에서 비전처리시스템 모듈(40)로 전송되게 되면 CCD카메라(10)에 의해서 영상이 입력되고, 비전처리시스템 모듈(20)은 입력된 영상을 캡춰한다(100). 영상 캡춰는 320 X 240 또는 640 X 480해상도로 한 프레임단위로 동작한다. 캡춰된 영상은 저대역 통과 필터링과 Smoothing처리 기법에 의해서 잡음을 제거한다(110). 다음, 영상에서 외곽선 검출 및 세선화하여(160) 영상의 특징 검출 및 분류기법(170)으로 웨이퍼(70)와 노즐(60) 영역부분을 추적하여 탐색한다(120, 140). 영상의 특징 추출 및 분류 기법은 매번 입력되는 영상에 대해 웨이퍼의 특징 및 노즐의 특징을 추출하여 학습 기법에 의해 데이터베이스화 한다.The operation flow of FIGS. 2 and 3 will be described with reference to FIG. 1. When the wafer 70 is mounted on the processing equipment 50 on the processing line 130, the nozzle 60 is positioned 150 at the center of the wafer 70, and the signal is transmitted from the processing equipment 50 to the vision processing system module ( When the image is transmitted to 40, an image is input by the CCD camera 10, and the vision processing system module 20 captures the input image (100). Image capture operates at frame rate of 320 x 240 or 640 x 480 resolution. The captured image is removed by the low pass filtering and smoothing technique (110). Next, by detecting and thinning the outlines in the image (160), the regions of the wafer 70 and the nozzle 60 are traced and searched by the feature detection and classification technique 170 of the image (120, 140). The feature extraction and classification technique of the image extracts the feature of the wafer and the feature of the nozzle from the input image every time and makes a database by the learning technique.
웨이퍼와 노즐 영역부분이 탐색되고 노즐이 웨이퍼 중앙에 위치하면(180), 노즐의 해상비와 CCD카메라의 종횡비와 렌즈의 배율에 의해 노즐의 형태 및 크기를 측정하고(190) 노즐이 분사를 시작했는지(200), 종료했는지(230)를 판단하여 분사 시작 시간과 종료시간를 측정하여(220, 280) 시간대비 환산으로 유량을 측정하고(290) 분사 시작 시점에 감광제의 Suck-back 높이를 측정하고(210), 분사 중에는 노즐 팁의 오염도 측정(240) 및 노즐 팁의 왜율 및 마모도를 측정(250)하여 설정된 값과 비교하여 일치하는지를 판단(260)하고 만일 일치하지 않을 경우 노즐 교체 신호를 발생시킨다(270). 분사 종료 시점에는 Cut-off 높이를 측정(310)하고 Suck-back 높이를 측정(340)하여 환산된 유량 및 Cut-off 높이, Suck-back높이가 설정된 값과 비교하여 일치하는지를 판단(300, 320)하여 만일 일치하지 않을 경우 경고신호를 발생(330)시킨다.When the wafer and the nozzle area are searched and the nozzle is located at the center of the wafer (180), the shape and size of the nozzle are measured by the resolution ratio of the nozzle, the aspect ratio of the CCD camera and the magnification of the lens (190), and the nozzle starts spraying. The flow rate is measured in terms of time (290) by measuring the injection start time and the end time (220, 280) by determining whether or not (200) or end (230), and measure the Suck-back height of the photoresist at the time of injection start. 210, during spraying, the contamination degree measurement 240 of the nozzle tip and the distortion and abrasion degree of the nozzle tip are measured 250 to compare the values with the set values, and determine whether they match (260) and generate a nozzle replacement signal if they do not match. (270). At the end of the injection, the cut-off height is measured 310 and the suck-back height is measured 340 to determine whether the converted flow rate, the cut-off height, and the suck-back height match with the set values (300, 320). If not matched to generate a warning signal (330).
다음, 노즐이 웨이퍼에서 벗어났는지(350), 웨이퍼의 회전이 멈추었는지(360)를 판단하여 웨이퍼의 특징 및 명암을 추출(370)하여 기 저장된 데이터와 비교(390)하여 웨이퍼의 도포 상태를 검사(380)하며, 비교된 값이 일치하지 않을 경우 경고신호를 발생(420)시키고, 일치할 경우 다음 웨이퍼의 공정을 진행시킨다.Next, it is determined whether the nozzle is out of the wafer (350) or the rotation of the wafer is stopped (360), and the characteristic and contrast of the wafer are extracted (370) and compared with the previously stored data (390) to examine the application state of the wafer. In operation 380, if the compared values do not match, a warning signal is generated 420, and if they match, the next wafer is processed.
이상에서 살펴본 바와 같이, 본 발명은 종래의 문제점들을 보완하기 위하여 Suck-back 높이, 팁 오염, 팁 마모, 분사 여부, 유량, Cut-off 높이를 자동적으로 측정 보완하고, 웨이퍼 표면상의 도포 상태를 24시간 실시간으로 검사함으로써 반도체 생산라인의 무인 자동화 실현을 가능케 하고, 불량 발생 시점의 현상들을 동영상으로 저장하여 필요시 검색함으로써 생산성 향상, 품질 향상, 반도체 제조장비의 성능향상에 크게 기여할 수 있다.As described above, the present invention automatically measures and compensates the sock-back height, tip contamination, tip wear, spraying, flow rate, and cut-off height in order to compensate for the conventional problems, and improves the coating state on the wafer surface. By real-time inspection in real time, it is possible to realize unmanned automation of semiconductor production line, and it can contribute greatly to productivity improvement, quality improvement, and performance improvement of semiconductor manufacturing equipment by storing phenomena at the time of defect occurrence and searching if necessary.
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| KR20230053746A (en) * | 2021-10-14 | 2023-04-24 | 주식회사 램스 | System for inspecting photoresist dispensing condition of spin coater |
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