KR20040090422A - Structure for connecting connector and electrical element to substrate - Google Patents

Abstract

PURPOSE: A connector and a connecting structure of an electrical component and a circuit board are provided to securely maintain the connection of the connector bonded onto the circuit board and the circuit board even when a large stress is applied to the connection structure or the connection structure is in a high temperature environment by using a gap formed between a reinforcing plate and a housing. CONSTITUTION: A connector(1) includes a housing(3) in which a plurality of pin contacts(2) are arranged, and an elastically deformable plate member(4) attached to each of both sides of the housing. The plate member includes a portion attached to each side of the housing, a portion bonded onto a circuit board, and an extended portion connecting the attached portion to the bonded portion. A gap is formed between the extended portion and each side of the housing.

Description

STRUCTURE FOR CONNECTING CONNECTOR AND ELECTRICAL ELEMENT TO SUBSTRATE}

The present invention provides a surface mount connector for mounting a pin contact on a wiring pad formed on a surface of a circuit board such as a printed wiring board and an electrical component having a DIP switch, a connector, or the like that can be electrically connected to the wiring pad. The connection structure which connects a to a board | substrate is related.

Conventionally, a surface-mounted connector that is bonded to a circuit board such as a printed wiring board by using a surface mount technology, and surface-mounted connector that surface-mounts a pin contact to a wiring pad formed on the surface of the board (hereinafter, referred to as “SMT (Surface-Mount-Technology Connector) is known. The SMT connector has a housing having an opening into which the mating connector is inserted, and a plurality of pin contacts are arranged in parallel at a predetermined pitch in the housing.

In the SMT connector, the part connected to the mating connector (hereinafter referred to as the "first connection part") is placed on the upper surface and the part joined to the substrate (hereinafter referred to as the "second connection part") is placed on the substrate. The pin contacts disposed at the connecting portions are bonded to the substrate to be mounted on the substrate surface. The first connection portion is equipped with a mating connector such as a harness terminal in which a plurality of wiring terminals are bundled, and is electrically connected to the mating connector. The wiring terminals of the mating connector are arranged at approximately the same pitch as the connecting terminals of the first connecting portion of the connector, and the mating connector is guided to a predetermined position by inserting the mating connector into the first connecting portion along the opening of the housing. On the other hand, the pin contact disposed in the second connecting portion is electrically connected to the metal wiring pad on the substrate by soldering.

In general, a reflow method is employed for mounting the connector onto the substrate. According to the reflow method, solder is applied to a metal wiring pad on a substrate in advance, and the connector is placed on a pad on the substrate by positioning the pin contact of the connector to contact the solder applied to the pad. In this state, after melting the solder through the high temperature reflow bath, the board is taken out from the reflow bath, and the solder is solidified to connect and fix each pin contact of the connector to the wiring pad to electrically connect the wiring pad and the connector. Connect with

The housing of the SMT connector as described above is made of resin such as various engineering plastics. On the other hand, the substrate on which the SMT connector is surface-mounted glass fillers are made of epoxy resin, etc., the housing and the substrate is formed of a different material.

In addition, the housing is a substantially rectangular cylindrical shape, and the four side walls often form a rectangular opening, and a pair of reinforcing tabs are provided at a pair of opposite ends of such a housing to increase the bonding strength between the board and the connector. . The reinforcing tab is made of a copper-based material such as brass, and is formed to be integral with the housing, such as being integrally formed with the housing during molding of the synthetic resin housing or being fitted with the housing after molding the housing. . Such a reinforcing tab may be substantially L-shaped (hereinafter referred to as an "L-shaped reinforcing tab") as seen from the side surface having two plate members orthogonal to each other. One of the plate members of the L-shaped reinforcing tab (hereinafter referred to as a "vertical plate") is integrated with the outer side wall of the housing and a plate orthogonal to the vertical plate (hereinafter referred to as a "horizontal plate") is soldered to the substrate.

Further, as disclosed in Japanese Unexamined Patent Application Publication No. 09-139242, it has an arched frame, a bulging portion suspended on the top of the frame, and a pair of joint portions that are oriented and projected from a pair of base portions of the frame. Reinforcing members have been proposed. This reinforcing member is attached to both ends of the longitudinal direction of the housing. Bulging holes are provided at both ends of the housing in the longitudinal direction of the contact to which the reinforcing member is attached, the bulging part is pressed into the bulging hole, and the joining part is surface-mounted on the substrate simultaneously with the terminal of the connector of the contact.

By the way, the board | substrate in which such electronic components, such as a connector, were mounted is used for various electronic products, for example, it is used in the vehicle body of an automobile, etc., and may be placed in the environment which is left at a very high temperature.

In such a high temperature environment, the housing of the connector extends and deforms due to thermal expansion. However, as described above, since the material of the connector housing is different from that of the substrate, the housing and the substrate are deformed into different forms due to the difference in the coefficients of thermal expansion. For this reason, there exists a possibility that a position shift may occur between the pin contact held by the housing, and the wiring pad provided on the board | substrate.

In particular, the reinforcing tabs are often provided at both ends of the housing, and in this case, they are most susceptible to the effects of positional displacement caused by deformation due to thermal expansion of the housing. For example, when the L-shaped reinforcing tab as described above is used, the vertical plate attached to the side wall of the housing due to the elongation deformation accompanying the thermal expansion of the housing is brought close to the horizontal plate by the force spreading to the outside of the housing. Is deformed. For this reason, when returning to the temperature which a housing does not expand, the horizontal board is tensioned in a vertical board direction, and the force in the direction which peels from a board | substrate arises.

By such a force, the horizontal plate easily peels from the substrate due to cracks in the solder applied between the horizontal plate and the substrate, and the electrical connection between the pin contact of the connector and the wiring pad on the substrate becomes unstable and the substrate The bond strength (fill strength) of the connector in a phase becomes weak, and there exists a possibility that a connector may fall out of a base | substrate.

In addition, the same problem occurs even when the reinforcing member disclosed in the above-mentioned patent document is used. That is, in this reinforcing member, parts other than the junction part with a board | substrate are press-fitted in the housing of a connector, and are integrated with the connector. For this reason, when the housing extends and deforms in the longitudinal direction by thermal expansion, positional displacement occurs between the housing and the wiring pads of the substrates having different thermal expansion coefficients, and a large stress is intensively added to the bonded portion bonded to the substrate.

In order to prevent such a problem, it is conceivable to improve the bonding strength by increasing the bonding area between the reinforcing tab and the substrate and increasing the amount of solder used for bonding. However, when the junction area is enlarged, the mounting effective area of the electronic component to be mounted on the substrate is reduced. In addition, when a large amount of solder is used, since the wiring pattern of the substrate is fine, the solder is applied over a plurality of wiring patterns, so that connection defects are likely to occur, which is not preferable.

It is also conceivable to provide a through hole in the substrate and fix it by inserting the reinforcing tab into the through hole, but this is also undesirable because the mounting effective area of the electronic component on the back side of the substrate is reduced.

In addition, when a connector such as a game cassette which is frequently pulled out and inserted from the connector is used as the mating connector, the torsional stress may be added by removing the game cassette by twisting the connector when the user pulls out the game cassette from the connector. In this case, when such a torsional stress concentrates on the junction part of a connector and a board | substrate, joining of a connector and a board | substrate may weaken and may cause the above-mentioned problem.

In addition, the problem as described above is not limited to the connector, but is likely to occur in an electrical component to which external force is applied from various directions by human manual operation. For example, a problem as described above is likely to occur in a surface mount type electrical component such as a DIP switch that is provided with a plurality of switches and enables a circuit change.

The present invention solves the problems as described above, the connector and the electrical components that can maintain a good bond between the connector and the substrate bonded on the substrate even when a large stress from the outside is added or left in a high temperature environment It is an object to provide a connection structure to a substrate.

MEANS TO SOLVE THE PROBLEM In order to solve the subject as mentioned above, this invention provides the following.

(1) A connector mounted on a substrate surface having a housing for holding a plurality of pin contacts in a longitudinal direction and an elastically deformable plate member attached to both ends in the longitudinal direction of the housing. End faces to which the plate member is attached are respectively formed at both ends in the longitudinal direction, and the plate member has an attachment portion in close contact with the end surface, a junction portion having a junction surface bonded to the substrate, and the attachment portion and the junction portion connected thereto. And an extension portion, wherein a gap portion is formed between the extension portion and the end face of the housing.

According to the invention of (1), the gap part is formed in the extension part of the reinforcement plate member attached to the housing, and the end surface of the housing. As a result, the extension mounting portion can flexibly elastically deform in the gap portion against stress from various directions added from the outside or extension deformation in the longitudinal direction due to thermal expansion of the housing, etc., where the junction portion and the substrate are joined. Can relieve stress.

(2) The extension mounting portion includes a first extension mounting portion extending from one end of the attachment portion and a second extension attachment portion extending from the other end of the attachment portion, and the joining portion is connected to the first extension attachment portion. The 1st junction part and the 2nd junction part connected with the said 2nd extended installation part are provided, The connector as described in (1) characterized by the above-mentioned.

According to the invention of (2), the extension mounting portion has a first extension mounting portion and a second extension mounting portion that are diverged from the attachment portion, and are respectively connected to the first bonding portion and the second bonding portion. For this reason, even if the extension installation part elastically deforms in the gap part, the above-described additional stress can be dispersed between the first joint part and the second joint part, and the additional stress can be alleviated again.

(3) The connector according to (1) or (2), wherein a length of the joining surface of the joining portion is longer than a cross-sectional overall length dimension in the case of cutting the extension mounting portion into a plane parallel to the joining surface.

According to the invention of (3), since the area where the junction part and the substrate are joined is large, the joining of the substrate and the junction part can be maintained more firmly with respect to the added stress.

(4) The pin contact includes a held portion held by the housing, a connecting portion connected to a wiring pad formed on the substrate, and a deformation allowable portion capable of bending deformation formed between the connecting portion and the held portion. The connector according to any one of (1) to (3).

According to the invention of (4), when the positional relationship between the retained portion of the pin contact held in the housing and the connection portion connected to the substrate is caused by external force or thermal expansion from various directions added to the housing, The deformation allowance of the pin contact is elastically deformed. Thereby, for example, it becomes possible to relieve the stress concentrated on the portion where the pin contact and the substrate are connected. For this reason, it becomes possible to prevent peeling of a solder etc. which connect a pin contact and a board | substrate, or a cracked crack, and to make it difficult to produce an electrical connection defect.

In this invention, it is a connector as described in any one of (1)-(4), and is substantially orthogonal to the 1st bonding surface which extends along the short direction of the said housing to the bonding surface formed in the said junction part, and the said 1st bonding part. You may form the 2nd bonding surface extended along the longitudinal direction of the said housing, and the curved surface which connects the said 1st bonding surface and the said 2nd bonding surface.

When the 1st joining surface and the 2nd joining surface are connected by the curved surface, a joining surface is substantially L-shaped from planar view. By setting a joining surface in such a structure, it is possible to increase the joining area of a joining surface and a board | substrate, and to improve the joining strength of a board | substrate and a joining part further. Further, when the housing is elongated and deformed in the longitudinal direction due to thermal expansion or the like, the extension mounting portion connected to the joining portion is bent to elastically deform so as to spread in this longitudinal direction. At this time, if the 2nd joining surface extended in parallel with the said bending direction is provided, it can support an extended installation part by this 2nd joining surface and a curved surface, and improves the joining strength of a board | substrate and a plate-shaped member further. It becomes possible.

Moreover, in this invention, you may form the said 2nd bonding surface in the corner of both ends of the said 1st bonding surface, and form one curved surface between a 2nd bonding surface and the both edges of a 1st bonding surface, respectively. When the second joining surface is formed at both end edges of the first joining surface, the joining surface is substantially U-shaped in plan view. By setting it as such a structure, it is possible to further increase the bonding area of a junction part and a board | substrate, and to improve the bonding strength with a board | substrate more. In addition, when the housing is deformed in the longitudinal direction by thermal expansion or the like, the housing supports an extension mounting portion that elastically deforms to be bent in the longitudinal direction, and prevents torsional deformation accompanying elastic deformation, thereby further improving the bonding strength between the substrate and the joint portion. Can be improved.

In addition, in this invention, you may provide a through-hole in the site | part located in the joining part to predetermined dimension upper direction from a joining surface. When a joining part is joined with a board | substrate through solder by providing a through hole in the upper side rather than a joining surface, ie, a part near an attachment part, what is called a solder rise which rises along the surface from the joining part toward an extension part can be suppressed. By suppressing the rise along the surface of the solder, it is possible to appropriately maintain the amount of solder in the joint portion with the substrate and to prevent the decrease in the bonding strength with the substrate. When the through hole is formed to be substantially parallel to the joining surface with the substrate, it is preferable because the rise along the surface of the solder can be suppressed broadly and accurately.

The electrical component provided with the pin contact which concerns on (4) invention can exhibit the effect similar to invention of (4) mentioned above. The deformation allowable portion of the pin contact according to the invention described in (4) may be formed to have a first deformation allowable portion and a second deformation allowable portion inclined at different angles.

The first deformation allowance portion and the second deformation allowance portion are connected at the bent connection points, and are respectively inclined at different angles, and the first deformation allowance portion and the second deformation allowance portion can respectively elastically deform around the curved connection point. . For this reason, the freedom degree and the magnitude | size of the elastic deformation direction as the whole deformation | transmission allowance part can be enlarged, and electrical connection defects, such as the peeling and solder crack which arise by the additional stress which concentrates on the connection part with the wiring pad of a board | substrate, etc. It is possible to suppress the problem.

(5) a housing which holds a plurality of pin contacts in a longitudinal direction, and an elastically deformable plate member attached to both ends in the longitudinal direction of the housing, and using a connector mounted on the substrate surface. An interconnecting structure of an electrical component to a substrate, wherein each of the plurality of pin contacts is soldered and bonded to a wiring pad formed on the substrate to connect the electrical component to the substrate, and an end surface of the housing in which the plate member is attached Each of which is formed, wherein the plate member has an attachment portion that is in close contact with the end face, a junction portion having a junction surface joined to the substrate, and an extension attachment portion connecting the attachment portion and the junction portion, The joining portion is formed in a state where a gap portion is formed between an end face and an extension portion of the plate member. A connection structure of an electrical component to a substrate, which is soldered and bonded to the substrate.

The electrical component according to the invention described in (5) is bonded onto the substrate in a state where a gap portion is formed between the housing end face to which the plate member is attached and the extension mounting portion of the plate member. For this reason, when the board | substrate with which this electric component was connected was put under high temperature environment, the junction part of the plate-shaped member attached to the electric component and the attachment position of the board | substrate shifted | deviated by the difference of the thermal expansion coefficient between a board | substrate and the housing of an electric component, etc. Even in the state, elastic deformation of the extension mounting portion can be flexibly allowed in this gap portion. This makes it possible to relieve the stress at the portion where the junction portion and the substrate are joined, so as to reduce problems such as cracking or peeling of the solder joining the junction portion and the substrate, and to maintain good bonding state between the junction portion and the substrate. Easier

As an electrical component which concerns on invention of (5), it is an electrical component which has an electrical contact part with board | substrates, such as a pin contact, and especially the surface mount type electrical component which is easy to add external force from various directions is mentioned. Specifically, besides the connector which can be detachably attached to the mating connector and makes electrical connection, electrical components, such as a DIP switch provided with a some switch and enabling a circuit change, are mentioned, for example. In particular, it is effective for an electrical component having an enlarged housing, an electrical component having a very small pitch-to-pitch distance, and an electrical component that is likely to have a poor electrical connection due to contact between adjacent pin contacts.

Next, although one Embodiment of the connector of this invention is described, referring drawings, etc., this invention is not limited to this. In addition, the term regarding the directions of back, front, left, right, up, down, etc. used in the following embodiment is used only for convenience of description.

1 is a perspective view of a connector of one embodiment of the present invention;

Fig. 2 is a diagram showing an upper surface of the connector.

3 is a bottom view of the connector.

4 is a front view of the connector;

Figure 5 is a perspective view of the pin contacts of the connector.

6 is a side view of the connector;

7 is a perspective view of a plate member installed in the connector.

8 is a front view of the plate member.

9 is a bottom view of the plate member.

Fig. 10 is a side view of the plate member.

Fig. 11 is an explanatory diagram for explaining a state in which the connector is surface mounted on a substrate.

Fig. 12 is a view for explaining the state when the connector is deformed in the longitudinal direction by thermal expansion.

Fig. 13 is a perspective view of a modification of the plate member according to the present invention.

Fig. 14 is a perspective view of another modification of the plate member according to the present invention.

<Explanation of symbols for the main parts of the drawings>

1: Connector

2: pin contact

3: housing

4: tab for reinforcement

5: opening

6: protrusion

8: protrusion

9: pin

10: insertion insert

1 is a perspective view of a connector that is an electrical component according to an embodiment of the present invention. 2 is a top view of the connector. 3 is a bottom view of the connector. 4 is a front view of the connector. 5 is a side view of the connector.

The connector 1 includes a housing 3 integrally molded with an insulating resin, and the housing 3 includes a plurality of metal pin contacts 2 and a reinforcing tab 4. The housing 3 is a substantially rectangular tubular member having two sets of pairs of opposing side walls arranged at right angles, and having an opening 5 into which a socket-side connector (not shown), which is a mating connector, is inserted in a portion surrounded by the side wall. Formed.

In this embodiment, the housing 3 has an external dimension of 49.4 mm in the long direction, 13 mm in the short direction, and 25 mm in the height direction. As a material of the housing | casing 3, thermoplastic resins, such as a synmetric polystyrene resin, polyphenine sulfide, 6T nylon, and 46 nylon, can be used preferably, for example.

Protrusions 8 are provided at four corners of the bottom surface of the housing 3 to stabilize the posture of the housing 3 when the housing 3 is mounted on the surface of the substrate. In addition, a substantially cylindrical pin 9 is provided at the proximal ends of the two protrusions 8 of each of the protrusions 8, and the pins 9 are fitted into the positioning holes drilled in the board, thereby providing the connector 1. The position on the substrate of is determined.

A part of the side wall forming the opening 5 of the housing 3 is provided with two projections 6 on the inner side standing up in the height direction of the housing 3 (direction from the bottom surface to the upper surface), thereby connecting the socket side connector. It functions as a guide member for mounting at a predetermined position. In addition, in the opening 5, a plurality of pin contacts 2 are arranged in parallel at substantially equal intervals along the long direction, and the terminal portion 7 (see Fig. 5) of the pin contacts 2 is provided in the socket side connector. It is arrange | positioned so that it may contact each of a some terminal.

As shown in FIG. 4, the plurality of pin contacts 2 are arranged in parallel at equal intervals along the longitudinal direction of the housing 3. 2 and 3, two rows in which a plurality of pin contacts 2 are arranged in parallel are provided.

5 is a perspective view of the pin contact 2. The pin contact 5 has a spring property, and the terminal part 7 is formed in the front-end | tip part, and the base end part which opposes the terminal part 7 is the connection part 2d soldered to the wiring pad (not shown) formed on the board | substrate. It is. Between the terminal part 7 and the connection part 2d, the retained support part 2c and the deformation | transmission allowable part 2e which can bend | bending-deformed for inserting the pin contact 2 in the predetermined position of the housing 3 are formed, have.

The connecting portion 2d is bent in a substantially horizontal direction so as to be parallel to the substrate in order to increase the bonding area with the wiring pad. The held portion 2c is formed of a plurality of concave portions 2a and convex portions 2b, one end of which is adjacent to the terminal portion 7, and the multistage portion thereof is adjacent to the deformation allowance portion 2e. The to-be-supported part 2c and the terminal part 7 do not bend along the height direction of the housing 3, and are substantially linear. The deformation allower 2e has a first deformation allower 21 and a second deformation allower 2g.

The first deformation allowable portion 2f is connected to one end of the held portion 2c, slightly bent and inclined in a direction parallel to the direction in which the connecting portion 2d extends, and is connected to the held portion 2c. The part is obtuse. On the other hand, the 2nd deformation | transformation allowance part 2g is bent and inclined in the direction in which the connection part 2d is extended in connection with the connection part 2d. Although the 1st deformation | transmission allowance part 2f and the 2nd deformation | transmission allowance part 2g are mutually connected in each end part, since both incline at different angles, the part to which both are connected is a curved connection point.

Although the pin contact 2 is connected to the wiring pad formed in the board | substrate by soldering, according to the pin contact 2 of the said structure, peeling and solder of the connection part 2d of the pin contact 2 and the wiring pad on a board | substrate It can make it hard to crack. That is, according to the pin contact 2 of the said structure, when the additional stress concentrates in the connection part of the connection part 2d of the pin contact 2 and the wiring pad by the external force added from various directions with respect to a connector, The deformation allowable portions 2f and 2g freely deform and deform the concentration of additional stress in the connection portion.

More specifically, the deformation allowable part 2f in the present invention is connected to the retained support part 2c and the connection part 2d by bending at a predetermined angle, not straight, and using the bent part as a support point. Therefore, the pin contact 2 is easily deformed in various directions. In particular, in this embodiment, two deformation | transformation allowable parts 2e and 1st deformation allowance part 2g are provided as the deformation | transmission allowance part 2e, and the front end part (terminal part 7) of the pin contact 2 is provided. A total of three curved portions are formed over the base end (connection part 2d). For this reason, since each deformation | transmission allowance part 2f, 2g performs bending deformation or bending deformation in each direction using these curved parts as a support point, the magnitude | size of freedom of the deformation | transformation allowance 2e and the direction of freedom in the direction of the deformation | transformation part 2e as a whole. Is increased. In addition, since the stresses added by the elastic deformation of adjacent deformation allowances can be alleviated by elastic deformation of these deformation allowances themselves, it is necessary to concentrate on the connection portion between the connection portion 2d of the pin contact and the wiring pad on the substrate. The added stress can be more relaxed.

In addition, the deformation | transmission allowance part in this invention does not need to be formed so that it may necessarily have a bent part with respect to the to-be-supported part 2c and the connection part 2d, as shown in this embodiment, for example, elasticity including bending deformation, etc. It is also possible to form R-shaped so that deformation is free.

Next, the structure of reinforcing the connection of the connector 1 to the board | substrate is demonstrated. Fig. 7 is a perspective view showing the plate member 4 used for the connector of the present embodiment. Fig. 8 is a front view thereof, Fig. 9 is a bottom view thereof, and Fig. 10 is a side view thereof. The plate member 4 is attached to the outer surface ("end face") of the pair of side walls of both ends of the housing 3 in the longitudinal direction to form a reinforcement part. Each end face of the housing 3 is provided with a fitting inserting portion 10 (see FIGS. 1 and 6), which is a skinned portion having a groove, and the plate member 4 is inserted into the fitting inserting portion 10. Attached to the housing 3 so as to be integrated with the housing 3.

The plate member 4 is formed by processing a metal plate made of a copper-based material such as brass into a predetermined shape. By using a copper-based material as the plate-shaped member 4, surface plating treatment required for stainless steel or the like is unnecessary, so that the cost is reduced, and the bonding strength with the solder at the time of joining to the substrate is good.

As shown in Fig. 7, the plate-shaped member 4 includes an attachment portion 11 attached to the fitting insertion portion 10 of the housing 3, and a junction portion 12 having a bonding surface with a substrate formed on the bottom surface thereof. The attachment portion 11 and the junction portion 12 are connected by the extension attachment portion 13.

The attachment portion 11 is inserted into the fitting insertion portion 10 of the housing 3 from above the housing 3. A plurality of protrusion mounting portions 11a are formed at both corners of the attachment portion 11, and the protrusion mounting portions 11a are engaged with the fitting insertion portions 10 by catching the grooves of the fitting insertion portions 10. Strength is increased.

The extension mounting portion 13 is connected to the upper portion of the attachment portion 11 and is oriented in the attachment portion 1l along the horizontal direction, that is, the short direction of the housing 3, and is installed to extend outward. Extends downward in the substantially vertical direction, that is, toward the bonding surface with the substrate. The extension mounting portion 13 includes a first extension mounting portion 13a extending from one side edge of the upper portion of the attachment portion 11 and a second extension portion extending from the other edge edge of the upper portion of the attachment portion 11. The extension mounting part 13b is provided.

The attachment part 11 is arrange | positioned between the 1st extension installation part 13a and the 2nd extension installation part 13b, and this attachment part 11 is inserted in the fitting insertion part 10 of a housing, and an attachment member is attached. 4 is integrated with the housing 3. As shown in Fig. 4, the side wall of the housing 3 has a recessed portion facing the extension mounting portion 13, so that a gap S between the end face of the housing 3 and the extension mounting portion 13 is provided. ) Is formed. As a result, the attachment portion 11 is fixed to the fitting insertion portion 10 so as to be in close contact with the end face of the housing 3, while the extension mounting portion 13 is not in close proximity to the housing 3.

The junction part 12 is formed in the lower part of the plate-shaped extension installation part 13, and is provided with the 1st junction part 122a and the 2nd junction part 122b. The 1st junction part 122a is joined with the 1st extension installation part 13a, and the 2nd junction part 122b is joined with the 2nd extension installation part 13b.

Each joining portion 12 is composed of a plate-shaped wall continuous with the extension mounting portion 13, as shown in Fig. 7, and a pair of plate-shaped sidewalls provided opposite to both sides of the wall, as shown in Fig. 9. As can be seen, the transverse cross section is U-shaped. The base end (bottom surface part) of a junction part is connected with a board | substrate, and a junction surface is formed in this bottom surface part.

The joining surface includes a first joining surface 12a and a pair of second joining surfaces 12b that are orthogonal to the first joining surface 12a and face each other with the first joining surface 12a interposed therebetween. . The 1st joining surface 12a is a strip | belt-shaped surface formed in the plate-shaped wall continuous with the extension installation part 13, and extending in the direction parallel to the short direction of the housing | casing 3. As shown in FIG.

On the other hand, the 2nd joining surface 12b is a strip | belt-shaped surface extended along the direction parallel to the longitudinal direction of the housing 3 from the both edges of the strip | belt-shaped 1st joining surface 12a, and comprises the joining part 12. It is formed on the side wall. One of both edges of the second joining surface 12b is joined to the first joining surface 12a via a curved surface 12c to be described later, and the other is oriented to the housing 3 so as to be oriented from the housing 3. Stretch in the direction of protruding. That is, the 2nd bonding surface 12b is formed so that it may extend in the direction toward an outer side from the centerline T (refer FIG. 2 thru | or FIG. 4) through the substantially center of the longitudinal direction of the housing 3.

Thus, the joint surface of the junction part 12 is larger than the total length dimension of the cross section at the time of cut | disconnecting the extension installation part 13 in this direction, and the total length dimension of the cross section in the direction parallel to a junction surface, Since the bonding area is increased, it is possible to further improve the bonding strength with the substrate.

Moreover, 12 d of through-holes are provided in the junction part 12 in the site | part located in predetermined dimension and upward (namely, the direction in which the attachment part 11 is connected) from the junction surface with a board | substrate. 12 d of through-holes are provided in each of the joining parts 12, respectively. One of the through holes 12d of each joining portion 12 is provided along the first joining surface 12a, one second joining surface 12b, and the bent surface 12c, and the other through hole 12d is provided. ) Is provided along the first joining surface and the other second joining surface and the curved surface 12c. The through hole 12d is formed to be substantially parallel to the joining surface in the shape of a horizontal hole having a horizontal length.

With this structure, when the plate-shaped member 4 is joined to the substrate by soldering, two through holes are provided for the so-called solder rise in which the solder rises along the surface from the joining portion 12 toward the extension mounting portion 13. 12d) can be soldered to suppress the rise along the surface of the solder. This makes it possible to prevent the fall of the bonding strength with the substrate by making the amount of solder applied between the bonding surfaces with the substrate appropriate.

Next, the bonding of the connector 1 to the board | substrate is demonstrated. 11 is a view for explaining a state in which the connector of the present embodiment is surface mounted on a substrate 20. The connector 1 having the plate member 4 described above is mounted on the surface of the substrate 20 on which a predetermined wiring pattern is formed. The wiring pad 21 is formed in the board | substrate 20 in the position which the several pin contacts 2 of the connector 1 contact, and the metallic pad 22 is in the position which contacts the plate-shaped member 4, respectively. Formed. The connector 1 is bonded to each of the pads 21 and 22 on the substrate 20 by means of a reflow method or the like, while many other electronic components and the like are bonded at portions not shown on the substrate 20. As a result, a substrate unit is formed.

Such a board | substrate unit is used for automobile meters etc., and may be left to stand in the environment of very high temperature at the time of use. Under such a high temperature, the housing 3 and the substrate 20 of the connector 1 are elongated and deformed by thermal expansion, but the materials are different and the thermal expansion coefficients are different. For this reason, the position shift of each pin contact 2 of the connector 1 with respect to each wiring pad 21 on the board | substrate 20, and the junction part of the plate member 4 with respect to the pad 22 on the board | substrate 20 ( Position shift of 12) is easy to occur. In particular, in the plate-like member 4 attached to both end faces positioned farthest from the center position of the housing 3, the degree of this position shift is large.

On the other hand, in the connector 1 of this embodiment, since the extension installation part 13 is not joined to the housing 3, as shown in FIG. 4, the extension installation part 13 of the plate-shaped member 4, and A gap portion S is formed between the junction 12 and the end face of the housing 3. That is, a part of both end surfaces of the housing 3 is provided with a recessed cutout portion 14 (see Fig. 12) to form the gap portion S. For this reason, this clearance part S functions as the elastic deformation area | region of the plate-shaped member 4, and absorbs the expansion deformation of the housing | casing 3. As shown in FIG. That is, when the plate-shaped member 4 is bent in the longitudinal direction of the housing 3 and deformed due to the difference in the coefficient of thermal expansion of the housing 3 and the substrate 20 described above, the extension mounting portion 13 is a gap portion ( It becomes possible to be deformed flexibly at S), and thereby it becomes possible to relieve the stress to the junction part of the junction part 12 and the board | substrate 20. FIG.

FIG. 12 is an explanatory diagram for explaining a state when the housing 3 of the connector 1 is elongated and deformed in the longitudinal direction by thermal expansion. As shown in Fig. 12, when the extension deformation side of the housing 3 is larger than the extension deformation of the substrate 20, the housing (3) is positioned with respect to the position of the bonding portion 12 bonded to the pad 22 on the substrate 20. The attachment part 11 (refer FIG. 7) attached to 3) causes position shift on the right side of FIG. 12 by pressurization at the time of the extension deformation by thermal expansion of the housing 3, and with this, the extension installation part 13 ) Is elastically deformed to bend in the gap portion S. FIG. By this elastic deformation, it becomes possible to relieve the stress added to the bonding portion between the bonding portion 12 and the pad 22 of the substrate 20.

In particular, in the present embodiment, the joining state is described with respect to the above-described stress by the two second joining surfaces 2b and the curved surfaces 12c (see FIG. 7) extending along the bending direction of the extension mounting part 13. It is possible to keep it strong, and to prevent the torsional deformation accompanying the elastic deformation in the extension mounting part 13, and to improve the bonding strength with the board | substrate 20 further. In addition, in FIG. 12, in order to show the position shift by the thermal expansion of the housing | casing 3 and the board | substrate 20 easily, the position by the extension deformation at the time of thermal expansion on the basis of the bonding position of the junction part 12 and the pad 22 is shown. The deviation is shown by the broken line.

Next, the modification of the junction part 12 of the plate member 4 mentioned above is demonstrated using FIG.13 and FIG.14. In the present embodiment shown in Figs. 1 to 12, the junction part 12 has a pair of opposing second joint surfaces 12a and has a U-shaped cross section, but the shape of the junction part 12 is limited thereto. It is also possible to use a junction part of the type shown in Figs. 13 and 14.

The junction part 30 shown in FIG. 13 has the 1st junction surface 31 formed so that it may extend along the short direction of a housing | casing (not shown), and the 1st junction surface from the edge of the one end part of the said 1st bonding surface 31. FIG. The second joining surface 32 formed to extend in the longitudinal direction of the housing so as to be substantially perpendicular to the 31, and the curved surface 33 formed between the first joining surface 31 and the second joining surface 32. Have

That is, this connector is provided with the 2nd joining surface 32 and the curved surface 33 with respect to one joining part, respectively, and has a substantially L-shaped cross section. As the second bonding surface 32 is formed in this manner, the bonding portion 30 increases in the bonding area with the substrate and extends along the bending deformation direction with respect to the additional stress accompanying bending deformation in the longitudinal direction of the housing. Bonding strength is further improved in order to prevent peeling by the joining surface of the 2nd joining surface 32 and a board | substrate which become.

Fig. 14 is a perspective view showing another modification of the reinforcing tab used in the connector of the present invention. The joining portion 40 shown in Fig. 14 is formed such that the second joining surface 42 extends from one end edge of the first joining surface 41 along the longitudinal direction of the housing. The junction portion 40 of FIG. 14 has a second bonding surface 42 except that the second bonding surface 42 is formed on an end edge side separate from the end corner where the second bonding surface 32 of the bonding portion 30 of FIG. 13 is formed. It is the same structure as the junction part 30 of this. By setting it as such a structure, it becomes possible to exhibit the same effect as the junction part 30 mentioned above.

According to the present invention, since the plate-shaped member serving as the reinforcing portion is attached to the housing so that a gap portion with the housing is formed in the extension portion, the extension portion is flexibly deformed in the elastic deformation region of the gap portion, so that the junction portion and the substrate are separated. The stress to the junction part of can be alleviated. For this reason, when joining a board | substrate through solder | pewter, for example, problems, such as peeling of a solder and a crack, can be reduced.

In addition, according to the present invention, the two joining portions branched from the attachment portion and formed at the end of the extended installation portion can further relieve the stress to the joining portion with the substrate in two places.

Moreover, according to this invention, by providing a deformation | transformation allowance part in a pin contact, it becomes possible to relieve by stress-straining the stress which concentrates on the connection part with a board | substrate.

In addition, according to the present invention, by increasing the bonding area in the bonding portion to the substrate, it is possible to more firmly maintain the bonding between the substrate and the additional stress between the bonding portion and the bonding portion of the substrate.

Claims (5)

It is a connector mounted on the board | substrate with the housing which hold | maintains several pin contacts in the longitudinal direction, and the plate member which is elastically deformable attached to the both ends of the said longitudinal direction, End faces to which the plate member is attached are formed at both ends in the longitudinal direction of the housing, The plate member has an attachment portion that is in close contact with the end face, a junction portion having a junction surface joined to the substrate, and an extension attachment portion connecting the attachment portion and the junction portion, between the extension attachment portion and an end face of the housing. A connector, wherein a gap portion is formed. The said extension installation part is a 1st extension installation part extended from the one end part of the said attachment part, and the 2nd extension installation part extended from the other end part of the said attachment part, The said junction part is a said 1st extension installation part. And a second joining portion connected to the second joining portion and a first joining portion connected to the portion. The connector according to claim 1 or 2, wherein a length of a joining surface of the joining portion is longer than a cross-sectional overall length dimension when the extension mounting portion is cut into a plane parallel to the joining surface. 4. The pin contact according to any one of claims 1 to 3, wherein the pin contact is held between the held portion held by the housing, a connecting portion connected to a wiring pad formed on the substrate, and the connecting portion and the held portion. A connector comprising a deformation allowable portion which is formed in a bending deformation. The plurality of pins by using a connector mounted on a substrate surface, the housing including a housing holding the pin contacts in the longitudinal direction and an elastically deformable plate member attached to both ends of the housing in the longitudinal direction. Each of the contacts is connected to a wiring pad formed on the substrate and bonded to each other to connect the electrical components to the substrate. End faces to which the plate member is attached are formed at both ends in the longitudinal direction of the housing, The plate member has an attachment portion that is in close contact with the end face, a junction portion having a junction surface joined to the substrate, and an extension attachment portion connecting the attachment portion and the junction portion, And said connector is joined by soldering said joining portion to said substrate in a state where a gap portion is formed between an end face of said housing and an extended mounting portion of said plate member.