KR20040085733A - Device for exposing wafer of semiconductor device, and method therefor - Google Patents

Abstract

PURPOSE: A wafer exposure apparatus for a semiconductor device and an exposure method are provided to improve the exactness of an exposure process by shielding only a necessary chip from light using a driving circuit part. CONSTITUTION: A wafer exposure apparatus(200) includes a plurality of liquid crystal display elements and a driving circuit part. The plurality of liquid crystal display elements(220a,220b,220c) are formed on the same plane and used as a light source for exposing wafer chips(230a,230b,230c). The driving circuit part(210) is electrically connected with each liquid crystal display element, so that the driving circuit part is capable of turning on the liquid crystal display elements, selectively.

Description

Device for exposing wafer of semiconductor device and method for exposing thereof {Device for exposing wafer of semiconductor device, and method therefor}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer exposure apparatus of a semiconductor device and an exposure method using the same. More particularly, the present invention relates to a wafer exposure apparatus of a semiconductor device for blocking or passing light using a liquid crystal display in a lithography and exposure process and an exposure method using the same. It is about.

In the exposure process of the conventional semiconductor device, the exposure process is performed on the entire surface of the wafer by using a mask in which chips of the same structure are placed in a certain array. In this case, normal patterning is impossible at the wafer edge and defects caused by foreign matters are caused. There is.

To solve this problem, the chip 20a of the edge portion of the wafer 20 is not exposed by light blocking using a blade as shown in FIG. 1.

This conventional blade is configured to adjust the size of the exposure area 10 by adjusting the four plates 5 in the X-axis and Y-axis.

When this is applied to a 2x3 chip array mask, as shown in FIG. 2, there is only one light blocking target chip 20a, but there is a problem in that even adjacent neighboring chips 20b are unnecessarily blocked at the same time.

That is, in the conventional blades, it is not only impossible to accurately position the blades according to the size of the chip array, but also there is a problem in that the exposure accuracy is poor due to mechanical problems and the process margins are poor.

Accordingly, the present invention has been made to solve the above-mentioned problems of the prior art, and by accurately shielding only the light-blocking target chip without unnecessarily shading the surrounding chips, improving exposure accuracy to increase the number of dies in the wafer and process margins. It is an object of the present invention to provide a wafer exposure method of a semiconductor device that can maximize the.

1 is a view for explaining a wafer exposure blade of a semiconductor device according to the prior art.

2 is a view for explaining an exposure method using a wafer exposure blade of a semiconductor device according to the prior art.

3A and 3B illustrate the operating principle of a liquid crystal display used in a wafer exposure apparatus of a semiconductor device according to the present invention.

4 illustrates a wafer exposure apparatus of a semiconductor device according to the present invention.

5 is a view for explaining an exposure method using a wafer exposure apparatus of a semiconductor device according to the present invention.

6A to 6E illustrate various exposure patterns formed by the wafer exposure apparatus of the semiconductor device according to the present invention.

(Code description of main parts of drawing)

100: upper polarizing plate 120: upper glass

150: optical axis 170: lower glass

190: lower polarizing plate 200: wafer exposure apparatus

210: driving circuit unit 220a, 220b, 220c: liquid crystal display

230a, 230b, 230c: Wafer Chips

300a, 300b, 300c, 300d, 300e: exposure pattern

The present invention for achieving the above object is formed on the same plane, a plurality of liquid crystal display used as a light source for exposure of the wafer; And a driving circuit part electrically connected to the plurality of liquid crystal displays to turn off the liquid crystal display facing the wafer chip to be shielded among the plurality of liquid crystal displays and to turn on the liquid crystal display facing the wafer chip to be exposed. Characterized in that configured to include.

(Example)

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3A and 3B illustrate the operating principle of a liquid crystal display used in a wafer exposure apparatus of a semiconductor device according to the present invention.

First, in the wafer exposure method of the semiconductor device according to the present invention, a liquid crystal display of TN (Twisted Nematic) mode is used.

The operation principle of the liquid crystal display of the TN mode is briefly described as follows.

As shown in FIG. 3A, when no voltage is applied, the light incident through the upper polarizing plate 100 and the upper glass 120 is lowered by the liquid crystal array in the TN mode with no change in the optical axis 150. Passes 170 and lower polarizer 190.

On the other hand, as shown in Figure 3b, when a voltage is applied to the light incident through the upper polarizing plate 100 and the upper glass 120 is the lower glass (by the liquid crystal arrangement of the TN mode of the optical axis 150 is changed) 170 and the lower polarizing plate 190 may be blocked.

4 is a view showing a wafer exposure apparatus of a semiconductor device according to the present invention, Figure 5 is a view for explaining an exposure method using a wafer exposure apparatus of a semiconductor device according to the present invention.

Hereinafter, the configuration of the wafer exposure apparatus of the semiconductor device according to the present invention as shown in FIG.

First, the wafer exposure apparatus 200 of the semiconductor device according to the present invention includes a driving circuit unit 210 and a plurality of liquid crystal displays 220a, 220b and 220c electrically connected thereto.

In addition, a plurality of chips 230a, 230b, and 230c are disposed below the plurality of liquid crystal displays 220a, 220b, and 220c, and a plurality of wafers W are disposed. Each of the plurality of chips 230a, 230b, and 230c is disposed to face each of the plurality of liquid crystal displays 220a, 220b, and 220c.

Hereinafter, the operation of the wafer exposure apparatus of the semiconductor device according to the present invention will be described.

First, since the chip 230c of the wafer edge portion (region B) is a target to be shielded, the liquid crystal display 220c disposed thereon is turned off, and the chips 230a and 230b of the wafer die (region A) are turned off. Since the target is to be exposed, the liquid crystal displays 220a and 220b disposed thereon are turned on.

As a result, the chip 230c of the wafer edge portion may be selectively shielded more accurately to expose only the chips 230a and 230b of the wafer die, thereby improving exposure accuracy in the exposure process.

That is, in the conventional exposure method, while having an accuracy of several tens of micrometers to several hundreds of micrometers, the exposure method according to the present invention can secure an accuracy of about several micrometers, which is a more precise one cell (pixel) size.

6A to 6E illustrate various exposure patterns formed by the wafer exposure apparatus of the semiconductor device according to the present invention.

As shown in FIGS. 6A to 6E, using the above-described wafer exposure apparatus of a semiconductor device, the liquid crystal display 220a (depending on the masking information regardless of the size and array of chips in the mask as well as its orientation and exposure pattern) ( The exposure patterns 300a, 300b, 300c, 300d, and 300e may be formed in various forms by turning on / off the 220b and 220c.

As described above, the present invention can increase the number of dies in the wafer by accurately shading only the desired chip by accurately exposing or shading to the size of the chip array, and also improving the exposure accuracy which distinguishes the scribe lines to an excellent level. This has the effect of maximizing process margins.

On the other hand, the present invention is not limited to the above-described specific preferred embodiments, and various changes can be made by those skilled in the art without departing from the gist of the invention claimed in the claims. will be.

Claims (2)

A plurality of liquid crystal displays formed on the same plane and used as a light source for exposure of the wafer; And A driving circuit part electrically connected to the plurality of liquid crystal displays to turn off the liquid crystal display facing the wafer chip to be shielded among the plurality of liquid crystal displays and to turn on the liquid crystal display facing the wafer chip to be exposed. Wafer exposure apparatus of a semiconductor device comprising a. Providing a semiconductor wafer having a plurality of chips formed thereon; Arranging a plurality of liquid crystal displays to face the plurality of chips, respectively; And And turning on the liquid crystal display of the chip portion to be exposed of the semiconductor wafer and turning off the liquid crystal display of the chip portion to be shielded to expose the semiconductor wafer. Exposure method.