KR20040048647A - Resin composition for shielding electro-magnetic interference - Google Patents

Resin composition for shielding electro-magnetic interference Download PDF

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KR20040048647A
KR20040048647A KR1020020076573A KR20020076573A KR20040048647A KR 20040048647 A KR20040048647 A KR 20040048647A KR 1020020076573 A KR1020020076573 A KR 1020020076573A KR 20020076573 A KR20020076573 A KR 20020076573A KR 20040048647 A KR20040048647 A KR 20040048647A
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density polyethylene
resin composition
electromagnetic wave
shielding
modified
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강현
김정호
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주식회사 현성테크
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/20—Silicates
    • C01B33/36—Silicates having base-exchange properties but not having molecular sieve properties
    • C01B33/38—Layered base-exchange silicates, e.g. clays, micas or alkali metal silicates of kenyaite or magadiite type
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/092—Polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0856—Iron

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE: Provided is a resin composition which has excellent mechanical property and moldability together with electromagnetic wave-blocking property, is used as products for delivering the semiconductors and housing materials for various electrical equipment. CONSTITUTION: The composition comprises: 100wt.% of polyolefin resin selected from a group of polypropylene, high density polyethylene, low density polyethylene, linear low density polyethylene and ethylene-propylene copolymer; 1-100wt.% of conductive electromagnetic wave-blocking agent selected from a group of ferrite, graphite and carbon black; 1-50wt.% of layered clay selected from a group of montmorillonite, bentonite, kaolinite, mica, hectorite, vermiculite and hallosite; and 1-100wt.% of coupling agent selected from anhydrous maleic acid-modified polypropylene, anhydrous maleic acid-modified(graft) high density polyethylene, anhydrous maleic acid-modified(graft) linear low density polyethylene and anhydrous maleic acid-modified(graft) ethylene-vinylacetate.

Description

전자파 차폐용 수지 조성물{RESIN COMPOSITION FOR SHIELDING ELECTRO-MAGNETIC INTERFERENCE}Resin composition for electromagnetic wave shielding {RESIN COMPOSITION FOR SHIELDING ELECTRO-MAGNETIC INTERFERENCE}

본 발명은 전자파 차폐용 수지 조성물에 관한 것으로, 특히 폐플라스틱을 이용할 수 있으며, 기계적 물성, 및 성형성이 우수하고, 전자파 차폐 능력이 우수하여 반도체 이송 제품 및 각종 전자기기의 하우징 소재로 사용할 수 있는 전자파 차폐용 수지 조성물에 관한 것이다.The present invention relates to a resin composition for shielding electromagnetic waves, in particular waste plastic can be used, excellent mechanical properties, moldability, excellent electromagnetic shielding ability can be used as a housing material for semiconductor transfer products and various electronic devices It relates to a resin composition for electromagnetic wave shielding.

일반적인 전자파 차폐 방법은 전자파 차폐용 전기 전도성 금속을 수지 등과 함께 코팅시킨 소재, 또는 전자파 차폐용 전기 전도성 금속 충전재가 함유된 소재를 사용하는 것이다. 특히 종래의 전자파 차폐용 전기 전도성 금속 충전재를 함유하는 전자파 차폐 플라스틱 소재는 금속 충전재와 소재의 매트릭스 수지의 분산도에 문제가 있어서 기계적 물성과 전자파 차폐 효과를 만족시키지 못하고 있다.A general electromagnetic shielding method is to use a material coated with an electrically conductive metal for electromagnetic shielding with a resin or the like, or a material containing an electrically conductive metal filler for electromagnetic shielding. In particular, the electromagnetic shielding plastic material containing the conventional electrically conductive metal filler for electromagnetic shielding has a problem in the degree of dispersion of the metal filler and the matrix resin of the material does not satisfy the mechanical properties and the electromagnetic shielding effect.

본 발명은 상기 종래기술의 문제점을 고려하여, 플라스틱 소재의 매트릭스 수지에 대한 전자파 차폐제의 분산성을 증대시켜 우수한 기계적 물성과 성형성을 나타낼 수 있으면서 전자파 차폐 효과가 우수한 전자파 차폐용 수지 조성물을 제공하는 것을 목적으로 한다.The present invention in consideration of the problems of the prior art, by increasing the dispersibility of the electromagnetic wave shielding agent to the matrix resin of the plastic material to provide an excellent electromagnetic shielding resin composition while exhibiting excellent mechanical properties and moldability For the purpose of

본 발명은 상기 목적을 달성하기 위하여, 전자파 차폐용 수지 조성물에 있어서, a) 폴리올레핀계 수지 100 중량부;The present invention, in order to achieve the above object, in the electromagnetic wave shielding resin composition, a) 100 parts by weight of a polyolefin resin;

b) 전기 전도성 전자파 차폐제 1 내지 100 중량부; 및b) 1 to 100 parts by weight of the electrically conductive electromagnetic shielding agent; And

c) 층상 점토화합물 1 내지 50 중량부c) 1 to 50 parts by weight of the layered clay compound

를 포함하는 전자파 차폐용 수지 조성물을 제공한다.It provides a resin composition for electromagnetic wave shielding.

또한 본 발명의 전자파 차폐용 수지 조성물은In addition, the resin composition for electromagnetic wave shield of the present invention

d) 커플링제 1 내지 100 중량부d) 1 to 100 parts by weight of coupling agent

를 추가로 포함할 수 있다.It may further include.

이하에서 본 발명을 상세하게 설명한다.Hereinafter, the present invention will be described in detail.

본 발명은 종래의 올레핀계 수지와 전기 전도성 전자파 차폐제를 포함하는 전자파 차폐용 수지에 층상 점토 화합물을 첨가하면, 전기 전도도가 크게 증가하여 전자파 차폐에 더욱 적합함을 발견하여 본 발명을 완성하게 되었다.The present invention, when the layered clay compound is added to the electromagnetic wave shielding resin including the conventional olefin resin and the electrically conductive electromagnetic wave shielding agent, the electrical conductivity is greatly increased to find a more suitable for electromagnetic shielding to complete the present invention.

이를 위하여, 본 발명의 전자파 차폐용 수지 조성물은 a) 폴리올레핀계 수지 100 중량부; b) 전기 전도성 전자파 차폐제 1 내지 100 중량부; c) 층상 점토화합물 1 내지 50 중량부; 및 필요시 d) 커플링제 1 내지 100 중량부를 포함한다.To this end, the resin composition for electromagnetic wave shield of the present invention a) 100 parts by weight of a polyolefin resin; b) 1 to 100 parts by weight of the electrically conductive electromagnetic shielding agent; c) 1 to 50 parts by weight of the layered clay compound; And if necessary d) 1 to 100 parts by weight of coupling agent.

본 발명에 사용되는 상기 a)의 폴리올레핀계 수지는 폴리프로필렌, 고밀도 폴리에틸렌(HDPE, high density polyethylene), 저밀도 폴리에틸렌(LDPE, low density polyethylene), 선형저밀도 폴리에틸렌(LLDPE, liner low densitypolyethylene), 또는 에틸렌-프로필렌 공중합체 등을 사용할 수 있다. 이러한 폴리올레핀계 수지는 플라스틱 소재에서 매트릭스 수지로 작용하며, 폐수지도 사용할 수가 있다. 특히 반도체 이송 제품 및 각종 전자기기의 하우징 소재에 사용할 때는 폴리프로필렌이 바람직하다.The polyolefin resin of a) used in the present invention is polypropylene, high density polyethylene (HDPE, high density polyethylene), low density polyethylene (LDPE, low density polyethylene), linear low density polyethylene (LLDPE, liner low density polyethylene), or ethylene- Propylene copolymers and the like can be used. Such polyolefin resins act as matrix resins in plastic materials, and waste resins can also be used. In particular, polypropylene is preferable for use in housing materials for semiconductor transfer products and various electronic devices.

본 발명에 사용되는 상기 b)의 전기 전도성 전자파 차폐제는 통상적인 전자파 차폐 소재에 함유되는 전기 전도성 금속, 전기전도성 탄소화합물 등을 사용할 수 있다. 그 예로는 페라이트(ferrite), 그라파이트(graphite), 카본블랙 등이 있으며, 폴리올레핀계 수지와의 상용성 및 전자파 차폐 효과를 고려하면 카본블랙이 특히 바람직하다. 이러한 카본블랙은 C-카본블랙, B-카본블랙, 및 Y-카본블랙으로 구분할 수 있는데, 그 중에서도 전자파 차폐 효과를 고려하면 C-카본블랙이 바람직하다.The electrically conductive electromagnetic shielding agent of b) used in the present invention may use an electrically conductive metal, an electrically conductive carbon compound, and the like contained in a conventional electromagnetic shielding material. Examples thereof include ferrite, graphite, carbon black, and the like, and carbon black is particularly preferable in view of compatibility with polyolefin resins and electromagnetic shielding effects. Such carbon black may be classified into C-carbon black, B-carbon black, and Y-carbon black, and among them, C-carbon black is preferable in consideration of the electromagnetic shielding effect.

이와 같은 전기 전도성 전자파 차폐제는 조성물 내에 매트릭스를 이루는 폴리올레핀 수지 100 중량부에 대하여 1 내지 100 중량부를 함유시키는 것이 바람직하다. 1 중량부 미만이면 전자파 차폐 효과가 낮고, 100 중량부를 초과하면 매트릭스 내에 분산시키기가 어렵다.Such an electrically conductive electromagnetic shielding agent preferably contains 1 to 100 parts by weight based on 100 parts by weight of the polyolefin resin forming the matrix in the composition. If it is less than 1 part by weight, the electromagnetic shielding effect is low. If it exceeds 100 parts by weight, it is difficult to disperse in the matrix.

본 발명에 사용되는 상기 c)의 층상 점토화합물은 조성물 내에 함유되어 전도성 전자파 차폐효과를 증대시키는 역할을 하는 첨가제로 작용한다. 층상 점토화합물은 실리케이트 화합물로, 1 ㎚ 정도 두께의 음전하를 갖는 옥사이드 층들이 적층되어 있으며, 층 사이의 중간층에는 Na+와 같은 양이온을 함유할 수 있어서 옥사이드 층의 전하를 상쇄하고 있는 형태를 가지고 있고, 실리케이트 층에서 전자파의 파장 진동을 흡수하여 소재로 방사되는 전자파를 차단하며, 특히 전계 뿐만 아니라 자계에 대한 차폐 효과도 제공할 수 있다.The layered clay compound of c) used in the present invention is contained in the composition to act as an additive that serves to enhance the conductive electromagnetic shielding effect. The layered clay compound is a silicate compound, in which oxide layers having negative charges having a thickness of about 1 nm are stacked, and an intermediate layer between layers may contain a cation such as Na + to offset the charge of the oxide layer. In addition, the silicate layer absorbs the wavelength vibration of the electromagnetic wave to block the electromagnetic wave emitted to the material, and may provide a shielding effect on the magnetic field as well as the electric field.

또한 층상 점토화합물은 유기물이 층상점토화합물의 층간 사이에 개재되어 있는 유기화된 층상 점토화합물인 것이 바람직하다. 층상 점토 화합물은 실리케이트 층을 가지며, 이러한 실리케이트 층 간의 강한 인력과 친수성으로 인하여 고분자 사슬이 침투하기가 대단히 어렵다. 그러나 알킬 암모늄과 같은 유기물을 층상 점토화합물과 혼합할 경우 양이온 유기화제인 알킬 암모늄이 실리케이트 층간에 침투하여 층상 점토화합물과 여타 수지의 나노컴포지트(nanocomposite)를 형성하도록 하고, 그 결과 친유성을 나타내게 하고 표면 에너지를 낮추게 된다.In addition, the layered clay compound is preferably an organic layered clay compound in which an organic substance is interposed between the layers of the layered clay compound. Layered clay compounds have a silicate layer, and due to the strong attraction and hydrophilicity between these silicate layers, polymer chains are very difficult to penetrate. However, when an organic material such as alkyl ammonium is mixed with a layered clay compound, alkyl ammonium, a cationic organizing agent, penetrates between the silicate layers to form nanocomposites of the layered clay compound and other resins, resulting in lipophilic results. Lowers the surface energy.

이와 같은 유기화된 층상 점토화합물은 폴리올레핀계 고분자와 친화성이 우수하여 상기 전기 전도성 전자파 차폐제의 분산을 도와서 전자파 차폐 효과를 증대시키며, 더욱이 층상에 침투된 유기 화합물에 의해 실리케이트 층에서 전자파의 파장 진동을 흡수하는 것은 물론, 전자파 차폐용 수지 내부에 미세하게 박리된 층상점토화합물이 차단막을 형성하게 되어 전자파의 투과를 차단한다. 또한 전자파 차폐용 수지에 기체 투과성과 수분 투과성을 억제할 수 있으며, 기계적 물성을 향상시킬 수 있으며, 이 수지를 타소재에 코팅처리할 경우 경도, 내스크레치의 향상, 및 내마모성 등의 물성 향상을 제공할 수도 있다.The organic layered clay compound has excellent affinity with the polyolefin-based polymer to help disperse the electrically conductive electromagnetic wave shielding agent, thereby increasing the electromagnetic wave shielding effect. Furthermore, the organic compound penetrated on the layer prevents the vibration of the electromagnetic wave in the silicate layer. As well as absorbing, the finely peeled layered clay compound inside the resin for shielding electromagnetic waves to form a blocking film to block the transmission of electromagnetic waves. In addition, it is possible to suppress gas permeability and water permeability, improve mechanical properties, and improve physical properties such as hardness, scratch resistance, and abrasion resistance when the resin is coated on other materials. You may.

층상 점토화합물의 실리케이트 층간에 유기물을 삽입하는 방법은 용액법, 층간중합법, 용융삽입법 등이 있으며, 용액법은 층상 점토화합물을 고분자 용액에 침지 분산시켜 용매가 실리케이트 층을 침투하게 하고 건조 과정 중에 고분자 수지에 분산되도록 하는 것이며, 중합법은 층상 점토화합물의 층간에 중합가능한 단량체를 삽입시킨 후 중합시켜 실리케이트 층의 박리를 유도하는 것이며, 용융삽입법은 고분자를 용융시킨 상태에서 층상 점토화합물을 혼합하여 층상 점토화합물의 실리케이트 층 사이로 고분자가 삽입되도록 하는 것이다.The organic material is inserted into the silicate layer of the layered clay compound by the solution method, the interlayer polymerization method, and the melt insertion method.The solution method is to immerse and disperse the layered clay compound in the polymer solution so that the solvent penetrates the silicate layer and the drying process The polymerizing method is to insert a polymerizable monomer between the layers of the layered clay compound and then polymerize to induce separation of the silicate layer. By mixing, the polymer is inserted into the silicate layer of the layered clay compound.

이와 같은 층상 점토화합물은 몬모릴로나이트(montmorllonite), 벤토나이트(bentonite), 카올린나이트(kalinite), 마이카(mica), 헥토라이트(hectorite), 버미큘라이트(vermiculite), 및 할로사이트(hallosite) 등이 있으며, 특히 몬모릴로나이트가 바람직하다.Such layered clay compounds include montmorllonite, bentonite, kalinite, mica, hectorite, vermiculite, and halosite, in particular montmorillonite. Is preferred.

또한 양이온 유기화제로 작용할 수 있는 유기물은 4차 암모늄(quaternary ammonium), 메틸(methyl), 탈로우(tallow), 비스-2-하이드록시에틸(bis-2-hydorxyethyl), 포스포늄(phosphonium), 말레이에이트(maleate), 석시네이트(succinate), 아크릴레이트(acrylate), 벤질릭 하이드로젠(benzyic hydrogens), 및 옥사졸린(oxazoline) 등의 작용기를 가지는 유기물 또는 그의 염이다.In addition, organic materials that can act as cationic organizing agents include quaternary ammonium, methyl, tallow, bis-2-hydroxyethyl, phosphonium, Organics or salts thereof having functional groups such as maleate, succinate, acrylate, benzyic hydrogens, and oxazoline.

이와 같은 층상 점토화합물은 조성물 내에 매트릭스를 이루는 폴리올레핀계 수지 100 중량부에 대하여 1 내지 50 중량부를 함유시키는 것이 바람직하다. 1 중량부 미만이면 전자파 차폐 효과가 낮고, 50 중량부를 초과하면 매트릭스 내에 분산시키기가 어렵고, 첨가량 만큼 전자파 차폐 증대 효과가 나타나지 않는다.Such a layered clay compound is preferably contained 1 to 50 parts by weight with respect to 100 parts by weight of the polyolefin resin forming a matrix in the composition. If it is less than 1 part by weight, the electromagnetic shielding effect is low. If it is more than 50 parts by weight, it is difficult to disperse in the matrix.

본 발명에 필요시 첨가되는 상기 d)의 커플링제는 상기 폴리올레핀 수지에대한 전기 전도성 전자파 차폐제, 및 층상 점토화합물 들의 상용성, 및 분산성을 향상시켜 안정한 구조의 수지를 형성시키는 작용을 한다.The coupling agent of d), which is added as necessary in the present invention, serves to form a resin having a stable structure by improving the compatibility and dispersibility of the electrically conductive electromagnetic wave shielding agent and the layered clay compounds with respect to the polyolefin resin.

이러한 커플링제는 무수말레인산 변성 폴리프로필렌, 무수말레인산 변성(그라프트)고밀도 폴리에틸렌, 무수말레인산 변성(그라프트)선형 저밀도 폴리에틸렌, 및 무수말레인산 변성(그라프트)에틸렌-비닐아세테이트 공중합체로 이루어지는 군으로부터 1 종 이상 선택하여 사용할 수 있으며, 사용량은 폴리올레핀계 수지 100 중량부에 대하여 1 내지 100 중량부를 함유시키는 것이 바람직하다. 1 중량부 미만이면 상용성 및 분산 증대 효과가 낮아서 전자파 차폐 효과가 낮아질 수 있으며, 100 중량부를 초과하면 첨가량 만큼 상용성 및 분산 증대 효과나 전자파 차폐 효과가 증대되지 않아서 비경제적이다.This coupling agent is selected from the group consisting of maleic anhydride-modified polypropylene, maleic anhydride-modified (graft) high density polyethylene, maleic anhydride-modified (graft) linear low density polyethylene, and maleic anhydride-modified (graft) ethylene-vinylacetate copolymer. It can select and use more than 1 type, It is preferable to contain 1-100 weight part with respect to 100 weight part of polyolefin resins. Less than 1 part by weight may lower the compatibility and dispersion enhancement effect, thereby lowering the electromagnetic wave shielding effect. If it is more than 100 parts by weight, the compatibility and dispersion increase effect or the electromagnetic shielding effect may not be increased by the amount added, which is uneconomical.

본 발명의 전자파 차폐용 수지 조성물은 폴리올레핀계 수지, 전기 전도성 전자파 차폐제, 층상 점토화합물, 및 필요시 커플링제를 혼합하여 제조한다. 제조된 전자파 차폐용 수지는 그대로 압출 또는 사출하여 일반 플라스틱 제품으로 제조할 수 있다. 따라서 종래의 코팅 등과 같은 후가공이 필요없기 때문에 전자파 차폐용 플라스틱 제품의 성형 공정이 단순화될 수 있다.The resin composition for electromagnetic wave shield of the present invention is prepared by mixing a polyolefin resin, an electrically conductive electromagnetic wave shielding agent, a layered clay compound, and a coupling agent if necessary. The prepared electromagnetic shielding resin may be manufactured as a general plastic product by extrusion or injection as it is. Therefore, the molding process of the electromagnetic wave shielding plastic product can be simplified since there is no need for post-processing such as a conventional coating.

또한 제조된 전자파 차폐용 수지를 용매에 용해하여 용액으로 제조하고, 이용액을 전자파 차폐가 필요한 각종 소재에 코팅하여 코팅된 소재에 전자파 차폐 효과를 부여할 수도 있다.In addition, the prepared electromagnetic shielding resin may be dissolved in a solvent to prepare a solution, and the solution may be coated on various materials requiring electromagnetic shielding to impart an electromagnetic shielding effect to the coated material.

이하의 실시예 및 비교예를 통하여 본 발명을 더욱 상세하게 설명한다. 단, 실시예는 본 발명을 예시하기 위한 것이지 이들만으로 한정되는 것은 아니다.The present invention will be described in more detail with reference to the following examples and comparative examples. However, an Example is for illustrating this invention and is not limited only to these.

[실시예]EXAMPLE

실시예 1∼19, 비교예 1∼5Examples 1-19, Comparative Examples 1-5

(전자파 차폐용 수지의 제조)(Manufacture of resin for electromagnetic wave shield)

하기 표 1에 나타낸 조성과 같이 일반 폴리프로필렌 수지, 전기 전도성 전자파 차폐제(Y-카본블랙, B-카본블랙, C-카본블랙, 페라이트, 그라파이트), 층상 점토화합물(몬모릴로나이트, 유기물로 개질된 몬모릴로나이트 : cloisite 30B, cloisite 15A), 및 무수말레인산 변성 폴리프로필렌(무수말레인산 15 내지 30 중량% 함유)을 일반 혼합기에서 혼합하여 전자파 차폐용 수지를 제조하고, 이를 압출하여 전자파 차폐 성능을 가지는 두께 1 mm의 흑색 시트를 제조하였다.As shown in Table 1, a general polypropylene resin, an electrically conductive electromagnetic wave shielding agent (Y-carbon black, B-carbon black, C-carbon black, ferrite, graphite), a layered clay compound (montmorillonite, montmorillonite modified with organic matter): Cloisite 30B, cloisite 15A), and maleic anhydride-modified polypropylene (containing 15 to 30% by weight of maleic anhydride) were mixed in a general mixer to prepare an electromagnetic wave shielding resin, and extruded to have a thickness of 1 mm black having electromagnetic wave shielding performance. Sheets were prepared.

전자파 차폐 소재의 차폐성능은 소재의 전기 전도도가 증가할수록 차폐효율이 높아지므로 제조된 시트의 전기 전도도를 측정하여 차폐 성능 정도를 하기 표 1에 조성과 함께 비교하였다.The shielding performance of the electromagnetic shielding material increases the shielding efficiency as the electrical conductivity of the material increases, so the electrical shielding performance of the manufactured sheet was measured and the shielding performance was compared with the composition in Table 1 below.

하기 표에서, PP는 일반 폴리프로필렌이고, Y-CB는 코리아카본블랙사 제조 Y형 카본블랙 41Y이고, B-CB는 코리아카본블랙사 제조 B형 카본블랙 30B이고, C-CB는 CABOT사 제조 C형 카본블랙 VULCAN XC-72이고, MMT는 개질되지 않은 천연 몬모릴로나이트이고, MMT30B는 하기 화학식 1로 표시되는 4급 암모늄염으로 유기화된 몬모릴로나이트이고, MMT15A는 하기 화학식 2로 표시되는 4급 암모늄염으로 유기화된 몬모릴로나이트이며, 전자파 차폐율은 ASTM D4985-89에 따라서 측정하였다.In the following table, PP is general polypropylene, Y-CB is Y-type carbon black 41Y manufactured by Korea Carbon Black, B-CB is B-type carbon black 30B manufactured by Korea Carbon Black, and C-CB is manufactured by CABOT. Type C carbon black VULCAN XC-72, MMT is unmodified natural montmorillonite, MMT30B is montmorillonite organicated with a quaternary ammonium salt represented by the following formula (1), MMT15A is organicized with a quaternary ammonium salt represented by the following formula (2) It is montmorillonite, and the electromagnetic wave shielding rate was measured according to ASTM D4985-89.

(화학식 1)(Formula 1)

(화학식 2)(Formula 2)

상기 화학식 1, 및 2의 식에서, T는 tallow 이고, HT는 수소화된 tallow이다.In the formulas (1) and (2), T is tallow and HT is hydrogenated tallow.

구 분division 조 성 (중량부)Composition (parts by weight) 물 성Properties 폴리올레핀Polyolefin 전기전도성 전자파차폐제Electrically conductive electromagnetic shielding agent 층상 점토화합물Layered clay compound 커플링제Coupling agent PPPP Y-CBY-CB B-CBB-CB C-CBC-CB MMTMMT MMT30BMMT30B MMT15AMMT15A 무수말레인산변성 폴리프로필렌Maleic anhydride modified polypropylene 전기전도도(Ω·cm)Electrical Conductivity (Ωcm) 300㎒전자파 차폐율(dB)300MHz electromagnetic shielding rate (dB) 900㎒전자파 차폐율(dB)900MHz electromagnetic shielding rate (dB) 비교예 1Comparative Example 1 100100 -- -- -- -- -- -- -- -- 비교예 2Comparative Example 2 7070 3030 -- -- -- -- -- -- 1.9x10-4 1.9 x 10 -4 실시예 1Example 1 7070 2929 -- -- 1One -- -- -- 0.0010.001 비교예 3Comparative Example 3 5050 3030 -- -- -- -- -- 2020 0.00830.0083 2222 2424 실시예 2Example 2 5050 2929 -- -- 1One -- -- 2020 -- 실시예 3Example 3 5050 2525 -- -- 55 -- -- 2020 0.1800.180 실시예 4Example 4 5050 2929 -- -- -- 1One -- 2020 -- 실시예 5Example 5 5050 2525 -- -- -- 55 -- 2020 0.1800.180 실시예 6Example 6 5050 2929 -- -- -- -- 1One 2020 0.1360.136 실시예 7Example 7 5050 2525 -- -- -- -- 55 2020 0.1700.170 비교예 4Comparative Example 4 5050 -- 3030 -- -- -- -- 2020 0.0120.012 2727 2828 실시예 8Example 8 5050 -- 2929 -- 1One -- -- 2020 -- 실시예 9Example 9 5050 -- 2525 -- 55 -- -- 2020 0.2130.213 실시예 10Example 10 5050 -- 2929 -- -- 1One -- 2020 -- 실시예 11Example 11 5050 -- 2525 -- -- 55 -- 2020 0.2260.226 실시예 12Example 12 5050 -- 2929 -- -- -- 1One 2020 0.1510.151 실시예 13Example 13 5050 -- 2525 -- -- -- 55 2020 0.1950.195 비교예 5Comparative Example 5 5050 -- -- 3030 -- -- -- 2020 0.0210.021 3030 3232 실시예 14Example 14 5050 -- -- 2929 1One -- -- 2020 -- 실시예 15Example 15 5050 -- -- 2525 55 -- -- 2020 0.0260.026 실시예 16Example 16 5050 -- -- 2929 -- 1One -- 2020 -- 실시예 17Example 17 5050 -- -- 2525 -- 55 -- 2020 0.2390.239 실시예 18Example 18 5050 -- -- 2929 -- -- 1One 2020 0.1940.194 실시예 19Example 19 5050 -- -- 2525 -- -- 55 2020 0.2640.264

본 발명의 전자파 차폐용 수지 조성물은 플라스틱 소재의 매트릭스 수지에 대한 전자파 차폐제의 분산성을 증대시켜 우수한 기계적 물성과 성형성을 나타낼 수 있으면서 전자파 차폐 효과가 우수하다.The resin composition for electromagnetic wave shield of the present invention increases the dispersibility of the electromagnetic wave shielding agent with respect to the matrix resin of the plastic material and can exhibit excellent mechanical properties and moldability, and is excellent in the electromagnetic wave shielding effect.

Claims (7)

전자파 차폐용 수지 조성물에 있어서,In the resin composition for electromagnetic wave shield, a) 폴리올레핀계 수지 100 중량부;a) 100 parts by weight of polyolefin resin; b) 전기 전도성 전자파 차폐제 1 내지 100 중량부; 및b) 1 to 100 parts by weight of the electrically conductive electromagnetic shielding agent; And c) 층상 점토화합물 1 내지 50 중량부c) 1 to 50 parts by weight of the layered clay compound 를 포함하는 전자파 차폐용 수지 조성물.Resin composition for electromagnetic shielding comprising a. 제 1 항에 있어서,The method of claim 1, d) 커플링제 1 내지 100 중량부d) 1 to 100 parts by weight of coupling agent 를 추가로 포함하는 전자파 차폐용 수지 조성물.Electromagnetic shielding resin composition comprising a further. 제 1 항에 있어서,The method of claim 1, 상기 a)의 폴리올레핀계 수지가 폴리프로필렌, 고밀도 폴리에틸렌(HDPE, high density polyethylene), 저밀도 폴리에틸렌(LDPE, low density polyethylene), 선형저밀도 폴리에틸렌(LLDPE, liner low density polyethylene), 및 에틸렌-프로필렌 공중합체로 이루어진 군으로부터 선택되는 전자파 차폐용 수지 조성물.The polyolefin resin of a) is polypropylene, high density polyethylene (HDPE, high density polyethylene), low density polyethylene (LDPE, low density polyethylene), linear low density polyethylene (LLDPE, liner low density polyethylene), and ethylene-propylene copolymer Resin composition for electromagnetic wave shield selected from the group consisting of. 제 1 항에 있어서,The method of claim 1, 상기 b)의 전기 전도성 전자파 차폐제가 페라이트(ferrite), 그라파이트(graphite), 및 카본블랙으로 이루어진 군으로부터 선택되는 전자파 차폐용 수지 조성물.The electrically conductive electromagnetic wave shielding agent of b) is a resin composition for electromagnetic wave shielding, selected from the group consisting of ferrite, graphite, and carbon black. 제 1 항에 있어서,The method of claim 1, 상기 c)의 층상 점토 화합물이 몬모릴로나이트(montmorllonite), 벤토나이트(bentonite), 카올린나이트(kalinite), 마이카(mica), 헥토라이트(hectorite), 버미큘라이트(vermiculite), 및 할로사이트(hallosite)로 이루어진 군으로부터 선택되는 전자파 차폐용 수지 조성물.The layered clay compound of c) is montmorllonite, bentonite, bentonite, kalinite, mica, hectorite, vermiculite, and halosite from the group consisting of Selected resin composition for electromagnetic shielding. 제 5 항에 있어서,The method of claim 5, wherein 상기 몬모릴로나이트가 유기화된 몬모릴로나이트인 전자파 차폐용 수지 조성물.The resin composition for electromagnetic wave shielding, wherein the montmorillonite is montmorillonite organic. 제 2 항에 있어서,The method of claim 2, 상기 d)의 커플링제가 무수말레인산 변성 폴리프로필렌, 무수말레인산 변성(그라프트)고밀도 폴리에틸렌, 무수말레인산 변성(그라프트)선형 저밀도 폴리에틸렌, 및 무수말레인산 변성(그라프트)에틸렌-비닐아세테이트 공중합체로 이루어지는 군으로부터 1 종 이상 선택되는 전자파 차폐용 수지 조성물.The coupling agent of d) consists of maleic anhydride-modified polypropylene, maleic anhydride-modified (graft) high density polyethylene, maleic anhydride-modified (graft) linear low density polyethylene, and maleic anhydride-modified (graft) ethylene-vinylacetate copolymer 1 or more types of resin composition for electromagnetic wave shielding selected from the group.
KR1020020076573A 2002-12-04 2002-12-04 Resin composition for shielding electro-magnetic interference KR20040048647A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060083513A (en) * 2005-01-17 2006-07-21 엘에스전선 주식회사 A composition for sheath having high electromagnetic shielding performance and a cable having a sheath made thereof
WO2021125542A1 (en) * 2019-12-19 2021-06-24 손기명 Pouch for electromagnetic interference shielding
CN113121972A (en) * 2019-12-30 2021-07-16 江苏派锐电子有限公司 Novel easy-heat-dissipation anti-aging electronic component plastic shell material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060083513A (en) * 2005-01-17 2006-07-21 엘에스전선 주식회사 A composition for sheath having high electromagnetic shielding performance and a cable having a sheath made thereof
WO2021125542A1 (en) * 2019-12-19 2021-06-24 손기명 Pouch for electromagnetic interference shielding
CN113121972A (en) * 2019-12-30 2021-07-16 江苏派锐电子有限公司 Novel easy-heat-dissipation anti-aging electronic component plastic shell material

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