KR200378833Y1 - Slit nozzle for photo register coating - Google Patents

Abstract

The present invention relates to a fluid ejection mechanism having a slit nozzle for uniformly applying a photo resist to a surface of a color filter (C / F) glass substrate for a liquid crystal display device. The injection mechanism according to the present invention is a chamber space formed in an ellipsoidal shape in the interior of the body is made of a front plate and the back plate is abut; A gap spacer used to maintain a substrate gap between the front plate and the back plate and to secure a developer as much as an application amount; An input terminal through which a photoresist or the like is introduced; With a load formed in the longitudinal direction of the body at the bottom of the body between the front plate and the back plate, it is a mechanism for injecting the developer supplied to the chamber space from the source to the substrate by the thickness of the load through the inlet communicating with the source.

The fluid ejection mechanism according to the present invention can apply a photoresist or the like using a slit nozzle and then uniformly apply the spin through spin; A slit-type nozzle which has undergone the processing, polishing and heat treatment process sequence to maintain flatness by deformation of the nozzle material, and has an H-type trust structure; The internal structure of the slit nozzle includes a shape in which the photoresist is uniformly supplied to the entire load by forming a long ellipse shape.

Description

Slit nozzle for photoresist coating {Slit nozzle for photo register coating}

The present invention relates to a jetting mechanism having a slit nozzle for uniformly applying a photo resist or the like to a surface of a color filter (C / F) glass substrate for a liquid crystal display (LCD). Specifically, the present invention relates to a fluid ejection mechanism in which a nozzle is formed in a slit so as to eject the fluid at an even pressure over the entire substrate.

More precisely, as a means of uniformly applying photoresist, etc., centrifugal force is applied by rotating the substrate after uniformly applying photoresist to the entire glass plane with a precise gap of the slit nozzle. It is the purpose of making the coating operation more uniform by using the method. When the spin is applied after applying the present slit nozzle, the film of the photosensitive liquid can be obtained even more uniformly.

Photo Resist Coating (P / R) methods include roller coating and spin coating. The roller coating method is uniformly applied on the upper surface of ITO (Indium Tin Oxide) glass (Glass) to a thickness of about 1.5㎛. The spin coating method, which is a method of applying photoresist, etc. to flat glass, is made of a stainless steel tube.The nozzle size is 1/4 "or Ø6 mm. It pressurizes the photoresist by using a N2 gas (Gas) in a fixed quantity supply pump, a fixed quantity supply cylinder or a vacuum tank, and supplies it by the time unit, and rotates the glass coated with the supplied photosensitive liquid. In other words, a centrifugal force is used to apply a thin film having a uniform thickness of about 100 to 200 μm onto the surface by using a centrifugal force generated from a rotating substrate.

However, when the photoresist is applied by spin coating, the thickness of the thin film just before application is uniform, but after the rotation stops and the centrifugal force is not applied, or the surface tension is affected. As a result, a coating film such as a photoresist liquid rises from the periphery of the substrate as thick as it rises. In this method, the excess photoresist or the like is dropped by the rotation of the substrate. However, the photoresist may be scattered on the back surface of the substrate and the photoresist may be attached to an unnecessary place.

In this way, a film such as a non-uniform thick photoresist formed on the periphery of the substrate and a photoresist attached to the surface may cause particles during the subsequent substrate transfer process, and may cause direct contamination of the mechanism for transporting the substrate. Sometimes.

In actual spin coating, the support for raising the substrate is connected to the vacuum pump so that the substrate can be fixed while the substrate is rotating. The rotation speed and rotation time can be selected as desired, but the large glass substrate If the film is not uniform, simply spin the film, and spin it after applying it with a nozzle, resulting in a viscosity of the photoresist, which makes the entire area uniform.

The object of the present invention is to apply photoresist by centrifugal force after supplying the photoresist to the entire glass plane by the precise gap of the slit nozzle. The film quality of the photoresist can be obtained more uniformly.

In the case of the current color filter for LCD, the area of the LCD screen becomes larger and the N2 gas (Gas) is supplied to the metering pump, the metering cylinder or the pressure tank through the photo resist tube nozzle in the application method due to the characteristics of the photoresist. There is a need for a method of applying glass by centrifugal force after rotating the glass within the shortest time after the quantitative supply using a pressurized method.

As a result, the effect of eliminating the change of the photosensitive liquid viscosity according to the application time elapsed by centrifugal force after supplying the photosensitive liquid (Photo Resist) can be obtained, and the effect of reducing the amount of chemical liquid used by the uniform photosensitive liquid supply can be obtained.

The object of the present invention is to apply a centrifugal force after the photoresist is supplied to the entire glass plane by the precise gap of the slit nozzle, and to apply the film using centrifugal force. The effect can be obtained. Since the slit method sprays the photoresist uniformly through a long nozzle, it is considered to be much more advantageous for producing color filters for large LCDs than the spin method of rapidly rotating the conventional glass substrate and spreading the photoresist.

The injection mechanism according to the present invention is a chamber space formed in an elliptical shape inside the body made of a front plate and a back plate butt; A gap spacer used to maintain a substrate gap between the front plate and the back plate and to secure an appropriate thickness of the liquid crystal layer; An input terminal through which a photoresist or the like is introduced; A load formed in the longitudinal direction of the body is provided at the bottom of the body between the front plate and the back plate so that fluid supplied from the source to the chamber space is injected downward through the load through an inlet communicating with the source. It is a slit nozzle fluid injection mechanism.

Preferably, a slit-type nozzle may be used to apply a photo resist or the like and then evenly apply the coating through spin.

In addition, it has an H-type trust structure as a slit type nozzle which is processed, polished, and heat-treated in order to maintain flatness due to material deformation.

More preferably, the internal structure of the slit nozzle includes an elliptical shape such that the photoresist is uniformly applied at a constant pressure.

If described in detail with reference to the accompanying drawings a preferred embodiment of the present invention

As shown in FIG. 1, the fluid ejection mechanism consists of a nozzle 11 and a PR Inlet 20 portion.

Referring to FIG. 2, the material of the nozzle 11 is SUS316, the inside of which is the front plate 11a and the back plate 11b, the chamber 12, the converging section 13, the rod 14, and the gap spacer 15. It is composed of

Dimensions inside the nozzle 11 follow the KS general tolerance standard unless otherwise indicated, and the tolerance display part follows the indicated tolerance standard. The top of the nozzle 11 is stepped to maintain the gap of the slit and the size is maintained to 300㎛. In addition, the tolerance ensures 10 µm / 100 mm. Guide pins 31 are installed therein to accurately position the top and bottom of the nozzle 11. Care should be taken in handling the rod 14, since no scratches should occur on the surface. The surface roughness of the upper and lower rods 14 of the nozzle 11 should ensure 0.02A and maintain the same surface roughness in any part of the plane. The burrs that may occur in the processing of the internal inlets 21 are completely removed.

Note that the outside of the nozzle 11 may be affected by the portion that is processed to reduce the weight may affect the internal shape of the nozzle 11. The inner surface roughness of the rib (LIP) 16, which is the peripheral portion where the photoresist is discharged, secures 0.02A, and the straightness secures the value of the checklist. The angle between the rib 16 and the inclined surface is 45 ° and the rib 16 and the rod surface 14 should be chamfered, and burr generation and angle collapse should not occur. The width of the upper and lower ribs 16 of the nozzle 11 is maintained at 5 μm or less.

3 is for explaining the shape of the main body of the nozzle 11, and includes a nozzle end enlarged shape, a left nozzle, a right nozzle, a left and right nozzle assembled shape, and the like. In particular, the internal structure of the left nozzle (11a) is made of a long oval shape can be made to uniformly apply a photosensitive organic solvent (Photo Resist).

Figure 4 shows the inlet portion, such as photoresist (Photo Resist) of the slit fluid injection mechanism,

5 is a cross-sectional view of a structure in which left and right nozzles are firmly fastened as assembled contents of a slit-type fluid injection mechanism.

FIG. 6 illustrates a gap spacer used to maintain a substrate gap between the front and rear plates and to secure an appropriate thickness of the liquid crystal layer. This thickness can be comprised with 0.05t, 0.1t, 0.15t, etc., respectively.

7 shows the processing of the nozzle 11 in more detail in a flowchart. The nozzle 11 is a slit-type nozzle which has undergone the processing, polishing, and heat treatment steps in order to maintain flatness due to material deformation, and has an H-type trust structure. The heat treatment method F3 of the nozzle 11 includes two processes, a first vacuum heat treatment method for increasing the hardness of the material and reducing material wear, and a second tempering process for reheating the material to lower the hardness and increase the viscosity strength. Rough In order to process while maintaining the flatness by material deformation, it goes through the order of primary processing (F4), primary polishing (F5), secondary processing (F6), and secondary polishing (F7). Repeat the 1st and 2nd machining and polishing (F4, F5, F6, F7) to remove the warpage and warping of the material, and then finish the fine machining by finishing (F8) and finishing (F9). Finally, lapping and polishing (F10) is performed mechanically to complete flatness and roughness.

As described above, the present invention uniformly spreads the photosensitive liquid through the long nozzle of the slit-type nozzle while scanning the entire glass plane with a precise gap, and then spins, thereby rapidly rotating the existing glass substrate. Photoresist film can be obtained more uniformly than the spin coating method that spreads the film.It is much more suitable for mass production of color filter (C / F) glass substrates and large glass panels for liquid crystal display (LCD). It is advantageous.

1 is a view showing a slit fluid injection mechanism according to an embodiment of the present invention (bottom view, front view, right side view, top view)

Figure 2 is a side internal cross-sectional view of the slit fluid injection mechanism according to an embodiment of the present invention

3 is a view illustrating a main body of a slit-type fluid injection mechanism according to an embodiment of the present invention (nozzle end enlargement portion, left nozzle portion, right nozzle portion, left and right nozzle assembly portion)

FIG. 4 is a view illustrating an inflow portion of a photoresist or the like of the slit-type fluid ejection mechanism according to an embodiment of the present invention shown in FIG. 1.

5 is an assembly view of the slit-type fluid injection mechanism according to an embodiment of the present invention shown in FIG.

FIG. 6 is a view illustrating a gap spacer of a slit fluid injection mechanism according to an embodiment of the present invention shown in FIG. 1.

7 is a flow chart showing a processing step of the slit fluid injection device according to the embodiment of the present invention.

<Description of the reference numerals for the main parts of the drawings>

10: fluid injection mechanism

11: Nozzle

11a: left nozzle part

11b: right nozzle part

12: Chamber

13: Converging Section

14: Load

15 Gap Spacer

16: Lip

20: photosensitive liquid supply port (PR Inlet)

21: Internal Inlet

31: guide pin

32: Trust

Claims (3)

The present invention relates to a spray mechanism having a slit nozzle for uniformly applying photoresist to a color filter (C / F) GLASS substrate surface for an LCD. A substrate gap between a front plate and a back plate is maintained and appropriately maintained. It is provided with a gap spacer used to secure the thickness of the coating layer and a load formed in the longitudinal direction of the body at the bottom of the body between the front plate and the back plate, so as to communicate with the source. In the fluid injection mechanism in which the photosensitive liquid supplied from the source to the buffer space is injected downward through the load, Slit nozzle fluid ejection mechanism characterized by H type thrust structure which is processed, polished and heat treated to minimize material deformation and maintain flatness. The method of claim 1, wherein the front plate and the rear plate is a slit-type inner chamber structure characterized in that the interior of the body made of a long oval shape to be uniformly applied to the photoresist (Photo Resist) at a constant pressure Fluid injection mechanism. delete