KR200361073Y1 - Light effusing structure comprising overlapping channels configuration - Google Patents

Abstract

The present invention relates to a light emitting structure that can be used for signs, indoor and outdoor advertisements, signs, or fancy products. In particular, when a defect such as a failure of the light emitting structure occurs by introducing a double frame structure consisting of an outer frame and an inner frame. The light emitting structure that can reduce the time and cost according to the repair by replacing only the inner frame that occurred. The light diverging structure of the present invention is an outer frame forming an outer shape of the light emitting structure, and a plurality of inner frames installed in an inner space of the outer frame, and connected to the outer frame by one or two fastening means. And an inner frame maintained in the outer frame, and a plurality of light emitting sources installed on the bottoms of the plurality of inner frames. According to the light-emitting structure of the present invention, when a defect such as a sign, such as a fault occurs, the repair is possible by replacing only the inner frame where the fault occurs, so that time and cost can be reduced according to the fault repair, and the sign is embedded in synthetic resin or In the case of cover treatment, it can prevent breakage or cracking which may occur due to deterioration of physical properties of synthetic resin due to external impact or ultraviolet radiation during use, and prevent peeling and separation of synthetic resin and outer frame due to changes in external temperature. It is possible to provide a space for accommodating the complicated wiring structure of the light emitting sources, so that the complicated wiring structure can be neatly processed and disconnection and short circuit prevention are possible.

Description

Light emitting structure with double frame structure {LIGHT EFFUSING STRUCTURE COMPRISING OVERLAPPING CHANNELS CONFIGURATION}

The present invention relates to a light emitting structure that can be used for signs, indoor and outdoor advertisements, signs, or fancy products. In particular, when a defect such as a failure of the light emitting structure occurs by introducing a double frame structure consisting of an outer frame and an inner frame. The light emitting structure that can reduce the time and cost according to the repair by replacing only the inner frame that occurred.

Light emitting structures used for signs, indoor and outdoor signs and advertisements are devices configured to display meaningful characters or figures by using light from a light emitting source such as a light emitting diode (LED). Signs, indoor and outdoor signs, and advertisements using such light emitting structures are generally installed at high positions such as skyscrapers. Signs and lights are installed in accordance with the intended location of skyscrapers. By the way, when a sign made of a large object or the like is installed on an attaching surface of a high position such as a high-rise building, and a defect such as breakage, failure or defect occurs in the product, various problems occur.

In other words, since the installation location of the signs, such as high places, when repaired directly from a high place, the cost of repair and maintenance due to high-rise work increases and takes a lot of time to repair. In addition, if the signs, etc. are molded from synthetic resin, or manufactured integrally in the form of perforated plates, it is impossible to replace only the part that has broken, broken or defective, so that the entire sign can be removed and reinstalled or repaired, or a new sign can be reinstalled. There is a problem to be done. In addition, when a sign made of a large object or the like is buried or covered with synthetic resin, the synthetic resin is widely distributed over a relatively large area, so it is easy to cause breakage or cracking due to deterioration of physical properties due to external impact or ultraviolet radiation during use. In addition, when the synthetic resin to be embedded or covered is different from the outer frame of the sign, the expansion and contraction caused by the change of the external temperature is repeated, the separation and separation phenomenon occurs due to the difference in expansion and contraction coefficient between them.

In addition, in the case of a sign made of a large object, a plurality of light emitting sources such as light emitting diodes are required in proportion to the size thereof, and thus a wiring structure for connecting these light sources to a power source becomes complicated. That is, since there are too many wires of a light emitting source for connecting with a power source, such as spider webs, work is inconvenient and requires a lot of space in the electric device part. However, a sign made of a conventional large-scale article has a lack of space to accommodate the complex wiring structure of such a light emitting source, so that the wiring is exposed to the outside, which is not aesthetically pleasing, and the risk of disconnection and leakage may be large.

In order to solve this problem, a light emitting structure is proposed in which a light emitting source is installed on a circuit board such as a PCB to simplify the complicated wiring structure of the light emitting source and thus the wiring is exposed to the outside, thereby reducing the risk of disconnection and short circuit. It is becoming. However, in order to protect the circuit board from external failure factors such as leakage, such a light emitting structure also requires embedding of the resin layer in the lead or the exposed portion of the wiring on the circuit board. Therefore, in the case of a sign made of a large object, there is still a problem that synthetic resins are easily formed by breakage or cracking by forming a wide distribution over a relatively large area. That is, in the prior art, breakage or cracking may occur due to a decrease in physical properties of the synthetic resin due to external impact or ultraviolet radiation during use, and there is a problem that peeling and separation of the synthetic resin and the outer frame may occur according to the change in the external temperature. In addition, after the installation of such signs made of large objects, there was a problem that still needs to replace the entire sign if a failure or failure occurs.

Accordingly, an object of the present invention is to replace the inner frame only when the defect occurs when the defects such as breakage, failure or failure of signs made of large objects by introducing a double frame structure provided with a plurality of inner frames in the outer frame. It is possible to repair through to provide a light emitting structure that can reduce the time and cost according to the repair.

In addition, another object of the present invention is to prevent damage or cracks that may occur during use when embedded or covered with synthetic resin to protect signs made of large objects from external failure factors such as water leakage, and at the same time It is to provide a light emitting structure that can prevent the peeling and separation of the outer frame.

In addition, another object of the present invention is to provide a light emitting structure capable of providing a space that can accommodate the complex wiring structure of the plurality of light emitting sources in the case of a sign made of a large object using a plurality of light emitting sources.

1 is a perspective view of a light emitting structure having a double frame structure according to an embodiment of the present invention, a perspective view showing a state in which the light emitting source and the resin layer is not provided in the inner frame of the double frame structure.

FIG. 2 is a plan view from above of a light diverging structure having a double frame structure according to an embodiment of the present invention shown in FIG. 1, wherein a spacer provided at the bottom of the outer frame is projected by an imaginary line.

3 is a cross-sectional view along the line A-A 'of the light emitting structure having a double frame structure according to one embodiment of the present invention shown in Figures 1 and 2, the cut light emitting structure Front view as seen from the cut plane.

FIG. 4 is a front view of the cut inner frame as viewed from its cut surface, after only separating the inner frame of the light emitting structure having the double frame structure according to another embodiment of the present invention and cutting in the transverse direction.

* Explanation of symbols for main parts of the drawings

10: light emitting structure 20: outer frame

22: bottom of the outer frame 24: side walls of the outer frame

26: spacer 30: inner frame

32: Bolt 34: Nut

36: escape prevention jaw 38: mesh network

39a, 39b: adhesive layer 40: light emitting source wiring coupling module

50: resin layer 60: light emitting source (light emitting diode)

62: light source lead or wiring 64: lead wire

Light-emitting structure having a double frame structure of the present invention,

An outer frame forming an outer shape of the light emitting structure;

A plurality of inner frames installed in the inner space of the outer frame, the inner frame being connected to the outer frame by one or more fastening means and maintained in the outer frame;

It includes a plurality of light emitting sources installed on the bottom of the plurality of inner frame.

The light emitting structure of the present invention may be configured such that a space is formed between the bottom of the outer frame and the bottom of the inner frame to accommodate the lead wires of the plurality of light emitting sources.

The light emitting structure may further include one or two or more spacers provided between the outer frame and the inner frame to form the space.

The light emitting structure of the present invention may further include a coupling module for coupling the plurality of light emitting sources. The coupling module may be a circuit board positioned at the bottom of the inner frame. The light emitting structure may further include an insulating layer interposed between the inner bottom of the inner frame and the coupling module to prevent a short circuit or a short circuit.

The light emitting structure of the present invention may further include a resin layer filling the inside of the inner frame. It is preferable that the said resin layer consists of synthetic resin materials or the molding paint. The resin layer may be formed by pouring a liquid material so that only the wiring portion of the light emitting source located inside the inner frame is embedded. In addition, the resin layer may be formed by pouring a liquid material so as to bury the entire light emitting source located inside the inner frame. As the synthetic resin material used for forming the resin layer, epoxy, acrylic, PC, urethane, or FRP is preferable.

The light emitting structure of the present invention may further include a coupling reinforcing means inside the inner frame to strengthen the resin layer is bonded to the inner surface of the inner frame. The coupling reinforcing means may be provided on an inner surface of the inner frame to prevent the separation layer to prevent the resin layer from leaving the inner frame. The release prevention jaw is bent and one side of the bent surface is fixed to the inner surface of the inner frame and the other side of the bent surface is configured to prevent the separation of the resin layer. In addition, the coupling reinforcing means may be a mesh net provided attached to a predetermined position between the inner frame inner surface and the resin layer. An adhesive layer may be provided between the mesh network and the inner surface of the inner frame. In addition, an adhesive layer may also be provided between the mesh network and the resin layer.

The plurality of inner frames of the light emitting structure of the present invention may further include a partition for partitioning the inner space of the inner frame into a plurality. The partition is preferably made of the same material as the inner frame, and preferably made of a material capable of reflecting light emitted from the light emitting source. The partition is preferably located below the upper end of the inner frame located in a direction away from the light emitting source.

In the light emitting structure of the present invention, the inner frame is preferably located below the upper end of the outer frame located in a direction away from the light emitting source. The inner frame is preferably coupled to each other by the fastening means.

The light emitting structure of the present invention may further include a diffusion plate fixed to the outer frame or the inner frame to cover the light emitting source. The diffusion plate is preferably made of a light guide plate, a special diffusion plate, or polyglass.

The light emitting source of the light emitting structure of the present invention is preferably a light emitting diode.

The fastening means of the light diverging structure of the present invention is preferably a bolt and a nut.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings as examples for description without limitation.

1 to 3, the light emitting structure 10 according to an embodiment of the present invention is the outer frame 20 to form the outer shape of the light emitting structure, and installed in the inner space of the outer frame And a plurality of inner frames 30, fastening means 32 and 34 connecting the outer frame 20 and the inner frame 30 to each other and also connecting the inner frame 30 to each other, A plurality of light emitting sources 60 are installed on the floor, the plurality of light emitting sources 60 is inserted into the circuit board 40 located on the bottom of the inner frame 30, and the light emitting source located inside the inner frame The outer frame and the inner part to form a space in which the lead wires of the plurality of light emitting sources are accommodated between the resin layer 50 embedded and formed to a predetermined height, and the bottom of the outer frame and the bottom of the inner frame. And a spacer 26 provided between the frames.

The outer frame 20 is a frame forming an outline of letters or figures forming a sign or a billboard, and has a bottom 22 and a sidewall 24 extending from the bottom 22. The outer frame 20 may be manufactured in various materials such as synthetic resin plates, metal plates, glass plates, wooden boards, slabs, and the like for use purposes. However, the outer frame 20 is preferably a translucent or opaque material that does not pass or pass less light to the outside.

The inner frame 30 is arranged in a predetermined space with respect to the side wall and the bottom of the outer frame 20 is installed in the inner space of the outer frame. The inner frame 30 is connected to the outer frame 20 by the fastening means 32 and 34, and the inner frame 30 mutually prevents the inner frame 30 from being easily separated from the outer frame 20. Edo is connected by the fastening means (32, 34). The fastening means 32 and 34 fasten the outer frame and the inner frame through holes formed at appropriate positions of the outer frame 20 and the inner frame 30. As the fastening means, the bolt 32 and the nut 34 are preferable, but the present invention is not limited thereto and those skilled in the art will understand that other fastening means other than the bolt and nut may be applied to the present invention.

The present invention has a double frame structure in which a plurality of the inner frame 30 is installed in the outer frame 20, so that any defects occur when a defect occurs, such as a signage made of a large object, a defect or a failure. It is possible to replace only one inner frame in which a defect occurs by releasing the bolt 32 and the nut 34 which bind between the frame part and the outer frame, or one inner frame in which the defect occurs and the other inner frame. In addition, when the large outer frame 20 is embedded or covered with a synthetic resin, breakage or cracking that may occur due to the physical properties of the synthetic resin due to external impact or ultraviolet radiation during use is improved by the introduction of the inner frame 30. do. That is, since the inner frame 30 divides the entire area of the outer frame 20, the area of the resin is reduced and the cracking phenomenon is reduced.

On the other hand, the inner frame 30 may be made of the same material as the outer frame 20 or made of a different material. In other words, the inner frame 30 may be manufactured in various materials such as synthetic resin plates, metal plates, glass plates, wooden boards, slabs, and the like for use purposes. However, the inner frame 30 is preferably a reflective synthetic resin, a metal material or a glass material that can reflect the light emitted from the light emitting source 60 to increase the light emitting effect. On the other hand, the inner frame 30 is preferably located slightly below the upper end of the outer frame 20 located in a direction away from the light emitting source 60 in terms of light reflection effect. In addition, the inner frame 30 may be partitioned by a plurality of partitions (not shown) to increase the reflection effect. Incidentally, the use of this partition divides and partitions the inner frame 30 to further reduce the area of the resin, further reducing the cracking phenomenon. The partition of the above-described inner frame 30 is preferably made of the same material as the inner frame 30, and particularly preferably of a material capable of reflecting light emitted from the light emitting source 60. In order to increase the reflection effect of the light, it is preferable that the partition is located slightly below the upper end of the inner frame 30.

The spacer 26 is installed between the bottom of the outer frame 20 and the bottom of the inner frame 30. The spacer 26 is attached by welding to the bottom 22 or sidewall 24 of the outer frame 20. The material of the spacer 26 should be the same as the outer frame 20 or at least a material capable of welding the outer frame 20. In order to support the inner frame 30 stably from below, the spacer 26 is attached to the lower side of the side wall 24 of the outer frame at appropriate intervals along the side wall 24 of the outer frame 20, Therefore, it is attached at an appropriate position of the bottom 22 of the outer frame 20 to enhance the support function. Spacer 26 has a constant height to stably position the inner frame 30 at a certain height of the outer frame 20, the bottom and the outer frame of the inner frame 30 by the predetermined height of the spacer 26 A predetermined space is formed between the bottoms 22 of the 20. This space is a space in which lead wires 64 of a plurality of light emitting sources 60 to be described later are accommodated, and lead wires 64 are drawn out through holes formed at a predetermined position on the bottom of the inner frame 30 described above. The storage is arranged in this accommodation space. The lead wire 64 housed in the receiving space between the bottom of the outer frame and the bottom of the inner frame is prevented from disconnection and short circuit due to the wire exposure.

The light emitting source 60 is a light source of the light emitting structure 10, it is preferable to use a general light emitting diode having a round head in a generally cylindrical shape. However, the present invention is not limited thereto. The light emitting diode 60 determines the number of uses according to the light emitting area of the sign, and selects and uses the light emitting diode 60 having a suitable brightness according to the required light intensity. The light emitting diode 60 may be connected to a predetermined wiring (not shown) through the lead 62 or may be inserted into and connected to the light emitting source wiring coupling module 40, for example, a circuit board 40 such as a PCB. have. In addition, the plurality of light emitting diodes 60 may be installed in the form of a chip type light emitting diode (not shown). On the other hand, the light emitting structure 10 according to the embodiment of the present invention discloses a form in which the circuit board 40 into which the plurality of light emitting diodes 60 are inserted is placed on the inner bottom of the inner frame 30. However, the present invention is not limited thereto. A person skilled in the art can connect a plurality of light emitting diodes 60 through the grid 62 using conventional wiring, and receive the wires through holes formed in the bottom of the inner frame 30 by connecting the anode lead wire and the cathode lead wire of the wires to the bottom of the inner frame 30. It will be appreciated that it is possible to construct other embodiments of the present invention withdrawing to space.

When the light emitting diodes 60 are inserted into and connected to a circuit board 40 such as a PCB, the circuit board 40 into which the light emitting diodes 60 are inserted is placed at the bottom of the inner frame 30. Preferably, an insulating sheet is placed below the circuit board 40 or subjected to an insulation coating process. Two leads 62 provided below the light emitting diode 60 are fitted to the circuit board 40 and joined by soldering or the like. In this case, since the circuit board 40 is printed with a circuit, a separate connection wire is not required, but the circuit may be connected with a connection wire as necessary. The lead wires of the positive electrode and the lead wires 64 of the negative pole from the circuit board 40 are collectively accommodated in the wire receiving space through holes formed in the bottom of the inner frame 30 described above.

The resin layer 50 may be formed by pouring and curing a liquid material so that the entire light emitting diode 60 located inside the inner frame 30 is embedded (not shown), and the light emitting diode 60 is approximately formed from the circuit board 40. It is also possible to form the liquid material by pouring it to the lead 62 portion of (see Fig. 3). The resin layer 50 shown in FIG. 3 reflects the light emitted from the light emitting diode 60 to enhance the light reflection effect, surrounds the lid 62 of the light emitting diode 60, and the light emitting diode 60 is a circuit board ( 40) to fix it so as not to move. In addition, the periphery of the light emitting diode 60 and the circuit board 40 are sealed to prevent penetration of water.

On the other hand, the resin layer 50 is made of a synthetic resin material. The resin layer 50 is formed by pouring a liquid synthetic resin material from the circuit board 40 by the height of the lead 62 of the light emitting diode 60, and then molding the synthetic resin by natural curing or heat curing. Liquid synthetic resin materials include molding epoxy, acrylic, PC, urethane, and FRP. Such a synthetic resin material may be a one-component type (hardened at a high temperature in one liquid molding furnace, etc.) to be cured at high temperature, or a two-component type (mixed two liquids and cured at room temperature) to be cured at room temperature. In addition, it is possible to produce the required color using not only a transparent synthetic resin but also an opaque synthetic resin mixed with pigments. Although the reflective surface may be formed of the cured synthetic resin itself, it is preferable to form a resin layer 50 by painting paint on the cured synthetic resin.

In the above embodiment, the resin layer 50 is molded from a synthetic resin, but the present invention is not limited thereto. For example, it is also possible to mold the resin layer 50 by pouring molding paint (which can be molded to a thickness of 1 mm or more) instead of the synthetic resin, and the molding paint is, for example, a Duratan series of paint for Two-part (topical, hardener) yellowing paint can be used.

Although not shown, the resin layer 50 may be formed by pouring and curing a liquid material from the circuit board 40 to the height of the light emitting diode 60 or more. In this case, the entire light emitting diode 60 is embedded. At this time, the resin layer 50 serves to diffuse the light emitted from the light emitting diode 60 and to protect the light bulb of the light emitting diode 60.

In addition, one embodiment of the present invention and another embodiment described below further includes a separation prevention jaw 36 for preventing the resin layer 50 from being peeled off and separated from the inner surface of the inner frame 30. Prior to formation of the resin layer 50 described above, the separation prevention jaw 36 is joined by welding to a predetermined position of the side wall of the inner frame 30 (see FIGS. 3 and 4). The release prevention jaw 36 should be made of the same material as the inner frame 30 or at least a material capable of welding the inner frame 30. The departure prevention jaw 36 is bent in the form of a clip (see Fig. 4), one side of the bent surface is fixed by welding to the inner surface of the inner frame 30 and the other side of the bent surface is the upper surface of the resin layer 50. It is structured to prevent some of them from pressing away.

FIG. 4 is a front view of the cut inner frame 30 viewed from the cut surface after separating and cutting only the inner frame 30 of the light emitting structure in the transverse direction as another embodiment of the present invention. The inner frame 30 has the same configuration as the inner frame shown in FIGS. 1 to 3 except that the mesh frame 38 is further provided on the inner frame 30 of FIGS. 1 to 3. to be. That is, the mesh net 38 is attached between the inner surface of the inner frame 30 and the resin layer 50. Details of each component are the same as those of the embodiment of FIGS. 1 to 3, and thus detailed descriptions thereof will be omitted.

The mesh net 38 is provided to prevent the resin layer 50 or the circuit board 40 from being peeled and separated from the inner frame 30. Looking at the installation process of the mesh network 38 as follows.

In order to attach the mesh net 38 to a predetermined region of the inner surface of the inner frame 30, an adhesive such as silicon is applied in a lattice form or as necessary to form an adhesive layer 39a. The mesh net 38 of an insulating material such as plastic or rubber is cut to fit the shape of the inner frame 30 and attached to the adhesive layer 39a described above. At this time, the material of the mesh net 38 used is preferably a plastic or rubber material for insulation between the above-described circuit board 40, for example, the soldering portion located below the PCB and the inner frame 30, but the insulating property Any material can be used. In addition, the pore size of the mesh net 38 is preferably about 10 mm, but this may be variably determined according to the size of the inner frame 30 to which the mesh net 38 is applied.

Next, after applying an adhesive such as silicon to the upper portion of the mesh net 38 in a lattice shape or other necessary shape, the circuit board 40, for example, the PCB to which the light-emitting diode 60 is inserted, is connected to the mesh net ( It adheres to the adhesive layer 39b formed on the top of 38). At this time, the lead wire 64 from the circuit board 40 is drawn out to the bottom of the inner frame 30 through the adhesive layer 39b, the mesh net 38 and the adhesive layer 39a, where the bottom of the inner frame 30 is located. Through the hole formed in the lead wire 64 is arranged to be housed in the wire receiving space.

On the other hand, the embodiment of Fig. 4 is an example of using the circuit board 40, but when the circuit board 40 is not used, the application of the adhesive layer 39b is unnecessary, and the liquid resin is the mesh network 38 immediately. It will pour to the top of and harden. At this time, the cured resin layer 50 is tightly coupled with the mesh network 38 of the mesh structure is prevented from being separated from the inner frame 30.

In addition, although not shown, the light emitting structure of the present invention may further include a diffusion plate fixed to the outer frame 20 or the inner frame 30 to cover the light emitting diode 60. The diffuser plate is adhered to the top of the outer frame 20 or the inner frame 30 or fixed by other means. The diffusion plate serves to enhance the light diffusion effect. For example, a light guide plate, a special diffusion plate, or polyglass made of polycarbonate or acrylic may be used. Usually, polyglass is used, but the present invention is not limited thereto, and a translucent glass plate or the like may also be used. Any plate can be used as a diffuser plate as long as there are irregularities inside or can be chemically treated to scatter light.

Although the present invention has been described with reference to the accompanying drawings, the present invention is not limited to the accompanying drawings and the disclosed embodiments. Those skilled in the art will appreciate that modifications can be made in accordance with the spirit of the present invention, and such modifications also fall within the scope of the present invention.

According to the light diverging structure of the present invention, when a defect such as a sign, made of a large object, such as a breakdown, defect or failure occurs, repair is possible only by replacing the inner frame in which the defect occurs, thereby reducing the time and cost according to the defect repair. It is economical. In addition, by making only the inner frame portion of the inner frame first and replace it on the same day, there is no need to remove the sign or billboard as a whole, it is possible to continue the guidance or advertising of the sign or billboard.

In addition, according to the light-emitting structure of the present invention, when the sign or the like made of a large object is embedded or covered with synthetic resin to prevent damage or cracking that may occur due to the physical properties of the synthetic resin due to external impact or ultraviolet radiation during use In addition, it is possible to prevent the separation and separation of the synthetic resin and the outer frame due to the change of the external temperature.

In addition, the light-emitting structure of the present invention can provide a space that can accommodate the complex wiring structure of a plurality of light emitting sources, it is possible to clean the complex wiring structure and prevent disconnection and short circuit.

Claims (16)

In the light diverging structure having a double frame structure, An outer frame forming an outer shape of the light emitting structure, A plurality of inner frames installed in the inner space of the outer frame, the inner frame being connected to the outer frame by one or more fastening means and maintained in the outer frame; Light-emitting structure having a plurality of light emitting sources installed on the bottom of the plurality of inner frame. The method of claim 1, And a space for accommodating lead wires of the plurality of light emitting sources is formed between the bottom of the outer frame and the bottom of the inner frame. The method of claim 2, And one or two or more spacers provided between the outer frame and the inner frame to form the space. The method of claim 1, The inner frame further comprises a partition for partitioning the inner space of the inner frame into a plurality. The method of claim 1, Light emitting structure further comprises a coupling module for coupling the wiring of the plurality of light emitting sources. The method of claim 5, The coupling module is a light emitting structure, characterized in that the circuit board located on the bottom of the inner frame. The method of claim 5, The light emitting structure further comprises an insulating layer interposed between the inner bottom of the inner frame and the coupling module. The method according to any one of claims 1 to 7, The light emitting structure further comprises a resin layer filling the inside of the inner frame. The method of claim 8, The light emitting structure further comprises a coupling reinforcing means in the interior of the inner frame to strengthen the resin layer is coupled to the inner surface of the inner frame. The method of claim 9, The coupling reinforcing means is provided on the inner surface of the light emitting structure characterized in that the separation prevention jaw to prevent the resin layer from leaving the inner frame. The method of claim 10, The release preventing jaw is bent and one side of the bent surface is fixed to the inner surface of the inner frame and the other side of the bent surface light emitting structure characterized in that the structure to prevent the separation of the resin layer. The method of claim 9, The coupling reinforcing means is a light diverging structure, characterized in that the mesh network is provided attached to a predetermined position between the inner surface of the inner frame and the resin layer. The method of claim 12, The light emitting structure further comprises an adhesive layer provided between the mesh network and the inner surface of the inner frame. The method of claim 13, And a further adhesive layer provided between the mesh network and the resin layer. The method according to any one of claims 1 to 7, And a diffuser plate fixed to the outer frame or the inner frame to cover the light emitting source. The method of claim 15, The diffusion plate is a light-emitting plate, or a special light diffusion plate, or a light emitting structure, characterized in that made of polyglass (polyglass).