KR200349833Y1 - Micro Heat Exchanger - Google Patents

Abstract

The present invention relates to a micro heat exchanger, and alternately laminating a metal plate processed microchannel with a thin plate for bonding, and performing brazing bonding to participate in all of the boundary areas of the microchannel as a target for bonding, and to manufacture a micro heat exchanger to be joined. This is a feature. Accordingly, each flow path structure of the micro heat exchanger composed of microchannels has an effect of maximizing heat resistance and pressure resistance.

Description

Micro Heat Exchanger

The present invention relates to a micro heat exchanger, and more particularly, to a micro heat exchanger formed by alternately stacking / bonding a metal plate on which a fine channel is formed with a bonding thin plate.

In general, heat transfer is the transfer of energy more intensely between parts at different temperatures, especially between their boundary parts. In a thermal transfer relationship, heat is transferred from the hot part to the cold part that is in contact with it, without involving material movement. It refers to conduction transmitted, convection that transfers heat due to fluid movement, and radiation in which an atomic group excited by heat emits electromagnetic waves.

In particular, convection is conceptualized as a heat exchange between a fluid and a solid and is used in industry. In particular, when forced convection is used, for example, heat exchange inside and outside the pipe wall is applied as a basic heat exchange concept of the heat exchanger.

The application of heat exchangers to industrial sites is closely related to the fields where precision and miniaturization are required, such as electronic components or materials, especially in the field of high heat generation information and communication. The heat generation of the electronic parts has a great influence on the performance of the entire device including the electronic parts. Therefore, the scale of the heat exchanger has been required to install the heat exchanger, thus leading to the development of the micro scale heat exchanger.

In addition, it can be applied to fuel cell, chemical reaction field required in petroleum industry, medical device cooling field, nuclear power generation field, aircraft electronic equipment cooling field, high heat generation laser cooling field, desalination machine seawater evaporation pipe field, etc. Known.

Most heat exchangers, including these micro heat exchangers, operate on the basis of forced convection of the fluid. As an application range of a micro heat exchanger, a fuel cell system, a pharmaceutical manufacturing process, and a structure formed by stacking a series of metal plates in which fine channels are formed in parallel on one surface thereof. Fluid is transported along each of these microchannels, so that the wall of the microchannel presents / induces and forces the direction of fluid movement.

In such a micro heat exchanger using forced / active fluid transfer, the design of a microchannel capable of forcing / inducing fluid transfer is important. In general, the microchannels are generally formed by milling by a micromachining technique. The design of the microchannels is important because there is a great difficulty in measurement as the device is reduced to a small scale. For example, it is difficult to measure the flow velocity of a fluid in a microchannel, the temperature, in particular, the pressure and temperature applied to the entire apparatus and each microchannel, and thus, the control thereof is difficult.

For the development of such measurement and control technology, in the manufacturing technology of the micro heat exchanger, in particular, the bonding technology of each metal plate on which the microchannels are formed is important.

In the manufacturing technology of the micro heat exchanger, as already known, the technical field of joining the metal plates on which the microchannels are formed after the processing of the microchannels, in particular, ensures high pressure resistance and heat resistance to the pressure and temperature received by each microchannel. It is a process field that can achieve the purpose.

In the manufacture of a conventional micro heat exchanger, as a joining technique of each metal plate formed with a microchannel, a technique of joining the edge of the metal plate laminated with a laser as a heat source, a state in which a soldering material is applied, deposited, or plated on each metal plate in advance, or Diffusion bonding technology, which is a technique of pressing each metal plate at a temperature of several hundred degrees without soldering material, is known.

In addition, the manifold consisting of the conduit for the entrance and exit of the fluid in the heat exchanger and its fixed plate member is manufactured by welding the conduit to the fixed plate member and joining it to the metal plate using the above-mentioned laser welding or diffusion bonding technique.

However, the microchannel of each metal plate is a relatively recessed part. In addition, there is a relatively protruding wall due to the formation of depressions. Such walls, i.e., portions that separate each of the microchannels, are not individually bonded when a micro heat exchanger is manufactured based on a conventional bonding technique. Therefore, in the manufactured micro heat exchanger, in a high temperature / high pressure environment in which each microchannel part is located, it causes a problem of failing to ensure high pressure resistance and heat resistance.

In addition, in the case of using the conventional bonding technology, in particular, an additional electrochemical plating process is added, and a press process at a high temperature takes a very long working time, and thus, there is a problem that mass production is inadequate due to its low production efficiency. As a result, the production cost of the product is very high, and accordingly, it is difficult to use it universally throughout the corresponding industry.

In addition, in the case of manifold fabrication, there have been difficult aspects in the working conditions such as welding must be performed one by one and careful attention is required for complete sealing.

As described above, the manufacturing technology of the conventional micro heat exchanger results in a decrease in production efficiency and a decrease in heat resistance and pressure resistance of the manufactured / used micro heat exchanger when the joining process of the metal plate on which the microchannel is formed is performed. In case of implementation, the company has a problem of low production efficiency due to too demanding working conditions.

Therefore, the present invention was devised in view of the above-described conventional problems, and a first object of the present invention is to alternately stack a metal plate on which a microchannel is formed and a thin plate for joining, and thus a boundary portion of each microchannel is a target of bonding in the bonding process. To provide a micro heat exchanger that can participate.

A second object of the present invention is to provide a micro heat exchanger capable of reversing / arranging a laminate of each metal plate and performing a joining process to prevent the melt of the joining thin plate from flowing into the microchannel.

In addition, the third object of the present invention is to arrange each metal plate to cross each other according to the stacking of each metal plate on the basis of the formation direction of the corresponding microchannel, so that fluids of different temperatures and adjacently placed metal plates are used when the product is used. It is to provide a micro heat exchanger in which the supplied structure can be implemented.

The objects of the present invention include a plurality of metal plates in which microchannels are formed in parallel to flow a fluid, and a supply channel and a discharge channel of the fluid are formed with respect to the microchannel in a micro heat exchanger. A laminate formed by lamination bonding so as to have a thermal correlation due to the temperature difference of the fluid; Each fixing plate symmetrically bonded to each of the corresponding metal plates on both sides of the stacking direction, and each of the fixing plates are connected to the respective fixing plates and connected to the supply channel and the discharge channel so as to supply / discharge the fluid to the stack. And a first manifold and a second manifold including respective conduits to which fluids at different temperatures are supplied / discharged.

The laminate may be configured based on the microchannel formation direction of each metal plate such that fluids having different temperatures may be alternately supplied / circulated with respect to the stacking order of the metal plates based on the formation direction of the corresponding microchannel. Preferably, each metal plate is alternately / laminated so that the corresponding microchannels of the adjacent metal plates intersect / arrange with each other.

In addition, each of the metal plates, it is preferable that the supply distribution channel and the discharge distribution channel for branching the supply channel and the discharge channel is further formed.

In addition, the metal plate may have a first connector penetrating to a position corresponding to a starting point of the supply channel and the discharge channel so as to form a flow path structure in communication with the respective conduits in the stack, and to face the first connector. A second connector is formed to be penetrated, and it is preferable that the first connector is connected to each other on the same axis as the second connector of the adjacent metal plate according to the cross arrangement of the microchannels.

Other objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and the preferred embodiments associated with the accompanying drawings.

1A to 1I are each process configuration diagram of a method for manufacturing a micro heat exchanger according to a first embodiment of the present invention;

2 is an exploded perspective view of a micro heat exchanger manufactured according to a first embodiment of the present invention;

3a to 3i are configuration diagrams of each process of the method for manufacturing a micro heat exchanger according to a second embodiment of the present invention;

4 is an exploded perspective view of a micro heat exchanger manufactured according to a second embodiment of the present invention;

Figure 5a is a photograph for showing the longitudinal cross-sectional structure of the laminate bonded in a micro heat exchanger manufactured according to the present invention,

FIG. 5B is an enlarged photograph showing a portion corresponding to the microchannel in the photo shown in FIG. 5A.

<Description of the code | symbol about the principal part of drawing>

100 laminated body 110 metal plate 110a fine channel

110b: supply channel 110c: supply distribution channel 110d: discharge channel

110e: discharge distribution channel 110f: first connector 110g: second connector

110h: alignment tool 200: first manifold 210: first fixing plate

220: first conduit 230: second conduit 300: second manifold

310: second fixing plate 320: third conduit 330: fourth conduit

DESCRIPTION OF SYMBOLS 1000 micro heat exchanger 2000 assembly 2100 joining thin plate 2200 joining material 3100 alignment jig 3200 alignment pin 4100 load part 4200 moving jig 4300 guide

4400: Fixture 5000: Brazing Furnace.

Hereinafter, with reference to the accompanying drawings, a micro heat exchanger according to the present invention will be described.

1A to 1I are each process configuration diagram of a method for manufacturing a micro heat exchanger according to a first embodiment of the present invention.

The manufacturing method according to the present invention, in the method of manufacturing the heat exchanger 1000 by stacking / reversing / aligning / assembling / bonding each metal plate 110 having the microchannels 110a formed between the manifolds 200 and 300. It is about. In particular, a process of alternately stacking the metal plates 110 and the thin plate 2100 for bonding is included, and this process provides a method in which all of the boundary portions of each of the microchannels 110a participate in the bonding. At this time, preferably, the laminated metal plate 110 and the thin plate 2100 are reversed to perform brazing in a state in which the fine channels 110a are stacked in a direction opposite to the depth direction of the fine channel 110a. Accordingly, there is provided a vane capable of preventing the melt of the thin plate 2100 from being introduced into the microchannel 110a.

As shown in Figs. 1A-1I, first, each metal plate 110 has a width and / or depth of about 1 mm or less along one direction, and is press-processed to obtain fine channels 110a, each of which is disposed in parallel with each other. General machining such as milling or special processing such as photoetching, precision casting and metal injection molding are performed.

At this time, as the processing region of the microchannel 110a, a rectangular processing target portion is selected as the center of the metal plate 110, the microchannel 110a is processed in parallel to the region, and the area around the microchannel 110a is formed. Through four holes. Each hole is formed to be symmetrical with each other to a point corresponding to each corner of the metal plate 110, each of the conduits (220, 230, 320, 330) constituting the manifold (200, 300) is connected, when each metal plate 110 is laminated / bonded Each connector 110f and 110g are formed to be supplied and discharged to each of the microchannels 110a while the low temperature or high temperature fluid is transferred. Each of the connectors 110f and 110g is located at a diagonal position and connected to the microchannel 110a, and the first connector 110f is formed, and the second connector is formed at a diagonal position without the connection structure with the microchannel 110a. (110 g).

At this time, the supply channel 110b and the discharge channel in a position and shape gradually expanding and communicating toward the formation region of the microchannel 110a so as to be connected to the microchannel 110a from each first connector 110f. 110d). At this time, the supply distribution channel 110c and the discharge distribution channel 110e so that the fluid supplied to or discharged from each of the fine channels 110a may be distributed in the supply channels 110b and the discharge channels 110d. It is preferable to branch the inside of the supply channel (110b) and the discharge channel (110d) by forming a (S1100).

Accordingly, the metal plate 110, as shown in Figure 1a is prepared.

The plurality of metal plates 110 prepared as described above are alternately stacked with the thin plate 2100 for bonding. The bonding thin plate 2100 is used as a bonding medium that is melted when the bonding process is performed in the brazing furnace 5000. When the metal plate 110 is made of aluminum, an alloy of aluminum and silicon is used, and copper is used. In the case of alloys, silver or silver-containing alloys, stainless-based alloys, or heat-resistant alloys, nickel-based alloys or pure copper are used. In order to prevent the microchannels 110a from being clogged during brazing bonding, one having a thickness of 0.1 mm or less and preferably having a thickness of about 0.025 to 0.05 mm is used.

The metal plate 110 and the thin plate 2100 are alternately stacked to provide a structure in which the metal plates 110 may be bonded to each other. In addition to the lamination, a method of laminating the formation direction of the microchannels 110a to cross each other for each metal plate 110 to be stacked with the thin plate 2100 interposed therebetween.

First, the metal plate 110 is laminated on the bonding thin plate 2100 having the same size as the metal plate 110, but one surface on which the fine channel 110a is formed is placed upward so that the formation direction of the fine channel 110a can be seen from above. Then, the other metal plate 110 is placed so that the formation direction of the metal plate 110 and the microchannel 110a which lies directly under the stack is arranged / crossed. At this time, the fine channel 110a is disposed upward. Then, each of the first connector 110f and the second connector 110g is provided with a structure in which the same direction in which the fine channels 110a are formed is disposed at the same position. After the desired number of metal plates 110 and thin plates 2100 are stacked, the thin plates 2100 are placed at the top for bonding to the manifolds 200 and 300, as the thin plates 2100 are placed at the bottom. Accordingly, the laminate 100 of the metal plate 110 and the thin plate 2100 is formed.

The lamination method according to the present invention, the thin plate 2100 has a structure that faces the entire surface of the metal plate 110, the melting when the thin plate 2100 for bonding in the brazing bonding process to be performed later We present a method that can also participate in the boundary of the micro-channel (110a) as a target of the junction.

In addition, the alternating stacking of the metal plate 110 and the thin plate 2100, such that the microchannels 110a are formed in the metal plates 110 stacked with the thin plate 2100 interposed therebetween, are arranged to cross each other. Alternating lamination is made based on the forming direction of 110a.

Accordingly, when three adjacent / laminated metal plates 110 are joined, the first connector 110f of the upper metal plate 110 is connected to the second connector 110g of the metal plate 110 below it. The second connector 110g is provided with a structure connected to the first connector 110f of the bottom metal plate 110. Therefore, when the product is completed and used, when fluid flows through each of these connectors 110f and 110g, the fluid flows into the first connector 110f and is provided to the supply channel 110b and the fine channel 110a and flows to the discharge channel 110d. And through the first connector 110f at the diagonal position.

In addition, when the second connector 110g is introduced thereunder, the fluid is alternately circulated in such a manner as to pass through the first connector 110f at the bottom thereof and flow into the corresponding microchannel 110a. As a result, it is considered that a fluid having a different temperature is provided to the second connector 110g compared to the first connector 110f at the connector, that is, at one metal plate 110 at a position opposite to each of the connectors 110f and 110g. In this case, the high temperature fluid and the low temperature fluid are alternately provided and circulated, and thus, to have a structure that allows heat exchange between adjacent metal plates 110 is alternately stacked based on the formation direction of the microchannel 110a. It is possible by the technique (S1200).

As described above, after the alternating lamination of the metal plate 110 and the bonding thin plate 2100 and the alternating lamination process based on the formation direction of the microchannels 110a between the metal plates 110 are performed, each metal plate 110 and each The laminate 100 of the thin plate 2100 is inverted to be reversed / positioned. Then, the fine channel 110a of the metal plate 110 faces downward. Accordingly, the molten body of the thin plate 2100 may be prevented from flowing into the fine channel 110a during the brazing bonding process to be performed later (S1210).

Then, the first manifold 200 and the second manifold 300 are manufactured. First, two first fixing plates 210 and second fixing plates 310 having the same size as the metal plate 110 and relatively thick are made. Prepare. Each of the fixing plates 210 and 310 is drilled into two holes at positions and sizes corresponding to the first connector 110f and the second connector 110g disposed in series along the edge of the metal plate 110. The first conduit 220f and the second conduit 230, the third conduit 320, and the fourth conduit 330 are spot welded to each of the holes, and the first connector 110f is formed by stacking the metal plate 110. And each manifold 200 and 300 having a structure in communication with the conduit structure formed by the second connector 110g. (S1300)

Thereafter, each of the fixing plates 210 and 310 and the portions bonded to the fixing plates have the same material as the thin plates 2100 around each of the conduits 220, 230, 320 and 330, and apply the bonding material 2200 in a paste state. (S1400)

At this time, the laminate 100 of the metal plate 110 and the thin plate 2100 configured above is likely to be disturbed in the stacking posture in the reverse process. Therefore, it is necessary to force restraint for alignment, since the metal plate 110 and the thin plate 2100 is a rectangular shape, the alignment jig 3100 is in close contact with and aligned to the diagonal edge portion thereof. The alignment jig 3100 is a rod structure recessed in a corresponding shape such that the edge portions of the metal plate 110 and the thin plate 2100 are fitted to the side, and use the same material or ceramic material as the metal plate 110. In this case, in the case of the same material, it is necessary to apply a liquid containing ceramic on the surface in advance so that the alignment jig 3100 does not adhere to the metal plate 110.

In addition, in order to prevent buckling due to thermal expansion of the metal plate 110 during the brazing process, the load in the height direction of the stack 100, that is, the gravity direction of the corresponding position, is greater than the static friction force of the alignment jig 3100. Use is preferred. When each of the alignment jig 3100 is pressed against each corner of the stack 100, alignment is easily performed. (S1410)

In addition, a fixing jig 4400 and a moving jig 4200 are prepared to assist in assembling the manifolds 200 and 300 and the stack 100. The moving jig 4200 and the fixing jig 4400 are in the form of thick plates disposed on the upper and lower portions of each of the manifolds 200 and 300 and the stack 100 to be assembled, and the upper portion thereof in the inverted / aligned stack 100. And holes are formed to prevent interference with the respective conduits (220, 230, 320, 330) of the corresponding manifold to be located below.

First, the fixture jig 4400 is placed on the floor, the first manifold 200 is turned over, and the first conduit 220 and the second conduit 230 are inserted into the holes of the fixture jig 4400. Then, the stack 100 is placed thereon with the alignment jig 3100. In this process, each alignment jig 3100 aligns the first fixing plate 210 of the first manifold 200 disposed below with the stack 100. Thereafter, the second manifold 300 is placed on the stack 100 and aligned with the stack 100 using the alignment jig 3100. Then, the movable jig 4200 is placed thereon, and the third conduit 320 and the fourth conduit 330 of the second manifold 300 are inserted into each hole of the movable jig 4200.

At this time, the guides 4300 fixed along the height direction are disposed on both sides of the fixing jig 4400. Each guide 4300 is formed at a position corresponding to both sides of the moving jig 4200, and is assembled to fit in each hole having a larger relative relative to the guide 4300. The load unit 4100 is placed on the upper portion of the movable jig 4200. The load part 4100 is a metal weight that can apply a load of about 10 g / cm 2 or more in order for the assembly 2000 to receive a predetermined load and to perform brazing bonding. The load part 4100 is about 50 to about 50 mm in consideration of the thickness of the metal plate 110. It is preferable that it is 150g / cm <2>. At this time, since the movable jig 4200 having a relatively large surface area is positioned between the load part 4100 and the assembly 2000, the movable jig 4200 is along the guide 4300 according to the applied load. While being transported downward, a structure is provided in which the load of the load part 4100 can be uniformly applied throughout the assembly 2000.

Accordingly, the assembly 2000 to be injected into the brazing furnace 5000 is completed. (S1500)

A plurality of assemblies 2000 assembled as described above are put into the brazing furnace 5000. At this time, the inside of the brazing furnace 5000 is formed in a vacuum state or filled with an inert gas, a reducing gas, or the like. Then, the brazing furnace 5000 is operated, and each metal plate 110 and each fixed plate (heated above the melting point of the bonding plate 2100 between the metal plate 110 and the bonding material 2200 in the paste state applied to the conduit). 210 and 310, and each of the fixing plates 210 and 310 and the conduit are joined. At this time, since the thin plate 2100 is in close contact with the entire surface of the metal plate 110, the thin plate 2100 is bonded to each boundary of the fine channel 110a. And since the laminate 100 is bonded in an inverted posture, the melt of the thin plate 2100 does not flow into the fine channel 110a.

Accordingly, each microchannel 110a of each metal plate 110 is in close contact with the other surface of each of the upper and lower metal plates 110 disposed close to each other to form a flow path. The micro heat exchanger 1000 is completed. (S1600)

After the brazing joining process, discharge from the brazing furnace (5000), remove the fixed jig (4400), the moving jig (4200) and the alignment jig (3100) and the load (4100), if necessary to the surface after the post-processing process Remove the residual melt discharged (S1700).

2 is an exploded perspective view of the micro heat exchanger 1000 manufactured according to the first embodiment of the present invention. As shown in FIG. 2, the micro heat exchanger 1000 manufactured by the above-described manufacturing method includes a plurality of metal plates 110 stacked / bonded such that the formation directions of the microchannels 110a cross / arrange each other. The stack 100 includes a first manifold 200 and a second manifold 300 disposed on one side and the other side of the stack 100 along the stacking direction of the metal plate 110.

At this time, the first connector 110f and the second connector 110g of each metal plate 110 form a single pipe while the metal plate 110 is alternately stacked based on the formation direction of the fine channel 110a. The conduit has a structure in communication with each conduit (220, 230, 320, 330) of each manifold (200, 300). Therefore, when the fluid flows through each of the conduits (220, 230, 320, 330), the fluid is supplied to each of the micro-channel (110a) through the supply channel (110b) formed from each connector (110f, 110g) to the micro-channel (110a), the discharge channel ( The flow path of the fluid discharged through 110d) is provided. In addition, a structure in which fluids of the same temperature are circulated between the metal plates 110 alternately arranged according to the coupling structure of the metal plates 110 stacked so that the formation directions of the respective microchannels 110a intersect / arrange are provided.

Here, the specific fluid circulation path will be described first, for example, a high temperature fluid flows through the first conduit 220 of the first manifold 200 to the first metal plate 110 proximate the first manifold 200. When a high temperature fluid is provided through the first connector 110f of the metal plate 110 in communication with the first conduit 220, the fluid flows through the supply channel 110b and is branched to the supply channel 110b. Fluid flows into the corresponding fine channel 110a through the supply distribution channel 110c.

This fluid flows through the fine channel 110a and is discharged through the discharge channel 110d. At this time, the low temperature fluid is supplied through the second conduit 230 to the second connector 110g at the position opposite to the first connector 110f provided with the high temperature fluid in the metal plate 110 adjacent to the first fixing plate 210. If provided, it immediately flows through the first connector 110f, the supply channel 110b, the fine channel 110a, and the discharge channel 110d of the metal plate 110 behind it, so that each adjacent metal plate 110 is different from each other. The fluid of temperature flows, and consequently, a structure in which a thermal correlation is provided between adjacent metal plates 110 is provided.

In addition, the second manifold 300 is disposed in a position opposite to the first manifold 200, and the third conduit 320 and the fourth conduit 330 are formed of the first conduit 220 and the second conduit ( 230 is connected to the first connector 110f and the second connector 110g opposite to the first connector 110f and the second connector 110g connected to the bar, and thus the high temperature fluid of the first conduit 220 Is discharged to the third conduit 320 through the circulation process described above, the low-temperature fluid of the second conduit 230 is discharged to the fourth conduit 330. At this time, the supply direction of each fluid is provided to each conduit (220, 230, 320, 330) of each manifold (200, 300) in the opposite direction rather than the same direction for heating, cooling of the corresponding field of use of the micro heat exchanger (1000) according to the present invention It will be possible according to the design change.

3A to 3I are configuration diagrams of each process of the method for fabricating the micro heat exchanger according to the second embodiment of the present invention. As shown in FIGS. 3A-3I, a method of forcing restraint using an alignment pin 3200 to align the stack 100 is proposed.

First, the microchannels 110a are formed in parallel in the central region, and two first connectors 110f and 110g having two diagonal positions are formed to be adjacent to each corner. In addition, the supply channel 110b and the discharge channel 110d are formed to extend from the two first connectors 110f at the diagonal positions to the formation region of the fine channel 110a. In this case, the supply channel 110b and the discharge channel 110d are branched to form a supply distribution channel 110c and a discharge distribution channel 110e so that the fluid flowing in or out flows smoothly.

In addition, a total of four holes, each of which has an inner diameter relatively smaller than each connector 110f and 110g, are drilled in the center near each edge of the metal plate 110. This hole is the alignment opening 110h. Each alignment sphere 110h is formed to align using the alignment pins 3200 in the alignment process of the stack 100. (S2100)

Thereafter, in order to identify the direction in which the microchannels 110a are formed, one surface of the metal plate 110 on which the microchannels 110a are formed is placed upward, and each metal plate 110 and the bonding thin plate 2100 are alternately stacked. The laminate 100 is formed. In addition to the alternating stacking of the metal plate 110 and the thin plate 2100, a technique of alternately stacking the metal plate 110 and the thin channel 110a based on the formation direction is performed. That is, when laminating different metal plates 110 with the thin plates 2100 interposed on one metal plate 110, the fine channels 110a of each metal plate 110 are repeatedly stacked so as to cross / arrange each other. . Accordingly, the two metal plates 110 having one metal plate 110 interposed therebetween have the same direction in which the microchannels 110a are formed, and the first thin plate 2100 has one metal plate 110. The microchannels 110a of each of the metal plates 110 closely stacked with the two thin plates 2100 intersect / arrange with each other. At this time, the thin plate 2100 is disposed at the top and bottom of the laminate 100 in the stacking order so that the manifolds 200 and 300 may be bonded to both sides of the laminate 100 in the stacking direction (S2200).

In such a stacking posture, since the molten material of the thin plate 2100 may be introduced into the fine channel 110a when the brazing bonding is performed, the stack 100 is reversed / positioned to prevent this from happening (S2210).

And manufacture each manifold (200,300). First, the first fixing plate 210 and the second fixing plate 310 thicker than the metal plate 110 are prepared, and four holes are drilled at positions corresponding to the respective connectors 110f and 110g in the fixing plates 210 and 310, respectively. Then, the fixing plate alignment pins 3200 are drilled in the position and size corresponding to the alignment holes 110h of the metal plate 110. The first conduit 220 and the second conduit 230, the third conduit 320, and the fourth conduit (two conduits formed along the edges of the holes formed corresponding to the respective connectors 110f and 110g). 330 is spot welded to each other to produce a first manifold 200 and a second manifold 300 (S2300).

Since the conduit (220, 230, 320, 330) and the coupling portion of each of the fixing plate (210, 310) has the same material as the thin plate 2100, and paste the bonding material 2200 in the paste state. (S2400)

At this time, since each metal plate 110 constituting the laminate 100 does not have a bonding relationship with each other, the stacking posture thereof is not aligned. Therefore, the alignment pins 3200 are placed on the alignment holes 110h of the metal plates 110 formed above. By inserting in succession, each metal plate 110 is aligned. (S24100)

And in order to assemble the laminated body 100 and each manifold 200,300 provided in this way, the member which assists assembly is used. This is the movable jig 4200 and the fixed jig 4400. The movable jig 4200 and the fixing jig 4400 are formed in the form of a thick plate and formed with holes for fitting the conduits 220, 230, 320, 330 of each manifold 200, 300, and both sides of the fixing jig 4400 are rod-shaped. The guide 4300 is fixed, and the movable jig 4200 guides and descends up and down on the guide 4300.

First, the first conduit 220 and the second conduit 230 of the first manifold 200 are inserted into each hole of the fixing fixture 4400, and the stacked stack 100 aligned and reversed / arranged thereon is fixed. Put it up. At this time, the alignment pins 3200 are inserted into the first fixing plate alignment holes 210a of the first fixing plate 210 to be aligned with the stack 100. Then, the second manifold 300 is placed on the laminate 100. At this time, each of the alignment pins 3200 is inserted into the second fixing plate alignment holes 310a of the second fixing plate 310. Accordingly, the manifolds 200 and 300 and the laminate 100 are assembled.

Thereafter, the movable jig 4200 is placed on the second manifold 300 and the third conduit 320 and the fourth conduit 330 of the second manifold 300 are inserted. The load unit 4100 is placed on the movable jig 4200. Accordingly, the assembly 2000 in which the load of the load part 4100 is uniformly applied along the height direction of the stack 100 through the moving jig 4200 is completed. (S2500)

After fabricating a large number of such assemblies 2000, and putting them in a brazing furnace 5000, it is heated above the melting temperature of the bonding thin plate 2100 and the bonding material 2200 to bond each metal plate 110 to the fine channel The boundary of 110a is bonded to the other surface of the adjacent metal plate 110 to form a flow path, and the conduits 220, 230, 320 and 330 are joined to each of the fixing plates 210 and 310, and at the same time, the manifolds 200 and 300 are stacked on the metal plate 110. It adheres to the sieve 100. Accordingly, the micro heat exchanger 1000 is completed. (S2600)

The finishing process of removing / removing the fixed jig 4400, the moving jig 4200, the load part 4100 and the alignment pin 3200 from the completed micro heat exchanger 1000, and removing the residual melt discharged to the outside. Proceed to step (S2700).

4 is an exploded perspective view of the micro heat exchanger 1000 manufactured according to the second embodiment of the present invention. As shown in FIG. 4, the micro heat exchanger 1000 manufactured by the above-described manufacturing method has a structure in which each metal plate 110 is alternately arranged based on the formation direction of the microchannel 110a. In each of the metal plates 110 arranged, heat exchange is performed as the fluid having different temperatures flows for each metal plate 110 in a flow path formed of the corresponding microchannels 110a.

To this end, the heat exchanger 1000 may include a stack 100 in which each metal plate 110 is stacked, and a first manifold disposed on both sides of the stack 100 and configured to supply / discharge fluid at different temperatures ( 200 and the second manifold 300.

Here, the laminate 100 is formed by stacking / joining each metal plate 110 through brazing bonding, and is a part where heat exchange occurs when each fluid flows through the microchannel 110a of each metal plate 110.

2, the metal plate 110 includes a plurality of microchannels 110a that are formed in parallel at the center of one surface and form a generally rectangular region, and are gradually expanded to the formation region of the microchannels 110a. Supply channel 110b and outlet channel 110d. In addition, the supply distribution channel 110c and the discharge distribution channel 110e are formed by branching the supply channel 110b and the discharge channel 110d.

At the starting point of the supply channel 110b and the discharge channel 110d, two first connectors 110f penetrating the metal plate 110 and disposed diagonally are formed. In addition, two second connectors 110g are formed to penetrate the metal plate 110 diagonally to each other at positions facing the first connectors 110f and are not structurally related to the flow path of the corresponding microchannel 110a. .

Herein, the metal plates 110 are disposed to intersect adjacent ones with respect to the formation direction of the microchannels 110a. Accordingly, the first connector 110f and the second connector 110g of the metal plate 110 are connected to each other to form a conduit.

At this time, since the first connector 110f is in communication with the corresponding microchannel 110a and the second connector 110g has no connection with the corresponding microchannel 110a, the corresponding fluid is provided in the first connector 110f. It is only provided if it passes. And considering the first connector 110f and the second connector 110g in the diagonal position, the provided fluid flows through the supply channel 110b and the fine channel 110a and is discharged through the discharge channel 110d. Discharged through the first connector 110f at the diagonal position and again through the second connector 110g at the rear thereof to provide the first connector 110f at the rear thereof to repeat the flow path of the aforementioned fluid. The structure is prepared.

If fluids of different temperatures are separately provided to the first connector 110f and the second connector 110g facing each other in one metal plate 110, fluids of different temperatures may be applied to the respective microplates 110 at different temperatures. A structure is provided in which heat exchange is performed between adjacent ones while flowing through 110a.

In addition, the first manifold 200 is provided on one side of the laminate 100 to provide fluid to each of the metal plates 110 constituting the laminate 100. It is a structure including a first conduit 220 and a second conduit 230 are arranged side by side on one side of the first fixing plate 210 and connected in parallel.

At this time, the first fixing plate 210 faces / bonds to the position where the first conduit 220 and the second conduit 230 correspond to the first connector 110f and the second connector 110g of the front metal plate 110. It is. Accordingly, the first connector 110f and the second connector 110g are connected to the first conduit 220 and the second conduit 230, and a high temperature or low temperature fluid is applied to the laminate 100 according to the connection structure. The provided structure is provided.

In addition, the first conduit 220 has a structure connected to the first connector 110f. If a high temperature fluid is provided, the supply channel 110b, the supply distribution channel 110c, and the fine channel of the metal plate 110 are provided. The high temperature fluid flows through the outlet channel 110a, the discharge channel 110d, and the discharge distribution channel 110e, and may be provided to the other metal plate 110 at the rear through the first connector 110f at the diagonal position.

In the rear metal plate 110, since the formation direction of the front metal plate 110 and the fine channel 110a is intersected / arranged, the front first connector 110f and the rear second connector 110g communicate with each other. A structure is provided. Therefore, a high temperature fluid does not flow through the fine channel 110a of the rear metal plate 110 and is provided directly to the first connector 110f of the rear metal plate 110 through the corresponding second connector 110g and in the aforementioned order. An alternating circulation structure of a high temperature fluid, such as circulated appropriately, is provided.

The second conduit 230 is connected to the second connector 110g of the metal plate 110 adjacent to the first fixing plate 210. The second conduit 230 provides a fluid having a temperature different from that of the first conduit 220 to the second connector 110g, for example, when providing a low temperature fluid. In the rear, the first connector 110f of the other metal plate 110 is arranged / connected.

Therefore, the low temperature fluid is not provided to the fine channel 110a of the metal plate 110 adjacent to the first fixing plate 210, but is provided to the first connector 110f of the metal plate 110 behind the supply channel 110b. , The supply distribution channel 110c, the fine channel 110a, the discharge channel 110d, the discharge distribution channel 110e in order, and through the first connector 110f at the diagonal position, An alternate circulation structure of the low temperature fluid provided to the two connectors 110g is provided.

The second manifold 300 is disposed at a position opposite to the first manifold 200 with the stack 100 of each metal plate 110 interposed therebetween, and the stack at the first manifold 200. The second fixing plate 310 bonded to the metal plate 110 at the corresponding position and the third conduit 320 bonded / connected to the second fixing plate 310 in order to discharge the hot and cold fluids provided to the 100. And a fourth conduit 330. The third conduit 320 and the fourth conduit 330, the first conduit 220 and the second conduit 230, the first connector (110f) and the second connector ( Unlike the connected to 110g), it is a structure connected to the first connector 110f and the second connector 110g located on the metal plate 110.

In the present invention, the stacking / arranging structure of even-numbered metal plates 110 is illustrated, and each fluid provided downward of the first fixing plate 210 is discharged upward of the second fixing plate 310. In particular, the high temperature fluid of the first conduit 220 passes through the stack 100 and is discharged into the third conduit 320, and the low temperature fluid of the second conduit 230 passes through the stack 100 and the fourth conduit. Discharged to 330.

The discharge position of each of the fluids is determined by the stacking structure of the even-numbered metal plate 110, and in addition to the stacking structure of the odd-numbered metal plate 110, the conduits 220, 230, 320, and 330 may be disposed at the same height.

Figure 5a is a photograph for showing the longitudinal cross-sectional structure of the laminate 100 bonded in the micro heat exchanger 1000 manufactured according to the present invention, Figure 5b is a photo shown in Figure 5a, in the fine channel (110a) It is an enlarged photograph showing the applicable site. As shown in Figs. 5A and 5B, a cross section in which the laminate 100 is cut in the stacking direction is shown. The bonding thin plate 2100 may be melted / bonded to each surface of the metal plate 110 through a brazing bonding process, and in particular, the boundary portion of the microchannel 110a may also participate in such bonding.

As a result, only the flow path structure consisting of the microchannel 110a and the other surface of the metal plate 110 in contact with the microchannel 110a is displayed in black, and the bonding is performed over the entire surface of the metal plate 110 except for the portion related to the flow of the fluid. It can be seen that it was done.

As described above, in the micro heat exchanger according to the present invention, the manifolds 200 and 300 are disposed with different positions of the conduits 220, 230, 320 and 330 with respect to the laminate 100, or the lamination of the metal plates 110. Of course, the number can vary depending on the design specifications required in the field of use.

In addition, although the supply channel 110b and the discharge channel 110d are formed toward each of the first connectors 110f that are diagonally disposed with the formation region of the microchannel 110a interposed therebetween, the formation region of the microchannel 110a is also defined. Naturally, the first connector 110f may be formed to face each other, and the supply channel 110b and the discharge channel 110d may be replaced.

According to the micro heat exchanger according to the present invention described above, a method of brazing bonding at a time is proposed in an alternating lamination step of the bonding thin plate, and a step of reversing the laminate is included. Since it does not flow, there is a manufacturing characteristic that all the boundary portions of the microchannels can participate as the object of bonding without additional processing while ensuring precision.

Since the boundary portion of the microchannel can participate as the object of the bonding, there is an advantage that the heat resistance and pressure resistance for each flow path formed by the microchannel in the manufactured micro heat exchanger can be maximized.

In addition, since the corresponding microchannels of each metal plate are stacked to cross / arrange, there is an effect that heat exchange of higher efficiency can be achieved.

Although the present invention has been described in connection with the above-mentioned preferred embodiments, it is possible to make various modifications or variations without departing from the spirit and scope of the invention. Therefore, the scope of the utility model registration claims attached will include such modifications or variations that fall within the spirit of the present invention.

Claims (4)

In micro heat exchanger, The microchannels 110a are formed in parallel to flow the fluid, and each of the metal plates includes a plurality of metal plates 110 having a supply channel 110b and a discharge channel 110d formed therein with respect to the microchannels 110a. A laminate 100 in which 110 is laminated and laminated so as to have a thermal correlation due to the temperature difference of the corresponding fluid; The fixing plates 210 and 310 are symmetrically bonded to the respective metal plates 110 on both sides of the stacking direction so as to supply / discharge fluids to the stack 100 and the bonding plates 210 and 310 so as to communicate with each of the fixing plates 210 and 310. And a first manifold 200 and a second manifold 300, each of which is connected to the supply channel 110b and the discharge channel 110d and includes respective conduits 220, 230, 320, and 330 to supply / discharge fluid at different temperatures. Micro heat exchanger comprising a. According to claim 1, wherein the stack 100, the fluids of different temperatures are to be supplied / circulated alternately with respect to the stacking order of each metal plate 110 on the basis of the formation direction of the fine channel (110a). The metal plates 110 are alternately / laminated on the basis of the formation direction of the microchannels 110a of the metal plates 110 so that the corresponding microchannels 110a of the adjacent metal plates 110 intersect / arrange each other. Micro heat exchanger having a structure. The method of claim 2, wherein each of the metal plate 110, characterized in that the supply distribution channel 110c and the discharge distribution channel 110e for branching the supply channel 110b and the discharge channel (110d) is further formed. Micro heat exchanger. The starting point of the supply channel (110b) and the discharge channel (110d) in each of the metal plate 110 so that a pipe structure in communication with the conduit (220, 230, 320, 330) is formed in the stack 100 A first connector 110f penetrated to a position corresponding to the first connector 110f, and a second connector 110g penetratingly formed to face the first connector 110f, The first heat exchanger (110f) is connected to each other on the same axis and the second connector (110g) of the adjacent metal plate 110 according to the cross arrangement of the fine channels (110a).