KR200325139Y1 - Adiabatic Board for Heat Piping - Google Patents
Adiabatic Board for Heat Piping Download PDFInfo
- Publication number
- KR200325139Y1 KR200325139Y1 KR20-2003-0009860U KR20030009860U KR200325139Y1 KR 200325139 Y1 KR200325139 Y1 KR 200325139Y1 KR 20030009860 U KR20030009860 U KR 20030009860U KR 200325139 Y1 KR200325139 Y1 KR 200325139Y1
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- South Korea
- Prior art keywords
- lower plate
- pad member
- heating
- insulation board
- plate
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D3/00—Hot-water central heating systems
- F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
- F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
- F24D3/149—Tube-laying devices
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
- E04F15/107—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials composed of several layers, e.g. sandwich panels
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
- E04F15/20—Separately-laid insulating layers; Other additional insulating measures; Floating floors for sound insulation
- E04F15/206—Layered panels for sound insulation
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
- E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/04—Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire
- E04F2290/041—Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire against noise
- E04F2290/043—Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire against noise with a bottom layer for sound insulation
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- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Floor Finish (AREA)
Abstract
본 고안은 난방관 배관용 단열보드에 관한 것으로, 건물의 바닥면을 이루는 콘크리트 슬라브층(1) 상부에 일정 두께로 펼쳐지는 것에 의해 실내의 보온을 유지토록 하는 단열재의 하부판재(30)와, 상기 하부판재(30)의 상부에 결합되며, 상부에는 난방관(4)이 배치되는 간격을 감안하여 난방관(4)을 안착시켜 배관할 수 있는 난방관 배관용 수단(21)이 구비되고, 종,횡으로 연결가능한 상부판재(20)로 구성된 것에 있어서, 상기 하부판재(30)의 하부면에는 소정두께를 가지는 패드부재(40)가 구비되어 이 패드부재(40)가 하부판재(30)와 2 중으로 흡음, 방진, 단열효과를 발생하여, 그 효과를 획기적으로 증대시킬 수 있는 것이다.The present invention relates to an insulation board for heating pipe piping, the lower plate 30 of the heat insulating material to maintain the warmth of the room by spreading a certain thickness on the concrete slab layer (1) forming the floor surface of the building, It is coupled to the upper portion of the lower plate 30, the upper portion is provided with a heating pipe piping means 21 that can be piped by mounting the heating tube 4 in consideration of the interval in which the heating tube 4 is disposed, In the vertical and horizontally connectable upper plate 20, the lower surface of the lower plate 30 is provided with a pad member 40 having a predetermined thickness, the pad member 40 is the lower plate 30 The sound absorbing, dustproofing, and adiabatic effect can be generated in two and two, and the effect can be greatly increased.
따라서, 건축내의 거주환경을 쾌적한 상태로 유지할 수 있고, 난방효율을 향상시켜 상품성과 경제성을 동시에 증대시킬 수 있는 매우 유용한 고안인 것이다.Therefore, it is a very useful design that can maintain the living environment in the building in a comfortable state and improve the heating efficiency at the same time to increase the merchandise and economics.
Description
본 고안은 난방관 배관용 단열보드에 관한 것으로 더 상세하게는 단열보드 하부에 패드부재를 구비하여, 건물의 바닥면에서 단열, 방진, 흡음효과를 증대시킬 수 있도록 고안된 것이다.The present invention relates to an insulation board for heating pipe piping, and more specifically, to provide a pad member under the insulation board, it is designed to increase the insulation, dustproof, sound-absorbing effect on the floor of the building.
일반적으로, 주거용 건축물들의 콘크리트 슬라브 층에는 일정 두께로 된 경량 기포콘크리트의 상부로 온수순환을 위해 난방파이프를 배관시키고, 마감몰탈을 시공한 후 건조기간을 거쳐 그 상부면에는 장판지등으로 마감하는 것에 의해 바닥면을 완성하게 되는 것이다.In general, the concrete slab layer of residential buildings pipes heating pipes for hot water circulation to the upper part of lightweight foam concrete of a certain thickness, finishes mortar, and finishes it with sheet paper on the upper surface after drying period. By completing the bottom surface.
그리고, 상기한 바와 같이 온돌 바닥면을 시공하는 과정에서 파이프 구조로 그 내부로 보일러에서 가열된 온수가 순환되어 난방되는 난방관은 그 절곡상태 및 배치된 간격을 유지하기 위해 난방관 고정구등을 기포콘크리트 상부면에 설치하기도 한다.And, as described above, in the process of constructing the floor of the underfloor, the heating tube circulated by heating the heated hot water from the boiler to the inside of the pipe structure to bubble the heating tube fixtures to maintain the bent state and the intervals arranged therein. It is also installed on the concrete top surface.
한편, 근래에는 상기한 바와 같은 온돌 바닥면 시공을 보다 간편하게 시공할 수 있고, 난방효율을 증대시킬 수 있는 난방관 배관용 단열보드가 사용된다.On the other hand, in recent years, the ondol floor construction as described above can be more easily installed, the insulation board for heating pipe piping that can increase the heating efficiency is used.
그리고, 종래의 난방관 배관용 단열보드는 도시하지는 않았지만 건물의 바닥면을 이루는 콘크리트 슬라브층 상부에 일정 두께로 펼쳐지는 것에 의해 실내의 보온을 유지토록 하는 단열재의 하부판재와, 상기 하부판재의 상부에 결합되며, 상부에는 난방관이 배치되는 간격을 감안하여 난방관을 안착시켜 배관할 수 있는 난방관 배관용 수단이 구비되고, 일정강성을 가지는 상부판재로 구성된다.In addition, although not shown, the conventional heat insulation board for heating pipe plumbing is not shown, the lower plate of the heat insulating material to maintain the warmth of the room by spreading a certain thickness on the concrete slab layer forming the floor surface of the building, and the upper of the lower plate Is coupled to, the upper portion is provided with a heating pipe piping means that can be piped by seating the heating tube in consideration of the interval in which the heating tube is disposed, is composed of a top plate having a certain rigidity.
그러나, 종래의 난방관 배관용 단열보드는 상부판재에 결합되는 단열재의 하부판재로는 바닥면에서 발생되는 진동이나, 소음을 흡수하기엔 미흡한 문제점이 있었던 것이다.However, the conventional insulation board for heating pipe piping has a problem that the lower plate of the heat insulating material coupled to the upper plate material is insufficient to absorb the vibration or noise generated from the bottom surface.
또한, 단층으로 형성된 단열재의 하부판재로는 단열효과가 미흡하여 난방관의 열이 콘크리트 슬라브층으로 전달되는 것을 완전히 차단하지 못해 열손실이 발생하는 폐단이 있었던 것이다.In addition, the lower plate of the heat insulating material formed of a single layer had a poor insulation effect, so that the heat dissipation occurred because the heat of the heating tube was not completely blocked from being transferred to the concrete slab layer.
따라서, 주거할 경우 필연적으로 발생하는 층간 및 이웃집과의 충격 및 소음에 따른 공해가 발생되어 주거환경을 저해하고, 열손실로 인한 난방비가 증대되는 문제점이 발생하였던 것이다.Therefore, when living, pollution caused by the impact and noise between floors and neighboring houses inevitably occurs, which hinders the residential environment and increases the heating cost due to heat loss.
본 고안의 목적은 하부판재의 패드부재를 구비하여 방진, 흡음, 단열효과를 증대시켜 쾌적한 주거환경을 유지하고, 난방효율을 향상시킬 수 있는 난방관 배관용 단열보드를 제공하는 데 있다.An object of the present invention is to provide a heat insulation board for heating pipe piping having a pad member of the lower plate to increase the dust, sound absorption, heat insulation effect to maintain a comfortable living environment, and improve the heating efficiency.
도 1 은 본 고안의 사시도.1 is a perspective view of the present invention.
도 2 (a) ∼ (b)는 본 고안인 난방관 배관용 단열보드가 콘크리트 슬라브층 상부에 설치된 상태를 도시한 단면도.2 (a) to (b) is a cross-sectional view showing a state in which the heat insulation board for heating pipe piping according to the present invention is installed on the concrete slab layer.
도 3 은 본 고안인 난방관 배관용 단열보드가 콘크리트 슬라브층 상부에 설치된 상태를 도시한 평면도.Figure 3 is a plan view showing a state in which the heat insulation board for heating pipe piping of the present invention is installed on the concrete slab layer.
*도면 중 주요 부호에 대한 설명** Description of the major symbols in the drawings *
1 - 콘크리트 슬라브층 2 - 마감몰탈1-concrete slab layer 2-finishing mortar
3 - 바닥판재 4 - 난방관3-floorboard 4-heating tube
10 - 단열보드 20 - 상부판재10-insulation board 20-top plate
21 - 난방관 배관용 수단 22 - 배관용 홈21-Heating pipes plumbing means 22-Plumbing grooves
30 - 하부판재 40 - 패드부재30-lower plate 40-pad member
50 - 연결수단 51 - 조립홈50-Connecting means 51-Assembly groove
52 - 조립돌기52-assembly protrusion
이러한 본 고안의 목적은 건물의 바닥면을 이루는 콘크리트 슬라브층(1) 상부에 일정 두께로 펼쳐지는 것에 의해 실내의 보온을 유지토록 하는 단열재의 하부판재(30)와, 상기 하부판재(30)의 상부에 결합되며, 상부에는 난방관(4)이 배치되는 간격을 감안하여 난방관(4)을 안착시켜 배관할 수 있는 난방관 배관용 수단(21)이 구비되고, 종,횡으로 연결가능한 상부판재(20)로 구성된 것에 있어서,The purpose of the present invention is the lower plate material 30 and the lower plate material 30 of the heat insulating material to maintain the warmth of the room by being spread to a certain thickness on the concrete slab layer (1) forming the floor surface of the building Coupled to the upper portion, the upper portion is provided with a heating pipe piping means 21 for piping the seated pipe 4 in consideration of the interval in which the heating tube 4 is disposed, the upper portion that can be connected vertically and horizontally In what consists of the board | plate materials 20,
상기 하부판재(30)의 하부면에는 소정두께를 가지는 패드부재(40)가 구비되므로서 달성된다.The lower surface of the lower plate 30 is achieved by being provided with a pad member 40 having a predetermined thickness.
즉, 상기 하부판재(30)의 하부면에 패드부재(40)가 구비되어 이 패드부재(40)가 콘크리트 슬라브층(1)과 하부판재(30) 사이에 설치되므로 , 하부판재(30)에 의해 흡수되지 못하는 열과 소음, 진동이 패드부재(40)에 의해 흡수되게 되는 것이다.That is, the pad member 40 is provided on the lower surface of the lower plate 30 so that the pad member 40 is installed between the concrete slab layer 1 and the lower plate 30, the lower plate 30 Heat, noise, and vibration that are not absorbed by the pad member 40 will be absorbed.
본 고안의 바람직한 실시예를 첨부된 도면에 의하여 상세히 설명하면 다음과 같다.Preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1 은 본 고안의 사시도로서, 하부판재의 하부에 소정두께의 패드부재가 구비된 상태를 나타내고 있다.1 is a perspective view of the present invention, showing a state in which a pad member of a predetermined thickness is provided below the lower plate member.
도 2 (a) ∼ (b)는 본 고안인 난방관 배관용 단열보드가 콘크리트 슬라브층 상부에 설치된 상태를 도시한 단면도로서, 도 2 (a)는 난방관 배관용 단열보드의 상부에 마감몰탈을 타설하는 습식공법에 의해 건물의 바닥면을 구성한 것이며, 도 2 (b)는 난방관 배관용 단열보드의 상부에 바닥판부재를 덮어서 배열한 건식공법으로 건물의 바닥면을 구성한 것을 나타내고 있다.2 (a) to (b) is a cross-sectional view showing a state in which the heat insulation board for heating pipe piping is the present invention installed on the concrete slab layer, Figure 2 (a) is a finishing mortar on the top of the heat insulation board for heating pipe piping The bottom surface of the building is constituted by a wet method of pouring the building, and FIG. 2 (b) shows that the bottom surface of the building is constructed by a dry method in which the bottom plate member is covered with an upper portion of the insulation board for heating pipe piping.
도 3 은 본 고안인 난방관 배관용 단열보드가 콘크리트 슬라브층 상부에 설치된 상태를 도시한 평면도로서, 난방관 배관용 단열보드가 종횡 연결되어 설치된 상태를 나타내고 있다.3 is a plan view showing a state in which the heat insulation board for heating pipe piping is the present invention is installed on the concrete slab layer, showing a state in which the heat insulation board for heating pipe piping is connected horizontally and horizontally.
이하, 도 1 에서 도시한 바와 같이 본 고안인 단열보드(10)는 단열재로 된 하부판재(30)의 상부로 합성수지재로 사출 성형된 상부판재(20)가 한조로 결합되어 구성된다.Hereinafter, as shown in FIG. 1, the heat insulation board 10 of the present invention is configured by combining the upper plate material 20 injection-molded with a synthetic resin material into the upper portion of the lower plate material 30 as the heat insulating material.
그리고, 상기 상부판재(20)는 상부에 난방관(4)이 배치되는 간격을 감안하여 난방관(4)을 배관할 수 있는 난방관 배관용 수단(21)으로 배관용 홈(22)이 형성되어, 이 배관용 홈(22)에 난방관(4)을 삽입하여 안착하므로서 배관할 수 있도록 한다.In addition, the upper plate 20 is a pipe groove 22 is formed of a heating tube piping means 21 that can pipe the heating tube 4 in consideration of the interval in which the heating tube 4 is disposed on the upper portion. As a result, the heating pipe 4 is inserted into the pipe groove 22 to allow the pipe to be piped therein.
또한, 상기 상부판재(20)는 상기 하부판재(30)와 동일한 크기로 덮어지게 하여, 이 하부판재(30)와 상호 결합된 상태로 하나의 단열보드(10)를 구성한다.In addition, the upper plate 20 is covered with the same size as the lower plate 30, and constitutes a single insulation board 10 in a state coupled with the lower plate 30.
한편, 상기 상부판재(20)에 결합되는 하부판재(30)는 주거용 건물의 바닥면을 이루는 콘크리트 슬라브층(1) 상부에 일정 두께로 펼쳐지는 것에 의해 실내의 보온을 유지하도록 하는 단열재의 기능을 가지는 것으로, 주거용 건물들의 외부의 냉, 온기가 실내로 불필요하게 전달되는 것을 차단하고, 특히 동절기에는 난방관(4)에 의해 가열된 실내의 온기가 외부로 유출되는 것을 방지하는 것이다.On the other hand, the lower plate 30 is coupled to the upper plate 20 has a function of a heat insulating material to maintain the warmth of the room by being spread to a certain thickness on the concrete slab layer (1) forming the floor surface of the residential building With this, the cold and warmth of the exterior of the residential buildings are prevented from being unnecessarily transmitted to the room, and particularly, in winter, the warmth of the room heated by the heating tube 4 is prevented from leaking to the outside.
따라서, 상기 하부판재(30)는 주로 단열효과와 성형성, 그리고 경량성등을 감안하여 합성수지 계열중에 스치로폼재로 성형한 것을 사용하고, 주거용 건물의 바닥면과 동일 넓이로 평편하게 펼쳐지게 하여 전체적으로 단열효과를 가지도록 한다.Therefore, the lower plate 30 is mainly made of styrofoam material in the synthetic resin series in consideration of the heat insulation effect, formability, and light weight, and flattened to the same area as the floor surface of the residential building to insulate the whole. Have an effect.
그리고, 상기 하부판재(30)는 스치로폼재 이외에도 상기한 주거용 건물의 바닥면상에 평편하게 펼쳐지는 것에 의해 실내의 보온을 유지할 수 있는 재질 이면어느 것이나 무관하다.In addition to the styrofoam material, the lower plate material 30 may be any material that can maintain the warmth of the room by being spread flat on the floor of the residential building.
한편, 상기 하부판재(30)의 하부면에는 소정두께를 가지는 패드부재(40)가 구비되며, 이 패드부재(40)는 방진, 흡음, 단열효과를 가지는 합성고무재, 스폰지, 발포수지재 중 어느 한 가지의 재질로 형성된다.On the other hand, the lower surface of the lower plate 30 is provided with a pad member 40 having a predetermined thickness, the pad member 40 of the synthetic rubber material, sponge, foamed resin material having the effect of dustproof, sound absorption, heat insulation It is formed of any one material.
그리고, 상기 패드부재(40)는 상기한 합성고무재, 스폰지, 발포수지재 이외에도 방진, 흡음, 단열효과를 가지는 재질이면 어느 것이나 무관함을 밝혀둔다.In addition, the pad member 40 is irrelevant to any material having a dust, sound absorption, and heat insulation effect in addition to the synthetic rubber material, sponge, and foamed resin material.
즉, 상기한 바와 같이 하부판재(30)의 하부면에 방진, 흡음, 단열효과를 가지는 패드부재(40)가 구비되어, 단열보드(10)가 주거용 건물의 콘크리트슬라브층에 평편하게 펼쳐져 건물의 바닥면을 형성한 경우 하부판재(30)에서 흡수하지 못하는 소음이나 진동을 패드부재(40)에서 흡수하여 주거환경을 쾌적하게 유지할 수 있게 되는 것이다.That is, as described above, the lower surface of the lower plate member 30 is provided with a pad member 40 having a dustproof, sound absorption, and heat insulation effect, the insulation board 10 is spread flat on the concrete slab floor of the residential building of the building When the bottom surface is formed, the noise or vibration that cannot be absorbed by the lower plate 30 is absorbed by the pad member 40 so that the living environment can be maintained comfortably.
그리고, 난방관(4)에서 발생하는 열을 하부판재(30)와 패드부재(40)에서 2중으로 차단하여 열손실을 최소화하여 난방효과를 극대화할 수 있는 것이다.In addition, the heat generated from the heating tube 4 is doubled in the lower plate 30 and the pad member 40 to minimize the heat loss to maximize the heating effect.
한편, 건축물의 바닥면을 시공하는 방법은 도 2 (a)에서 도시한 바와 같이 건축물의 콘크리트 슬라브층(1) 상부면에 상기 단열보드(10)를 펼쳐 설치한 다음 이 단열보드(10)의 상부에 마감몰탈(2)을 타설하는 습식공법이 있다.On the other hand, the method of constructing the floor surface of the building as shown in Figure 2 (a) to expand and install the insulation board 10 on the upper surface of the concrete slab layer (1) of the building and then the insulation board 10 There is a wet method of pouring finishing mortar (2) at the top.
그리고, 상기 습식공법으로 건축물의 바닥면을 시공할 경우 상부판재(20)의 상부면에 패드부재(40)를 구비할 경우 이 패드부재(40)와 마감몰탈(2)의 이격으로 인하여 마감몰탈(2)에 균열이 발생하는 문제점이 있어 상부판재(20)의 상부면에 패드부재(40)를 구비하는 것이 사실상 불가능한 것이다.In addition, when the bottom surface of the building is constructed by the wet method, when the pad member 40 is provided on the upper surface of the upper plate 20, the finishing mortar due to the separation between the pad member 40 and the finishing mortar (2). There is a problem that the crack occurs in (2) it is virtually impossible to provide the pad member 40 on the upper surface of the upper plate 20.
또한, 도 2 (b)에서 도시한 바와 같이 건축물의 콘크리트 슬라브층(1) 상부면에 상기 단열보드(10)를 펼쳐 설치한 다음 이 단열보드(10)의 상부판재(20) 상부에 일정두께를 가지고 판형상으로 형성된 바닥판재(3)를 덮어서 배열한 건식공법이 있으며, 이 건식공법으로 바닥면을 시공할 경우에는 상기 상부판재(20)의 상부면에 상기 패드부재(40)를 구비하는 것이 바람직하다.In addition, as shown in Figure 2 (b) to expand and install the insulation board 10 on the upper surface of the concrete slab layer (1) of the building and then a predetermined thickness on the upper plate 20 of the insulation board (10). There is a dry method that covers the bottom plate member 3 formed in a plate shape arranged to cover, when the bottom surface is constructed by this dry method is provided with the pad member 40 on the upper surface of the upper plate member 20 It is preferable.
즉, 상기 상부판재(20)의 상부면에 상기 패드부재(40)를 구비하고, 이 패드부재(40)의 상부에 일정두께를 가지고 판형상으로 형성된 바닥판재(3)를 덮어서 배열하여 건축물의 바닥면을 완성하게 되는 것이다.That is, the pad member 40 is provided on an upper surface of the upper plate member 20, and the upper plate member 20 is formed by covering and covering the bottom plate member 3 formed in a plate shape with a predetermined thickness. You will complete the bottom surface.
따라서, 상기한 바와 같이 건식공법으로 건축물의 바닥면을 시공할 경우에는 상부판재(20)의 상부면에 패드부재(40)가 구비되어 바닥판재(3)와 상부판재(20) 사이에서 발생되는 소음 및 진동을 흡수시키고, 열손실을 차단할 수 있는 것이다.Therefore, as described above, when constructing the bottom surface of the building by a dry method, the pad member 40 is provided on the upper surface of the upper plate 20 to be generated between the bottom plate 3 and the upper plate 20. It can absorb noise and vibration and block heat loss.
또한, 건축물의 바닥면에서 발생되는 충격에 의해 상부판재(20)가 파손되는 것을 방지할 수 있는 것이다.In addition, it is possible to prevent the upper plate 20 is damaged by the impact generated on the floor surface of the building.
한편, 상기 상부판재(20)의 외주면에는 이 상부판재(20)를 종횡으로 연결된 상태로 상호 결합되도록 하는 연결수단(50)으로 도브테일 형상의 조립홈(51)과 조립돌기(52)를 각각 대응되는 위치에 돌출시키거나 파여지게 한다.On the other hand, the outer circumferential surface of the upper plate 20 corresponds to the dovetail-shaped assembling groove 51 and the assembling protrusion 52 by connecting means 50 to be coupled to each other in the state in which the upper plate 20 is connected in the longitudinal and horizontal direction, respectively. To protrude or excavate to the desired position.
즉, 도 3에서 도시한 바와 같이 상부판재(20)의 각 외주면 중에 일측변에는 조립돌기(52)만을 그리고 타측변에는 조립홈(51)만을 대응하는 위치에 각각 4개의 변에 형성하는 것에 의해 상호 결합된 상태로 종횡 연결시켜 콘크리트 슬라브층(1) 상부에 펼쳐서 설치되는 것이다.That is, as shown in FIG. 3 by forming the assembly protrusions 52 on one side and only the assembly grooves 51 on the other side of the outer circumferential surface of the upper plate member 20 at four sides respectively. It is installed to expand on the concrete slab layer (1) by vertically connected in a state coupled to each other.
상기한 본 고안의 구성에 의하면, 하부판재의 하부면에 흡음, 방진, 단열효과를 가지는 재질로 형성된 패드부재를 구비하여, 이 패드부재가 하부판재와 2 중으로 흡음, 방진, 단열효과를 발생하여, 그 효과를 획기적으로 증대시킬 수 있는 것이다.According to the above constitution of the present invention, the lower surface of the lower plate is provided with a pad member formed of a material having sound absorbing, dustproofing, and insulating effect, and the pad member generates double sound absorbing, dustproofing, and insulating effect with the lower plate. In other words, the effect can be dramatically increased.
따라서, 건축내의 거주환경을 쾌적한 상태로 유지할 수 있고, 난방효율을 향상시켜 상품성과 경제성을 동시에 증대시킬 수 있는 매우 유용한 고안인 것이다.Therefore, it is a very useful design that can maintain the living environment in the building in a comfortable state and improve the heating efficiency at the same time to increase the merchandise and economics.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2003-0009860U KR200325139Y1 (en) | 2003-04-01 | 2003-04-01 | Adiabatic Board for Heat Piping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2003-0009860U KR200325139Y1 (en) | 2003-04-01 | 2003-04-01 | Adiabatic Board for Heat Piping |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR200325139Y1 true KR200325139Y1 (en) | 2003-08-30 |
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ID=49337694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR20-2003-0009860U KR200325139Y1 (en) | 2003-04-01 | 2003-04-01 | Adiabatic Board for Heat Piping |
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| Country | Link |
|---|---|
| KR (1) | KR200325139Y1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100915593B1 (en) * | 2009-05-11 | 2009-09-03 | 정애순 | Prefabricated underfloor-heating panel assembly for puzzle type |
| KR101085825B1 (en) * | 2011-06-24 | 2011-12-20 | (주) 새롬에코히팅시스템 | Polyester heating panel manufacturing process for heating |
-
2003
- 2003-04-01 KR KR20-2003-0009860U patent/KR200325139Y1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100915593B1 (en) * | 2009-05-11 | 2009-09-03 | 정애순 | Prefabricated underfloor-heating panel assembly for puzzle type |
| KR101085825B1 (en) * | 2011-06-24 | 2011-12-20 | (주) 새롬에코히팅시스템 | Polyester heating panel manufacturing process for heating |
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