KR20030086127A - Surface mountable l-loop excitation structure on dielectric inset metallic waveguide - Google Patents
Surface mountable l-loop excitation structure on dielectric inset metallic waveguide Download PDFInfo
- Publication number
- KR20030086127A KR20030086127A KR1020020024504A KR20020024504A KR20030086127A KR 20030086127 A KR20030086127 A KR 20030086127A KR 1020020024504 A KR1020020024504 A KR 1020020024504A KR 20020024504 A KR20020024504 A KR 20020024504A KR 20030086127 A KR20030086127 A KR 20030086127A
- Authority
- KR
- South Korea
- Prior art keywords
- dielectric
- metal waveguide
- metallic waveguide
- excitation structure
- conductor
- Prior art date
Links
- 230000005284 excitation Effects 0.000 title claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims description 28
- 230000008878 coupling Effects 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 abstract description 5
- 230000010354 integration Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical group ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 2
- SXHLTVKPNQVZGL-UHFFFAOYSA-N 1,2-dichloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1 SXHLTVKPNQVZGL-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
- H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
- H01P1/2084—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure with dielectric resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
- H01P3/121—Hollow waveguides integrated in a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
- H01P3/122—Dielectric loaded (not air)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
Description
본 발명은 이동 통신 및 무선 통신용 RF 회로에서 PCB 상에 제작된 주변 회로와 세라믹 유전체를 이용한 소자와의 집적화를 위한 기술로 표면 실장용 L-LOOP 형 유전체 내장 금속 도파관 여기 구조에 관한 것이다. 이 여기 구조는 유전체 내장 금속 도파관과 기존 PCB 선로 사이의 임피던스 정합을 고려한 구조이며 표면 실장이 가능하도록 하는 표면 실장용 L-LOOP 형 유전체 내장 금속 도파관 여기 구조에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-mounted L-LOOP type dielectric embedded metal waveguide excitation structure for integration of peripheral circuits fabricated on a PCB in a RF circuit for mobile communication and wireless communication and a device using a ceramic dielectric. This excitation structure considers impedance matching between a dielectric embedded metal waveguide and a conventional PCB line and relates to a surface mount L-LOOP type dielectric embedded metal waveguide excitation structure for surface mounting.
일반적으로 유전체 내장 금속 도파관의 여기 구조는 도 1에 도시된 바와 같이 외부가 금속 케이스로 형성되고, 금속 케이스 내에 유전체가 내장된 유전체 내장 금속 도파관(1)의 일부분에 동축 케이블(2)의 내부 심선을 삽입 고정시켰다.In general, the excitation structure of the dielectric embedded metal waveguide is formed as a metal case outside as shown in FIG. 1, and the inner core wire of the coaxial cable 2 is connected to a portion of the dielectric embedded metal waveguide 1 having the dielectric embedded therein. Was inserted and fixed.
그러나 이러한 구조로는 동축 케이블의 심선을 유전체에 장하시키기 위해 드릴과 같은 별도의 장비를 이용하여 유전체 내부로 구멍을 내야하는 번거로운 작업이 요구된다. 그리고 신호의 여기를 위해 반드시 동축 콘넥터를 사용하여야 하므로 여기 구조의 특성상 유전체 내장 금속 도파관을 PCB 표면에 실장이 불가능하며, 주변회로와의 연결을 위해서 주변회로 입출력 선로를 동축 케이블로 전환해야 함으로 해서 회로의 집적화가 어려운 문제점이 있다. 또한 전체적인 회로의 크기가 커지며 제작 시 시간과 비용이 추가로 발생하여 회로 양산 시 비 경제적인 문제를 안고 있다.However, such a structure requires a cumbersome task of drilling a hole into the dielectric using a separate device such as a drill to load the core of the coaxial cable to the dielectric. And because the coaxial connector must be used for signal excitation, due to the nature of the excitation structure, it is impossible to mount a metal waveguide with a dielectric built on the surface of the PCB, and the peripheral circuit input and output lines must be converted to coaxial cables for connection to the peripheral circuit. There is a problem that the integration of the difficult. In addition, the overall size of the circuit is larger, and additional time and cost are required for manufacturing, which is an uneconomical problem in mass production of the circuit.
본 발명은 상기와 같은 문제점을 해결하기 위해, PCB 선로로부터 PCB 에 표면 실장된 유전체 내장 금속 도파관 회로로의 신호의 원활한 흐름을 제공할 수 있는 효율적인 여기 구조를 제안하는데 있다.In order to solve the above problems, an object of the present invention is to propose an efficient excitation structure capable of providing a smooth flow of signals from a PCB line to a dielectric embedded metal waveguide circuit surface-mounted on a PCB.
도 1은 종래의 유전체 내장 금속 도파관의 여기 구조를 나타낸 사시도1 is a perspective view showing an excitation structure of a conventional dielectric embedded metal waveguide
도 2는 본 발명에 따른 자계의 커플링이 가능한 표면 실장용 L-LOOP 형 유전체 내장 금속 도파관 여기 구조를 나타낸 사시도Figure 2 is a perspective view showing the structure of the L-LOOP type dielectric built-in metal waveguide excitation for surface mounting capable of coupling the magnetic field according to the present invention
<도면 중 주요부분에 대한 부호의 설명><Description of Symbols for Major Parts of Drawings>
10 : PCB 20 : 선로10: PCB 20: Line
110 : 유전체 내장 금속 도파관 120 : 도체110: dielectric waveguide metal waveguide 120: conductor
상기와 같은 목적을 달성하기 위한 본 발명의 특징은,Features of the present invention for achieving the above object,
유전체 내장 금속 도파관에 있어서,In a dielectric embedded metal waveguide,
상기 유전체 내장 금속 도파관의 일 측면에 자계의 커플링이 가능하도록 L-자형으로 도체를 부착하고, 상기 도체의 끝단 부를 상기 유전체 내장 금속 도파관의 저면으로 확장 부착한 후, 상기 저면에 부착된 도체를 PCB에 형성된 선로와 결합시키는 것을 특징으로 한다.The conductor is attached in an L-shape to enable coupling of the magnetic field to one side of the dielectric embedded metal waveguide, and the end portion of the conductor is extended and attached to the bottom of the dielectric embedded metal waveguide, and then the conductor attached to the bottom surface is attached. It is characterized in that the coupling with the line formed on the PCB.
이하, 본 발명에 의한 표면 실장용 유전체 내장 금속 도파관 여기 구조의 구성 및 작용을 도 2를 참조하여 상세하게 설명하기로 한다.Hereinafter, the configuration and operation of the surface mount dielectric embedded metal waveguide excitation structure according to the present invention will be described in detail with reference to FIG.
도 2는 본 발명에 따른 자계의 커플링이 가능한 표면 실장용 L-LOOP 형 유전체 내장 금속 도파관 여기 구조를 나타낸 사시도이다.2 is a perspective view showing a surface mount L-LOOP type dielectric built-in metal waveguide excitation structure capable of coupling a magnetic field according to the present invention.
도 2를 참조하면, 본 발명에 따른 자계의 커플링이 가능한 표면 실장용 L-LOOP 형 유전체 내장 금속 도파관 여기 구조는 유전체 내장 금속 도파관(110)의 일 측면에 자계(H-Field)의 커플링이 가능하도록 L-자형으로 도체(120)를 부착하고, 도체(120)의 끝단 부를 유전체 내장 금속 도파관(110)의 저면으로 확장 부착한 후, 저면에 부착된 도체(120)를 PCB(10)에 형성된 선로(20)와 결합시킨다. 여기에서 도체(120)는 마이크로스트립 라인과 같은 도체의 사용이 바람직하다. 이 때 L-LOOP의 모양은 임피던스 정합을 최적화할 수 있도록 설정한다.Referring to FIG. 2, the L-LOOP type dielectric built-in metal waveguide excitation structure for surface mounting according to the present invention enables coupling of a magnetic field to one side of the dielectric embedded metal waveguide 110. After attaching the conductor 120 in an L-shaped shape, and extending the end portion of the conductor 120 to the bottom of the dielectric embedded metal waveguide 110, the conductor 120 attached to the bottom is attached to the PCB 10. Coupled with the line 20 formed in. In this case, the conductor 120 is preferably a conductor such as a microstrip line. At this time, the shape of L-LOOP is set to optimize impedance matching.
이렇게 유전체 내장 금속 도파관(110) 의 일 측면에 L-자형으로 도체(120)를 부착하고, PCB(10)에 형성된 선로(20)를 통해 시스템에서 고주파 신호를 인가하면 유전체 내장 금속 도파관(110)의 도체(120)로 신호가 전달되며, 이 신호는 L-LOOP의 상단부로 전달되어 도 2에 도시된 바와 같이 자계가 형성된다. 이렇게 형성된 고주파 자계 신호는 자계 커플링에 의해 유전체 내장 금속 도파관으로 최종 전달되게 된다.When the conductor 120 is attached to one side of the dielectric embedded metal waveguide 110 in an L-shaped shape and a high frequency signal is applied from the system through the line 20 formed on the PCB 10, the dielectric embedded metal waveguide 110 may be used. The signal is transmitted to the conductor 120, which is transmitted to the upper end of the L-LOOP to form a magnetic field as shown in FIG. The high frequency magnetic field signal thus formed is finally delivered to the dielectric embedded metal waveguide by magnetic field coupling.
이상에서 설명한 바와 같이 본 발명에 따른 표면 실장용 L-LOOP 형 유전체 내장 금속 도파관 여기 구조에 따르면, 유전체 내장 금속 도파관을 PCB에 용이하게 부착시킴으로써 표면 실장이 가능하고 주변 회로와의 집적화가 가능하므로 제품의 양산성이 뛰어나다.As described above, according to the surface mount L-LOOP type dielectric embedded metal waveguide excitation structure according to the present invention, the dielectric embedded metal waveguide can be easily attached to the PCB to enable surface mounting and integration with peripheral circuits. Excellent mass production.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020024504A KR20030086127A (en) | 2002-05-03 | 2002-05-03 | Surface mountable l-loop excitation structure on dielectric inset metallic waveguide |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020024504A KR20030086127A (en) | 2002-05-03 | 2002-05-03 | Surface mountable l-loop excitation structure on dielectric inset metallic waveguide |
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| Publication Number | Publication Date |
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| KR20030086127A true KR20030086127A (en) | 2003-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020020024504A KR20030086127A (en) | 2002-05-03 | 2002-05-03 | Surface mountable l-loop excitation structure on dielectric inset metallic waveguide |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021106731A1 (en) * | 2019-11-27 | 2021-06-03 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1168419A (en) * | 1997-08-14 | 1999-03-09 | Hokkaido Univ | Converter for coaxial dielectric image line |
| JP2000341007A (en) * | 1999-05-28 | 2000-12-08 | Kyocera Corp | Input output terminal for high frequency and package for high frequency circuit |
| KR20020084453A (en) * | 2001-05-02 | 2002-11-09 | 엘지이노텍 주식회사 | Dielectric waveguide excitation structure for mounting surface |
-
2002
- 2002-05-03 KR KR1020020024504A patent/KR20030086127A/en not_active Application Discontinuation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1168419A (en) * | 1997-08-14 | 1999-03-09 | Hokkaido Univ | Converter for coaxial dielectric image line |
| JP2000341007A (en) * | 1999-05-28 | 2000-12-08 | Kyocera Corp | Input output terminal for high frequency and package for high frequency circuit |
| KR20020084453A (en) * | 2001-05-02 | 2002-11-09 | 엘지이노텍 주식회사 | Dielectric waveguide excitation structure for mounting surface |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021106731A1 (en) * | 2019-11-27 | 2021-06-03 | ||
| JP7326469B2 (en) | 2019-11-27 | 2023-08-15 | 京セラ株式会社 | bandpass filter |
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