KR20030052882A - Apparatus of continuous hot dip coating for metal strip employing electromagnetic - Google Patents

Apparatus of continuous hot dip coating for metal strip employing electromagnetic Download PDF

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Publication number
KR20030052882A
KR20030052882A KR1020010083012A KR20010083012A KR20030052882A KR 20030052882 A KR20030052882 A KR 20030052882A KR 1020010083012 A KR1020010083012 A KR 1020010083012A KR 20010083012 A KR20010083012 A KR 20010083012A KR 20030052882 A KR20030052882 A KR 20030052882A
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KR
South Korea
Prior art keywords
molten metal
plating
pot
chamber
plating bath
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KR1020010083012A
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Korean (ko)
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KR100448920B1 (en
Inventor
김호영
김구화
정희태
윤민수
아나스타시아
김종근
Original Assignee
재단법인 포항산업과학연구원
주식회사 포스코
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Priority to KR10-2001-0083012A priority Critical patent/KR100448920B1/en
Application filed by 재단법인 포항산업과학연구원, 주식회사 포스코 filed Critical 재단법인 포항산업과학연구원
Priority to CN2006100846097A priority patent/CN1920087B/en
Priority to US10/297,741 priority patent/US6984357B2/en
Priority to AU2002249644A priority patent/AU2002249644B2/en
Priority to RU2002133100/02A priority patent/RU2242531C2/en
Priority to JP2002581708A priority patent/JP2004519561A/en
Priority to EP02718660A priority patent/EP1379707B1/en
Priority to DE60224875T priority patent/DE60224875T2/en
Priority to PCT/KR2002/000644 priority patent/WO2002083970A1/en
Priority to CN02801785.4A priority patent/CN1289706C/en
Publication of KR20030052882A publication Critical patent/KR20030052882A/en
Application granted granted Critical
Publication of KR100448920B1 publication Critical patent/KR100448920B1/en
Priority to JP2005360720A priority patent/JP4332150B2/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/11—Vats or other containers for liquids or other fluent materials
    • B05C11/115—Sealing means for work inlet or outlet
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/003—Apparatus
    • C23C2/0034—Details related to elements immersed in bath
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36—Elongated material
    • C23C2/40—Plates; Strips

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE: A molten metal floating apparatus for continuously hot dip coating metal strip is provided to stably float molten metal using electromagnetic field in process for continuously coating the metal strip by passing the metal strip through a molten metal contained pot. CONSTITUTION: The molten metal floating apparatus for continuously hot dip coating metal strip comprises a plating pot(10) in which molten metal(20) is contained, and which is vertically penetrated in such a shape that the upper part of the plating pot(10) is wide while the lower part of the plating pot(10) is narrow; an attached pot(70) attached to the plating pot(10) in a bucket shape along the outer circumferential surface of the plating pot(10) with being adjacent to the upper part of the plating pot(10); a chamber(60) formed inside parts projected along the outer circumferential surface of the plating pot(10) with being adjacent to the lower part of the plating pot(10); an outlet(62) which is extended from one side of the chamber(60) in such a way that the front end part of the outlet(62) is gradually narrowed as it is being inclined upward, and which is formed by being directed to the center of the plating pot(10); a subsidiary pipe(72) for vertically connecting the attached pot(70) and chamber(60); an electromagnetic core(30) installed on the outer part of the plating pot(10) between the chamber(60) and attached pot(70); and an electromagnetic coil(90) which is coiled around the electromagnetic core(30), and to which an alternating current (A.C.) is conducted.

Description

금속판의 연속용융도금을 위한 용융금속 부양장치{APPARATUS OF CONTINUOUS HOT DIP COATING FOR METAL STRIP EMPLOYING ELECTROMAGNETIC}Molten metal flotation device for continuous hot dip plating of metal plate {APPARATUS OF CONTINUOUS HOT DIP COATING FOR METAL STRIP EMPLOYING ELECTROMAGNETIC}

본 발명은 용융금속을 담은 통에 금속판을 통과시켜 연속적으로 도금하는 공정에서 전자기장을 이용하여 용융금속을 안정적으로 부양할 수 있도록 한 금속판의 연속용융도금을 위한 용융금속 부양장치에 관한 것이다.The present invention relates to a molten metal flotation device for the continuous molten plating of the metal plate to stably support the molten metal using an electromagnetic field in the process of continuously plating the metal plate through the barrel containing the molten metal.

일반적으로, 금속판을 도금하기 위해서는 도금액이 저장된 도금조 내부로 금속판을 침지시킨 상태에서 연속 공급함으로써 이루어진다.Generally, in order to plate a metal plate, it is made by continuously supplying the metal plate in the state which immersed the metal plate in the plating tank in which the plating liquid was stored.

즉, 도 1의 도시와 같이, 금속판(8)에 알루미늄이나 아연 또는 이들 합금 등의 용융금속을 연속적으로 도금하기 위해서는 도금 금속을 용해하여 도금조(1)에 담아두고 금속판(8)을 침지하여 도금하도록 구성되었는 바, 이때 연속적으로 도금을 하기 위해서는 금속판(8)의 이송방향을 바꾸는 싱크롤(4)과 금속판(8)의 진행을 조정하는 스테이빌라이징롤(5)등이 모두 용융금속(2)에 잠겨져 있으며, 각 롤들의 축수부는 고온환경으로 인해 무윤활 상태의 슬리브-부시 형태로 지지되게 된다.That is, as shown in FIG. 1, in order to continuously plate molten metal such as aluminum, zinc or these alloys on the metal plate 8, the metal is dissolved in the plating bath 1 and the metal plate 8 is immersed. In this case, in order to continuously plate, both the sink roll 4 for changing the transfer direction of the metal plate 8 and the stabilizing roll 5 for adjusting the progress of the metal plate 8 are molten metal. Locked in 2), the bearing part of each roll is supported in the form of sleeve-bush without lubrication due to the high temperature environment.

이러한 롤과 그 구성품들은 용융금속(2)과 반응하여 금속간 화합물을 발생시키며, 불순물들이 도금 강판의 표면에 부착되면 그대로 압착되어 도금강판의 품질을 저하시키는 요인이 된다.These rolls and their components react with the molten metal 2 to generate an intermetallic compound, and when the impurities adhere to the surface of the plated steel sheet, they are pressed as they are, causing deterioration of the quality of the plated steel sheet.

또한, 무윤활로 회전하는 각 롤들의 축수부는 마모가 진행되고 이러한 축수부 마모는 금속판(8)에 진동을 야기시켜 도금된 금속판에 흐름무늬, 도금량 편차 등의 결함을 발생시킨다.Further, the bearing part of each roll rotating with no lubrication progresses, and the bearing part wear causes vibration in the metal plate 8, resulting in defects such as flow patterns, plating amount deviations, etc. in the plated metal plate.

이와 같은 문제를 해결하기 위하여, 최근에는 도금조 하부에 금속판(8)이 인입될 수 있는 개구부를 형성하고 이 개구부를 통해 금속판(8)이 용융금속(2)의 하부로 들어와서 상부로 빠져나가게 배치하며, 개구부를 통한 용융금속(2)의 유출을 방지할 수 있는 장치를 구성함으로써 롤들을 배제한 용융도금방법이 제안되기에 이르렀다.In order to solve such a problem, in recent years, an opening through which the metal plate 8 can be introduced is formed in the lower part of the plating bath, and through this opening, the metal plate 8 enters the lower part of the molten metal 2 and exits to the upper part. By arranging and constituting an apparatus capable of preventing the outflow of the molten metal 2 through the opening, a hot-dip plating method excluding rolls has been proposed.

그러한 예들로는 개구부 주위에 압력실을 설치하여 공기압으로 용융금속의 무게를 지탱하는 방법, 직류자석을 개구부 주위에 배치하고 용융금속에 직류전류를 흘려서 발생하는 전자기력이 용융금속의 무게를 지탱하도록 하는 방법, 개구부 주위에 리니어 인덕션 모터를 배치하여 트레블링 마그네틱 필드에 의한 전자기력으로 용융금속의 무게를 지탱하도록 하는 방법, 개구부 주위에 교류 전자석을 배치하고 전도체를 도금조내의 단변부에 설치하여 발생하는 전자기력으로 용융금속의 무게를 지탱하도록 하는 방법 등이 그것이다.Examples include a pressure chamber around an opening to support the weight of the molten metal by air pressure, a method of placing a direct current magnet around the opening and directing the DC current through the molten metal to support the weight of the molten metal. A method of arranging a linear induction motor around an opening to support the weight of molten metal by an electromagnetic force caused by a traveling magnetic field, and by placing an alternating electromagnet around the opening and installing a conductor at the short side of the plating bath. For example, to support the weight of the molten metal.

그러나, 이들 공개된 방법들중 상기 공기압을 이용하는 방법은 압력실의 유지 및 소음발생 등의 문제가 있고, 직류자석과 직류전류를 이용하는 방법은 직류전류가 강판을 타고 주변설비에 영향을 미칠 수 있다는 단점이 있으며, 교류 전자석과 전도체를 이용하는 방법은 용융금속에 침지되어 있는 전도체의 용출로 인해 그 형태를 유지하기 어려울 뿐 아니라 용융금속의 화학조성 유지가 곤란하다는 단점이 유발되었다.However, among these published methods, the method using the air pressure has problems such as the maintenance of the pressure chamber and the noise generation, and the method using the DC magnet and the DC current may cause the DC current to affect the peripheral equipment on the steel sheet. In addition, the method of using an alternating current electromagnet and a conductor is difficult to maintain its shape due to the elution of the conductor immersed in the molten metal, and it is difficult to maintain the chemical composition of the molten metal.

특히, 전자기장을 이용하는 방법들은 개구부를 통한 용융금속의 유출을 대체로 방지할 수 있지만 개구부 전체에서 용융금속의 자기유동학적 운동이 안정되어 있지 않기 때문에 자유표면이 안정하지 않아서 유출을 완벽하게 방지하는 것은 쉽지않다는 부수적인 문제를 안고 있었다.In particular, methods using electromagnetic fields can generally prevent the leakage of molten metal through the opening, but since the magnetohydrodynamic movement of the molten metal is not stable throughout the opening, it is difficult to prevent the leakage completely because the free surface is not stable. It was a side issue.

본 발명은 상술한 바와 같은 종래 기술이 갖는 제반 문제점을 감안하여 이를 해결하고자 창출한 것으로, 전자석코일과 전자석코어로 구성되는 전자기력 발생장치를 이용하여 도금조 하부의 개구부를 통해 용융금속이 유출되지 않고 이 부분의 자유표면을 안정하게 유지할 수 있도록 한 금속판의 연속용융도금을 위한 용융금속 부양장치를 제공함에 그 목적이 있다.The present invention has been made in view of the above-described problems of the prior art, and solved this problem. The molten metal does not leak through the opening of the lower portion of the plating bath by using an electromagnetic force generator composed of an electromagnet coil and an electromagnet core. It is an object of the present invention to provide a molten metal flotation device for continuous hot-melt plating of a metal plate to maintain the free surface of this part stably.

도 1은 종래 기술에 따른 금속판의 도금공정을 개략적으로 보인 예시도,1 is an exemplary view schematically showing a plating process of a metal plate according to the prior art,

도 2는 본 발명 장치의 설치상태 개략 종단면도,2 is a schematic longitudinal sectional view showing an installation state of the apparatus of the present invention;

도 3은 본 발명 장치의 요부 단면도 및 평면도,3 is a sectional view and a plan view of a main portion of the apparatus of the present invention;

도 4는 본 발명 장치에 의한 전자기력의 모식도,Figure 4 is a schematic diagram of the electromagnetic force by the device of the present invention,

도 5는 본 발명에 따른 도금조를 대상으로 전자기장을 해석한 결과를 보인 모식도,5 is a schematic view showing the results of analyzing the electromagnetic field of the plating bath according to the present invention,

도 6은 본 발명에 따른 도금조 개구부의 용융금속에서 발생하는 유동장에 대한 수치해석 결과를 보인 모식도.Figure 6 is a schematic diagram showing the numerical results of the flow field generated in the molten metal of the plating tank opening according to the present invention.

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

10 : 도금조 20 : 용융금속10 plating bath 20 molten metal

30 : 전자석코어 60 : 챔버30: electromagnet core 60: chamber

62 : 분출구 70 : 부속조62: outlet 70: accessory

72 : 보조관 80 : 금속판72: auxiliary pipe 80: metal plate

90 : 전자석코일90: electromagnet coil

본 발명의 상기한 목적은 용융금속이 수강되며 상광하협 형태로 상하관통된 도금조와; 상기 도금조의 상단부에 인접하여 그 외주면을 따라 버켓형태로 부착된 부속조와; 상기 도금조의 하단부에 인접하여 그 외주면을 따라 돌출된 부위의 내부에 형성된 챔버와; 상기 챔버의 일측으로부터 상향 경사지면서 선단부가 좁아지도록 연장되고 상기 도금조의 중심을 향해 형성된 분출구와; 상기 부속조와 챔버를 수직방향으로 연결시키는 보조관과; 상기 챔버와 부속조 사이의 도금조 외부에 설치된 전자석코어와; 상기 전자석코어에 권취되고 교류가 통전되는 전자석코일을 포함하여 구성되는 것을 특징으로 하는 금속판의 연속용융도금을 위한 용융금속 부양장치를 제공함에 의해 달성된다.The above object of the present invention is a molten metal receiving and plating tank vertically penetrated in the upper and lower strait form; Adjoining tank attached in the form of a bucket along the outer peripheral surface adjacent to the upper end of the plating bath; A chamber formed inside a portion protruding along the outer circumferential surface of the plating bath adjacent to a lower end of the plating bath; An ejection opening which is inclined upwardly from one side of the chamber and extends to narrow the tip portion and is formed toward the center of the plating bath; An auxiliary pipe connecting the accessory tank and the chamber in a vertical direction; An electromagnet core installed outside the plating bath between the chamber and the auxiliary bath; It is achieved by providing a molten metal flotation device for the continuous molten plating of the metal plate, characterized in that it comprises an electromagnet coil wound around the electromagnet core and energized alternating current.

이하에서는, 첨부도면을 참고하여 본 발명을 보다 상세하게 설명한다.Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 장치를 간략하게 보여주는 모식도이고, 도 3은 본 발명 장치를 구성하는 요부 단면도이다.FIG. 2 is a schematic view showing a device according to the present invention, and FIG. 3 is a cross-sectional view showing main parts of the device of the present invention.

도 2 내지 도 3에 따르면, 용융금속(20)이 담겨있는 도금조(10)의 하부측 외부에 금속판(80)의 폭 방향에 대응하도록 전자석코일(90)과 전자석코어(30)가 설치된다.2 to 3, the electromagnet coil 90 and the electromagnet core 30 are installed outside the lower side of the plating bath 10 in which the molten metal 20 is contained so as to correspond to the width direction of the metal plate 80. .

도금조(10)의 상부 양측에는 서로 대칭되는 형태로 버켓형태의 부속조(70)가 설치되고, 상기 부속조(70)의 중앙부는 용융금속(20)이 수강된 도금조(10)와 연결되어 상기 용융금속(20)의 일부가 오버플로우하여 부속조(70) 내부로 수강될 수 있도록 형성된다.Bucket-shaped subsidiary tub 70 is installed on both sides of the upper side of the plating tub 10 in a symmetrical manner, and a central portion of the subsidiary tub 70 is connected to a plating tub 10 in which molten metal 20 is received. As a result, a portion of the molten metal 20 overflows and is formed to be taken into the accessory tank 70.

아울러, 상기 도금조(10)는 상부가 넓고 하부가 좁은 상광하협 형태로 구비된다.In addition, the plating bath 10 is provided in the form of the upper and lower narrow light receiving narrow.

상기 부속조(70)는 구조상 전자석코일(90)과 전자석코어(30)의 인접 상측에 마련된 구조이다.The attachment tank 70 is a structure provided on the upper side adjacent to the electromagnet coil 90 and the electromagnet core 30.

도금조(10)의 하단부 양측에는 상기 부속조(70)와 마찬가지로 서로 대칭되는 구조로 이루어진 챔버(60)가 형성된다.Both sides of the lower end of the plating bath 10 is formed with a chamber 60 made of a structure symmetrical with each other similarly to the accessory tank (70).

상기 챔버(60)는 그 일부로부터 상방향으로 점점 좁아지는 형태를 갖고 용융금속(20)이 수강된 도금조(10)의 중심을 향해 서로 연통가능하게 분출구(62)가 절개 형성된다.The chamber 60 has a form that gradually narrows upward from a portion thereof, and blow holes 62 are formed to be in communication with each other toward the center of the plating bath 10 in which the molten metal 20 is received.

아울러, 상기 챔버(60)와 부속조(70)는 이들을 수직방향으로 연결하는 보조관(72)에 의해 상호 연통가능하게 설치된다.In addition, the chamber 60 and the auxiliary tank 70 is installed so as to communicate with each other by an auxiliary pipe 72 connecting them in the vertical direction.

또한, 도 3의 (가),(나)에서와 같이, 부속조(70)의 일측벽면 중심에는 배출구(74)가 형성되고, 상기 배출구(74)는 보조관(72)과 연결되어 오버플로우된 용융금속(20)이 상기 부속조(70)의 배출구(74)를 통해 보조관(72)으로 유입되고, 보조관(72)을 따라 하강된 용융금속(20)의 일부는 챔버(60)에 수강됨과 동시에 일정압에 의해 분출구(62)를 통해 다시 금속판(80)이 통판되는 도금조(10)의 중심부측으로 분출되도록 구성된다.In addition, as shown in (a) and (b) of FIG. 3, an outlet 74 is formed at the center of one side wall surface of the attachment tank 70, and the outlet 74 is connected to the auxiliary pipe 72 to overflow. Molten metal 20 is introduced into the auxiliary pipe 72 through the outlet 74 of the auxiliary tank 70, and a portion of the molten metal 20 lowered along the auxiliary pipe 72 is the chamber 60 At the same time as being received at the same time, the metal plate 80 is ejected to the central side of the plating bath 10 through which the metal plate 80 is passed through the jet port 62.

한편, 도 4의 도시와 같이, 교류 전자기장에 의하여 용융금속(20)에 발생하는 유도전류는 하나의 전류흐름 경로(12)를 형성하게 되는데, 이때 유도전류와 전자기장의 벡터곱으로 표시되는 전자기력(Lorentz force)은 전류흐름 경로(12)의 중심을 향한 방향으로 작용하며 그 크기는 전자기장과 유도전류의 곱에 비례하게 된다.On the other hand, as shown in Figure 4, the induced current generated in the molten metal 20 by the alternating electromagnetic field forms a current flow path 12, wherein the electromagnetic force represented by the vector product of the induced current and the electromagnetic field ( Lorentz force acts in the direction toward the center of the current flow path 12 and its magnitude is proportional to the product of the electromagnetic field and the induced current.

따라서, 도금조(10) 하부의 개구부 근처, 즉 챔버(60)의 인접측에 전자석(80)을 배치하게 되면 그 부근에서 용융금속(20)에 작용하는 전자기력(10)은 중력반대 방향으로 작용하고, 전자석으로부터 상대적으로 먼 위치에 있는 용융금속(20)의 상부 자유표면 부근에서는 중력방향의 전자기력(11)이 발생하지만 전자기장의 크기가 작기 때문에 발생하는 전자기력(11)이 매우 작게 된다.Therefore, when the electromagnet 80 is disposed near the opening of the lower portion of the plating bath 10, that is, the adjacent side of the chamber 60, the electromagnetic force 10 acting on the molten metal 20 in the vicinity thereof acts in the opposite direction of gravity. In the vicinity of the upper free surface of the molten metal 20 located relatively far from the electromagnet, the electromagnetic force 11 in the gravity direction is generated, but the electromagnetic force 11 generated due to the small size of the electromagnetic field is very small.

그러므로, 용융금속(20)에 작용하는 전체적인 전자기력의 합은 중력 반대방향으로 향하게 되고, 용융금속(20)이 받는 중력장보다 큰 전자기장만 형성되면 용융금속(20)은 부양상태를 유지할 수 있게 된다.Therefore, the sum of the total electromagnetic force acting on the molten metal 20 is directed in the direction opposite to gravity, and if only the electromagnetic field larger than the gravitational field received by the molten metal 20 is formed, the molten metal 20 can maintain the flotation state.

이러한 구성으로 이루어진 본 발명의 부양장치를 통한 작동관계에 대해 기술하면 다음과 같다.Referring to the operation relationship through the flotation device of the present invention made of such a configuration as follows.

먼저, 보조관(72)과 도금조(10)를 채우고 있는 용융금속(20)은 외부 전자석에 의해 유도되는 유도전류의 전기통로를 형성하므로 정수압과 전자기장 원리에 의해 분출구(62)를 통해 분사되면서 그 부근에 존재하는 용융금속(20)을 가압하는 작용을 하게 된다.First, the molten metal 20 filling the auxiliary pipe 72 and the plating bath 10 forms an electric passage of an induced current induced by an external electromagnet, so that the molten metal 20 is sprayed through the spout 62 by the hydrostatic pressure and the electromagnetic field principle. Pressurizes the molten metal 20 present in the vicinity thereof.

상기 분출구(62)를 통해 분출되는 용융금속(20)은 도금조(10) 내부의 용융금속(20)에 하부에서 상부로 향하는 유동이 발생시킨다.The molten metal 20 ejected through the ejection port 62 generates a flow from the lower side to the upper side in the molten metal 20 in the plating bath 10.

이로 인해, 도금조(10) 상부에서는 용융금속(20)이 넘쳐서 부속조(70)를 거쳐서 보조관(72) 상부로 흘러 들어간다.For this reason, in the upper part of the plating tank 10, the molten metal 20 overflows and flows into the upper part of the auxiliary pipe 72 through the accessory tank 70.

상기 부속조(70)는 보조관(72)을 통해 도금조(10) 하부의 챔버(60)와 연결되어 있으므로 흘러넘친 용융금속은 상기 챔버(60)로 유입되게 된다.The auxiliary tank 70 is connected to the chamber 60 under the plating tank 10 through the auxiliary pipe 72, so that the overflowed molten metal is introduced into the chamber 60.

이때, 보조관(72)의 높이에 따른 정수압과 전자기력에 의해 용융금속(20)은 프리 플랫 제트(FREE FLAT JET) 형태로 분출구(62)를 통해 도금조(10) 하부로 중심을 향해 분출되게 된다.At this time, by the hydrostatic pressure and the electromagnetic force according to the height of the auxiliary pipe 72, the molten metal 20 is ejected toward the center through the jet port 62 in the form of a free flat jet (FREE FLAT JET) toward the bottom of the plating tank 10. do.

이와 같은 관계는 외부에서 도금조(10) 내부로 지속적으로 혹은 주기적으로 용융금속의 공급이 이루어져 손실된 용융금속에 대한 보충이 이루어져야 가능하다.This relationship is made possible by supplementing the molten metal that is lost by the supply of molten metal continuously or periodically into the plating bath 10 from the outside.

이렇게 형성된 프리 플랫 제트 유동은 분출구(62)의 각도에 의해 상방향으로 금속판(80)에 접근하고 이로 인해 개구부의 용융금속 자유표면은 동역학적으로 안정화되어 전자기력에 의해 형성된 부양을 안정적으로 유지할 수 있게 된다.The free-flat jet flow thus formed approaches the metal plate 80 upward by the angle of the ejection opening 62, whereby the molten metal free surface of the opening is dynamically stabilized so that the flotation formed by the electromagnetic force can be stably maintained. do.

도 5는 본 발명에 따른 도금조를 대상으로 전자기장을 해석한 결과이고, 도 6은 본 발명에 따른 도금조 개구부의 용융금속에서 발생하는 유동장에 대한 수치해석 결과이다.5 is a result of analyzing the electromagnetic field for the plating bath according to the present invention, Figure 6 is a numerical analysis of the flow field generated in the molten metal of the plating bath opening according to the present invention.

실험결과, 분출구(62)를 통한 프리 플랫 제트 유동은 금속판(80)과 30~45°의 각도(θ)로 접촉할 때 용융금속을 가장 안정적으로 부양하는 결과를 나타내었다.As a result of the experiment, the free flat jet flow through the ejection opening 62 showed the most stable support of molten metal when contacting the metal plate 80 at an angle θ of 30 to 45 °.

또한, 전자석에 의해 형성되는 전자기력의 크기는 전자석코일(90)에 공급되는 전류량의 제곱에 비례하므로 분출구(62)를 통한 프리 플랫 제트 유동에 의한 용융금속(20)의 유출 방지작용은 전자석코일(90)에 공급되는 전류량의 조절과 부속조(70)에 담겨져 있는 용융금속(20)의 수직방향 높이를 조절함에 의해 안정적으로 유지될 수 있다.In addition, since the magnitude of the electromagnetic force formed by the electromagnet is proportional to the square of the amount of current supplied to the electromagnet coil 90, the prevention of the leakage of the molten metal 20 by the free flat jet flow through the jet port 62 is characterized by the electromagnet coil ( By controlling the amount of current supplied to the 90 and the vertical height of the molten metal 20 contained in the accessory tank 70 can be maintained stably.

이상에서 상세히 설명한 바와 같이, 본 발명에 따르면 전자기력을 이용하여 도금조 하부의 개구부를 통해 용융금속이 유출되지 않고 이 부분의 용융금속 자유표면을 안정하게 유지시킴으로써 공정의 생산성을 높이고, 도금제품의 결함을 방지하는 효과를 제공한다.As described in detail above, according to the present invention, the molten metal does not flow out through the opening of the lower part of the plating tank by using electromagnetic force, and thus the molten metal free surface of the part is stably maintained to increase the productivity of the process and the defect of the plated product. Provides the effect of preventing.

Claims (2)

용융금속(20)이 수강되며 상광하협 형태로 상하관통된 도금조(10)와;The molten metal 20 is received and the plating tank 10 which is vertically penetrated in the form of ordinary light and bottom narrow; 상기 도금조(10)의 상단부에 인접하여 그 외주면을 따라 버켓형태로 부착된 부속조(70)와;Adjoining tank (70) attached in the form of a bucket along the outer peripheral surface adjacent to the upper end of the plating bath (10); 상기 도금조(10)의 하단부에 인접하여 그 외주면을 따라 돌출된 부위의 내부에 형성된 챔버(60)와;A chamber (60) formed inside a portion protruding along the outer circumferential surface of the plating bath (10) adjacent to the lower end of the plating bath (10); 상기 챔버(60)의 일측으로부터 상향 경사지면서 선단부가 좁아지도록 연장되고 상기 도금조(10)의 중심을 향해 형성된 분출구(62)와;An ejection opening (62) extending inclined upward from one side of the chamber (60) to narrow the tip portion and formed toward the center of the plating bath (10); 상기 부속조(70)와 챔버(60)를 수직방향으로 연결시키는 보조관(72)과;An auxiliary pipe 72 connecting the auxiliary tank 70 and the chamber 60 in a vertical direction; 상기 챔버(60)와 부속조(70) 사이의 도금조(10) 외부에 설치된 전자석코어(30)와;An electromagnet core 30 installed outside the plating bath 10 between the chamber 60 and the accessory bath 70; 상기 전자석코어(30)에 권취되고 교류가 통전되는 전자석코일(90)을 포함하여 구성되는 것을 특징으로 하는 금속판의 연속용융도금을 위한 용융금속 부양장치.A molten metal flotation device for continuous hot-plating of a metal plate, characterized in that it comprises an electromagnet coil (90) wound around the electromagnet core (30) and the alternating current. 제1항에 있어서, 상기 분출구(62)는 도금조(10)를 통판하는 금속판(80)과 30~45°의 각도를 갖고 용융금속(20)을 분출하도록 형성되는 것을 특징으로 하는 금속판의 연속용융도금을 위한 용융금속 부양장치.The method according to claim 1, wherein the outlet 62 is continuous with the metal plate, characterized in that formed to eject the molten metal 20 at an angle of 30 ~ 45 ° with the metal plate 80 through the plating bath 10 Molten metal flotation device for hot dip plating.
KR10-2001-0083012A 2001-04-10 2001-12-21 Apparatus of continuous hot dip coating for metal strip employing electromagnetic KR100448920B1 (en)

Priority Applications (11)

Application Number Priority Date Filing Date Title
KR10-2001-0083012A KR100448920B1 (en) 2001-12-21 2001-12-21 Apparatus of continuous hot dip coating for metal strip employing electromagnetic
US10/297,741 US6984357B2 (en) 2001-04-10 2002-04-10 Apparatus and method for holding molten metal in continuous hot dip coating of metal strip
AU2002249644A AU2002249644B2 (en) 2001-04-10 2002-04-10 Apparatus and method for holding molten metal in continuous hot dip coating of metal strip
RU2002133100/02A RU2242531C2 (en) 2001-04-10 2002-04-10 Apparatus and method for holding of melted metal during continuous hot coating of metal strip
CN2006100846097A CN1920087B (en) 2001-04-10 2002-04-10 Apparatus and method for floating molten metal for continuous hot-dip plating of metal strip
JP2002581708A JP2004519561A (en) 2001-04-10 2002-04-10 Molten metal flotation equipment for continuous hot dip plating of metal strip.
EP02718660A EP1379707B1 (en) 2001-04-10 2002-04-10 Apparatus and method for holding molten metal in continuous hot dip coating of metal strip
DE60224875T DE60224875T2 (en) 2001-04-10 2002-04-10 DEVICE AND METHOD FOR KEEPING LIQUID METAL IN CONTINUOUS MELT COATING OF METAL STRIP
PCT/KR2002/000644 WO2002083970A1 (en) 2001-04-10 2002-04-10 Apparatus and method for holding molten metal in continuous hot dip coating of metal strip
CN02801785.4A CN1289706C (en) 2001-04-10 2002-04-10 Appts. and method for holding molten metal in continuous hot dip coating of metal strip
JP2005360720A JP4332150B2 (en) 2001-04-10 2005-12-14 Molten metal flotation device for continuous hot dipping of metal strips

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101065567B1 (en) * 2008-11-27 2011-09-19 현대하이스코 주식회사 Apparatus for fabricating hot-dip galvanized steel sheet using electromagnetic field-floting, including device for collecting leaked zinc
KR20150116644A (en) 2014-04-08 2015-10-16 전라남도 Oyster larva's seed collecting device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
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JPH02298247A (en) * 1989-05-12 1990-12-10 Nippon Steel Corp Plating method with molten metal
CA2131059C (en) * 1993-09-08 2001-10-30 William A. Carter Hot dip coating method and apparatus
KR100191810B1 (en) * 1995-04-27 1999-06-15 찰스 비. 살로위츠 Electromagnetic confinment of molten metal with conduction current assistance
US6037011A (en) * 1997-11-04 2000-03-14 Inland Steel Company Hot dip coating employing a plug of chilled coating metal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101065567B1 (en) * 2008-11-27 2011-09-19 현대하이스코 주식회사 Apparatus for fabricating hot-dip galvanized steel sheet using electromagnetic field-floting, including device for collecting leaked zinc
KR20150116644A (en) 2014-04-08 2015-10-16 전라남도 Oyster larva's seed collecting device

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