KR20030048241A - Housing with cooling dispenser - Google Patents

Abstract

PURPOSE: A housing is provided to effectively lower the temperature of the housing by directly supplying cooling air to the sub rack or electronic circuit board, while reducing noises and faults of the housing. CONSTITUTION: A housing(5) for protecting electronic units for electronic system, comprises a supply unit for supplying cooling air into the housing; and a cooling dispenser(1) for supplying cooling air into the housing through an external inlet unit, a distributor unit(4) and an internal inlet unit(3). The cooling air compressed by a press transfer unit flows into the distributor unit through the external inlet unit, and flows into the cooling dispenser through the internal inlet unit. The cooling air is discharged to outside through holes(2) formed at the top, bottom or side surface of the dispenser, to thereby lower the temperature of a sub rack or an electronic circuit board.

Description

Housing with cooling dispenser

The present invention is a housing (or cabinet, or rack) for installing and protecting a sub-rack or an electronic circuit board constituting an electronic system, the pressure transfer means 11 that can supply cooling air into the housing and connected thereto It relates to a housing composed of a cooling dispenser (1) for providing cooling air into the housing (5) via an external inlet means (8), a distributing means (4) and an inner inlet means (3).

In general, the equipment constituting the device for the electronic system is composed of a large number of electronic circuit boards and sub-racks (6) from which a lot of heat is generated. In particular, the high speed and high output of the equipment in the electronic system generates more heat, which is the main cause of deterioration of the system performance and even failure. In order to prevent this, in a conventional housing, a cooling fan is installed on the upper, lower, or rear surface to forcibly discharge heat generated therein to lower the temperature inside the housing. However, in such a conventional housing, only a small gap is allowed between the subracks having a layered layer, and thus a structure that relies solely on the cooling fan as a means for exhausting heat generated from an electronic circuit board or a sub rack, and is blocked by a sub rack installed inside the housing. There is a disadvantage that can not be smoothly solved, there is a problem that causes a serious system failure due to noise of the cooling fan, dust and cooling fan failure. In addition, by installing a separate cooling fan, the power circuit becomes complicated and the volume increases, which is the main cause of unnecessary noise generation.

The present invention is designed to solve the above-mentioned problems of the prior art by supplying the cooling air to the inside of the housing evenly supplied to the inside of the housing using the inlet means (3) and the cooling dispenser (1). Can be lowered. In particular, in the conventional housing, heat generated from an internal heat source (such as an electronic circuit board and a sub-rack) far from the cooling fan position may not be quickly removed due to a sealed internal condition. By supplying air evenly, the thermal stability of the entire system can be maintained.

Another object of the present invention is to provide an economical competitive advantage by not using an expensive cooling fan, and a failure of an electronic system caused by a system operator not recognizing or late detecting a malfunction of a cooling fan installed in a conventional housing. It can be prevented through the present invention.

Another object of the present invention is to remove the dust contained in the air through the filter for cooling air supplied from the outside can provide a very clean environment inherently in the internal electronic circuit or sub-rack devices.

1 is a structural diagram of a housing with a cooling dispenser

2 is a structural diagram of an embodiment of a housing with a cooling dispenser;

3 is a structural diagram of a housing in which a sub rack and an electronic assembly board are mounted;

4 is a connection diagram of a housing with a cooling dispenser;

5 is a side view of a housing with a cooling dispenser;

6 is a conventional housing

7 is a cooling fan used in a conventional housing.

<Description of the symbols for the main parts of the drawings>

1: Cooling Dispenser

2: cooling hole

3: internal drawing means

4: Distribution means

5: housing

6: subrack

7: forced exhaust means

8: external entry means

9: discharge guide

10: guide rail

11: pressurized transfer means

Housing 5 of the present invention that can achieve the above object is equally distributed by the cooling air compressed by the pressure transfer means 11 to each housing distribution means (4) through the external inlet means (8). Then, the distributed cooling air is moved to the cooling dispenser 1 composed of several stages through the inlet means (3). The cooling air reaching the cooling dispenser 1 is discharged to the outside through the holes 2 formed in the upper or lower part and the side part of the dispenser 1, thereby remarkably increasing the temperature of the surrounding subrack 6 or the electronic circuit board. The feature is that it is configured to be lowered. In addition, it is configured to be discharged to the outside of the housing using the forced exhaust means (7) through the discharge guide (9) installed in the lower portion of each sub-rack to smooth the flow of air inside the housing.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a structural diagram of a housing with a cooling dispenser

2 is a structural diagram of an embodiment of a housing with a cooling dispenser;

3 is a three-dimensional view of a housing on which a subrack and a printed assembly board are mounted;

4 is a connection diagram of a housing with a cooling dispenser;

5 is a side view of a housing with a cooling dispenser;

6 is a typical representative housing

7 is an example of a cooling fan used in a conventional housing.

1 and 2 are structural diagrams of an example of a housing having a cooling dispenser, and in particular, FIG. 1 shows that the inside of the housing is an empty hexahedron or a cylindrical or polygonal cross-section left and right in FIG. have. At this time, the structure was penetrated to the surface so that the cooling air flows freely from the inside of the dispenser. In this figure, the side is removed to help understand the internal assembly situation. However, unlike the case of FIGS. 1 and 2, at least four surfaces including both sides are sealed to support the internal subracks. .

3 illustrates a structure in which a cooling air from the cooling dispenser 1 lowers the temperature of the heating element in the upper and lower portions of the housing structure in which the sub rack or the electronic circuit board is installed. 4 shows an assembly shape for supplying cooling air into a plurality of housings through a single cooling air supply means. FIG. 5 shows a side view of the housing with a cooling dispenser, in particular the discharge guide 9 installed at the bottom of the subrack, outside the housing without allowing air cooled in the subrack 6 to flow into another upper subrack. Make it easy to drain. 6 is a structure in which a cooling fan is installed in the upper or rear portion of the conventional housing structure to forcibly discharge the raised air therein.

As described above, the present invention can lower the temperature inside the housing more effectively than the structure using the conventional forced exhaust means by supplying cooling air directly to the sub-rack or the electronic circuit board which is the heat generating unit inside the housing. By doing so, it is possible to provide a very stable housing by increasing the overall reliability of the housing and solving the thermal problem caused by the high speed and high output of the electronic communication system. In addition, once the air used for cooling is filtered with a filter, the dust inside the housing is eliminated and the forced exhaust means is not used or the number is reduced, thereby reducing the noise and failure rate of the entire housing. In addition, by eliminating or reducing expensive forced exhaust means, the overall price may be maintained or reduced.

Claims (17)

A housing (or cabinet, or rack) for installing and protecting electronic devices for an electronic system, wherein the inside of the housing is provided through a supply means for supplying cooling air into the housing, an external inlet means, a distributor and an inner inlet means connected thereto. And a cooling dispenser for providing furnace cooling air. The housing as claimed in claim 1, wherein the cooling dispenser connected to the inner retracting means is hollow inside and is drilled through the through-holes of circular and polygonal surfaces. The housing as claimed in claim 1, wherein holes of different shapes and sizes are drilled to provide equal cooling air inside the housing. The housing according to claim 1, wherein the size of the connection portion with the cooling dispenser is different so that the pressure of the cooling air supplied from the inner drawing means is equal to the upper and lower parts. The housing according to claim 1, wherein at least one inlet means for delivering cooling air from the distributor to each dispenser is provided to enable independent cooling air supply. The housing according to claim 1, wherein a filter means is installed in the cooling air supply means to remove unnecessary foreign matter in the housing. The housing according to claim 1, wherein the cooling air supply means have different sizes of cooling air supply means so as to provide cooling air at the same pressure to the one or more housings. The housing according to claim 1, wherein a forced exhaust means is provided in the housing for smoother exhaust of internal air. The housing according to claim 1, wherein a discharge guide is installed to be inclined at the lower end of the sub rack, which is a heat generating portion, for smoother exhaust of internal air. The housing according to claim 1, wherein a groove is formed at a specific portion of the inner retracting means and the position of the connected dispenser can be adjusted, and a fixing means is installed to fix the dispenser. The housing of claim 1, wherein the dispenser has a cylindrical or polygonal pipe shape that traverses the interior of the housing and has a perforated hole of a circular or polygonal shape on its surface. The housing according to claim 1, wherein the inner wall of the inner retracting means has a through hole of a circular or polygonal shape. The housing according to claim 1, wherein the cooling air supplied to the inlet means is supplied from the bottom supply means and connected to the inside of the housing. The housing according to claim 1, wherein the cooling air is supplied from either the left and right sides of the inner drawing means and sucked from the opposite side. The housing according to claim 1, wherein the cooling dispenser is arranged in parallel with the internal inlet means. The housing according to claim 1, wherein means for constant temperature, humidity, and dust removal are installed inside the pressure transfer means. The housing according to claim 1, wherein the forced exhaust means is separated from the housing.