KR20030039708A - Ni-w/mo/lanthanide mixed-rare earth metal electroless plating solution and plating method using the same - Google Patents

Ni-w/mo/lanthanide mixed-rare earth metal electroless plating solution and plating method using the same Download PDF

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KR20030039708A
KR20030039708A KR1020010070734A KR20010070734A KR20030039708A KR 20030039708 A KR20030039708 A KR 20030039708A KR 1020010070734 A KR1020010070734 A KR 1020010070734A KR 20010070734 A KR20010070734 A KR 20010070734A KR 20030039708 A KR20030039708 A KR 20030039708A
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plating
rare earth
earth metal
molybdenum
sodium
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엄태인
강용혁
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엄태인
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1675Process conditions
    • C23C18/1683Control of electrolyte composition, e.g. measurement, adjustment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1689After-treatment
    • C23C18/1692Heat-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48Coating with alloys
    • C23C18/50Coating with alloys with alloys based on iron, cobalt or nickel

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE: Ni-W/Mo/Lanthanide mixed-rare earth metal electroless plating solution and a plating method using the same are provided. CONSTITUTION: The Ni-W/Mo/Lanthanide mixed-rare earth metal electroless plating solution contains, in 1 liter of distilled water, nickel sulfate 5 to 15g, sodium tungstate 20 to 35g, molybdenum 25 to 35g, Lanthanide mixed-rare earth metal 0.1 to 5g, sodium citrate 10 to 15g, sodium hypophosphate 5 to 10g and molybdenum ionic surfactant 0.7 to 2.0g/25cc, wherein the ionic surfactant is dioctyl phthalate+phthyl cellosolve; the diameter is molybdenum is 0.1 to 1.0 micrometer; the diameter of Lanthanide mixed-rare earth metal is 0.1 to 2.3 micrometer. The plating method using Ni-W/Mo/Lanthanide mixed-rare earth metal electroless plating solution includes the steps of completely dissolving nickel sulfate 5 to 15g, sodium tungstate 20 to 35g in 1 liter of distilled water; secondary dissolving sodium citrate 10 to 15g, sodium hypophosphate 5 to 10g in the distilled water; adding 25 to 35g of molybdenum with a particle size of 0.1 to 1.0 micrometer, 0.1 to 5g of Lanthanide mixed-rare earth metal with a particle size of 0.1 to 2.3 micrometer and 0.7 to 2.0g/25cc of molybdenum ionic surfactant in the distilled water; electroplating a specimen to be plated in a thickness of 7 to 10 micrometers at pH 9.0 to 9.8 at electroplating solution temperature of 85 to 90°C; and heat treatment at 350 to 450°C for about 30 min.

Description

무전해 Ni-W/Mo/란탄계 혼합희토류 금속 도금액 및 이를 이용한 도금방법{Ni-W/Mo/Lanthanide mixed-rare earth metal electroless plating solution and plating method using the same}Ni-W / Mo / Lanthanide mixed-rare earth metal electroless plating solution and plating method using the same}

본 발명은 무전해 Ni-W/Mo/란탄계 혼합희토류 금속 도금액 및 이를 이용한 도금방법에 관한 것으로, 좀 더 구체적으로는 무전해 도금액의 안정화제로 이온계면활성제를 이용하고, 이에 적합한 환원제 및 착화제를 선택하여 텅스텐, 몰리브덴, 란탄계 혼합희토류 금속을 복합적으로 무전해 도금을 할 수 있는 도금액을 제공하며, 1차 도금한 제품의 내마모성, 경도 및 연성을 증가시키기 위하여 무전해 복합도금 후 표면처리를 하고 최종적으로 350∼450℃ 정도에서 약 30분 이상 열처리하여 최종적으로 내마모성이 우수하고 비커스 경도계로 Hv 2,850∼3,200인 고경도인 제품을 제공할 수 있는 무전해 Ni-W/Mo/란탄계 혼합희토류 금속 도금액 및 이를 이용한 도금방법에 관한 것이다.The present invention relates to an electroless Ni-W / Mo / lanthanum-based mixed rare earth metal plating solution and a plating method using the same. More specifically, an ionic surfactant is used as a stabilizer for an electroless plating solution, and a reducing agent and a complexing agent suitable therefor. Select to provide a plating solution that can electrolessly plate tungsten, molybdenum and lanthanum mixed rare earth metals in combination, and surface treatment after electroless composite plating to increase wear resistance, hardness and ductility of primary plated products. And finally heat treated at about 350 to 450 ° C. for about 30 minutes or more to provide a highly wear resistant and high hardness product of Hv 2,850 to 3,200 as a Vickers hardness tester. Electroless Ni-W / Mo / lanthanum mixed rare earths It relates to a metal plating solution and a plating method using the same.

도 1을 참조하면, 일반적으로 무전해 도금이란 도금조(4)내에서 도금용액(또는 금속염, 5)과 가용성 환원제(3)가 공존하는 용액에 피도금물체(1)을 접촉시켰을 때 피도금물체(1)의 표면에 도금물질(2)을 형성시키는 방법으로서, 환원제(3)의 산화에 의해 방출되는 전자가 금속이온에 전이하여 금속피막이 형성되는 것이며 전기력에 의하지 않는 도금이므로 무전해 도금이라 한다.Referring to FIG. 1, in general, electroless plating refers to a plating target when the object to be plated 1 is brought into contact with a solution in which a plating solution (or a metal salt 5) and a soluble reducing agent 3 coexist in a plating bath 4. A method of forming the plating material (2) on the surface of the object (1), the electrons released by the oxidation of the reducing agent (3) is transferred to the metal ions to form a metal film is a non-electrical plating is called electroless plating. do.

이와 같이, 무전해 도금기술은 외부로부터 전기에너지를 공급받지 않고 금속염 수용액 중의 금속이온을 환원제가 금속분자로 환원시켜 피처리물의 표면에 석출시키는 방법으로서, 전기도금에 비하여 도금층이 치밀하고 약 10∼25㎛ 정도의 두께로 도금을 할 수 있다. 현재까지 무전해 도금은 구리(Cu), 니켈-인(Ni-P), 니켈-코발트(Ni-Co), 니켈-붕소(Ni-B), 니켈-텅스텐-인(Ni-W-P) 합금이 이루어져 도체 금속을 비롯하여 플라스틱과 유기체와 같은 다양한 기판에 적용할 수 있었다.As described above, the electroless plating technique is a method in which metal ions in an aqueous metal salt solution are reduced to metal molecules to be deposited on the surface of an object to be processed without receiving electrical energy from the outside. Plating can be performed in a thickness of about 25 μm. To date, electroless plating is made of copper (Cu), nickel-phosphorus (Ni-P), nickel-cobalt (Ni-Co), nickel-boron (Ni-B) and nickel-tungsten-phosphorus (Ni-WP) alloys. It could be applied to various substrates such as plastics and organic materials as well as conductor metals.

이와 관련된 선행기술로서, 한국 공개특허 제2000-76067호에서는 낮은 전도율을 가진 재료, 경면물이나 분말체 등의 표면상에 무전해도금에 의해 금속도금하는 방법 및 그를 위한 금속도금 전처리제를 개시하고 있고, 한국 공개특허 제97-701275호에서는 염기성 화합물, 환원제 및 착화제을 포함하는 금속막상에 형성되는 무전해 도금용 전처리액, 무전해 도금욕 및 무전해 도금방법을 개시하고 있다. 또한, 한국 공개특허 제83-07893호에서는 순수 1,000cc당 황산니켈 80g, 차인산나트륨 24g, 소디움 아세테이트 12g, 붕산 8g, 염화암모니움 6g을 혼합조성한 도금용액을 개시하고 있으며, 한국 특허출원 제97-77682호에서는 무전해 도금법을 이용하여 P 함량이 비교적 높은 Ni-P(니켈-인) 합금에 W(텅스텐)을 공석시킨 피막을 철제의 캔 및 캡에 도금하는 방법을 개시하고 있다.As a related art, Korean Patent Laid-Open Publication No. 2000-76067 discloses a method of metal plating by electroless plating on a surface having a low conductivity, a mirror surface or a powder, and a metal plating pretreatment therefor. Korean Patent Laid-Open Publication No. 97-701275 discloses an electroless plating pretreatment liquid, an electroless plating bath and an electroless plating method formed on a metal film containing a basic compound, a reducing agent and a complexing agent. In addition, Korean Patent Application Publication No. 83-07893 discloses a plating solution in which 80g of nickel sulfate, 1,000g of sodium phosphate, 24g of sodium acetate, 12g of sodium acetate, 8g of boric acid, and 6g of ammonium chloride are mixed and prepared, and Korean Patent Application No. 97 -77682 discloses a method of plating a steel can and cap onto a steel can and cap by using an electroless plating method, in which a W (tungsten) vacancy is coated in a Ni-P (nickel-phosphorus) alloy having a relatively high P content.

그러나, 종래에는 도금물질, 환원제 및 안정화제의 제한으로 다양한 금속을 이용한 도금이 이루어지지 못하고 있는 실정이다. 그러므로 내마모성이 강하거나 연성 및 강도가 강한 물질의 표면처리에는 제약이 있었다.However, conventionally, the plating using various metals is not performed due to the limitation of the plating material, the reducing agent, and the stabilizer. Therefore, there is a limitation in the surface treatment of materials having high wear resistance or ductility and strength.

이에 본 발명에서는 무전해 도금액의 안정화제로 이온계면활성제를 이용하고, 이에 적합한 환원제 및 착화제를 선택하여 텅스텐, 몰리브덴, 란탄계 혼합희토류 금속을 복합적으로 무전해 도금을 할 수 있는 기술을 개발하였고, 본 발명은 이에 기초하여 완성되었다.Therefore, the present invention has developed a technology for complex electroless plating of tungsten, molybdenum and lanthanum mixed rare earth metals by using an ionic surfactant as a stabilizer of an electroless plating solution, and selecting a reducing agent and a complexing agent suitable for this. The present invention has been completed based on this.

따라서, 본 발명의 목적은 도금 처리된 표면의 경도, 강도, 연성 및 내마모성을 증가시킬 수 있는 무전해 Ni-W/Mo/란탄계 혼합희토류 금속 도금액을 제공하는데 있다.Accordingly, it is an object of the present invention to provide an electroless Ni-W / Mo / lanthanum-based mixed rare earth metal plating solution which can increase the hardness, strength, ductility and wear resistance of the plated surface.

본 발명의 다른 목적은 상기 도금액을 이용하여 피도금 물체에 도금하는 방법을 제공하는데 있다.Another object of the present invention is to provide a method for plating a plated object using the plating solution.

상기 목적을 달성하기 위한 본 발명의 무전해 Ni-W/Mo/란탄계 혼합희토류 금속 도금액은 증류수 1ℓ에 대하여 황산니켈 5∼15g, 텅스텐나트륨 20∼35g, 몰리브덴 25∼35g, 란탄계 혼합희토류 금속 0.1∼5g, 구연산나트륨 10∼15g, 차인산나트륨 5∼10g 및 몰리브덴 이온계면활성제 0.7∼2.0g/25cc로 구성된다.The electroless Ni-W / Mo / lanthanum mixed rare earth metal plating solution of the present invention for achieving the above object is 5 to 15 g of nickel sulfate, 20 to 35 g of tungsten sodium, 25 to 35 g of molybdenum, and lanthanum mixed rare earth metal with respect to 1 L of distilled water. 0.1-5g, 10-15g sodium citrate, 5-10g sodium hypophosphate, and 0.7-2.0g / 25cc molybdenum ion surfactant.

본 발명의 다른 목적을 달성하기 위한 상기 도금액을 이용한 도금방법은 증류수로 도금조 절반을 채운 후 황산니켈 5∼15g/ℓ 및 텅스텐나트륨 20∼35g/ℓ을 첨가하여 완전히 용해시킨 후, 구연산나트륨 10∼15g/ℓ 및 차인산나트륨 5∼10g/ℓ을 추가 용해한 후 입경이 0.1∼1.0㎛인 몰리브덴 25∼35g/ℓ과 입경이 0.1∼2.3㎛인 란탄계 혼합희토류 금속 0.1∼5g/ℓ과 몰리브덴 이온계면활성제 0.7∼2.0g/25cc를 첨가하고, 다시 증류수로 도금조 수위까지 보충시키는 단계; 상기 도금조 온도를 85∼90℃, 용액의 pH를 9.0∼9.8로 조정하여 도금속도를 시간당 7∼10㎛두께로 피도금물체에 도금을 실시하는 단계; 및 상기 피도금물체의 표면처리를 하고 350∼450℃에서 약 30분이상 열처리시키는 단계를 포함한다.Plating method using the above plating solution to achieve another object of the present invention after filling the plating tank half with distilled water and completely dissolved by adding nickel sulfate 5-15g / l and tungsten sodium 20-35g / l, sodium citrate 10 After further dissolving ˜15 g / l and 5-10 g / l of sodium hypophosphate, 25 to 35 g / l of molybdenum having a particle size of 0.1 to 1.0 μm, and 0.1 to 5 g / l of lanthanum mixed rare earth metal having a particle size of 0.1 to 2.3 μm and molybdenum Adding 0.7 to 2.0 g / 25 cc of an ionic surfactant, and replenishing with distilled water to the plating bath level; Plating the object to be plated with a plating rate of 7 to 10 μm per hour by adjusting the plating bath temperature to 85 to 90 ° C. and a pH of the solution to 9.0 to 9.8; And surface-treating the object to be plated and heat-treated at 350 to 450 ° C. for at least about 30 minutes.

도 1은 통상적인 무전해 도금공정에서 도금 메카니즘을 개략적으로 나타낸 도면이고,1 is a view schematically showing a plating mechanism in a conventional electroless plating process,

도 2는 본 발명에 따른 도금방법을 적용하기에 적합한 장치를 개략적으로 나타낸 도면이다.2 is a view schematically showing an apparatus suitable for applying the plating method according to the present invention.

※ 도면의 주요부분에 대한 부호의 설명 ※※ Explanation of code about main part of drawing ※

1. 피도금물체2. 도금물질(M)1.Object to be plated 2. Plating material (M)

3. 환원제(R)4. 도금조3. Reducing agent (R) 4. Plating bath

5. 도금용액6. 공기 배관5. Plating solution 6. Air piping

7. 가열히타8. 자동 온도조절장치7. Heating Heater 8. Thermostat

9. 자동 pH 조절장치10. 송풍기9. Automatic pH Control 10. air blower

11. 필터 펌프12. 예비 도금조Filter pump 12. Pre-plating bath

이하 본 발명을 좀 더 구체적으로 살펴보면 다음과 같다.Looking at the present invention in more detail as follows.

전술한 바와 같이, 현재까지 무전해 도금기술은 Cu, Ni-Co 및 Ni-P를 이용한 표면처리기술이 주로 이루어져 많은 산업체에서 균일한 표면처리 및 플라스틱 나무등 비금속 물질의 표면처리가 가능하여 다양하게 응용되었다. 그러나 도금물질에 제약을 받는 등 아직까지 해결해야 할 분야 중 하나가 기계적 성질이 우수한 텅스텐, 몰리브덴, 란탄계 혼합희토류 금속 등을 무전해 방법을 이용하여 도금하는 것이다. 상기 텅스텐은 니켈-텅스텐-인 합금으로 사용된 예가 종종 있으나, 몰리브덴과 란탄계 혼합희토류 금속은 도금성분으로 사용된 예가 거의 없는 실정이다. 따라서, 이때 요구되는 것이 무전해 도금에서 중요한 환원제 개발과 안정화제 개발이다.As described above, the electroless plating technology has been mainly made of surface treatment technology using Cu, Ni-Co and Ni-P, so that many industries can make uniform surface treatment and surface treatment of non-metallic materials such as plastic trees. Was applied. However, one of the fields still to be solved, such as being restricted by plating materials, is to plate tungsten, molybdenum, and lanthanum mixed rare earth metals having excellent mechanical properties using an electroless method. Tungsten is often used as a nickel-tungsten-phosphorus alloy, but molybdenum and lanthanum mixed rare earth metals are rarely used as plating components. Therefore, what is required at this time is the development of important reducing agents and stabilizers in electroless plating.

이에 본 발명에서는 무전해 도금액의 착화제로 구연산나트륨, 환원제로 차인산나트륨 용액과 안정화제로 이온계면 활성제를 이용하여 안정적인 무전해 도금이 되도록 하였다. 또한, 도금될 금속성분으로서 몰리브덴과 란탄계 혼합희토류 금속을 추가하여 니켈-텅스텐 무전해 도금에 합금 도금이 가능하도록 하여 표면처리된 부분의 경도, 강도, 연성 및 내마모성을 증가시켰으며, 특히 경도는 브린델 경도계로 Hv 3,200까지 나타내고 있다.Thus, in the present invention, a stable electroless plating was performed by using sodium citrate as a complexing agent of an electroless plating solution, a sodium phosphate solution as a reducing agent, and an ionic surfactant as a stabilizer. In addition, molybdenum and lanthanum mixed rare earth metals were added as the metal components to be plated to allow alloy plating for nickel-tungsten electroless plating, thereby increasing the hardness, strength, ductility, and wear resistance of the surface-treated part. It is shown up to Hv 3,200 by Brindel hardness tester.

전술한 바와 같이, 본 발명의 무전해 Ni-W/Mo/란탄계 혼합희토류 금속 도금액은 황산니켈, 텅스텐나트륨, 몰리브덴, 란탄계 혼합희토류 금속, 구연산나트륨, 차인산나트륨 및 몰리브덴 이온계면활성제로 구성된다.As described above, the electroless Ni-W / Mo / lanthanum mixed rare earth metal plating solution of the present invention comprises nickel sulfate, tungsten sodium, molybdenum, lanthanum mixed rare earth metal, sodium citrate, sodium hypophosphite and molybdenum ionic surfactant do.

본 발명에 따르면, 상기 황산니켈은 증류수 1ℓ에 대하여 5∼15g이 사용되며, 텅스텐나트륨은 20∼35g이 사용된다. 또한, 상기 몰리브덴은 증류수 1ℓ에 대하여 25∼35g이 사용되는데, 25g 미만이면 인성이 약하고, 35g를 초과하면 잔류응력이 크므로서 균일이 발생될 수 있고, 상기 몰리브덴의 입경은 0.1∼1.0㎛가 바람직한데, 이는 평활한 전착을 하기 위함이다. 아울러, 상기 란탄계 혼합희토류 금속의 사용량은 증류수 1ℓ에 대하여 0.1∼5g이 바람직하며, 0.1g 미만이면 첨가효과가 미미하며, 5g를 초과하면 도금표면에 거치른 금속이 전착되는 경향이 있고, 상기 란탄계 혼합희토류 금속의 입경은 0.1∼2.3㎛가 바람직한데, 0.1㎛ 미만이면 전착속도가 저하되고, 2.3㎛를 초과하면 도금표면에 돌기현상을 갖는 전착이 발생된다.According to the present invention, 5 to 15 g of nickel sulfate is used for 1 L of distilled water, and 20 to 35 g of tungsten sodium is used. In addition, the molybdenum is used 25 ~ 35g per 1 liter of distilled water, if less than 25g toughness is weak, more than 35g may cause uniformity due to large residual stress, the particle size of the molybdenum is preferably 0.1 ~ 1.0㎛ This is for smooth electrodeposition. In addition, the amount of the lanthanum-based mixed rare earth metal is preferably 0.1 to 5 g with respect to 1 L of distilled water, and when the amount is less than 0.1 g, the effect of addition is insignificant. The particle diameter of the system-based mixed rare earth metal is preferably 0.1 to 2.3 占 퐉. However, if the particle diameter is less than 0.1 占 퐉, the electrodeposition rate is lowered.

본 발명의 도금용액의 착화제로 사용되는 구연산나트륨은 증류수 1ℓ에 대하여 10∼15g로 사용되는 것이 금속분(W, Ni)이 일정비율로 전착되어 바람직하며, 환원제로 사용되는 차인산나트륨은 증류수 1ℓ에 대하여 5∼10g으로 사용되는 것이 도금액의 안정성면에서 바람직하다.Sodium citrate used as the complexing agent of the plating solution of the present invention is preferably used in 10 to 15g per 1L of distilled water, the metal powder (W, Ni) is electrodeposited in a certain ratio, sodium hypophosphate used as a reducing agent in 1L of distilled water It is preferable to use 5-10g with respect to stability of a plating liquid.

한편, 본 발명의 특징인 도금용액의 안정화제로 사용되는 이온계면활성제는 증류수 1ℓ에 대하여 5.0∼7.0g으로 사용되며, 5.0g 미만이면 금속분(몰리브덴)의 석출속도가 적어지고, 7.0g을 초과하면 도금용액이 분해되는 경향이 있다. 상기 이온계면활성제를 도금액에 첨가시 몰리브덴과 함께 첨가하는 것이 바람직한데, 몰리브덴 이온계면활성제를 0.7∼2.0g/25cc로 구성된다. 본 발명에 사용 가능한 이온계면활성제로는 디욱틸프탈레이트+프틸셀로솔브이다.On the other hand, the ionic surfactant used as a stabilizer of the plating solution, which is a feature of the present invention, is used at 5.0 to 7.0 g per 1 L of distilled water, and when less than 5.0 g, the precipitation rate of the metal powder (molybdenum) decreases and exceeds 7.0 g. The plating solution tends to decompose. When the ionic surfactant is added to the plating solution, it is preferable to add it together with molybdenum, and the molybdenum ionic surfactant is composed of 0.7 to 2.0 g / 25 cc. The ionic surfactant usable in the present invention is diuktylphthalate + phthalocellosolve.

몰리브덴 이온계면활성제를 0.7∼2.0g/cc의 양으로 첨가하는 것은 이 농도에서 금속표면에 몰리브덴 금속의 전착이 가장 양호하기 때문이며 이 때의 몰리브덴의 양은 무전해 도금에 사용하는 몰리브덴과 별개의 양으로 계산된다.The addition of molybdenum ionic surfactant in an amount of 0.7 to 2.0 g / cc is most preferred because of the best electrodeposition of molybdenum metal on the metal surface at this concentration, and the amount of molybdenum at this time is different from that of molybdenum used for electroless plating. Is calculated.

한편, 본 발명의 도금방법은 먼저, 증류수로, 도 2에 도시된 바와 같은, 도금조(4) 절반을 채운후 황산니켈 5∼15g/ℓ 및 텅스텐나트륨 20∼35g/ℓ을 첨가하여 완전히 용해시킨다. 그 다음, 구연산나트륨 10∼15g/ℓ 및 차인산나트륨 5∼10g/ℓ을 추가 용해한 후 입경이 0.1∼1.0㎛인 몰리브덴 25∼35g/ℓ과 입경이 0.1∼2.3㎛인 란탄계 혼합희토류 금속 0.1∼5g/ℓ과 몰리브덴 이온계면활성제 0.7∼2.0g/25cc를 첨가한다. 다시 증류수로 도금조 수위까지 보충시킨 다음, 상기 도금조 온도를 85∼90℃, 용액의 pH를 9.0∼9.8로 조정하여 도금속도를 시간당 7∼10㎛두께로 피도금물체에 도금을 실시한다. 이 때, 도금속도를 시간당 7∼10㎛로 유지시키는 이유는 도금액을 표준으로 했을 때의 평균 도금속도이며 도금속도의 조절은 온도, pH, 도금액 농도로 한다. 도금 후, 상기 피도금 물체의 표면처리를 하고 350∼450℃에서 약 30분이상, 바람직하게는 약 1시간 열처리시키면 피도금물체의 경도가 비커스 경도계로 Hv 2,850∼3,200 정도를 유지하게 된다.On the other hand, the plating method of the present invention, first, with the distilled water, as shown in Figure 2, half of the plating tank (4) is added, and then completely dissolved by adding 5 to 15 g / l nickel sulfate and 20 to 35 g / l tungsten sodium Let's do it. Then, 10-15 g / l sodium citrate and 5-10 g / l sodium hypophosphate were further dissolved, followed by 25-35 g / l molybdenum having a particle size of 0.1-1.0 μm and a lanthanum mixed rare earth metal 0.1 having a particle size of 0.1-2.3 μm. -5 g / l and molybdenum ionic surfactant 0.7-2.0 g / 25 cc are added. After replenishing with distilled water to the level of the plating bath, the plating bath temperature is adjusted to 85 to 90 ° C. and the pH of the solution to 9.0 to 9.8 to plate the object to be plated at a thickness of 7 to 10 μm per hour. At this time, the reason for maintaining the plating rate at 7 to 10 탆 per hour is the average plating rate when the plating solution is used as a standard, and the plating rate is controlled by temperature, pH, and plating solution concentration. After plating, the surface of the object to be plated is subjected to heat treatment at 350 to 450 ° C. for about 30 minutes or more, preferably about 1 hour, thereby maintaining the hardness of the object to be Hv 2,850 to 3,200 using a Vickers hardness tester.

전술한 바와 같이, 본 발명은 높은 내마모성과 고경도의 기계적 특성을 가진 텅스텐과 인성이 강한 몰리브덴 및 소량으로서 금속의 강도 및 연성을 증가시킨 란탄계 혼합희토류 금속을 첨가한 화학환원법 무전해 복합도금 기술로서 도금 후 표면처리를 하면 경도가 비커스 경도계로 Hv 1,400∼1,800 정도를 유지하게 된다. 또한, 최종적으로 350∼450℃ 정도에서 약 30분 이상 열처리하면 비커스 경도계로 Hv 2,850∼3,200를 나타낸다.As described above, the present invention is a chemical reduction method electroless composite plating technology in which tungsten having high wear resistance and high hardness mechanical properties, molybdenum having high toughness, and a lanthanum mixed rare earth metal having a small amount of increased strength and ductility are added. As a surface treatment after plating, the hardness is maintained at about Hv 1,400 to 1,800 using a Vickers hardness tester. In addition, when finally heat-treated at about 350-450 degreeC for about 30 minutes or more, a Vickers hardness tester shows Hv 2,850-3,200.

따라서, 본 발명의 무전해 도금액 및 도금방법은 내마모성과 높은 인성, 강도 및 경도를 요구하는 초정밀 베어링을 비롯한 정밀 기계 부품은 물론 제지, 섬유, 필름, 유리솜/암면 고무산업 등에서 다량으로 고속 절단용 칼날과 반도체 장비의 부품에 적용할 수 있다. 이 경우 상기 내마모성과 경도 및 강도가 요구되는 부품의 모재는 기계적 성질 및 작업성이 우수한 일반 연강으로 제작하고, 본 발명에 따른 무전해 복합도금액을 필요한 표면에만 도금 처리하여 사용할 경우 부품가격의 저하는 물론 사용시간을 획기적으로 연장할 수 있는 우수한 표면처리 기술이다.Therefore, the electroless plating solution and plating method of the present invention is a high speed cutting blade in a large amount in the paper, fiber, film, glass wool / rock wool rubber industry, as well as precision mechanical parts, such as ultra-precision bearings that require wear resistance and high toughness, strength and hardness It can be applied to parts of semiconductor equipment. In this case, the base material of the parts requiring the wear resistance, hardness and strength is made of general mild steel with excellent mechanical properties and workability, and the price of parts is reduced when the electroless composite plating solution according to the present invention is plated only on the required surface. Of course, it is an excellent surface treatment technology that can significantly extend the use time.

이하 실시예를 통하여 본 발명을 좀 더 구체적으로 살펴보지만, 하기 예에 본 발명의 범주가 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to the following examples, but the scope of the present invention is not limited to the following examples.

실시예 1Example 1

본 실시예에서는, 도 2에 도시된 바와 같이, 자동 온도조절장치(8), 자동 pH 조절장치(9), 송풍기(10), 필터 펌프(11) 및 예비 도금조(12)가 외부에 장착되고, 내부에 상기 송풍기(10)에 연결된 공기 배관(6) 및 가열히타(7)를 구비한 도금조(4)를 이용하였다.In the present embodiment, as shown in Figure 2, the thermostat 8, the automatic pH regulator 9, the blower 10, the filter pump 11 and the pre-plating tank 12 is mounted on the outside And a plating bath 4 having an air pipe 6 and a heating heater 7 connected to the blower 10 therein was used.

상기 필터 펌프(11)는 불순물을 여과하여 주고, 예비 도금조(12)는 도금 종료시 도금액을 예비도금조로 이송하여 보관하며, 공기 배관(6)에서 공기를 각반시켜 도금이 균일하게 금속표면에 전착되도록 한다.The filter pump 11 filters the impurities, and the pre-plating tank 12 transfers and stores the plating solution to the pre-plating tank at the end of plating, and deposits air on the air pipe 6 to uniformly deposit the plating on the metal surface. Be sure to

증류수로 도금조(4) 절반을 채운 후 황산니켈 11g/ℓ과 텅스텐나트륨 27g/ℓ을 첨가하여 완전히 용해시킨 후, 구연산나트륨 13g/ℓ 및 차인산나트륨 8g/ℓ을 추가 용해시킨 다음, 입경이 0.1∼1.0㎛인 몰리브덴 30g/ℓ 및 입경 0.1∼2.3㎛인 란탄계 복합희토류 금속 1g/ℓ과 몰리브덴 이온계면활성제 1g/25cc를 추가하고 증류수로 도금조 수위까지 보충하였다. 도금 작업조건은 온도 약 87℃이고, 도금조 용액의 pH는 NaOH를 첨가하여 9.5로 조정하여 피도금 물체인 고속 절단용 칼날에도금속도를 시간당 약 8㎛의 두께로 1.5시간 실시하였다. 이렇게 무전해 복합도금된 칼날의 비커스 경도는 약 Hv 1,600이었다.After filling half of the plating bath (4) with distilled water, 11 g / l of nickel sulfate and 27 g / l of sodium tungsten were completely dissolved, and then 13 g / l of sodium citrate and 8 g / l of sodium hypophosphate were further dissolved, 30 g / l molybdenum (0.1-1.0 μm), 1 g / l lanthanum composite rare earth metal (0.1-2.3 μm) and 1 g / 25 cc molybdenum ionic surfactant were added and supplemented with distilled water to the plating bath level. The plating working conditions were about 87 ° C., and the pH of the plating bath solution was adjusted to 9.5 by adding NaOH to conduct a high speed cutting blade, which is a plated object, at a thickness of about 8 μm per hour for 1.5 hours. The Vickers hardness of this electroless composite plated blade was about Hv 1,600.

한편, 상기 Ni-W/Mo/란탄계 희유금속을 이용한 무전해 복합도금한 칼날의 내마모성, 경도 및 연성을 증가시키기 위하여 무전해 복합도금 후, 방청유로 표면처리를 실시하고, 최종적으로 약 400℃에서 1시간 동안 열처리하여 최종 제품을 제조하였다. 상기 제품의 비커스 경도는 약 Hv 3,000이었다.On the other hand, in order to increase the wear resistance, hardness and ductility of the electroless composite plated blade using the Ni-W / Mo / lanthanum-based rare metals, after the electroless composite plating, the surface treatment with rust-preventive oil, finally about 400 ℃ The final product was prepared by heat treatment at 1 hour. The Vickers hardness of this product was about Hv 3,000.

도금액은 농도를 일정하게 유지하면서 지속적으로 사용하기 때문에 폐수가 발생하지 않으며 일부 대기오염 물질인 VOCs는 활성탄소섬유를 사용하여 흡착하여 처리하므로 무공해 도금기술을 실현할 수 있다.Wastewater does not occur because the plating liquid is used continuously while maintaining a constant concentration. VOCs, which are some air pollutants, are adsorbed and treated using activated carbon fibers to realize pollution-free plating technology.

본 발명에 따른 Ni-W/Mo/란탄계 혼합희토류 금속 무전해 복합도금액 및 도금방법은 기존의 Cu, Ni-Co, Ni-P 등에서 입증된 우수한 도금기술에 텅스텐, 몰리브덴 및 란탄계 혼합희토류 금속을 첨가하여 표면처리함으로서 기계적 특성을 획기적으로 증대시킨 우수한 기술이다. 특히 본 발명에서 사용하는 무전해 도금은 처리가 곤란한 도금 폐수를 발생하지 않고 연속적인 사용한 가능하므로 향후 특수한 도금 분야에서 널리 이용될 수 있는 기술이다.Ni-W / Mo / lanthanum-based mixed rare earth metal electroless composite plating solution and plating method according to the present invention is a tungsten, molybdenum and lanthanum-based mixed rare earth in the excellent plating technology proved by conventional Cu, Ni-Co, Ni-P, etc. It is an excellent technology that dramatically improves mechanical properties by adding metal to surface treatment. In particular, the electroless plating used in the present invention is a technology that can be widely used in a special plating field in the future because it can be used continuously without generating plating wastewater which is difficult to treat.

특히 본 발명에서 개발한 무전해 도금액은 그 동안 사용하기 곤란했던 텅스텐 및 몰리브덴을 이용한 안정적인 복합도금이 가능하다. 또한, 본 발명은 중량비로 0.1∼0.3% 정도만 용융금속에 첨가하여도 강도가 10∼20%, 연성이 10% 정도 증가하는 란탄계 혼합희토류 금속을 추가할 수 있는 복합도금 기술이다. 그러므로 본발명의 무전해 복합 도금액 및 도금방법은 내마모성과 높은 인성, 강도 및 경도를 요구하는 초정밀 항공기 및 우주왕복선 등에 사용하는 초정밀 베어링을 비롯한 각종 정밀 기계 부품은 물론 제지, 섬유, 필름, 유리솜/암면 고무산업 등에서 다량으로 사용하는 고속 절단용 칼날과 반도체 장비의 부품에 적용할 수 있다. 이 경우 상기 내마모성과 경도 및 강도가 요구되는 부품의 모재는 기계적 성질 및 작업성이 우수한 일반 연강으로 제작하고, 본 발명의 무전해 복합도금을 필요한 표면에만 처리하여 사용할 경우 부품가격의 저하는 물론 사용시간을 획기적으로 연장할 수 있는 친환경적인 우수한 표면처리 기술이다.In particular, the electroless plating solution developed in the present invention is capable of stable composite plating using tungsten and molybdenum, which have been difficult to use. In addition, the present invention is a composite plating technology that can add a lanthanum-based mixed rare earth metal in which the strength is increased by 10 to 20% and the ductility by about 10% even when only 0.1 to 0.3% by weight is added to the molten metal. Therefore, the electroless composite plating solution and plating method of the present invention are not only a variety of precision mechanical parts including ultra-precision bearings used in high precision aircraft and space shuttles that require abrasion resistance, high toughness, strength and hardness, but also paper, fiber, film, glass wool / rock wool It can be applied to high speed cutting blades and parts of semiconductor equipment used in a large amount in the rubber industry. In this case, when the base material of the parts requiring the wear resistance, hardness and strength is made of general mild steel having excellent mechanical properties and workability, the electroless composite plating of the present invention is used only on the required surface, of course, the lowering of the part price is used. It is an excellent environmentally friendly surface treatment technology that can significantly extend the time.

Claims (7)

증류수 1ℓ에 대하여 황산니켈 5∼15g, 텅스텐나트륨 20∼35g, 몰리브덴 25∼35g, 란탄계 혼합희토류 금속 0.1∼5g, 구연산나트륨 10∼15g, 차인산나트륨 5∼10g 및 몰리브덴 이온계면활성제 0.7∼2.0g/25cc로 구성되는 것을 특징으로 하는 무전해 Ni-W/Mo/란탄계 혼합희토류 금속 도금액.Nickel sulfate 5-15g, sodium tungsten 20-35g, molybdenum 25-35g, lanthanum mixed rare earth metal 0.1-5g, sodium citrate 10-15g, sodium hypophosphite 5-10g and molybdenum ionic surfactant 0.7-2.0 per liter of distilled water An electroless Ni-W / Mo / lanthanum mixed rare earth metal plating solution, characterized in that it is composed of g / 25cc. 제1항에 있어서, 상기 이온계면활성제가 디욱틸프탈레이트+프틸셀로솔브인 것을 특징으로 하는 도금액.The plating solution according to claim 1, wherein the ionic surfactant is diuktylphthalate + phthalyl cellosolve. 제1항에 있어서, 상기 몰리브덴의 입경이 0.1∼1.0㎛인 것을 특징으로 하는 도금액.The plating solution according to claim 1, wherein the molybdenum has a particle diameter of 0.1 to 1.0 mu m. 제1항에 있어서, 상기 란탄계 혼합희토류 금속의 입경이 0.1∼2.3㎛인 것을 특징으로 하는 도금액.The plating solution according to claim 1, wherein the lanthanum mixed rare earth metal has a particle diameter of 0.1 to 2.3 mu m. 증류수로 도금조 절반을 채운후 황산니켈 5∼15g/ℓ 및 텅스텐나트륨 20∼35g/ℓ을 첨가하여 완전히 용해시킨 후, 구연산나트륨 10∼15g/ℓ 및 차인산나트륨 5∼10g/ℓ을 추가 용해한 후 입경이 0.1∼1.0㎛인 몰리브덴 25∼35g/ℓ과 입경이 0.1∼2.3㎛인 란탄계 혼합희토류 금속 0.1∼5g/ℓ과 몰리브덴 이온계면활성제0.7∼2.0g/25cc를 첨가하고, 다시 증류수로 도금조 수위까지 보충시키는 단계;After half of the plating bath is filled with distilled water, 5 to 15 g / l of nickel sulfate and 20 to 35 g / l of tungsten sodium are completely dissolved. Then, 10 to 15 g / l of sodium citrate and 5 to 10 g / l of sodium hypophosphite are further dissolved. Then, 25 to 35 g / l molybdenum having a particle size of 0.1 to 1.0 µm, 0.1 to 5 g / l of a lanthanum mixed rare earth metal having a particle size of 0.1 to 2.3 µm, and 0.7 to 2.0 g / 25 cc of molybdenum ion surfactant were added thereto, followed by distilled water. Replenishing to the bath level; 상기 도금조 온도를 85∼90℃, 용액의 pH를 9.0∼9.8로 조정하여 도금속도를 시간당 7∼10㎛두께로 피도금물체에 도금을 실시하는 단계; 및Plating the object to be plated with a plating rate of 7 to 10 μm per hour by adjusting the plating bath temperature to 85 to 90 ° C. and a pH of the solution to 9.0 to 9.8; And 상기 피도금물체의 표면처리를 하고 350∼450℃에서 약 30분이상 열처리시키는 단계를 포함하는 것을 특징으로 하는 무전해 Ni-W/Mo/란탄계 혼합희토류 금속 도금액을 이용한 도금방법.Surface treatment of the object to be plated and the plating method using an electroless Ni-W / Mo / lanthanum-based mixed rare earth metal plating solution comprising the step of heat treatment at 350 ~ 450 ℃ for more than about 30 minutes. 제5항에 있어서, 상기 피도금물체의 표면처리후의 경도가 비커스 경도계로 Hv 1,400∼1,800인 것을 특징으로 하는 도금방법.The plating method according to claim 5, wherein the hardness after the surface treatment of the plated object is Hv 1,400 to 1,800 with a Vickers hardness tester. 제5항에 있어서, 상기 피도금물체의 열처리 단계후의 경도가 비커스 경도계로 Hv 2,850∼3,200인 것을 특징으로 하는 도금방법.The plating method according to claim 5, wherein the hardness after the heat treatment step of the plated object is Hv 2,850 to 3,200 with a Vickers hardness tester.
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JPH04157169A (en) * 1990-10-17 1992-05-29 Hitachi Chem Co Ltd Electroless nickel-phosphorus plating solution
JPH0610147A (en) * 1992-06-25 1994-01-18 Hitachi Ltd Palladium activating solution
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US6273943B1 (en) * 1999-01-12 2001-08-14 C. Uyemura & Co., Ltd. Electroless composite Plating Solution and Electroless composite plating method

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JPH04157169A (en) * 1990-10-17 1992-05-29 Hitachi Chem Co Ltd Electroless nickel-phosphorus plating solution
JPH0610147A (en) * 1992-06-25 1994-01-18 Hitachi Ltd Palladium activating solution
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Publication number Priority date Publication date Assignee Title
KR101645676B1 (en) * 2015-03-24 2016-08-04 김대수 Tungsten-nickel-molybdenum alloy electroless plating solution and plating method using the same

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