KR20030012941A - Mold for molding an optical fiber connecting device and a method for fabricating the device using the same - Google Patents

Abstract

PURPOSE: A die of optical fiber coupling apparatus and method of making the optical fiber coupling apparatus using the same is provided to be capable of mass-producing with a low cost by shaping a coupling apparatus made of high molecular resin in bulk. CONSTITUTION: A V-groove die structure(400) has upper and lower dies(410,420) where a plurality of grooves(412,422) for inserting optical fibers and grooves(414,424) for inserting a guide pin are formed. A metal member(430) is placed between the upper and lower dies in order to maintain an interval between columns of grooves where the optical fibers are inserted. A fine-pin die structure has a plurality of core pins coupled with the slide core. The V-groove die structure is coupled with the fine-pin die structure so that the core pin is inserted in a plurality of grooves formed by coupling of the upper and lower dies.

Description

Mold for forming optical fiber connection device and manufacturing method of optical fiber connection device using the same {Mold for molding an optical fiber connecting device and a method for fabricating the device using the same}

The present invention relates to a mold for forming an optical fiber connection device and a method for manufacturing an optical fiber connection device using the same, and in particular, an optical fiber connection device molding mold and an optical fiber using the same to minimize the connection loss generated during the connection between the planar optical waveguide and the optical fiber. It relates to a manufacturing method of the wiring device.

Recently, the demand for and use of wavelength multi-elements and multi-channel optical interconnection parts for increasing the capacity and multi-channel of optical communication have been increasing. Accordingly, two-dimensional multi-dimensional multi-channel planar optical waveguide elements and optical fibers or large-capacity optical cables are used for connection. The use of channel optical fiber connection elements is required. In order to satisfy the service and reliability demanded by the large capacity and multi-channel of optical communication system, low-cost multi-channel connection parts are required, and it is possible to replace expensive optical connection parts made by lamination of conventional micro drilling or silicon substrate. There is a need for the development of new technologies.

Due to the large capacity and multi-channelization required in optical communication systems, the use of optical connection components is essential. In particular, planar devices such as wavelength multiplexing devices emerge as the core of the system configuration, and they are designed to realize these planar optical devices through two-dimensional integration. Development is progressing. This necessitates the use of components for the connection between planar optical elements and high density optical fibers, and lowers the price of multi-channel optical fiber connection elements in not only multi-fiber connection but also packaging, which takes up more than half the cost of optical elements. There is a need for a two-dimensional large-capacity multichannel fiber optic connection device.

In the current optical communication system, multiplexing of optical connection parts is rapidly required as multiplexing is performed in various forms from 8 channels, 16 channels, 32 channels up to 128 channels, but the existing technology can cope with the multichannel trend. Technical and economic requirements are not met.

Conventional two-dimensional multi-channel optical connector is manufactured by polymer molding, and since the 125μm optical fiber hole must be processed using a submicron level precision drill, there is no free space in the mold of the core pin during molding, so the mold operation This leads to difficulties and increases the cost of precision machining. Drilling for fiber-hole drilling requires preservation of precise pitches and diameters, and there should be no risk of breaking the core pins when the mold is engaged. Therefore, there are many difficulties in the manufacture of optical fiber holes, and an assembly process for accurate alignment of core pins, which is an important problem, must be prepared.

In addition, in the case of a two-dimensional optical connector using a substrate stack, a two-dimensional multi-channel optical connector is realized by mounting a optical fiber by processing a groove on a silicon or a polymer substrate, and stacking the substrate. An increase in cumulative error inevitably occurs, resulting in a decrease in performance. In addition, in terms of mass production, it is not easy to mass-produce according to the individual manufacturing of the device, the cost of processing is also a lot of problems.

Accordingly, an object of the present invention is to provide a mold for forming an optical fiber connection device which can solve the above-mentioned disadvantages, and a method for manufacturing the optical fiber connection device using the same.

In addition, the present invention solves the problem of high production cost of the optical connection device by the existing precision processing for economical configuration of the optical communication system, and the two-dimensional that can reduce the manufacturing cost through mass production by batch molding of polymer materials Another object is to provide a high-density multichannel fiber optic connection device.

Mold for forming the optical fiber connection device according to the present invention for achieving the above object is the upper and lower molds each formed with a plurality of grooves for the insertion of the optical fiber and the groove for the insertion of the guide pin, and the gap between the grooves into which the optical fiber is inserted It consists of a groove-shaped mold structure consisting of a metal plate material positioned between the upper and lower molds to maintain the shape, and a mold structure for fine pins having a plurality of core pins coupled to the slide core, and formed by a combination of upper and lower molds. The grooved mold structure and the fine pin mold structure are combined to insert the core pin into the groove.

In addition, the optical fiber connection device manufacturing method using a mold for forming an optical fiber connection device according to the present invention comprises the steps of manufacturing a mold structure for the fine pin having a plurality of core pins coupled to the slide core, and a plurality of grooves for the insertion of the optical fiber and A step of manufacturing a groove mold structure consisting of upper and lower dies each having grooves for inserting guide pins, and a metal plate member positioned between the upper and lower dies to maintain the gap between the grooves into which the optical fiber is inserted; Combining the groove-type mold structure and the micro-pin mold structure so that the core pins are inserted into the plurality of grooves formed by the combination of the two and then installing them in the die mold such that the binder is positioned inside the polymer mold and injecting the polymer resin into the die mold. Forming and removing the mold, the grooved mold structure and the mold structure for the microfin. Characterized in that comprises a step.

1 is a perspective view showing a coupling state between optical fibers using a connection device.

Figure 2 is a perspective view of a mold structure for a V groove according to an embodiment of the present invention.

3A and 3B are a perspective view and a front view for explaining the metal plate shown in FIG.

Figure 4 is an exploded perspective view of a mold structure for fine pins according to an embodiment of the present invention.

5 is a perspective view of the core pin shown in FIG.

6 is a coupling structure diagram of the V-groove mold structure and the mold structure for the fine pin.

7 is a process chart for explaining the manufacturing process of the optical fiber connection device according to an embodiment of the present invention.

8A and 8B are a perspective view and a front view of the two-dimensional optical fiber connection device shown in FIG.

<Explanation of symbols for the main parts of the drawings>

100: two-dimensional optical fiber polymer element 110: fine hole

120: adhesive injection portion 130: fixed portion

200: optical fiber 300: guide pin

400: V groove mold structure 410: Upper die

412: first V grooves 414 and 424: grooves

420: lower type 422: second V groove

428: groove for fixing the metal plate 430: metal plate

434: protrusion 436: recess

438: hole for fixing the metal plate 500: mold structure for the fine pin

510: core pin 512: first molding part

514: second molding portion 516: circumferential groove

520: slide core 522: fixing pinhole

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a view showing a state of coupling between optical fibers using the optical fiber connection device produced according to the present invention, the optical fiber connection connection device 100 is molded in a polymer resin, the connection device 100 in the optical fiber 200 (For example, a ribbon optical fiber) is inserted and fastened, and the alignment between the connection devices 100 is made by the guide pin 300. That is, the optical fiber 200 is inserted into the plurality of micropores 110 formed in two lines in the connection device 100, so that the two connection devices 100 are coupled and aligned by the guide pin 300. The connection between the 200 is made and the optical signal is transmitted.

The present invention provides a molding die in order to manufacture a connection device 100 having high precision and easy mass production, and enables the connection device 100 to be manufactured using a molding die.

The molding die includes a V-groove mold structure and a fine pin mold structure. Then, the mold structure for forming the connection device of the present invention will be described with reference to FIG. 2.

V-shaped mold structure 400 is composed of a metal plate 430 for maintaining the hot gap of the upper mold 410, the lower mold 420 and the optical fiber hole 110. On one side of the upper mold 410, a first V-groove 412 is formed so that the core pin located at the upper side of the two rows of core pins (not shown) can be inserted. A second V-groove 422 is formed on one side of the lower mold 420 so that the core pins positioned at the lower side of the two core pins can be inserted, and a recess 426 is formed on a portion of the core pin. On both sides of the 426, a metal plate fixing groove 428 for fixing the metal plate 430 is formed. In addition, grooves 414 and 424 are formed in the upper mold 410 and the lower mold 420 at both sides of the first and second V-grooves 412 and 422 so that the guide pin 300 can be inserted.

The metal plate 430 is formed in a plate shape having a predetermined thickness as shown in FIGS. 3A and 3B, and a protrusion 434 having a predetermined size is formed on a rear surface thereof, and the guide pin 300 is formed on one side thereof. An opening 436 is formed to coincide with the grooves 414 and 424 to be inserted. In addition, metal for inserting a fixing pin (not shown) for fixing the metal plate 430 to both sides of the protrusion 434 corresponding to the metal plate fixing groove 428 of the lower die 420. The plate fixing hole 438 is formed.

The metal plate 430 is manufactured to have a thickness of 250 μm or 500 μm so that hot gaps of the optical fiber holes 110 are maintained during molding, and the upper mold 410 and the lower mold 420 forming the V groove mold structure 400. It is manufactured to be easily mounted in between. The metal plate 430 is fastened to the lower die 420 by inserting a fixing pin into the metal plate fixing groove 428 of the lower die 420 through the metal plate fixing hole 438. In addition, by having the protrusion 434 as described above, when the lower mold 420 and the lower mold 420 are engaged, the protrusion 434 is matched with the recessed portion 426 of the lower mold 420, thereby facilitating fastening even if not completely fixed with screws.

4 is a perspective view of a mold structure for a fine pin, the micro-pin mold structure 500 is composed of a plurality of core pins 510, guide pins 300 and the slide core 520 formed in two rows.

Each of the core pins 510 is divided into a first molding part 512 and a second molding part 514, as shown in FIG. 5, and a circumferential groove 516 at one end of the second molding part 514. Is formed. A plurality of holes are formed on one surface of the slide core 520 to allow the second molding part 514 of the core pin 510 to be inserted, and two holes for the two guide pins 33 on both sides of the plurality of holes. 2 is formed, and two fixing pinholes 522 are formed on the other surface.

Therefore, when the pin is inserted through the fixing pin hole 522 in the state in which the second molding part 514 of the core pin 510 is inserted into the hole of the slide core 520, the inserted pin becomes the circumferential groove ( A core pin 510 is fixed to the slide core 520 by being inserted along the 516. The slide core 520 is used to facilitate mounting of the micro pin mold structure to the V groove mold structure 100.

The core pins 510 are arranged in two rows up and down, and are inserted into and mounted on the slide core 520. A plurality of holes formed in the slide core 520 is uniformly formed in the position or depth of insertion of the core pin 510 according to the shape of the core pin 510. In addition, the slide core 520 is processed by a multiple of 250㎛ the space in which the core pin 510 is inserted is equal to the number of pins of the core pin 510 when the core pin 510 is fastened It does not require any sorting. That is, the slide core 520 is formed with two rows of mounting holes for mounting the two rows of core pins 510, and the mounting holes have a rear end diameter of the core pins 510 having a diameter of 250 μm in a two-dimensional space. , So that the space between the left and right is maintained at about 250㎛. In addition, guide pins 300 are fixed to the left and right sides of the core pins 510 aligned in two stages, and fixing pins for fixing the core pins 510 to the side surfaces of the slide core 520. The pin pins 522 are formed in the upper and lower portions in the vertical direction to the core pin 510 axis so as to be inserted therein.

5 is a perspective view of the core pin shown in FIG. 4, wherein the core pin 510 is formed to facilitate a diameter, a molding part length, a fixing method in a V groove mold structure, a curved surface and a pitch of the guide groove.

The first molding part 512 of the core pin 510 is a part for molding the hole 110 of the connection device 100 into which the optical fiber is inserted, and the second molding part 514 is the optical fiber hole 110. In order to maintain a constant distance between the) and to easily guide the insertion of the optical fiber is formed thicker than the first molded part 512. For example, the diameter of the first molding part 512 may be processed to 126 μm, and the diameter of the second molding part 514 may be 250 (−1. + 0) μm. In addition, the core pin 510 is made of an alloy such as tungsten carbide and cobalt, and selects a physical property having a hardness of less than 100Hra and a compressive strength of about 400 to 600kgf / mm2.

Pitch precision between the core pins 510 is configured to independently complement the V-groove mold structure 400 and the core pins 510 and then independently. That is, the first and second V grooves 412 and 422 of the V groove mold structure 400 on which the core pin 510 is mounted are processed by precision grinding, and the second molding part 514 is 250 μm. By making the core pin 510 to be mounted on the mold structure 400 for the V-groove first, a rough pitch is confirmed, and then the pitch is precisely maintained by allowing the core pin 510 to be mounted on the V-groove 412 and 422.

When the upper mold 410 and the lower mold 420 are matched, the metal plate 430 is positioned between the upper mold 410 and the lower mold 420. In addition, the core pin 510 of the slide core 520 is inserted into a hole formed by matching the first V groove 412 of the upper mold 410 and the second V groove 422 of the lower mold 420. In this case, the metal plate 430 is inserted between the rows of the core pins 510 so that the rows of the holes 110 formed in the connection device 100 are independently maintained.

6 is a structural diagram of the V-shaped mold structure 400 and the fine pin mold structure 500 assembled in the die mold 700.

The upper and lower molds 410 and 420 of the V-groove mold structure 400 are fastened, and the slide core 520 of the micro-fin mold structure 500 moves in the direction in which the V-groove mold structure 400 is positioned. Core pins 510 are mounted and fixed to the first and second V grooves 412 and 422 of the upper and lower molds 410 and 420, and the guide pins 300 are the upper and lower molds 410 and 420. ) Grooves 414 and 424. Subsequently, a polymer resin is injected into an empty space in the mold 600 through a separate injection portion (not shown) formed on the side of the mold mold 700 to form a molding, and the mold 600 is open. As the slide core 520 moves in the opposite direction in which the V-groove mold structure 400 is positioned, the core pin 510 and the guide pin 300 are removed from the molding, and the process is completed.

Then, a method of manufacturing a connection device using the mold structure will be described with reference to FIG. 7.

As a step (step S10) of manufacturing the fine pin mold structure, the core pin 510 is coupled to the slide core 520 as described above. As the step (S11) of manufacturing the V groove mold structure 400, the upper mold 410, the metal plate 430 and the lower mold 420 are combined as described above.

The slide is formed by the matching of the first V groove 412 formed in the upper mold 410 of the mold structure 500 for micro-fins manufactured as described above and the second V groove 422 formed in the lower mold 420. Inserting and combining the core pins 510 of the core 520 (step S12), in which the first molding part 512 of the core pins 510 is inserted into the V-grooves 412 and 422. .

After the micro mold mold structure 500 and the V-groove mold structure 400 are installed in the die mold 700 to be positioned as described above, the polymer resin is injected into the die mold 700 to be molded. S13), at this time, while maintaining the internal temperature at 170 to 180 ℃ to cure the polymer resin is sufficiently molded for 2 minutes. As the polymer resin, a low deformation plastic (for example, epoxy) or the like having a very low thermal expansion property is used.

The upper and lower molds 410 and 420 are separated after molding, and at the same time, the slide core 520 holding the microcore pins 510 is reversed so that the core pins 510 are removed from the molded product. The wiring apparatus 100 as shown in FIG. 8 is manufactured.

The wiring device 100 formed in the above manner is made as shown in FIGS. 8A and 8B.

8A and 8B, the wiring apparatus 100 includes a guide (not shown) for guiding the optical fiber 200 to the micro-holes 110 and the optical fiber 200 to its body. An adhesive injection unit 120 for bonding, a fixing unit 130 having a jaw for fixing to a grinder jig or jig for polishing a cross section, and two rows in which the optical fiber 200 is inserted and precisely arranged at 250 μm intervals. It is composed of a plurality of fine holes 110 made up. The plurality of micropores 110 are precisely molded to have a precision of the mutual spacing and the diameter below the micron.

As described above, the present invention provides a mold structure for a fine pin including a circular two-stage core pin and a slide core on which a core pin and a guide pin are mounted, and a V-groove in which the core pin is to be formed is formed, and a hot gap between the upper and lower molds. In order to maintain the metal plate is manufactured for each mold structure for the V groove is placed. Then, the combination of the microfin mold structure and the V-groove mold structure is positioned and fixed inside the formwork, and the polymer resin is injected and molded to fabricate the optical fiber connection device.

Therefore, by using the present invention, by collectively molding the connection device made of a polymer resin using a mold structure, mass production is possible at a low cost, and a more precise product can be realized.

In addition, the present invention can be directly applied to the optical fiber devices for connecting two-dimensional integrated planar optical waveguide devices, and it is expected that multichannels such as 16 channels and 32 channels can be easily formed, and the ripple effect of other optical connection components will be great. .

Claims (14)

Grooves formed of upper and lower dies each having a plurality of grooves for inserting optical fibers and grooves for inserting guide pins, and a metal plate positioned between the upper and lower dies to maintain a gap between the grooves into which the optical fibers are inserted. Mold structures, It consists of a mold structure for fine pins having a plurality of core pins coupled to the slide core, The mold structure for forming the optical fiber connection device, characterized in that the groove-type mold structure and the micro-pin mold structure is coupled so that the core pin is inserted into a plurality of grooves formed by the coupling of the upper mold and the lower die. The method of claim 1, The core pin is composed of first and second molding parts, wherein the first molding part is formed to be inserted into a groove formed so that the optical fiber can be inserted into the upper and lower molds, and the second molding part is inserted into the optical fiber. Mold structure for molding an optical fiber connection device, characterized in that formed easier than, and thicker than the first molded part to maintain a constant interval. The method of claim 1, The diameter of the first molded part is 126㎛, the mold structure for molding the optical fiber connection device, characterized in that the diameter of the second molding portion is 250 (-1, +0) ㎛. The method of claim 2, A mold structure for forming an optical fiber connection device, characterized in that a circumferential groove is formed in the end of the second forming portion is inserted with a fixing pin for coupling the core pin and the slide core. The method of claim 1, The core pin is a mold structure for forming an optical fiber connection device, characterized in that arranged in two rows, upper and lower. The method of claim 1, The metal plate member is formed in a plate shape having a predetermined thickness, and a protrusion having a predetermined size is formed on a rear surface thereof, and an opening is formed on one side thereof to coincide with a groove into which the guide pin is inserted, and is mounted on a lower mold. Mold structure for forming optical fiber connection device. The method of claim 6, Mold structure for forming the optical fiber connection device, characterized in that the thickness of the metal plate material is 250㎛ to 500㎛. Manufacturing a mold structure for a fine pin having a plurality of core pins coupled to a slide core; Grooves formed of upper and lower dies each having a plurality of grooves for inserting optical fibers and grooves for inserting guide pins, and a metal plate positioned between the upper and lower dies to maintain a gap between the grooves into which the optical fibers are inserted. Manufacturing a mold structure, Combining the groove-type mold structure and the micro-pin mold structure such that the core pin is inserted into the plurality of grooves formed by the coupling of the upper mold and the lower mold, and then installing the formwork such that the assembly is positioned inside the mold; Injecting a polymer resin into the mold and then molding the polymer resin; Method for producing an optical fiber connection device using a mold structure, characterized in that comprises the step of removing the mold, the groove-shaped mold structure and the mold structure for the fine pin. The method of claim 8, The core pin is composed of first and second molding parts, wherein the first molding part is formed to be inserted into a groove formed so that the optical fiber can be inserted into the upper and lower molds, and the second molding part is inserted into the optical fiber. Method for manufacturing an optical fiber connection device using a mold structure, characterized in that formed to be thicker than the first molded part to facilitate. The method of claim 9, The diameter of the first molded part is 126㎛, the diameter of the second molded part is 250 (-1, + 0) ㎛ characterized in that the optical fiber connection device manufacturing method using a mold structure. The method of claim 9, Method for manufacturing an optical fiber connection device using a mold structure, characterized in that the end portion of the second forming portion is formed with a circumferential groove is inserted into the fixing pin for coupling the core pin and the slide core. The method of claim 8, The core pin is an optical fiber connection device manufacturing method using a mold structure, characterized in that arranged in two rows, upper and lower. The method of claim 8, The metal plate member is formed in a plate shape having a predetermined thickness, and a protrusion having a predetermined size is formed on a rear surface thereof, and an opening is formed on one side thereof to coincide with a groove into which the guide pin is inserted. How to make a device. The method of claim 13, The thickness of the metal sheet material is 250㎛ to 500㎛ manufacturing method of the optical fiber connection device using a mold structure, characterized in that.