KR20030005499A - Bake plate of semiconductor manufactoring system and temperature control apparatus use with the same - Google Patents

Abstract

PURPOSE: A bake plate of a silicon material and a thermal controller using the same are provided to control uniformly temperature of the bake plate by measuring temperature in cells units on a bake plate and controlling temperature of each cell of the bake plate according to the measured temperature. CONSTITUTION: A bake plate(100) is formed with a silicon material. The bake plate(100) includes a plurality of integrated cells(110). The cells(110) include a switching transistor for applying or cutting off current, a resistor connected with the transistor, and a thermal sensor for measuring temperature of the cell(110), respectively. The cells(110) of the bake plate(100) are heated by the resistor if the electric power is applied to the transistor. The IC(Integrated Circuit) can be formed by using a photo etch method of a semiconductor fabrication process.

Description

BAKE PLATE OF SEMICONDUCTOR MANUFACTORING SYSTEM AND TEMPERATURE CONTROL APPARATUS USE WITH THE SAME}

The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a baking plate of a silicon material and a temperature control apparatus using the same.

In general, a spinner system is a system for processing and transporting wafers. A spinner system is a transport robot for transporting wafers, a coater for applying a photosensitive agent onto the wafer, and an alignment and exposure. Difference between developer and developer to remove PR (Photo Resist) at a certain area by using developer to form image by separating necessary and unnecessary parts of wafer surface An exposure machine that performs a process of exposing to ultraviolet light to be transferred to the wafer, a baker to increase the adhesion of the photosensitive agent by heating and cooling the wafer coated with the photosensitive agent by the coater, and a reticle using an optical lens. It consists of various units, such as a stepper, which reduces and exposes the pattern of this pattern on a wafer.

The bake plate used in the spinner system is a convection oven type for baking a large amount of wafers in a chamber having a heating structure to cure the photosensitive film, and a hot plate for baking the photosensitive film on a hot iron plate. There is a hot plate type.

1 is a plan view and a cross-sectional view showing the configuration of a bake plate for general temperature control.

Referring to the drawings, the bake plate 2 is a hot plate type, and forms a coil 4 on the bottom to heat the plate. The temperature measuring sensor 6 is provided at the center of the baking plate. Then, by sensing the temperature of the wafer placed on the plate from the temperature measuring sensor 6, the temperature is automatically controlled using a PID type temperature control device.

Referring to FIG. 2, the temperature control device 10 using the bake plate 2 includes a reference temperature value Tem_ref and the temperature measuring sensor 16 set from the temperature control device 10 for temperature correction. A comparator 12 for comparing the measured temperature values output from the bake, a baking device 14 for heating the hot wire according to the temperature-corrected signal from the comparator 12, and a temperature measurement for sensing the temperature of the wafer placed on the plate And a feedback circuit 18 that receives the measured temperature value Tem_out fed back from the sensor 16 and the temperature measuring sensor 16 and outputs it to the comparator 12.

The baking plate 2 described above is different in shape of the arrangement of the heating wires and affects the temperature uniformity. In addition, the temperature control device 10 using the baking plate 2 described above has a problem that it is difficult to secure temperature uniformity in the plate according to the arrangement of the heating wires and the position of the sensor.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems, and to provide a bake plate integrated with silicon for maintaining temperature uniformity.

In addition, an object of the present invention is to solve the above problems, to provide a temperature control device using a baking plate integrated with silicon.

1 is a view showing a configuration of a bake plate for general temperature control;

FIG. 2 is a block diagram showing a part of a configuration of a temperature control device using the bake plate shown in FIG. 1;

3 is a view showing a configuration of a bake plate made of silicon for temperature control according to the present invention; And

4 shows a schematic configuration of each cell shown in FIG. 3; And

FIG. 5 is a block diagram illustrating a part of a temperature control apparatus using the baking plate of silicon illustrated in FIG. 3.

Explanation of symbols on the main parts of the drawings

100: bake plate 110: cell

112: temperature sensor 114: switching transistor

116: resistance for baking 120: temperature control device

122: control signal generator 124: cell integrated circuit

126: cell temperature sensor 128: feedback circuit

According to an aspect of the present invention for achieving the above object, a baking plate of a semiconductor manufacturing apparatus, comprising: a silicon material, a plurality of cells in an integrated circuit; The cells control the temperature of the bake plate, including switching means for conducting and blocking current, respectively, baking means for heating the cells, and sensor means for measuring the temperature of each of the cells.

In a preferred embodiment of this feature, the switching means is provided with a transistor.

In a preferred embodiment of this feature, the baking means is provided with a resistor connected to one end of the switching means.

According to another aspect of the present invention for achieving the above object, in a temperature control apparatus of a bake plate having a plurality of cells: for controlling the temperature of the bake plate to the respective cells by accepting a specific reference temperature value A control signal generator for outputting a control signal; A cell integrated circuit including switching means for conducting and interrupting respective currents integrated in each of the cells, and baking means for heating the cells, respectively; A sensor for measuring the temperature of each of the cells; A feedback circuit for receiving a measured temperature value fed back from the sensor and outputting the measured temperature value to the control signal generator; The control signal generation signal outputs the control signal using the specific reference temperature value and the measured measurement temperature value fed back.

(Action)

Therefore, according to the present invention, by measuring the temperature in the cell unit provided in the bake plate, by controlling the temperature of each cell of the bake plate corresponding to the measured temperature, the temperature of the bake plate is uniformly controlled.

(Example)

DETAILED DESCRIPTION Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a plan view and a cross-sectional view showing the configuration of the baking plate of the silicon material for temperature control according to the present invention.

Referring to the drawings, the novel bake plate 100 is made of a silicon material and includes a plurality of integrated cells 110. As shown in FIG. 4, each of the cells 110 includes a switching transistor 114 for conducting and blocking current, a resistor 116 connected to the transistor 114, and a temperature measuring sensor for measuring cell temperature. (112). The resistor 116 heats the cells 110 of the bake plate 100 when the transistor 114 is conductive. The integrated circuits 112 to 116 may be implemented using a photolithography technique of a semiconductor manufacturing process.

FIG. 5 is a block diagram illustrating a part of a temperature control apparatus using the baking plate made of silicon illustrated in FIG. 3.

Referring to the drawings, the temperature control device 120 using the baking plate 100 includes a control signal generator 122 for outputting a control signal for temperature control to each cell 110, and an integrated circuit, respectively. Feedback from the cell integrated circuit 124 having the elements (i.e., transistors and resistors) 114, 116, and the cell temperature sensor 126 and the cell temperature sensor 126, which measure the temperature of the cells 110, respectively. And a feedback circuit 128 that receives the measured temperature value Tem_out and outputs it to the control signal generator 122. The control signal output from the control signal generator is output to the cell integrated circuit 124 using a specific reference temperature value Tem_ref and the fed back measurement temperature value Tem_out.

Therefore, the temperature is measured in units of cells, and by controlling the temperature of each cell of the bake plate corresponding to the measured temperature, the temperature of the bake plate is uniformly controlled.

As described above, according to the present invention, the temperature is measured in units of cells included in the bake plate, and the temperature of the bake plate is uniformly controlled by controlling the temperature of each cell of the bake plate in response to the measured temperature.

Claims (4)

In the bake plate of the semiconductor manufacturing apparatus: It is provided of a silicon material, comprising a plurality of cells in an integrated circuit; The cell, Switching means for conducting and interrupting current respectively; Baking means for heating the cells, respectively; And a sensor means for measuring the temperature of each of said cells to control the temperature of said bake plate. The method of claim 1, The switching means is a baking plate of the semiconductor manufacturing apparatus, characterized in that provided with a transistor. The method of claim 1, The bake plate of the semiconductor manufacturing apparatus, characterized in that the baking means is provided with a resistor connected to one end of the switching means. In a bake plate temperature control apparatus having a plurality of cells: A control signal generator which receives a specific reference temperature value and outputs a control signal for temperature control of the bake plate to the respective cells; A cell integrated circuit including switching means for conducting and interrupting respective currents integrated in each of the cells, and baking means for heating the cells, respectively; A sensor for measuring the temperature of each of the cells; A feedback circuit for receiving a measured temperature value fed back from the sensor and outputting the measured temperature value to the control signal generator; And the control signal generation signal outputs the control signal using the specific reference temperature value and the measured measurement temperature value fed back.