KR200296685Y1 - Smart Card using PET Material Sheet - Google Patents

Abstract

The present invention relates to a smart card using a sheet of PET material which is excellent in durability and heat resistance, easy to manufacture the card and does not generate pollution in place of the sheet of PVC material conventionally used.

The smart card using the PET sheet of the present invention, the surface is treated with a surface treatment agent prepared by mixing a surfactant and an acrylic resin, and the sheet is attached to the surface of the FT sheet 100 Copper wire 102 fixed by heating to a high temperature using a polyamide resin-based adhesive, a packaged chip module 104 installed to conduct electricity with the copper wire 102, and an upper side of the PIT sheet 100 It is characterized in that it is composed of a sheet printing paper 106 which is heated to a high temperature using a polyamide resin-based adhesive.

Description

Smart Card using PET Material Sheet

The present invention relates to a smart card using a sheet of PET material which is excellent in durability and heat resistance, easy to manufacture the card and does not generate pollution in place of the sheet of PVC material conventionally used.

Semiconductor chips are widely applied to smart (IC) cards as well as computers and home appliances. In other words, it is used for electronic money by processing and storing data, so it is possible to pay for goods or services without having to carry cash.It replaces the existing magnetic card and replaces credit card, ID card, social security card, public phone Widely used for cards, electronic wallets, cash cards, etc.

1 is a perspective view of a conventional smart card 10, the general smart card 10 is a card upper sheet 11 and a chip formed on the surface of the card upper sheet 11, the letter or pattern is printed on the surface It includes a chip module 12 accommodated in the module seating groove (13). The chip module 12 includes a substrate exposed to the outside, a semiconductor chip for processing and storing data, which is mounted on a bottom surface of the substrate, a tape attached to the periphery of the semiconductor chip, and the semiconductor chip and the substrate. It includes copper wire to connect. Since the structure of the chip module 12 is known in the art, a detailed description thereof will be omitted.

2 is a card lower sheet 14 attached to the lower part of the smart card 10, the copper wire (or copper copper foil) forming a wiring pattern is attached to its surface. The wiring pattern is changed according to the purpose of use of the smart card 10. In the case of the non-contact type, the copper wire performs the loop type wireless antenna function, and in the case of the contact type, it is used to perform the connection terminal function. The card upper sheet 11 and the card lower sheet 14 are combined using an adhesive or a tape to form one smart card 10.

The manufacturing method of the smart card 10 as described above is as follows with reference to the flowchart of FIG. First, a PVC sheet (card lower sheet) having a suitable size and thickness is produced. A copper wire is prepared by purchasing copper wire on the PVC sheet prepared as described above, printing a conductive paste resin, or bonding copper copper foil to PVC, followed by corrosion (etching).

After the production of copper wire is completed, pre-packaged IC chip module is assembled, and PVC printing paper (card upper sheet) is laminated on the PVC sheet. At this time, a tape or adhesive is applied between the PVC sheet and the PVC printing paper. The smart card 10 is manufactured by bonding a PVC sheet and PVC printing paper by pressing using a press or the like in a laminated state. The manufacturing of the smart card 10 is completed by cutting the finished PVC sheet according to the card standard (55m / m X 85m / m).

The conventional smart card 10 as described above has a problem in that durability and heat resistance are weak because it is manufactured using a sheet of PVC material. In addition, since the expansion coefficient of PVC is large when the card is manufactured, poorly bonded products are frequently generated, and old or broken PVC cards have a problem that pollution occurs because toxic gas is generated when incinerated.

The present invention is to solve the above problems, the object of the present invention is a smart card using a PET sheet that is excellent in durability and heat resistance, easy to manufacture the card, and does not cause pollution in place of the sheet of PVC material conventionally used To provide.

1 is an external perspective view of a conventional smart card,

Figure 2 is a perspective view of the lower sheet attached to the back of the smart card of Figure 1,

3 is a flowchart illustrating a manufacturing method of a conventional smart card;

4 is a flowchart illustrating a smart card manufacturing method according to the present invention,

Figure 5a-5e is a schematic diagram showing a smart card manufacturing method according to the present invention.

※ Explanation of symbols about main part of drawing ※

10: Smart Card 11: Card Top Sheet

12: chip module 13: chip module seating groove

14: Lower card 15: Copper wire

100: PET sheet 102: copper wire

104: chip module 106: PET printing paper

108: chip module seating groove 110: nozzle

112: surface treatment agent 114: reactor

116: heater

Smart card using a PET sheet to achieve the above object, the surface is treated with a surface treatment agent prepared by mixing a surfactant and an acrylic resin and adhered to the surface of the FT sheet 100 Copper wire 102 is fixed by heating to a high temperature using a polyamide resin-based adhesive, a packaged chip module 104 is installed so as to conduct electricity to the copper wire 102, and the top of the PIT sheet 100 It is characterized by consisting of a sheet printing paper 106 which is heated to a high temperature by using a polyamide resin-based adhesive on the side.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The present invention is a smart card manufactured by using a PVC (Poly Ethylene Terephthalate) with excellent durability and heat resistance, a low coefficient of expansion, and no toxic gas during incineration.

4 is a flowchart illustrating a process of manufacturing a smart card of the present invention. First, prepare a PET sheet having a suitable size and thickness (S1).

As described above, a surface treatment for cleaning is performed in a prepared PET sheet (S2). The surface treatment process is a pre-stop operation for removing foreign matter on the PET sheet and also for attaching copper wire (copper foil or nano paste). The surface treatment agent used in the surface treatment process is prepared by mixing a certain ratio of the surfactant and acrylic resin. The mixing ratio of the surfactant and the acrylic resin may be changed depending on the PET sheet to be surface treated. The surface treatment agent has solvent solvent property.

Surface treatment of the PET sheet using the surface treating agent may be performed manually or by using a nozzle for spraying the surface treating agent at a constant speed. The surface treatment agent sprayed through the nozzle is inclined to position the PET sheet to flow in a natural state. When the surface treatment is completed, the PET sheet is dried. When the drying process is completed, an acrylic resin layer is formed on the surface of the PET sheet.

An example for surface treatment of the PET sheet 100 is shown in FIG. 5A. As shown, the surface of the PET sheet 100 is applied to the surface treatment agent 112 at a constant speed by using the nozzle 110 to wash and adhere the acrylic resin. Instead of the high-speed spraying using the nozzle 110, it is also possible to surface-treat by hand by wiping a cloth with a surface treating agent.

After the surface treatment of the PET sheet as described above, copper copper foil for wiring is attached to the surface of the PET sheet using a polyamide resin adhesive (S3). 5B illustrates a state in which the copper copper foil 102 is attached to the surface of the PET sheet 100. It can be seen that the copper copper foil is attached to form a loop type wireless antenna. However, it is obvious that not only the loop wireless antenna but also a connection terminal capable of transmitting an electric signal can be configured. In addition, although not shown in detail, an adhesive is attached to the lower side surface of the copper copper foil 102.

In this state of attachment, the PET sheet and the copper copper foil are not completely bonded, so they are put in a reactor and heated for a predetermined time. The heating temperature in the reactor is 80 to 100 ° C, preferably 90 ° C. The heating time is about 10 to 14 hours, preferably about 12 hours of heating. By the heating reaction in the reactor as described above, the polyamide resin adhesive is modified into a thermosetting (hot melt) resin.

FIG. 5C illustrates a state of the PET sheet 100 accommodated in the reactor 114 and heated. The PET sheet 100 is heated by the heat supplied by the heater 116 located at the bottom, and thus the polyamide resin adhesive is thermoset.

Through the above steps (S1-S3), the manufacture of the embedded wireless antenna module used in the smart card is completed. Built-in wireless antenna configured as described above can be combined with the sheet of the conventional PVC material.

Instead of forming a built-in loop wireless antenna using copper copper foil in step S3, copper wire may be formed using nanopaste (S3a). Since the nano paste contains a conductive material, printing on the surface of the PET sheet using the nano paste can obtain conductivity such as copper copper foil. Nanopaste uses silver paste or copper paste. Nanopaste adheres well because the PET sheet is already surface treated and the acrylic resin component is attached to the surface.

Alternatively, instead of the nano paste, a coil, that is, a copper wire is embedded to form an embedded loop wireless antenna (S3b). The embedding method of the coil may be performed using the same method as the conventional method. Due to the surface treatment effect at the time of coil embedding, it does not move well due to the resistance due to the adhesion of acrylic resin after embedding, thus having a stable fixing effect.

As described above, the chip module is mounted as shown in FIG. 5D so as to conduct electricity with the wiring of the sheet on which the wireless antenna is formed on the surface (S4). After the chip module is mounted, the PET printing paper to be located on the upper side of the PET sheet is bonded using an adhesive (S5). The adhesive applied to the PET sheet and the adhesion surface (the upper surface of the PET sheet and the back surface of the PET printing paper) of the PET printing paper is preferably the same as that used in the step (S3) as a polyamide resin adhesive. Moreover, in order to improve adhesiveness, it is also possible to process using the surface treating agent on the back surface of PET printing paper. Application of the surface treating agent may be performed in the same manner as in step S2.

5E is a state diagram of separation immediately before coupling. In this state, the PET sheet 100 and the PET printing paper 106 are in close contact with each other, and the chip module 104 is exposed to the outside through the chip module seating groove 108. Adhesive is applied to each of the surfaces to be in close contact with each other.

As described above, since the adhesive is applied to the PET sheet and the PET printing paper and is not completely adhered, the PET sheet and PET printing paper are put into the reactor and heated for a predetermined time.

The heating temperature in the reactor is 80 to 100 ° C, preferably 90 ° C. The heating time is about 10 to 14 hours, preferably about 12 hours of heating. By the heating reaction in the reactor as described above, the polyamide resin adhesive is modified into a thermosetting (hot melt) resin. The manufacturing of the smart card 10 is completed by cutting the PET sheets, which have been manufactured, to the card standard (55m / m X 85m / m).

The present invention provides a smart card that is excellent in durability and heat resistance, easy to manufacture the card, and does not cause pollution.

Claims (5)

The surface is attached to the surface of the PIT sheet 100 treated with a surface treatment agent prepared by mixing a surfactant and an acrylic resin, and heated to a high temperature using a polyamide resin-based adhesive Fixed copper wire 102, the packaged chip module 104 is installed so as to energize the copper wire 102, and heated to a high temperature using a polyamide resin-based adhesive on the upper side of the FT sheet 100 Smart card using a piti sheet, characterized in that composed of a tight-fitting printing paper 106. The method of claim 1, Smart card using a Piti sheet, characterized in that the copper wire is formed by printing the nano paste containing a conductive material on the surface of the PET sheet instead of the copper wire (102). The method of claim 2, Smart card using a Piti sheet, characterized in that the nano paste is silver paste or copper paste. The method of claim 1, Smart card using a FT sheet, characterized in that to form a copper wire by embedding the coil instead of the copper wire (102). The method of claim 1, Smart card using a FT sheet, characterized in that the heating of the polyamide resin adhesive is heated for 10 to 14 hours at a temperature of 80 ~ 100 ℃ in the reactor.