KR200235805Y1 - Packing structure of integrated circuit chip - Google Patents

Abstract

The present invention relates to an integrated circuit chip package. The integrated circuit chip package according to the present invention includes a loading part, a chip, an adhesive material, a cover, and a spacer, the loading part includes an upper surface and a lower surface, and a plurality of solder parts are disposed on the upper surface, and the chip is a loading part. It is fixedly mounted on the upper surface and includes a plurality of solder portions, each of which is connected to the solder portions on the load portion through a plurality of solder wires, and an adhesive material is applied around the upper portion of the load portion, and the spacer is connected to the load portion and the cover. The cover is isolated from the outside by allowing the cover to cover the top surface of the load while maintaining a constant distance.

Description

Integrated Circuit Chip Package {PACKING STRUCTURE OF INTEGRATED CIRCUIT CHIP}

The present invention relates to an integrated circuit chip package, and more particularly to a small integrated circuit chip package structure.

1 shows an integrated circuit chip package 10 according to the prior art. The chip package 10 mainly includes a loading part 11, a chip 12, and a lid 13, and the loading part 11 includes a storage compartment 14 having an opening facing upward, and storing A predetermined number of solder portions 16 having a predetermined shape are disposed under the seal 14, and the chips 12 are attached to the central position of the lower portion of the containment chamber 14 and the solder portions are provided through the solder wires 17. It is electrically connected to the (16), the cover 13 covers the opening of the mounting portion 11 to isolate the chip 12 from the outside, so that the chip 12 is broken by the impact from the outside or contaminated by foreign matter The cover 13 is made of a transparent material when the chip 12 is an image chip. 2 illustrates another integrated circuit chip package 20 according to the related art, and a structure thereof is similar to the package 10 described above, and thus a detailed description thereof will be omitted.

In the package 10, the bottom portion of the compartment 14 must be capable of accommodating the chip 12 and the solder portions 16 of the mounting portion 11, and the chip 12 and the enclosure 14. The space between the wall arrangers must be provided between the walls, and the overall volume of the package is inevitably increased because the area under the compartment 14 must be much larger than the area of the chip. Therefore, these packages do not meet the needs of light weight, ultra thin and small size for modern electronic products.

In addition, since the loading part 11 of the package 10 is generally made of a printed circuit board made of a material such as reinforced plastic or ceramics, it is necessary to make a concave compartment for accommodating chips through improvement of the processing process, and thus the overall manufacturing process This complexity is disadvantageous.

The present invention has been made to solve such a problem, and an object thereof is to provide an integrated circuit chip package with a significantly reduced overall volume.

Yet another object of the present invention is to provide an integrated circuit chip package with a simple structure and easy manufacture and assembly.

An integrated circuit chip package according to the present invention for achieving the above object includes an upper surface and a lower surface, the upper surface includes a mounting portion and a plurality of solder portions disposed on the upper surface and attached to the upper surface of the loading portion At least one chip, a plurality of solder wires electrically connecting the solder portion of the load and the solder portion on the chip, the adhesive material applied around the upper surface of the load, the lid, the lid and the lid being connected to each other so And a spacer to cover the top surface of the stack while retaining.

In order to better understand the actual structure and features of the subject innovation will be described in detail with reference to the following examples.

1 is a typical integrated circuit chip package,

2 is another conventional integrated circuit chip package,

3 is a perspective view of a first embodiment according to the present invention,

4 is a cross-sectional view taken along line 4-4 of FIG. 3;

5 is a front view of a first embodiment according to the present invention,

6 is a cross-sectional view of a second embodiment according to the present invention,

7 is a cross-sectional view of a third embodiment according to the present invention,

8 is a cross-sectional view of a fourth embodiment according to the present invention,

9 is a cross-sectional view of a fifth embodiment according to the present invention,

10 is a cross-sectional view of a sixth embodiment according to the present invention,

11 is a cross-sectional view of a seventh embodiment according to the present invention.

<Description of the symbols for the main parts of the drawings>

First embodiment

30. Package 31. Loaded section 31a. Upper surface

31b. Lower surface 31c. Solder part 32. Chip

32b. Solder section 33. Solder wire 34. Adhesive material

35. Cover 35a. Top face 35b. Bottom

36. Spacer 36a. 4 position fixing column 37.

37a. Through hole

Second embodiment

40. Package 42. Positioning column 44. Loading section

44a. Positioning holes 46. cover

Third embodiment

50. Package 52. Load 52a. Positioning holes

54. Position Fixed Column

Fourth embodiment

60.Package 61.Load 62.Chip

63. Solder wire 64. Adhesive material 65. Cover

65a. Upper surface 65b. Bottom surface 65d. Through hole

65e. Lens 66. Spacer 66a. frame

66b. Top 65c. Bottom 67. Connecting device

67a. Through hole 67b. Solder ball

Fifth Embodiment

70.Package 71.Load 72.Chip

73. Solder wire 74. Adhesive material 75. Cover

75a. Upper surface 75b. Bottom surface 75c. Screw holes

75d. Lens 75f. Barrel 75 g. lens

76. Spacer 76a. Frame 76b. Top

76c. Bottom 76d. Recess 77.

77a. Lead 77b. One end of the lead 77c. The other end of the lead

Sixth embodiment

80. Package 81. Load 82. Chip

83. Solder wire 84. Adhesive material 85. Cover

86. Spacer 86a. Bottom 86b. Recess

87. Connection devices 87a. Lead 87b. One end of the lead

87c. The other end of the lead

Seventh embodiment

90. Package 91. Loading 91a. Electronic parts

92. Chip 93. Solder wire 94. Adhesive material

95. Cover 96. Spacer 97. Attachment

3 to 5, the integrated circuit chip package 30 according to the first exemplary embodiment of the present invention may include a mounting part 31, a chip 32, a plurality of solder wires 33, and an adhesive material ( 34), lid 35, spacer 36 and connecting device 37.

The loading part 31 is a printed circuit board (PCB) made of a material such as plastic glass fiber reinforced plastic or ceramics, and includes an upper surface and a lower surface, and a plurality of solders are formed around the upper surface 31a. The payment part 31c is arrange | positioned.

The chip 32 is attached to the central portion of the upper surface 31a of the loading portion 31, and the surface of the chip 32 includes a plurality of solder portions 32b.

Each solder wire 33 is made of a material such as gold or aluminum, and one end is connected to the solder portion 32b on the chip 32 by a line arranger (not shown). One end is connected to the solder part 31c on the mounting part 31.

The adhesive material 34 may be made of a material such as silicone, epoxy, acrylic, polyamide, low melting glass or double-sided tape, and the adhesive material 34 is disposed on the upper surface 31a of the loading part 31 so that each solder may be used. The line 33 and the mounting portion 31 cover and protect the portion where the solder portion 31c is connected.

The lid 35 is a plate member made of a material such as opaque plastic, metal or transparent glass and plastic, and includes an upper surface 35a and a lower surface 35b.

The main function of the spacer 36 is to connect the loading portion 31 and the lid 35 so that the lid 35 covers the upper surface 31a of the loading portion 31 at a certain distance. In the present embodiment, the spacer 36 includes four positioning pillars 36a, one end of each positioning pillar 36a is integrally connected to the four corners of the lower surface 35b of the cover 35. The other end of each of the position fixing pillars 36a is connected to the upper surface 31a of the loading part 31 so that the circumference of the lower surface 35b of the cover 35 and the adhesive material 34 attach to the chip 32. It isolates the outside and the outside, and prevents the chip 32 from being damaged or contaminated by foreign matter due to the impact from the outside.

The main function of the connecting device 37 is to electrically connect the solder portion 31c on the mounting portion with the outside. In the present embodiment, the connecting device 37 is disposed around the loading part 31 and passes through the solder part 31c and the lower part 31b of the loading part 31 of the upper surface 31a of the loading part 31. Through hole 37a, whereby the package 30 is electrically connected to an external circuit board (not shown) through soldering.

Through such a structure, an open space is formed around the upper surface 31a of the integrated circuit chip package 30 and the stacking unit 31 so that the line arranger can move freely and the stacking unit 31 has the maximum area. Since the size is reduced to approximate the area of the chip 32, the overall volume of the package 30 is significantly reduced, thereby achieving the purpose of chip size packaging. In addition, since the loading unit 31 may use a conventional printed circuit board, no separate processing is required, and thus the overall structure is simple and assembly is more simple.

As shown in FIG. 6, the structure of the integrated circuit chip package 40 according to the second embodiment of the present invention is largely similar to the previous embodiment. The only difference is:

One end of the position fixing column 42 of the spacer device is fitted into the concave position fixing hole 44a of the upper surface of the mounting portion 44 so as to cover the lid 46 on the mounting portion 44 stably.

As shown in FIG. 7, the structure of the integrated circuit chip package 50 according to the third embodiment of the present invention is largely similar to the above embodiment. The only difference is:

The mounting portion 52 is provided with a position fixing hole 52a that penetrates the upper and lower surfaces of the mounting portion 52, and one end of the position fixing column 54 of the spacer device has a position fixing hole 52a. It penetrates and protrudes on the lower surface of the mounting portion 52 to become a position fixing point when installing the package 50 to an external printed circuit board.

As shown in FIG. 8, the integrated circuit chip package 60 according to the fourth embodiment of the present invention mainly includes a mounting portion 61, an imaging chip 62, a plurality of solder wires 63, and an adhesive material ( 64, cover 65, spacer 66, and connecting device 67. The difference between this embodiment and another embodiment is as follows.

The lid 65 includes an upper surface 65a, a lower surface 65b, and a through hole 65d penetrating through the upper surface 65a and the lower surface 65b, and the through hole 65d includes a plurality of lenses ( 65e is provided, and light rays are irradiated onto the chip 62 through the lens 65e.

The spacer 66 is also a frame 66a, the top 66b is connected to the bottom surface 65b of the cover 65 and the bottom 65c of the frame 66a is connected to and fixed with the adhesive material 64. do.

In this embodiment, the connecting device 67 electrically connects the upper surface solder portion of the loading portion 61 and the plurality of through holes 67a (through holes) of the lower surface of the loading portion 61, and the loading portion 61. And a plurality of solder balls 67b disposed on the bottom surface and electrically connected to the respective through holes 67a.

As shown in FIG. 9, the integrated circuit chip package 70 according to the fifth embodiment of the present invention mainly includes a loading unit 71, an imaging chip 72, a plurality of solder wires 73, and an adhesive material ( 74, a cover 75, a spacer 76 and a connecting device 77. The difference between this embodiment and another embodiment is as follows.

The lid 75 includes a screw hole 75c and a lens 75d penetrating the upper surface 75a and the lower surface 75b. The lens 75d includes a barrel 75f and a lens 75g provided in the barrel 75f, and the barrel 75f is screwed with the screw hole 75c. Also described here, the lens 75d is connected to the screw hole 75c by a screwing method so that the distance (focal length) between the lens 75d and the chip 72 can be conveniently adjusted, but other fixing methods may be employed. Can be.

In addition, in the present embodiment, the spacer 76 is a frame 76a, the top 76b is connected to the lower surface 75b of the cover 75, and the bottom 76c is connected to the upper surface of the loading part 71. The frame 76a includes a recess 76d capable of storing the adhesive material 74 at a position adjacent to the mounting portion 71.

In addition, in the present embodiment, the connection device 77 includes a plurality of metal leads 77a, one end 77b of each lead 77a is electrically connected to the solder portion of the upper surface of the loading portion 71, and the other One end 77c is located outside the mounting portion 71 and is curved in a predetermined form.

As shown in FIG. 10, the integrated circuit chip package 80 according to the sixth embodiment of the present invention mainly includes a mounting portion 81, an imaging chip 82, a plurality of solder wires 83, and an adhesive material ( 84), lid 85, spacer 86 and connecting device 87. The difference between this embodiment and another embodiment is as follows.

In the present embodiment, the connecting device 87 includes a plurality of metal leads 87a, and one end 87b of each lead 87a is attached to the upper surface of the loading part 81 and positioned around each chip 82. One end 87b of each lead 87a includes a solder portion (not shown), and is connected to the solder wire 83 through the solder portion, and the other end 87c of the lead 87a is placed on the mounting portion 81. ) It is located outside and is curved in a certain shape.

The lower end 86a of the spacer 86 is also connected to one end 87b of the lead, and the lower end 86a includes a recess 86b for receiving the adhesive material 84.

As shown in FIG. 11, the integrated circuit chip package 90 according to the seventh exemplary embodiment of the present invention mainly includes a mounting part 91, an imaging chip 92, a plurality of solder wires 93, and an adhesive material ( 94, cover 95, spacer 96 and connecting device 97. The difference between this embodiment and another embodiment is as follows.

A plurality of electronic components 91a are disposed on an upper surface of the stacking portion 91, and each of the electronic components 91a is electrically connected to a solder portion (not shown) on the upper surface of the stacking portion 91 so as to provide a package 90. ) Is used as a module with certain functions.

As described above, the integrated circuit chip package according to the present invention has the advantages of small volume and simple structure, the present invention is equipped with practicality and progress.

Claims (19)

A loading part including an upper surface and a lower surface, the plurality of soldering parts being disposed on the upper surface; At least one chip including a plurality of solder portions and attached to an upper surface of the loading portion; A plurality of solder wires electrically connecting the solder portion on the mounting portion and the solder portion on the chip; An adhesive material applied around the upper surface of the loading portion; cover; And A spacer that connects the loading portion and the lid and causes the lid to cover an upper surface of the loading portion while maintaining a constant distance Integrated circuit chip package comprising a. The method of claim 1, When the adhesive material is applied around the upper surface of the mounting portion, the integrated circuit chip package, characterized in that to cover and protect the solder wire and the portion where the solder portion of the upper surface of the loading portion is connected. The method of claim 1, And wherein the cover is attached to the adhesive material. The method of claim 1, The spacer device includes at least one position fixing pillar that is sandwiched between the mounting portion and the cover fixed. The method of claim 4, wherein At least one positioning hole is formed in the upper surface of the loading portion in a concave shape, and one end of the positioning column is fitted into the positioning hole to be fixed. The method of claim 4, wherein At least one or more position fixing holes penetrating the upper and lower surfaces of the loading portion are installed in the loading portion, and one end of the positioning pillar protrudes from the lower surface of the loading portion through the positioning hole. Integrated circuit chip package, characterized in that. The method of claim 1, The spacer device comprises a frame fitted between the mounting portion and the cover is fixed to the integrated circuit chip package. The method of claim 7, wherein And the frame includes a recess for receiving an adhesive material at a position adjacent to the stacking portion. The method of claim 1, The cover is an integrated circuit chip package, characterized in that made of a transparent material. The method of claim 1, And the cover includes a through hole corresponding to a position where the chip is located and having at least one lens installed therein. The method of claim 1, The cover includes a screw hole and a barrel penetrating the upper surface and the lower surface of the cover and installed in the barrel, and the barrel includes a lens screwed with the screw hole. Integrated circuit chip package, characterized in that. The method of claim 1, And the stacking portion is made of one of plastic, reinforced plastic, glass fiber or ceramics. The method of claim 1, Said adhesive material being made of one of silicon, epoxy, acrylic, polyamide or glass. The method of claim 1, And said adhesive material is a double sided tape. The method of claim 1, A plurality of electronic components are disposed on the upper surface of the mounting portion, the integrated circuit chip package, characterized in that electrically connected to the solder portion located on the upper surface of the loading portion. The method of claim 1, And a connection device for electrically connecting the solder portion on the stack and the outside of the stack. The method of claim 16, And the connection device is arranged around the loading part and comprises a plurality of through holes penetrating from the loading part upper surface solder part to the loading part bottom surface. The method of claim 16, The connecting device includes a plurality of through holes and solder balls, each through hole electrically connecting the solder portion of the upper portion of the loading portion and the lower portion of the loading portion, wherein each of the solder balls is disposed on the lower portion of the loading portion. And electrically connected to each of the through holes. The method of claim 16, The connecting device is a plurality of metal leads, one end of each lead is electrically connected to the solder portion located on the upper surface of the loading portion, the other end is located outside the loading portion and is curved in a constant shape Integrated circuit chip package.