KR200210751Y1 - The structure for assembling a circuit board of controller - Google Patents

Abstract

Provided is a circuit board assembly structure of a controller having a function of firmly assembling two or more layers of an electric circuit board and absorbing deformation due to electrical action, vibration prevention, and expansion and contraction.

A plurality of layers of circuit boards are provided, and the plurality of buffer leads 13 are erected so as to connect and support the upper and lower circuit boards together with the plurality of studs 14, respectively.

Description

STRUCTURE FOR ASSEMBLING A CIRCUIT BOARD OF CONTROLLER

The present invention relates to a circuit board assembly structure of a controller, and in particular, a controller having a function capable of firmly supporting a multi-electric circuit board of two or more layers and absorbing deformation due to electrical action, vibration prevention, and expansion contraction. It relates to a circuit board assembly structure of.

In this regard, with the advance of science and technology, the design of electrical circuits is also becoming more precise and complicated day by day, and when installed on the circuit board, the volume of the circuit board is inevitably increased. Therefore, in order to overcome the drawback of increasing the electrical product by the volume of the circuit board under the tendency that the miniaturization of the electrical product is emphasized along with the improvement of the way of environmental conservation, the circuit board is multilayered when the circuit is installed on the circuit board. In order to achieve the necessary function by reducing the volume of the circuit board efficiently according to the design of the configuration.

However, in order to maintain the two-layer circuit board at an appropriate distance (height), a common circuit, for example, a brushless controller of a brushless controller in an electric bicycle, is usually simply fastened with studs and locked at both ends with screws. Significant stability can be achieved, which is more robust and reliable, but the method of maintaining the spacing distance through the connection of the studs only serves as a spacer and does not make any contribution to the electrical circuit. However, many connectors are used in the external line of the controller, which makes the connection complicated and error-prone, and during the use, the contacts of the circuit become loose due to shaking during use in situations where expansion contraction or vibration is likely to occur due to temperature changes. Or a contact resistance occurs.

In view of the above problems, the present invention provides a circuit board assembly structure of a controller having a function capable of rigidly assembling two or more electrical circuit boards and absorbing deformation due to electrical action, vibration prevention and expansion and contraction. For the purpose of

In order to achieve the above object, the circuit board assembly structure of the controller of the present invention has a plurality of layers of circuit boards, and a plurality of buffer leads are configured to stand up and support the upper and lower circuit boards, respectively, with a plurality of studs. .

Further, a curved portion is formed in the intermediate portion of the buffer lead, the buffer lead is connected to and supported by two or more layers of circuit boards, or both circuit boards, the control module and the power module are connected by a buffer lead, or the buffer It is still more preferable if the lead is made of a metallic material.

According to the present invention configured as described above, a plurality of buffering leads having curved portions are connected to each other between the upper and lower circuit boards with a plurality of studs, respectively, so that the amount of deformation due to positioning, vibration prevention, and thermal cooling may be absorbed. It is possible to maintain the distance distance (height) of both the upper and lower circuit boards more firmly without generating contact resistance, and to have numerous actions including electrical connection and the like.

1 is an assembled state stereoscopic view of a relatively preferred embodiment in the present invention,

2 is a perspective view of FIG.

Explanation of symbols for the main parts of the drawings

10 brushless motor controller 11 control module

12 power module 13 buffer lead

131 curved portion 14 stud

141: screw 142: washer

Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited only to this example.

As shown in Figure 1 and 2, a relatively preferred embodiment of the circuit board assembly structure of the controller of the present invention,

The brushless motor controller 10 includes a control module 11 and a power module 12, and a plurality of buffer leads 13 and a plurality of buffer leads between the control module 11 and the power module 12. The stud 14 of is connected.

The buffer lead 13 is made of a metal material, and is connected to the signal terminal P or the ground terminal G between the upper and lower circuit boards of the control module 11 and the power module 12. The buffer lead 13 is arrange | positioned in an upright shape, and the curved part 131 is provided in the intermediate part.

The stud 14 is connected to and supported on the ground terminal G between the upper and lower circuit boards of both the control module 11 and the power module 12, and is disposed in an upright shape. The washer 142 is provided by a screw 141. ) Is fixed by placing screws.

As mentioned above, although the characteristic structure of each of the comparative examples of this invention, and each relevant installation site were outlined, the use state is described as follows.

1 and 2 show the use of an assembly of a relatively preferred embodiment of the circuit board assembly structure of the controller according to the present invention. First, both the upper and lower circuits of the control module 11 and the power module 12 are used. When connecting the substrate, the lower end of the buffer lead 13 having the curved portion 131 is welded and fixed to the signal terminal P or the ground terminal G of the power module 12, and the stud 14 is positioned at a predetermined position. Accordingly welded and fixed to the ground terminal G of a suitable site, and then the control module 11 is mounted on the power module 12 above, and the upper end of the buffer lead 13 is connected to the signal terminal P of the control module 11. ) Or to the ground terminal G, and the control module 11 is screwed to the top of the stud 14 by using the screws 141 and the washer 142, thus brushless motor controller ( 10) the upper and lower circuit boards of both the control module 11 and the power module 12 in FIG. Complete the lip. As a result, the stud 14, the buffer lead 13, and the curved portion 131 not only have the function of absorbing the deformation amount due to the support hypothesis, positioning, vibration prevention, and thermal cooling and compression, but also control. The distance distance (height) of the module 11 and the power module 12 can be firmly maintained, and there are multiple functions including the electrical connection by the installation of the buffer lead 13 and the like.

Further, in a comparatively preferred embodiment of the present invention, the brushless motor controller 10 merely provides a bilayer circuit board of the control module 11 and the power module 12, but the buffer lead 13 Although it is possible to operate with two or more circuit boards (for example, three layers, four layers, etc.) from the configuration in which the temporary support of the studs 14 is assembled, the more cities are not drawn here.

As described above, the present invention provides a firm and reliable support action from the combination of the installation of the buffer lead and its curved portion and the conventional support hypothesis of the stud, and each circuit board (i.e., the control module of the brushless motor) And a power supply module) capable of absorbing deformation due to excellent positioning, vibration prevention, and thermal cooling, and at the same time, the buffer lead is hypothesized on the signal and ground terminals of the control module and the power module. Since it has the double effect of electrical connection, it is widely used for various multilayer circuit boards and is convenient to use.

Claims (5)

A circuit board assembly structure of a controller having a plurality of layers of circuit boards, wherein a plurality of buffer leads are erected to connect and support the upper and lower circuit boards together with a plurality of studs, respectively. The method of claim 1, Formed by forming a bent portion at an intermediate portion of the buffer lead. Circuit board assembly structure of the controller. The method of claim 1, The buffer lead is formed by connecting and supporting two or more circuit boards. Circuit board assembly structure of the controller. The method according to any one of claims 1 to 3, The circuit board, the control module, and the power module are connected by a buffer lead. Circuit board assembly structure of the controller. The method of claim 1, The buffer lead is made of a metal material Circuit board assembly structure of the controller.