KR20020066627A - Handler blade of robot for transfering wafer - Google Patents

Handler blade of robot for transfering wafer Download PDF

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Publication number
KR20020066627A
KR20020066627A KR1020010006907A KR20010006907A KR20020066627A KR 20020066627 A KR20020066627 A KR 20020066627A KR 1020010006907 A KR1020010006907 A KR 1020010006907A KR 20010006907 A KR20010006907 A KR 20010006907A KR 20020066627 A KR20020066627 A KR 20020066627A
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South Korea
Prior art keywords
wafer
blade
handler
robot
braid
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KR1020010006907A
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Korean (ko)
Inventor
황종모
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삼성전자 주식회사
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Priority to KR1020010006907A priority Critical patent/KR20020066627A/en
Publication of KR20020066627A publication Critical patent/KR20020066627A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A handler blade of a robot is provided to prevent a wafer drop or a broken wafer by normally correcting a deviated wafer mounted on the handler blade through a sliding along a slant surface. CONSTITUTION: A handler blade(30) of a robot comprises a fixing part(24) and a wafer mounting part(20) for mounting a wafer(22). At this point, the fixing part(24) has a slant surface having a defined slope at the connection portion between the fixing part(24) and the wafer mounting part(20). At this point, the slant surface of the fixing part(24) corrects a deviated wafer so as to stably mount at the wafer mounting part(20) through a sliding along the slope of the surface, thereby restraining a wafer drop or a broken wafer.

Description

웨이퍼 이송용 로봇의 핸들러 브레이드{HANDLER BLADE OF ROBOT FOR TRANSFERING WAFER}HANDLER BLADE OF ROBOT FOR TRANSFERING WAFER}

본 발명은 웨이퍼 이송로봇의 핸들러 브레이드에 관한 것으로, 특히 웨이퍼핸들러에서 웨이퍼를 언로딩할 시 슬라이드에 의해 웨이퍼가 틀어지지 않도록 하는 핸들러 브레이드에 관한 것이다.The present invention relates to a handler braid of a wafer transfer robot, and more particularly to a handler braid to prevent the wafer from being twisted by the slide when unloading the wafer in the wafer handler.

일반적으로 반도체 웨이퍼 핸들러는 이송 로봇 전체의 어셈블리(ASSEMBLAY)의 업/다운을 시켜주는 리드(LEAD)부위 및 웨이퍼를 들고 언로딩을 하는 브레이드와 이를 동작하게 구성하는 로테이션(RATATION)/익스텐드(EXTEND), 리트랙트(RETRACT)/업,다운(UP, DOWN)의 동작을 위한 기어 및 각 모터로 구성되어 있으며, 또한 이를 각 스텝 움직임에 맞게 동작시키는 모터구동부를 구비하고 있다. 이러한 핸들러의 브레이드에 의한 로딩동작은 브레이드를 카세트로 삽입하여 웨이퍼를 슬롯에 끼우고 하강하므로서 웨이퍼가 슬롯에 놓여져 탑재하는 것이고, 언로딩동작은 브레이드를 카세트로 삽입하여 슬롯에 탑재된 웨이퍼를 약간 들어올려 브레이드에 웨이퍼가 탑재되도록 하는 것이다.In general, the semiconductor wafer handler has a lead part that raises and lowers the assembly of the entire transfer robot, a braid for lifting and unloading the wafer, and a rotation / extension for operating the same. ), Gears for the operation of RETRACT / UP, DOWN, and each motor, and a motor driving part for operating the motor according to each step movement. The loading operation by the blade of the handler is to insert the blade into the cassette, insert the wafer into the slot, and lower the wafer into the slot, and the unloading operation inserts the blade into the cassette and slightly lifts the wafer loaded into the slot. The wafer is placed on the braid.

도 1은 일반적인 쳄버내에 웨이퍼가 탑재되는 상태를 나타낸 평면도이고,1 is a plan view showing a state in which a wafer is mounted in a general chamber,

도 2는 언로딩 시 정상적으로 웨이퍼가 탑재된 브레이드의 측면도이며,Figure 2 is a side view of the blade is normally mounted on the wafer during unloading,

도 3은 언로딩 시 비정상적으로 웨이퍼가 탑재된 브레이드의 측면도이다.Figure 3 is a side view of the blade mounted abnormally wafer during unloading.

로봇(10)은 웨이퍼(14)를 로딩 또는 언로딩되도록 제어한다. 브레이드(12)는 고정부(16)가 직각으로 형성되어 있으며, 로봇(10)의 제어에 의해 언로딩 시 웨이퍼를 탑재하게 된다. 이때 웨이퍼가 도 2와 같이 정상적으로 탑재되어 로봇(10)의 제어에 의해 브레이드(12)가 웨이퍼를 쳄버에서 들고나올 때 드롭이나 브로큰(BROKEN)이 발생하지 않는다. 그러나 브레이드(12)가 웨이퍼를 언로딩할 시 쳄버내에서 웨이퍼가 슬라이딩에 의해 도 3과 같이 비정상적으로 탑재되면 브레이드(12)가 웨이퍼를 쳄버에서 들고나올 때 드롭이나 브로큰이 발생한다.The robot 10 controls the wafer 14 to be loaded or unloaded. The braid 12 has a fixed portion 16 formed at right angles, and the wafer is mounted upon unloading under the control of the robot 10. At this time, as the wafer is normally mounted as shown in FIG. 2, when the braid 12 lifts the wafer out of the chamber under the control of the robot 10, no dropping or breaking occurs. However, if the blade 12 is abnormally mounted as shown in FIG. 3 by sliding in the chamber when the blade 12 unloads the wafer, drop or broken occurs when the blade 12 lifts the wafer out of the chamber.

상기와 같은 종래의 로봇의 브레이드(12)는 고정부(16)가 직각으로 형성되어 언로딩 시 슬라이딩에 의해 웨이퍼가 고정부위로 올라타는 경우 웨이퍼가 추락하거나 웨이퍼의 손상이 발생되는 문제가 있었다.The blade 12 of the conventional robot has a problem in that the fixing portion 16 is formed at right angles and the wafer falls or the damage of the wafer occurs when the wafer rises to the fixing portion by sliding during unloading.

따라서 본 발명의 목적은 상기와 같은 문제를 해결하기 위해 이송로봇이 웨이퍼를 언로딩할 때 쳄버내의 예상치 못한 슬라이딩에 의해서 웨이퍼 탑재불량을 방지할 수 있는 핸들러 브레이드를 제공함에 있다.Accordingly, an object of the present invention is to provide a handler blade that can prevent wafer loading failure due to unexpected sliding in the chamber when the transfer robot unloads the wafer to solve the above problem.

도 1은 일반적인 쳄버내에 웨이퍼가 탑재되는 상태를 나타낸 평면도1 is a plan view showing a state in which a wafer is mounted in a typical chamber

도 2는 언로딩 시 정상적으로 웨이퍼가 탑재된 브레이드의 측면도Figure 2 is a side view of the blade is normally mounted on the wafer during unloading

도 3은 언로딩 시 비정상적으로 웨이퍼가 탑재된 브레이드의 측면도3 is a side view of an abnormally wafer mounted blade during unloading

도 4는 본 발명의 실시예에 따른 언로딩 시 웨이퍼를 탑재하기 위한 브레이드의 측면 구성도4 is a side configuration diagram of a braid for mounting a wafer during unloading according to an embodiment of the present invention;

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

20: 웨이퍼 탑재부 22: 웨이퍼20: wafer mounting portion 22: wafer

24: 고정부 30: 브레이드24: fixed portion 30: braid

상기 목적을 달성하기 위한 본 발명의 웨이퍼 이송용 로봇의 핸들러 브레이드에 있어서, 상기 핸들러 브레이드는 고정부와 웨이퍼 탑재부로 형성되어 있으며, 상기 고정부는 웨이퍼가 탑재되는 방향에 소정각도 경사를 갖도록 형성하는 것을 특징으로 한다.In the handler braid of the wafer transfer robot of the present invention for achieving the above object, the handler blade is formed of a fixed portion and a wafer mounting portion, wherein the fixed portion is formed to have a predetermined angle inclined in the direction in which the wafer is mounted. It features.

이하 본 발명에 따른 바람직한 실시 예를 첨부한 도면을 참조하여 상세히 설명한다. 그리고 본 발명을 설명함에 있어서, 관련된 공지 기능 혹은 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우 그 상세한 설명을 생략한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

도 4는 본 발명의 실시예에 따른 언로딩 시 웨이퍼를 탑재하기 위한 브레이드의 측면 구성도이다.4 is a side configuration diagram of a braid for mounting a wafer during unloading according to an embodiment of the present invention.

핸들러 브레이드(30)는 고정부(24)와 웨이퍼 탑재부(20)로 형성되어 있으며, 상기 고정부(24)는 웨이퍼(22)가 탑재되는 방향에 소정각도 경사를 갖도록 형성하고, 상기 웨이퍼 탑재부(20)는 언로딩할 때 웨이퍼(22)를 탑재하도록 한다. 브레이드(30)의 웨이퍼 탑재부(20)는 기존에 18cm로 웨이퍼가 브레이드(30)의 웨이퍼 탑재부(20)에 놓이면 거의 마진이 남지 았았으나, 본 발명에서는 웨이퍼 탑재부(20)의 길이를 20cm로 마진이 남게 약간 길게 제작하였다.The handler blade 30 is formed of the fixing part 24 and the wafer mounting part 20, and the fixing part 24 is formed to have a predetermined angle inclination in the direction in which the wafer 22 is mounted, and the wafer mounting part ( 20 allows the wafer 22 to be mounted upon unloading. The wafer mounting portion 20 of the braid 30 has a margin of almost 18 cm when the wafer is placed on the wafer mounting portion 20 of the braid 30. However, in the present invention, the length of the wafer mounting portion 20 is 20 cm. This left slightly longer.

로봇은 웨이퍼(22)를 로딩 또는 언로딩되도록 제어한다. 이때 브레이드(30)는 고정부(24)가 소정각도 경사지도록 형성되어 있으며, 로봇의 제어에 의해 언로딩 시 웨이퍼(22)를 웨이퍼 탑재부(20)에 탑재하게 된다. 그런데 쳄버내에서 예상하지 않은 이상동작이 발생하면 웨이퍼(22)가 도 2와 같은 상태로 브레이드(30)의 웨이퍼 탑재부(20)에 탑재된다. 이때 브레이드(30)의 고정부(24)는 소정각도 경사지도록 형성되어 있어 탑재되는 웨이퍼(22)가 경사면을 따라 슬라이딩 되도록 하여 웨이퍼 탑재부(20)에 안정되게 탑재되도록 한다. 따라서 쳄버내에서 언로딩할 때 이상동작으로 웨이퍼가 틀어져 탑재되더라도 슬라이딩에 의해 웨이퍼 탑재부(20)에 웨이퍼(22)가 정상적으로 탑재되므로 드롭이나 브로큰이 발생하지 않게된다.The robot controls the wafer 22 to be loaded or unloaded. At this time, the braid 30 is formed such that the fixing part 24 is inclined at a predetermined angle, and the wafer 22 is mounted on the wafer mounting part 20 during unloading under the control of the robot. However, when an unexpected abnormal operation occurs in the chamber, the wafer 22 is mounted on the wafer mounting portion 20 of the braid 30 in a state as shown in FIG. 2. At this time, the fixing portion 24 of the braid 30 is formed to be inclined at a predetermined angle so that the wafer 22 to be mounted slides along the inclined surface so as to be stably mounted on the wafer mounting portion 20. Therefore, even when the wafer is mounted in an abnormal operation when the wafer is unloaded, the wafer 22 is normally mounted on the wafer mounting unit 20 by sliding so that no dropping or breaking occurs.

상술한 바와 같이 본 발명은 쳄버내에 진행되는 웨이퍼가 예상치 못한 이상동작으로 웨이퍼가 틀어져 핸들러 브레이드에 탑재되는 경우 틀어진 웨이퍼가 브레이드 고정부의 경사면을 따라 슬라이딩되어 정상적으로 핸들러 브레이드에 웨이퍼가 탑재되므로 쳄버내의 이상동작으로 인해 언로딩 시 웨이퍼의 드롭이나 브로큰 발생을 방지할 수 있는 이점이 있다.As described above, according to the present invention, when the wafer is moved into the handler blade due to an unexpected abnormal operation and the wafer is mounted on the handler blade, the broken wafer slides along the inclined surface of the blade fixing part so that the wafer is normally mounted on the handler blade. Operation has the advantage of preventing the wafer from dropping or breaking during unloading.

Claims (2)

웨이퍼 이송용 로봇의 핸들러 브레이드에 있어서,In the handler braid of the wafer transfer robot, 상기 핸들러 브레이드는 고정부와 웨이퍼 탑재부로 형성되어 있으며, 상기 고정부는 웨이퍼가 탑재되는 방향에 소정각도 경사를 갖도록 형성하는 것을 특징으로 하는 웨이퍼 이송용 로봇의 핸들러 브레이드.The handler braid is formed of a fixing portion and a wafer mounting portion, wherein the fixing portion handler blade of the wafer transfer robot, characterized in that formed to have a predetermined angle inclined in the direction in which the wafer is mounted. 제1항에 있어서,The method of claim 1, 상기 고정부의 경사는 쳄버내의 이상동작으로 인해 상기 웨이퍼가 상기 웨이퍼 탑재부에 틀어져 탑재될 시 상기 웨이퍼가 브레이드의 웨이퍼 탑재부에 정상적으로 탑재되도록 하기 위해 슬라이딩되도록 하는 것을 특징으로 웨이퍼 이송용 로봇의 핸들러 브레이드.The inclination of the fixed part is a handler blade of the robot for transporting the wafer, characterized in that the wafer is slid to be normally mounted on the wafer mounting portion of the blade when the wafer is mounted in the wafer mounting portion due to abnormal operation in the chamber.
KR1020010006907A 2001-02-13 2001-02-13 Handler blade of robot for transfering wafer KR20020066627A (en)

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