KR20020036145A - Assembling apparatus for an IC card - Google Patents

Abstract

PURPOSE: An IC card assembly facilities is provided to apply pressure uniformly when a base card is adhered to a chip-on-board. CONSTITUTION: An IC card assembly facilities comprises an upper housing(30) including an upper block(32), a rod(34) and a spring(36), and a lower housing(140) including a lower block(142), a rod(144) and a spring(146). A chip-on-board(20) and a base card(10) to be assembled are arranged between the upper block(32) and the lower block(142). The upper block(32) and the lower block(142) are connected to the ends of the rods(34,144), respectively, and the rods(34,144) are inserted into the springs(36,146), respectively. The lower block(142) is connected to a mechanical buffer as the spring(146) so as to move up/down and to left/right. The lower block(142) and the rod(144) are spaced from the lower housing(140).

Description

Assembling apparatus for an IC card

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card assembling facility, and more particularly to an IC card assembling facility which compresses a chip on board onto a base card in order to assemble an IC card.

With the trend of higher density and miniaturization of electronic devices, a new packaging method for directly mounting a semiconductor chip onto a printed circuit board has been attracting attention by omitting the process of mounting a semiconductor chip package using a lead frame and then mounting the printed circuit board. have. Such a semiconductor chip is directly mounted on a printed circuit board is called a chip on board (COB). IC cards using chip-on-board (COB) with built-in flash memory chips, such as smart media or solid state floppy disc cards (SSFDCs), are smaller in size and smaller than conventional memory cards. They have the same pin count, which means they are highly scalable and easy to carry. The IC card is completed by combining a chip on board (COB) including a semiconductor chip with a standardized base card or card body having a storage space for mounting the chip on board (COB).

1 is a perspective view showing a typical IC card, Figure 2 is a schematic diagram showing the state of assembling the IC card using the IC card assembly equipment according to the prior art.

1 and 2, the IC card 10 is formed by assembling the base card 11 and the chip on board 20. Accordingly, the base body 11 is formed with an adhesive part 12 to which the chip on board 20 is attached and a cavity 13 into which the molding part 24 of the chip on board 20 is inserted. The chip on board 20 uses a printed circuit board 30, and a semiconductor chip (not shown) is directly bonded to the printed circuit board 30 by an adhesive (not shown). An adhesive tape (not shown) is interposed between the base card 10 and the chip on board 20, and is bonded in a thermocompression bonding manner by an assembly facility. Detailed description of the bonding process is as follows.

The chip on board 20 and the base card 10 to be assembled are placed between the upper block 32 and the lower block 40 of the assembly facility. The upper block 32 is connected to the end of the rod 34, and the rod 34 is inserted into the spring 36. A housing 30 surrounds the upper block 32, the rod 34, and the spring 36. The lower block 40 is fixed below the upper block 32. When the housing 30 moves downward, and the base card 10 and the chip on board 20 are heated and compressed by the upper block 32 and the lower block 40, the base card 10 and the chip on board 20 ) Is bonded. However, since the lower block 40 is fixed, if the upper block 32 or / and the lower block 40 cannot be level, the pressure is uniformly applied to the base card 10 and the chip on board 20. Not authorized Therefore, incomplete adhesion at a portion of the applied pressure may be incomplete peeling phenomenon may occur between the bonded base card 10 and the chip on the board (20).

Therefore, an object of the present invention is to apply pressure uniformly when adhering a base card and a chip on board.

1 is a perspective view showing a general IC card.

Figure 2 is a cross-sectional view showing a state of assembling the IC card using the IC card assembly equipment according to the prior art.

3 is a cross-sectional view showing the assembly of the IC card using the IC card assembling equipment according to an embodiment of the present invention.

4 is a partial cross-sectional view showing a state in which the IC card assembling equipment crimping the IC card according to an embodiment of the present invention.

Description of the main parts of the drawing

140; A housing 142; Lower block

146; Spring 144; rod

In order to achieve the above object, an embodiment of the present invention provides an IC card assembling facility comprising an upper block and a lower block, wherein the lower block is supported by an elastic member having a predetermined elasticity. to provide.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like numbers refer to like elements throughout.

Figure 3 is a schematic diagram showing the assembly of the IC card using the IC card assembling equipment according to an embodiment of the present invention.

1 and 3, the assembly facility includes an upper housing 32 in which an upper block 32, a rod 34, and a spring 36 are embedded, a lower block 142, a rod 144, and a spring 146. It is composed of a built-in lower housing 140. The chip on board 20 and the base card 10 to be assembled are placed between the upper block 32 and the lower block 140. The upper block 32 and the lower block 142 are connected to the ends of the rods 34 and 144 respectively, and each rod 34 and 144 is inserted into the springs 36 and 146.

Unlike conventional assembly equipment, the lower block 142 of the present invention is coupled to an elastic member, for example, a mechanical buffer such as a spring 142, and thus can be moved up, down, left and right without being fixed. At this time, in order to allow the lower block 142 to move freely horizontally within a predetermined range, the lower block 142 and the rod 144 are spaced apart from the lower housing 140 by a predetermined distance. When comparing the upper housing 30 and the lower housing 140 in Figure 3, the lower block 142 and the lower housing 140, the portion of the rod 144 is inserted into the upper block 32 and the rod 34 It can be seen that it is wider than the portion of the upper housing 30 to be inserted. The IC card assembly process is completed by moving the upper housing 30 downward to compress the base card 10 and the chip on board 20.

Figure 4 is a schematic diagram showing a state in which the IC card assembling equipment crimping the IC card according to the present invention.

Referring to FIGS. 1 and 4, when the upper housing 30 (FIG. 3) is lowered, the upper block 32 and the lower block 142 may be formed by the elasticity of the spring (36 in FIG. 3 and 146 in FIG. 4). 10) and the chip on board 20 is compressed. In this case, since the lower block 142 and the rod 144 are not fixed to the lower housing 140, even when the upper block 32 is inclined without being horizontal, the lower block 142 corresponds to the upper block. By inclining at the same angle as 32, pressure is uniformly applied to the base card 10 and the chip on board 20. As shown in FIG.

Since the angle at which the upper block 32 is inclined is limited by the upper housing 30 (FIG. 3), the distance at which the lower block 142 and the rod 144 are spaced apart from the lower housing 140 is tilted at the upper block 32. It is determined by considering the possible angle. In addition, the elasticity of the spring 146 is determined to maintain more than the minimum pressure necessary to compress the base card 10 and the chip on board 20.

Therefore, according to the present invention, since a uniform pressure is applied when adhering the base card and the chip on board, the peeling phenomenon can be prevented from occurring in the assembled IC card.

Claims (3)

In the IC card assembly facility comprising an upper block and a lower block, And the lower block is supported by an elastic member having a predetermined elasticity. The IC card assembling apparatus according to claim 1, wherein the elastic member is made of a spring. The IC card assembling apparatus according to claim 2, wherein the IC card assembling apparatus further comprises a housing, wherein the housing surrounds the lower block and the spring.