KR20020035961A - Temperature Control Equipment of Power Amplitude Within Mobile Station Using the Electronic Cooling Device - Google Patents

Temperature Control Equipment of Power Amplitude Within Mobile Station Using the Electronic Cooling Device Download PDF

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Publication number
KR20020035961A
KR20020035961A KR1020000065789A KR20000065789A KR20020035961A KR 20020035961 A KR20020035961 A KR 20020035961A KR 1020000065789 A KR1020000065789 A KR 1020000065789A KR 20000065789 A KR20000065789 A KR 20000065789A KR 20020035961 A KR20020035961 A KR 20020035961A
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South Korea
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power amplifier
electronic cooling
electric power
communication terminal
mobile communication
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KR1020000065789A
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Korean (ko)
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류무철
서윤민
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송문섭
주식회사 큐리텔
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Priority to KR1020000065789A priority Critical patent/KR20020035961A/en
Publication of KR20020035961A publication Critical patent/KR20020035961A/en

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/30—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/04—Circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F2200/00—Indexing scheme relating to amplifiers
    • H03F2200/447—Indexing scheme relating to amplifiers the amplifier being protected to temperature influence
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/04—Circuits
    • H04B2001/0408—Circuits with power amplifiers
    • H04B2001/0416—Circuits with power amplifiers having gain or transmission power control

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Amplifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE: A device for controlling a temperature of a power amplifier in a mobile communication terminal using an electronic cooling element is provided to secure the stability of a transmitted electric power output by attaching an electronic cooling element which is a thermoelectric semiconductor using a peltier and a seeback effect on an electric power amplifier of a mobile communication terminal and absorbing a heat being generated in the electric power amplifier during a telephone call, thereby compensating an output characteristic of the electric power amplifier. CONSTITUTION: An electric power amplifier(11) amplifies an electric power of an RF signal mounted in a PCB(Printed Circuit Board) of an RF transmission unit of a mobile communication terminal and inputted as a predetermined level. An electronic cooling element(12) is attached to the upper end surface of the electric power amplifier(11), absorbs a heat being generated in the electric power amplifier(11), and maintains a temperature of the electric power amplifier(11) fixedly. A direct current power source unit(13) supplies a predetermined power source by connecting an anode to an N-type semiconductor portion of the electronic cooling element(12) and connecting a cathode to a P-type semiconductor portion thereof. The electronic cooling element(12) attaches the P-type semiconductor portion on the upper end surface of the electric power amplifier(11). The direct current power source unit(13) supplies a constant voltage power source of small ripple.

Description

전자냉각소자를 이용한 이동통신단말기 내 전력증폭기의 온도제어장치 {Temperature Control Equipment of Power Amplitude Within Mobile Station Using the Electronic Cooling Device}Temperature control device of power amplifier in mobile communication terminal using electronic cooling device {Temperature Control Equipment of Power Amplitude Within Mobile Station Using the Electronic Cooling Device}

본 발명은 전자냉각소자를 이용한 이동통신단말기 내 전력증폭기의 온도제어장치에 관한 것으로, 특히 이동통신단말기의 전력증폭기에 열전반도체인 전자냉각소자를 부착하여 전력증폭기 자체의 온도를 일정하게 유지시켜줌으로써 안정된 송신전력의 출력을 보장할 수 있도록 한 전자냉각소자를 이용한 이동통신단말기 내 전력증폭기의 온도제어장치에 관한 것이다.The present invention relates to a temperature control device of a power amplifier in a mobile communication terminal using an electronic cooling device. In particular, by attaching an electronic cooling device, which is a thermoelectric semiconductor, to a power amplifier of a mobile communication terminal by maintaining a constant temperature of the power amplifier itself. The present invention relates to a temperature control device of a power amplifier in a mobile communication terminal using an electronic cooling element capable of guaranteeing a stable output of transmission power.

일반적으로, 이동통신단말기의 RF 송신부는 도 1에 도시된 바와 같이, 입력되는 RF 신호를 일정레벨 전력 증폭하는 전력증폭기(1)와, 상기 전력증폭기(1)에 의해 증폭된 RF 신호를 송신방향으로 흐르게 하는 아이솔레이터(Isolator)(2)와, 상기 아이솔레이터(2)를 통해 흐르는 RF 신호를 안테나(Ant)를 통해 송신하는 듀플렉서(Duplexer)(3)를 포함하여 구성된다.In general, the RF transmitter of the mobile communication terminal transmits an RF signal amplified by the power amplifier 1 and a power amplifier 1 for a predetermined level power amplification of the input RF signal. And an duplexer (3) for transmitting the RF signal flowing through the isolator (2) through the antenna (Ant).

상기 구성에서와 같이 종래 이동통신단말기의 RF 송신부는 상기 전력증폭기(1)를 구비하여 RF 신호의 전력을 증폭함으로써 송신전력의 출력특성을 만족시키고자 한다.As described above, the RF transmitter of the conventional mobile communication terminal includes the power amplifier 1 to amplify the power of the RF signal to satisfy the output characteristics of the transmit power.

여기서 전력증폭기(1)는 저전압과 저전류로 비교적 높은 전력을 출력해야 하기 때문에 효율이 좋은 증폭기를 사용해야 한다.In this case, since the power amplifier 1 must output relatively high power with low voltage and low current, an efficient amplifier must be used.

그러나, 상기와 같이 저전압으로 높은 전력을 출력하다보면 전압증폭기(1)에서 많은 열이 발생하게 되고, 이 발생된 열에 의해 전력증폭기(1)의 효율이 저하되는 문제점이 있었다.However, when outputting high power at a low voltage as described above, a large amount of heat is generated in the voltage amplifier 1, and the heat amplifier has a problem in that the efficiency of the power amplifier 1 is lowered.

특히, 전계의 강도가 약한 약전계 지역에서 통화할 때 미약한 신호를 증폭시키기 위해 전력증폭기(1)의 출력을 높일 경우에는 더욱 열이 많이 발생하고, 이 발생된 열이 이동통신단말기에서 발생하는 열의 대부분을 차지함에 따라 오랫동안 통화 시 이동통신단말기가 뜨거워지는 원인이 된다.In particular, when the power amplifier 1 increases its power to amplify a weak signal when talking in a weak electric field where the strength of the electric field is weak, more heat is generated, and the generated heat is generated in the mobile communication terminal. As it takes up most of the heat, it causes the mobile communication terminal to heat up for a long time.

이때, 이동통신단말기가 열에 약한 특성을 가진 많은 반도체 부품으로 구성되어 있어 상기와 같이 전력증폭기에서 발생되는 열에 의해 뜨거워지면 성능과 특성이 열화되어 100% 기본 성능을 발휘할 수 없게 된다.At this time, the mobile communication terminal is composed of a large number of semiconductor components having a weak characteristic of heat, when the heat is generated by the heat generated in the power amplifier as described above, the performance and characteristics deteriorate, so that 100% of the basic performance can not be exhibited.

이에 따라, 종래에는 상기와 같은 문제점을 해결하기 위해 이동통신단말기 내 온도센서에서 검출된 후 A/D(Analog to Digital) 변환된 온도데이터를 기준으로 전력증폭기의 이득을 제어하여 열에 의해 효율이 저하된 전력증폭기가 동일한 전력을 지속적으로 출력할 수 있도록 전력증폭의 출력특성을 보상하였다.Accordingly, conventionally, in order to solve the above problems, the efficiency of the power amplifier is controlled by controlling the gain of the power amplifier based on temperature data detected by the temperature sensor in the mobile communication terminal and then converted to A / D (Analog to Digital). The power amplifier compensates for the output characteristics so that the same power can be output continuously.

그러나, 싱기와 같은 종래 온도데이터를 기준으로 하는 출력특성 보상방법의 경우, 온도데이터를 기준으로 전력증폭기의 이득을 증가시키게 되면 소모전류가 늘어나게 되고, 계속적인 전류소모는 다시 더 많은 열의 발생을 유도하게 되는 등, 이러한 악순환이 되풀이 됨에 따라 이동통신단말기 내 주위 소자에도 악영향을 미쳐 이동통신단말기의 전체 온도특성이 저하되어 통화품질 및 이동통신단말기의 전체 성능이 저하되는 문제점이 있었다.However, in the case of the output characteristic compensation method based on the conventional temperature data such as the singer, increasing the gain of the power amplifier based on the temperature data increases the current consumption, and continuous current consumption induces more heat again. As such a vicious cycle is repeated, the peripheral devices in the mobile communication terminal adversely affect the overall temperature characteristics of the mobile communication terminal, thereby degrading the call quality and the overall performance of the mobile communication terminal.

본 발명은 상기와 같은 문제점을 해결하기 위한 것으로서, 그 목적은 이동통신단말기의 전력증폭기에 펠티어(Peltier) 및 제어백(Seeback) 효과를 이용한 열전반도체인 전자냉각소자를 부착하여 통화 시 전력증폭기에서 발생되는 열을 흡수함으로써 전력증폭기의 출력특성을 보상하여 송신전력 출력의 안정성을 보장할 수 있고, 이에 따라 이동통신단말기의 성능저하를 방지할 수 있도록 한 전자냉각소자를 이용한 이동통신단말기 내 전력증폭기의 온도제어장치를 제공하는 데에 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to attach an electronic cooling device, which is a thermoelectric semiconductor using a Peltier and a control back, to a power amplifier of a mobile communication terminal in a power amplifier during a call. By absorbing the generated heat, it is possible to ensure the stability of the transmission power output by compensating the output characteristics of the power amplifier. Accordingly, the power amplifier in the mobile communication terminal using the electronic cooling element to prevent the performance degradation of the mobile communication terminal. To provide a temperature control device of.

도 1은 일반적인 이동통신단말기의 RF 송신부의 블록 구성도,1 is a block diagram of an RF transmitter of a general mobile communication terminal;

도 2의 (가)는 일반적인 열전반도체의 펠티어 효과를 설명하기 위한 구성도이고, (나)는 제어백 효과를 설명하기 위한 구성도,2 (a) is a block diagram for explaining the Peltier effect of a general thermoelectric semiconductor, (b) is a block diagram for explaining the control back effect,

도 3은 본 발명에 의한 전자냉각소자를 이용한 이동통신단말기 내 전력증폭기의 온도제어장치를 보인 구성도.3 is a block diagram showing a temperature control apparatus of a power amplifier in a mobile communication terminal using an electronic cooling device according to the present invention.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

11 : 전력증폭기 12 : 전자냉각소자11: power amplifier 12: electronic cooling element

13 : 직류전원부13: DC power supply

상기와 같은 목적을 달성하기 위한 본 발명의 전자냉각소자를 이용한 이동통신단말기 내 전력증폭기의 온도제어장치는, RF 신호를 일정레벨 전력 증폭하는 전력증폭기와, 상기 전력증폭기 상단면에 부착되어, 전력증폭기에서 발생하는 열을 흡수하여 증폭기 자체의 온도를 일정하게 유지시키는 전자냉각소자와, 상기 전자냉각소자의 n형 반도체 부분에는 양극을, p형 반도체 부분에는 음극을 각각 연결하여 소정의 동작전원을 공급하는 직류 전원부로 구성되는 것을 특징으로 한다.The temperature control device of the power amplifier in the mobile communication terminal using the electronic cooling device of the present invention for achieving the above object, a power amplifier for amplifying a predetermined level power RF signal, and is attached to the power amplifier upper surface, The electronic cooling element absorbs heat generated from the amplifier to maintain a constant temperature of the amplifier itself, and connects a positive electrode to an n-type semiconductor portion and a negative electrode to a p-type semiconductor portion to provide a predetermined operating power source. It is characterized by consisting of a DC power supply to supply.

이하, 첨부된 도면을 참고하여 본 발명에 의한 전자냉각소자를 이용한 이동통신단말기 내 전력증폭기의 온도제어장치의 구성 및 동작을 설명한다.Hereinafter, with reference to the accompanying drawings will be described the configuration and operation of the temperature control device of the power amplifier in the mobile communication terminal using the electronic cooling device according to the present invention.

본 발명에서는 이동통신단말기 내 전력증폭기에서 발생하는 열을 흡수하기 위해 펠티어 및 제어백 효과를 이용한 열전반도체인 전자냉각소자를 사용한다.In the present invention, in order to absorb heat generated from the power amplifier in the mobile communication terminal, an electronic cooling device, which is a thermoelectric semiconductor using a Peltier and control back effect, is used.

즉, 도2의 (가)는 일반적인 열전반도체의 펠티어 효과를 보인 구성도로서, 상기 펠티어 효과는 열전반도체의 n형 반도체(4) 부분과 p형 반도체(5) 부분에 직류전원부(6)를 통한 소정의 직류전류를 인가하면 음극으로 대전된 p형 반도체(5) 부분에서는 주위로부터 열에너지를 흡수한 전자가 열전반도체 내부로 이동하여 흡열이 일어나고, 양극으로 대전된 n형 반도체(4) 부분에서는 전자의 열에너지 방출에 의하여 발열이 일어나는 현상을 말한다.That is, FIG. 2A is a configuration diagram showing the Peltier effect of a general thermoelectric semiconductor. The Peltier effect is a DC power supply unit 6 connected to an n-type semiconductor 4 portion and a p-type semiconductor portion 5 of the thermoelectric semiconductor. When a predetermined direct current is applied, the p-type semiconductor (5) portion charged by the cathode moves electrons absorbing thermal energy from the surroundings to the inside of the thermoelectric semiconductor, resulting in endothermization, and in the n-type semiconductor portion (4) charged by the anode It refers to a phenomenon in which heat is generated by the release of heat energy of electrons.

그리고, 도2의 (나)는 열전반도체의 제어백 효과를 보인 구성도로서, 상기 제어백 효과는 펠티어 효과의 역현상으로, 열전반도체의 n형 반도체(7) 부분과 p형 반도체(8) 부분으로 연결된 회로 양단에 일정한 온도차를 유지하면 열에너지를 포함한 전자의 이동으로 인하여 접점간에 전위차가 생겨서 기전력(9)이 발생하는 현상을 말한다.FIG. 2B is a block diagram showing the control back effect of the thermoelectric semiconductor. The control back effect is an inverse phenomenon of the Peltier effect. The n-type semiconductor 7 and the p-type semiconductor 8 of the thermoelectric semiconductor are shown in FIG. If a constant temperature difference is maintained at both ends of a circuit connected to parts, an electromotive force 9 is generated due to a potential difference between the contacts due to the movement of electrons including thermal energy.

도 3은 본 발명의 전자냉각소자를 이용한 이동통신단말기 내 전력증폭기의 온도제어장치를 보인 구성도로서, 이동통신단말기의 RF 송신부의 PCB(Printed Circuit Board)에 실장되어 입력되는 RF 신호를 일정레벨 전력 증폭하는 전력증폭기(11)와, 상기 전력증폭기(11)의 상단면에 부착되어, 전력증폭기(11)에서 발생하는 열을 흡수하여 전력증폭기(11) 자체의 온도를 일정하게 유지시키는 열전반도체인 전자냉각소자(12)와, 상기 전자냉각소자(12)의 n형 반도체 부분에는 양극을, p형 반도체 부분에는 음극을 각각 연결하여 소정의 동작전원을 공급하는 직류전원부(13)로 구성된다.3 is a block diagram showing a temperature control device of a power amplifier in a mobile communication terminal using the electronic cooling device of the present invention. The RF signal mounted on the PCB (Printed Circuit Board) of the RF communication unit of the mobile communication terminal has a predetermined level. It is attached to the power amplifier 11 for power amplification, and the upper surface of the power amplifier 11, the heat conduction semiconductor absorbs heat generated by the power amplifier 11 to maintain a constant temperature of the power amplifier 11 itself Phosphorus electron cooling element 12 and a direct current power source unit 13 for supplying a predetermined operating power supply by connecting an anode to an n-type semiconductor portion of the electron cooling element 12 and a cathode to a p-type semiconductor portion, respectively. .

상기 전자냉각소자(12)는 펠티어 및 제어백 효과를 이용한 열전반도체로서, 흡열이 일어나는 p형 반도체 부분을 상기 전력증폭기(11)의 상단면에 부착한다.The electronic cooling device 12 is a thermoelectric semiconductor using a Peltier and control back effect, and attaches a p-type semiconductor portion in which endotherm occurs to the top surface of the power amplifier 11.

상기 직류전원부(13)는 리플(Ripple)이 작은 정전압 전원을 공급한다.The DC power supply unit 13 supplies a constant voltage power with a small ripple.

상기와 같이 구성된 전자냉각소자를 이용한 이동통신단말기 내 전력증폭기의 온도제어장치의 동작을 설명한다.The operation of the temperature control device of the power amplifier in the mobile communication terminal using the electronic cooling device configured as described above will be described.

먼저, 이동통신단말기를 사용하여 통화를 수행하는 경우, 상기 전력증폭기(11)는 입력되는 RF 신호를 일정레벨 출력함으로써 안정된 출력특성을 만족하도록 한다.First, when making a call using a mobile communication terminal, the power amplifier 11 outputs a predetermined level of the input RF signal to satisfy a stable output characteristic.

이때, 약전계에서 통화가 이루어질 때 또는 전력증폭기(11)의 출력을 높이게 되면 상기 전력증폭기(11)는 전류소모를 늘여 이득을 증가시킴으로써 동일한 전력을 출력하게 된다.At this time, when a call is made in the weak electric field or when the output of the power amplifier 11 is increased, the power amplifier 11 outputs the same power by increasing the current consumption to increase the gain.

상기와 같이 전력증폭기(11)의 과다한 전류소모로 인하여 전력증폭기(11)에서는 많은 열이 발생하게 된다.As described above, a large amount of heat is generated in the power amplifier 11 due to excessive current consumption of the power amplifier 11.

그러면 상기 전력증폭기(11)의 상단면에 부착된 전자냉각소자(12)가 직류전원부(13)에서 공급되는 리플이 작은 정전압 전원에 따라 동작하여 상기 전력증폭기(11)에서 발생되는 열을 흡수한다.Then, the electronic cooling element 12 attached to the upper surface of the power amplifier 11 operates according to the constant ripple power supply with a small ripple supplied from the DC power supply unit 13 to absorb the heat generated by the power amplifier 11. .

즉, 음극으로 대전되는 열전반도체의 p형 반도체 부분에서 흡열이 일어나 상기 전력증폭기(11)에서 발생되는 열을 흡수하는 것이다.That is, endothermic occurs in the p-type semiconductor portion of the thermoelectric semiconductor that is charged to the cathode to absorb heat generated by the power amplifier 11.

이에 따라 상기 전력증폭기(11) 자체의 온도를 일정하게 유지할 수 있어 안정된 송신전력의 출력을 보장할 수 있다.Accordingly, the temperature of the power amplifier 11 itself can be maintained at a constant, thereby ensuring a stable output of transmission power.

상기와 같이 본 발명에서는 전자냉각소자(12)에 의한 전자냉각방식을 이용함에 따라 정확한 온도제어와 국부냉각(Local Cooling)이 가능하고, 종래 온도데이터를 사용하여 전력증폭기(11)의 출력특성을 보상해 주지 않아도 된다.As described above, according to the present invention, by using the electronic cooling method by the electronic cooling device 12, accurate temperature control and local cooling are possible, and output characteristics of the power amplifier 11 using conventional temperature data can be obtained. You do not have to compensate.

상기에서 설명한 바와 같이, 본 발명은 이동통신단말기의 전력증폭기에 펠티어 및 제어백 효과를 이용한 열전반도체인 전자냉각소자를 부착하여 통화 시 전력증폭기에서 발생되는 열을 흡수하여 전력증폭기에 발생하는 열을 지속적이고 효율적으로 냉각시킴으로써 이동통신단말기의 RF 송신부로부터 안정된 송신전력을 얻을 수 있고 성능저하를 방지할 수 있는 효과가 있다.As described above, the present invention attaches an electronic cooling element, which is a thermoelectric semiconductor using a Peltier and a control back effect, to a power amplifier of a mobile communication terminal, absorbs heat generated from the power amplifier during a call, and generates heat generated by the power amplifier. By continuously and efficiently cooling, stable transmission power can be obtained from the RF transmission unit of the mobile communication terminal, and there is an effect of preventing performance degradation.

Claims (3)

RF 신호를 일정레벨 전력 증폭하는 전력증폭기와,A power amplifier for amplifying the RF signal at a predetermined level; 상기 전력증폭기 상단면에 부착되어, 전력증폭기에서 발생하는 열을 흡수하여 전력증폭기 자체의 온도를 일정하게 유지시키는 전자냉각소자와,An electronic cooling element attached to an upper surface of the power amplifier and absorbing heat generated from the power amplifier to maintain a constant temperature of the power amplifier itself; 상기 전자냉각소자의 n형 반도체 부분에는 양극, p형 반도체 부분에는 음극을 각각 연결하여 소정의 동작전원을 공급하는 직류 전원부로 구성되는 것을 특징으로 하는 전자냉각소자를 이용한 이동통신단말기 내 전력증폭기의 온도제어장치.An n-type semiconductor portion of the electronic cooling device, the anode, and a p-type semiconductor portion of the power amplifier in the mobile communication terminal using an electronic cooling device, characterized in that it comprises a direct current power supply for supplying a predetermined operating power. Temperature controller. 제1항에 있어서, 상기 전자냉각소자가 펠티어 및 제어백 효과를 이용한 열전반도체인 것을 특징으로 하는 전자냉각소자를 이용한 이동통신단말기 내 전력증폭기의 온도제어장치.The temperature control apparatus of a power amplifier in a mobile communication terminal using an electronic cooling element according to claim 1, wherein the electronic cooling element is a thermoelectric semiconductor using a Peltier and control back effect. 제1항에 있어서, 상기 직류전원부가 상기 전자냉각소자에 리플이 작은 정전압 직류전원을 공급하는 것을 특징으로 하는 전자냉각소자를 이용한 이동통신단말기 내 전력증폭기의 온도제어장치.The temperature control apparatus of a power amplifier in a mobile communication terminal using an electronic cooling device according to claim 1, wherein the DC power supply unit supplies a constant voltage DC power supply having a low ripple to the electronic cooling device.
KR1020000065789A 2000-11-07 2000-11-07 Temperature Control Equipment of Power Amplitude Within Mobile Station Using the Electronic Cooling Device KR20020035961A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6995931B2 (en) 2003-06-26 2006-02-07 Samsung Electronics Co., Ltd. Temperature controlled optoelectronic device
KR100656638B1 (en) * 2004-07-02 2006-12-11 엘지전자 주식회사 Portable terminal generating low-temperature
KR100655969B1 (en) 2005-04-19 2006-12-11 엘지전자 주식회사 Mobile Terminal having Induction Heating System Temperature control Power amplifier and Power amplifier Thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6995931B2 (en) 2003-06-26 2006-02-07 Samsung Electronics Co., Ltd. Temperature controlled optoelectronic device
KR100656638B1 (en) * 2004-07-02 2006-12-11 엘지전자 주식회사 Portable terminal generating low-temperature
KR100655969B1 (en) 2005-04-19 2006-12-11 엘지전자 주식회사 Mobile Terminal having Induction Heating System Temperature control Power amplifier and Power amplifier Thereof

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