KR20020028381A - The making method and apparatus of card module - Google Patents

Abstract

PURPOSE: A non-contact type IC card module producing system and method is provided to apply supersonic wave indirectly to a copper wire antenna wound on a base plate for fixing the copper wire antenna to the base plate at once and simplifying an electrical connection between the antenna and a chip. CONSTITUTION: The system comprises a work table(30), a jig(32), an absorption member(34), a buffering spring(36), an absorption hole(38), an insert cartridge(40), and a wire winder(50). The work table(30), rotatable, has a circular shape and installs four jigs(32) on an upper surface for fixing a base plate of an IC card module. The jig(32) includes an absorption member(34) with a certain height protruded from a center. The absorption member(34) is liftable up and down up to a certain height by the buffering spring(36). The height of the absorption member(34), when lifted up by the buffering spring(36), is the same as that of copper wire, when it is fixedly molten at the base plate. The absorption hole(38) is formed at the center of the absorption member(34) for fixing the base plate, and connected to a vacuum passage(39) formed along the work table(30) for supplying vacuum pressure. The insert cartridge(40), installed at a side of the work table(30), feeds the base plate for the jig(32) one by one. The wire winder(50), installed equidistantly between the jigs(32), winds the copper wire on the base plate.

Description

Manufacturing method and apparatus thereof for contactless card module

The present invention relates to a contactless card module, and more particularly, to a method and apparatus for installing an antenna of a contactless card module.

1 is a plan view of a general contactless card module. In the non-contact card module, an antenna 3 for inputting and outputting signals is installed on the rectangular substrate 1, and the antenna 5 is connected to a chip 5 mounted on the substrate 1.

In this case, the antenna 3 is generally made by fixing a copper wire 4 having a diameter of 0.08 mm to 0.12 mm on the substrate 1. Such an antenna 3 is wound a plurality of times along the edge of the substrate 1, but must maintain a constant distance so as not to be electrically connected between the adjacent copper wire (4).

In the non-contact card module, a separate substrate (not shown) is attached to the upper and lower surfaces of the substrate 1 on which the antenna 3 and the chip 5 are mounted, respectively, and a separate laminator (not shown) on the surface of each substrate. To complete a card.

Meanwhile, a process of fixing the antenna 3 to the substrate 1 in the contactless card module is shown in FIG. 2. As shown here, the copper wire 4 is supplied onto the substrate 1 by the elbow nozzle 7. The tip of the elbow nozzle 7 forms a bent portion 9 bent at a predetermined curvature.

In order to fuse the copper wire 4 to the substrate 1, ultrasonic waves generated by the ultrasonic generator 10 are used. The front end of the ultrasonic generator 10 is provided with a vibration punch 12, the front end of the vibration punch 12 is provided with a forming end 13 formed concave to correspond to the outer surface of the copper wire (4). The vibration punch 12 may apply ultrasonic waves while applying mechanical vibration to the copper wire 4 to fuse the copper wire 4 to the substrate 1.

However, the method of winding the copper wire 4 as described above has the following problems.

First, in the process of fusing the copper wire 4, since the ultrasonic wire is fixed to the substrate 1 while applying the ultrasonic wave directly to the copper wire 4, the copper wire 4 is often damaged by the ultrasonic wave. In particular, since the ultrasonic punch is applied while applying mechanical vibration to the copper wire 4 using the vibration punch 12, the copper wire 4 is damaged a lot by the mechanical vibration.

And since the copper wire 4 is fixed by using the ultrasonic waves generated by the ultrasonic generator 10 while the copper wire 4 is disposed on the substrate 1, the working time for applying ultrasonic waves becomes relatively long and overall working time. There is a problem of this lengthening.

Next, the copper wire 4 is generally enamel coated on its outer circumferential surface. Therefore, the process of electrically connecting the chip 5 after the antenna 3 is mounted on the substrate 1 is difficult. This is because the work of removing the enamel coating of the connecting part so that the copper wire is electrically connected to the chip 5 is a cumbersome work.

Therefore, an object of the present invention is to solve the problems of the prior art as described above, and to fix on the substrate at a time using ultrasonic waves in the state of winding the copper wire forming the antenna.

Another object of the present invention is to indirectly apply ultrasonic waves to copper wire in fusion bonding copper wire to a substrate.

Another object of the present invention is to make it easier to perform the electrical connection between the antenna and the chip.

1 is a plan view showing the configuration of a general contactless card module.

Figure 2 is a working state showing the antenna installation method of a contactless card module according to the prior art.

Figure 3 is a plan view showing the configuration of a preferred embodiment of the apparatus for manufacturing a contactless card module according to the present invention.

4 is a cross-sectional view taken along the line AA ′ of FIG. 3.

5 is a cross-sectional view taken along line BB ′ of FIG. 3.

Figure 6 is a connection state showing the electrical connection between the chip and the copper wire in the manufacturing method of the present invention.

Figure 7 is a connection state showing another method of electrically connecting the chip and the copper wire in the manufacturing method of the present invention.

8 is a connection state showing another method for electrically connecting the chip and the copper wire in the manufacturing method of the present invention.

Explanation of symbols on the main parts of the drawings

20: substrate 21: chip seat

22: copper wire 23: chip

30: Worktable 32: Jig

34: adsorption table 36: buffer spring

38: adsorption hole 40: insert cartridge

50: winding machine 52: copper wire guide

54: horizontal guide 56: guide roller

60: ultrasonic generator 62: ultrasonic horn

70: eject cartridge

According to a feature of the present invention for achieving the above object, the present invention comprises the steps of mounting a substrate cut to a predetermined size to a jig on the work table, between the lower surface of the substrate mounted on the jig and the upper surface of the jig Winding the copper wire around the distal end of the jig, providing ultrasonic waves to the upper surface of the substrate on which the copper wire is wound, and fusion bonding the copper wire to the lower surface of the substrate, mounting a chip on the substrate, and using a laser. And electrically connecting the copper wire and the chip.

The substrate is vacuum-absorbed on the jig, the jig is provided on the work table at predetermined angular intervals, and the jig is mounted on the jig, and the work is continuously performed.

The copper wire wound on the substrate and fused is connected to the copper wire wound at the previous stage at least until it is fused to the substrate.

The copper wire is supplied from the edge of the substrate in a direction parallel to the lower surface and wound around the lower surface of the substrate.

According to another feature of the present invention, the present invention is a jig for holding the substrate is installed and rotated at a predetermined angular interval, and is installed at a position corresponding to one side of the work table, the insert for supplying the substrate to the jig A winding unit for winding a copper wire between an upper surface of the jig and a lower surface of the substrate mounted on the jig, the unit being disposed at a position corresponding to the work table spaced apart by the angular interval between the insert part and the jig; An ultrasonic generator for fusion bonding the copper wire wound by the winding machine to the substrate, the ultrasonic generator being installed at a position corresponding to the work table spaced apart by an angular interval, and installed at a position corresponding to the work table spaced apart from the ultrasonic generator by the angular interval; And an ejection unit for removing the copper wire-fused substrate from a work table. .

In the center of the upper surface of the jig is provided so that the adsorption portion protruding a predetermined height is supported by the elastic member to be elevated by a predetermined height elasticity.

The suction part communicates with the vacuum flow path inside the work table, and the suction part is formed to correspond to the innermost winding shape of the copper wire, and the protruding height is equal to the height of the copper wire protruding in the state of being fused to the substrate. .

The winding machine is provided with a copper wire supply port for supplying copper wire to the lower surface of the substrate, wherein the distal end portion of the copper wire supply hole is bent at a right angle to be formed in parallel with the lower surface of the substrate, and the inside of the copper wire supply port bent at a right angle to the inside A guide roller for guiding the movement of the copper wire is further provided.

A method of manufacturing a non-contact card module and a device according to the present invention having such a configuration will be described in detail with reference to the drawings.

3 to 5 show the configuration of a non-contact card module manufacturing apparatus according to the present invention. According to this, the work table 30 is rotatably installed to be formed in a circular shape when viewed from the top. The work table 30 is provided with a jig 32 at intervals of 90 degrees. The jig 32 is for fixing the substrate 20 that is the workpiece.

Such a jig 32 is provided with a suction table 34. The adsorption table 34 is installed so that the tip thereof protrudes a predetermined height in the center of the jig 32, and is supported by the shock absorbing spring 36 therein, and is capable of lifting up and down a predetermined height. The height at which the suction table 34 protrudes is the same as the height at which the copper wire 22 protrudes when the copper wire 22 is fused to the substrate 20. The shock absorbing spring 36 serves to absorb the shock acting on the suction table 34 in the vertical direction.

And when viewed from the top of the suction table 34 is configured as a rectangle as well shown in FIG. This is according to the winding form of the copper wire 22 installed on the substrate 20.

Adsorption holes 38 for adsorption of the substrate 20 are formed at the center of the suction table 34, and the suction holes 38 are formed along the working table 30. It communicates with and receives vacuum pressure.

On the other hand, the insert cartridge 40 for mounting the substrate 20 to the jig 32 of the work table 30 is installed on one side of the work table (30). The insert cartridge 40 supplies the substrate 20 one by one to the jig 32.

The winding machine 50 for winding the copper wire 22 on the substrate 20 is installed at the position away from the insert cartridge 40 in the same distance between the jig 32 installed on the work table 30. do. The winding machine 50 is located above the jig 32 of the worktable 30 as well shown in FIG. 5.

The winding wire 50 is provided with a copper wire guide 52, the copper wire 22 is guided and supplied along the copper wire guide 52 rotated by the winding machine 50. A horizontal guide portion 54 is formed at the tip of the copper wire guide 52. The horizontal guide portion 54 is formed at the tip of the copper wire guide 52 so that the copper wire 22 is guided along a plane parallel to the bottom surface of the substrate 20. Most preferably in design, the copper wire guide 52 rotated along the circumference of the jig 32 extends vertically downward toward the ground, and is bent vertically to the front end thereof to face the outer circumferential surface of the suction table 34. Horizontal guide portion 54 is formed. The horizontal guide part 54 is provided with a guide roller 52 for guiding the copper wire 22 supplied through the horizontal guide part 54.

On the other hand, the lower part of the winding machine 50 is provided with a fixing table 58 for pressing the upper surface of the substrate 20 during the winding of the copper wire (22). However, the fixing unit 58 may not be depending on the suction force of the suction hole 38.

The ultrasonic generator 60 is installed at a position facing the insert cartridge 40 which is spaced apart by the distance between the winding machine 50 and the jig 32. The ultrasonic generator 60 is provided with an ultrasonic horn 62 so as to extend toward the upper surface of the jig 32. The ultrasonic horn 62 is formed to have a lower surface shape corresponding to the shape of the copper wire 22 wound on the substrate 20. The ultrasonic horn 62 applies ultrasonic waves generated by the ultrasonic generator 60 together with mechanical vibration to the upper surface of the substrate 20.

An eject cartridge 70 is installed at a position facing the winding machine 50, which is spaced apart by the distance between the ultrasonic wave generator 60 and the jig 32. The eject cartridge 70 serves to remove the substrate 20, which has been fixed and moved by the jig 32, from the work table 30.

In the drawing, reference numeral 21 denotes a chip mounting part in which the chip 23 is mounted on the substrate 20.

Hereinafter, a process of manufacturing a card module using the apparatus for manufacturing a contactless card module according to the present invention having the configuration as described above will be described.

First, the substrate 20 is cut out to a predetermined size from the base material to match the type of product. The substrate 20 cut in this manner is mounted on the insert cartridge 40. Then, the substrate 20 is supplied one by one from the insert cartridge 40 to the jig 32 of the work table 30. That is, after the substrate 20 is first supplied to the one side jig 32 by the insert cartridge 40, the work table 30 is rotated 90 degrees. As the worktable 30 is rotated 90 degrees, the jig 32, in which the substrate 20 is not mounted again, comes to the position of the insert cartridge 40, and the substrate 20 is again inserted in the insert cartridge 40. This piece is supplied and attached to the jig 32. At this time, the jig 32 fixes the substrate 20 by using a vacuum pressure.

Next, the substrate 20 supplied from the insert cartridge 40 to the jig 32 comes to a position corresponding to the winding machine 50 by the rotation of the turntable 30. At this time, the substrate 20 is gripped by the vacuum pressure through the suction hole 38 on the upper surface of the suction table 34 of the jig 32, the suction table 34 is the buffer spring (36) The protrusion protrudes a predetermined height from the upper surface of the jig 32.

Therefore, a gap equal to the height of the protrusion of the suction table 34 is formed between the upper surface of the jig 32 and the lower surface of the substrate 20. The copper wire 22 is wound between the substrate 20 and the upper surface of the jig 32 through the gap. In particular, the copper wire 22 is wound along the outer circumferential surface of the suction table 34. That is, first, the copper wire 22 is wound once so as to contact the outer circumferential surface of the suction table 34, and the copper wire 22 is sequentially wound adjacent to the wound copper wire 22.

The winding operation of the copper wire 22 is performed while the copper wire guide 52 rotates around the jig 32 by the winding machine 50. In particular, since the copper wire 22 is supplied along a surface parallel to the lower surface of the substrate 20 by the horizontal guide portion 54 formed at the tip of the copper wire guide 52, the copper wire 22 is the jig 32. B can be wound accurately without touching the substrate 20.

On the other hand, when moving from the inside of the copper wire guide 52 to the horizontal guide portion 54, the copper wire 22 is guided by the guide roller 56 is changed direction, so the supply of the copper wire 22 is smooth Doing so, the copper wire 22 does not interfere with other parts, so that no damage occurs.

When the winding work for one substrate 20 is completed, the work table 30 is rotated 90 degrees so that the new substrate 20 is positioned below the winding machine 50. At this time, the copper wire 22 supplied through the copper wire guide 52 is wound on the lower surface of the new substrate 20 without being cut off. The winding operation without cutting the copper wire 22 is to prevent the worker from fixing the copper wire 22 separately when starting the winding of the copper wire 22 on the new substrate 20. And the copper wire 22 may be cut after the fusion operation to be described below.

After the winding of the copper wire 22 as described above is finished, the work for fusion welding the wound copper wire 22 to the substrate 20. The substrate 20 is located below the ultrasonic generator 60 in accordance with the rotation of the work table 30.

In other words, the ultrasonic wave generated by the ultrasonic generator 60 is applied to the upper surface of the substrate 20 by the ultrasonic horn 62 to be fused. At this time, the ultrasonic horn 62 is applied to the ultrasonic wave while applying a mechanical vibration to the substrate 20, wherein the mechanical vibration is absorbed to some extent by the buffer spring 36 to the substrate 20 ) Or copper wire 22 is prevented from being damaged. In addition, the lower surface of the ultrasonic horn 62 is formed to correspond to the shape in which the copper wire 22 is wound, thereby applying ultrasonic waves only to necessary portions.

In this case, the copper wire 22 is fused and fixed to the substrate 20. This operation is performed on the substrate 20 to which the copper wire 22 is wound while being fixed to the jig 32 of the work table 30.

After fusion is performed by the ultrasonic generator 60, the substrate 20 on which the copper wire 22 is fused by the rotation of the work table 30 moves to the position of the eject cartridge 70. The eject cartridge 70 separates the substrate 20 which has been moved by the jig 32 from the jig 32 and sends it to the next work process.

On the other hand, after the copper wire 22 is fused to the substrate 20, the chip 23 is mounted on the chip mounting portion 21 of the substrate 20. The chip 23 should be electrically connected to the copper wire 22, which is illustrated in FIGS. 6 to 8.

6 shows a case where the chip 23 is placed in the transverse direction with reference to the drawings. In such a case, both ends 22 'of the copper wire 22, which are not fused in the welding operation, are guided to the connection part 24 of the chip 23, and the copper wire 22 is guided by using a laser. ). At this time, the laser removes the enamel layer surrounding the copper wire 22 and fixes the copper wire 22 to the connection part 24.

7 illustrates a case where the chip 23 is placed in the longitudinal direction with reference to the drawings. In this case, a plurality of forming protrusions 25 are formed to guide both ends 22 ′ of the copper wire 22, which are not fused in the fusion operation, to the connection part 24 of the chip 23. The forming protrusion 25 is to protrude the surface of the substrate 20 by pressing. The forming protrusion 25 serves to fix and guide both ends 22 'that are not fused. As described above, both ends 22 'of the copper wire 22 are positioned at the connection part 24 of the chip 23, and the copper wire 22 is connected to the chip 23 using a laser.

At this time, the direction in which both ends 22 'are guided and fixed, respectively, is to proceed in a direction opposite to each other in parallel as shown in FIG.

8 illustrates a case where the guide pin 27 is used instead of the forming protrusion 25 when the chip 23 is placed in the longitudinal direction with reference to the drawings. That is, a hole (not shown) is formed on a predetermined position on the substrate 20, and guide pins 27 are positioned through the hole to guide and fix both ends 22 ′ of the copper wire 22. .

At this time, the direction in which the both ends 22 'are guided and fixed, respectively, is parallel to each other and proceeds in the same direction as shown in FIG.

In the method and apparatus for manufacturing a non-contact card module according to the present invention as described in detail above, ultrasonic waves are used to fuse copper wires to a substrate. A shortened effect can be obtained.

The ultrasonic wave is not applied directly to the copper wire but is applied to the opposite surface of the substrate on which the copper wire is wound. In addition, since the adsorption zone of the jig on which the substrate is supported is supported by the buffer spring, mechanical shock generated during the application of ultrasonic waves can be absorbed, so that copper wires or substrates are not damaged during the welding operation, thereby improving productivity.

In addition, the present invention uses a laser for the connection between the copper wire and the chip forming the antenna, thereby removing the enamel layer surrounding the copper wire and at the same time can connect the copper wire to the chip more easily the electrical between the antenna and the chip The connection can be made.

Claims (10)

Mounting a substrate cut into a predetermined size to a jig on a worktable; Winding a copper wire around the distal end of the jig between a lower surface of the substrate mounted on the jig and an upper surface of the jig; Fusing the copper wire to the lower surface of the substrate by providing an ultrasonic wave to an upper surface of the substrate on which the copper wire is wound; And mounting the chip on the substrate and electrically connecting the copper wire and the chip using a laser. The method of claim 1, wherein the substrate is vacuum-adsorbed onto the jig. The method of claim 1 or 2, wherein the working table is provided with jigs at predetermined angular intervals, and the jig is equipped with substrates, respectively, so that the work is continuously performed. 4. The method of claim 3, wherein the copper wire wound on the substrate is fused together with the copper wire wound on the previous step until at least the copper wire is welded to the substrate. 4. The method of claim 3, wherein the copper wire is supplied from the edge of the substrate in a direction parallel to the lower surface and wound around the lower surface of the substrate. A working table on which a jig for holding a substrate is installed and rotated at a predetermined angle interval, An insert part installed at a position corresponding to one side of the work table and supplying a substrate to the jig; A winding machine installed at a position corresponding to the work table spaced by an angular interval between the insert portion and the jig, and winding a copper wire between an upper surface of the jig and a lower surface of the substrate mounted on the jig; An ultrasonic generator installed at a position corresponding to the work table spaced apart from the winding machine by the angular interval and for fusion welding the copper wire wound by the winding machine to a substrate; And an ejection unit installed at a position corresponding to the work table spaced apart from the ultrasonic generator by the angular interval and removing the substrate on which the copper wire is fused from the work table. 7. The apparatus of claim 6, wherein an adsorption part protruding a predetermined height is supported by an elastic member at a center of the upper surface of the jig so as to be elevated by a predetermined height elasticity. The apparatus of claim 7, wherein the suction unit communicates with a vacuum flow path inside the work table. The contactless card module of claim 7 or 8, wherein the adsorption part is formed to correspond to the innermost winding shape of the copper wire, and the protruding height is the same as the height of the copper wire protruding in a state in which the copper wire is fused to the substrate. Manufacturing equipment. According to claim 6, The winding machine is provided with a copper wire supply port for supplying a copper wire to the lower surface of the substrate, wherein the distal end of the copper wire supply port is bent at a right angle and formed parallel to the lower surface of the substrate, An apparatus for manufacturing a contactless card module, wherein a guide roller for guiding the movement of the copper wire is further provided inside the copper wire supply port.