KR20020023388A - Heat sink construction of largest radiant heat area - Google Patents

Heat sink construction of largest radiant heat area Download PDF

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Publication number
KR20020023388A
KR20020023388A KR1020020003539A KR20020003539A KR20020023388A KR 20020023388 A KR20020023388 A KR 20020023388A KR 1020020003539 A KR1020020003539 A KR 1020020003539A KR 20020003539 A KR20020003539 A KR 20020003539A KR 20020023388 A KR20020023388 A KR 20020023388A
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South Korea
Prior art keywords
heat sink
cooling
cpu
cooling fluid
supply
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KR1020020003539A
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Korean (ko)
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KR100450326B1 (en
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성이제
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성이제
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Priority to KR10-2002-0003539A priority Critical patent/KR100450326B1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

PURPOSE: A heat sink structure for cooling a CPU having an enlarged heat emitting area is provided to enlarge a heat emitting area by forming a fluid path as a rectangular shape and forming a prominence and depression of both sides and bottom surface as a plurality of rows in order to enlarge the surface area. CONSTITUTION: The fluid path(11) of heat sink(1) is formed as a spiral shape and has entirely a rectangular shape in a view of plain surface. The fluids path is formed a groove having a specific depth and the center of fluid pate is formed a supply terminal(11a) supplying a cooling fluids to a supply hole(21) placed on the center of cover(20). The fluids path is circulated in spiral shape from the supply terminal formed on the center to the outer side and cools the CPU under the fluids path. The rectangular shape of fluids path enhances the cooling efficiency because of cooling the total contacting surface of the CPU.

Description

방열면적을 크게한 씨피유냉각용 히트싱크구조{HEAT SINK CONSTRUCTION OF LARGEST RADIANT HEAT AREA}Heat sink structure for CIF oil cooling with large heat dissipation area {HEAT SINK CONSTRUCTION OF LARGEST RADIANT HEAT AREA}

본 발명은 개인용 컴퓨터(P.C)의 중앙처리장치(CPU)를 냉각하는 히트싱크에 관한 것으로, 더욱 더 상세하게는 유로를 평면에서 볼 때, 4각형으로 형성하여 표면적을 증대시킴과 동시에 상기 유로의 양측면과 바닥면에 수평상으로 다양한 형태의 요홈 또는 돌기로 된 요철을 다수열 형성하여 방열면적을 크게한 CPU냉각용 히트싱크구조에 관한 것이다.The present invention relates to a heat sink for cooling a central processing unit (CPU) of a personal computer (PC). More particularly, the flow path is formed in a quadrangular shape in a plan view to increase the surface area and at the same time The present invention relates to a CPU cooling heat sink structure having a large heat dissipation area by forming a plurality of rows of grooves or protrusions having various shapes horizontally on both sides and the bottom surface.

일반적으로, 개인용 컴퓨터(Personal Computer)의 핵심이라할 수 있는 중앙처리장치(CPU)를 냉각하도록 하는 히트싱크에 대해서는 여러가지가 사용되어 오고 있다.In general, a variety of heat sinks have been used for cooling the central processing unit (CPU), which is the core of a personal computer.

예를 들면, 도 1a와 도 1b에 도시한 바와 같은 히트싱크(HS)가 대표적으로 사용되어 오고 있는 형태의 것이다.For example, the heat sink HS as shown in FIG. 1A and FIG. 1B has been used typically.

도시한 바와 같이, 종래에는 상측의 뚜껑(CA)과 하측의 본체(MB)로 대별되고, 원형으로 나선형 유로(FL)가 형성되어 중심의 상측에 구비된 공급구(SS)를 통해 냉각유체를 공급하고, 상기 냉각유체는 나선형으로 흐르며 하측에 면접한 중앙처리장치(C)(이하, "CPU"라 칭함.)을 냉각시키는 것이다.As shown in the prior art, a cooling fluid is generally divided into upper lid CA and lower main body MB, and a spiral flow path FL is formed in a circle to supply a cooling fluid through a supply port SS provided on the upper side of the center. The cooling fluid flows in a spiral manner and cools the central processing unit C (hereinafter referred to as "CPU") which is interviewed on the lower side.

또한, 상기한 바와 같이, 냉각되며 승온된 냉각유체는 외측단에 구비된 배출구(OS)를 통해 배출되고, 상술한 바와 같이, 순환을 반복하는 것이다.In addition, as described above, the cooled and heated up cooling fluid is discharged through an outlet (OS) provided at the outer end, and as described above, the circulation is repeated.

그러나, 상기한 바와 같은 히트싱크는 본체 표면에 원형으로 형성된 유로에 의해 본체의 표면적을 활용하지 못해 냉각유체와 열교환을 일으키는 표면적과 순환하는 냉각유체의 유량을 좌, 우하는 단면적이 감소하는 문제가 있었다.However, the heat sink as described above has a problem that the surface area of the main body cannot be utilized due to a circular flow path formed on the main body surface, thereby reducing the cross-sectional area of the surface area causing heat exchange with the cooling fluid and the flow rate of the circulating cooling fluid left and right. there was.

또한, 상기한 바와 같이, 표면적과 단면적이 감소함으로써, 냉각효율이 떨어지는 문제가 있었다.In addition, as described above, the surface area and the cross-sectional area are reduced, resulting in a decrease in cooling efficiency.

또한, 유로의 표면적과 단면적이 작아짐으로써, 발생하는 냉각유체의 유량 감소에 대한 대책으로 더 큰 용량의 펌프를 사용하여 순환량을 강제로 증가시키도록 함으로써, 제조원가가 높게 형성되는 문제가 있었다.In addition, as the surface area and the cross-sectional area of the flow path are reduced, there is a problem that the manufacturing cost is high by forcibly increasing the circulation amount by using a pump of a larger capacity as a countermeasure against the flow rate of the cooling fluid generated.

본 발명은 상술한 바와 같은 문제점을 해결하기 위해 안출한 것으로서, 본 발명의 목적은 히트싱크본체의 표면적을 최대한 활용하여 냉각유체와 열교환을 일으키는 표면적과 단면적을 크게하여 순환하는 냉각유체가 안정적인 유량으로 순환하도록 하는데 있다.The present invention has been made to solve the problems described above, the object of the present invention is to maximize the surface area of the heat sink body to maximize the surface area and cross-sectional area causing the cooling fluid and heat exchange to circulate the cooling fluid at a stable flow rate To circulate.

또한, 본 발명의 다른 목적은 상기한 바와 같이, 표면적과 단면적을 증대하여 안정적인 유량이 순환하도록 하여 방열면적을 크게함으로써, 냉각효율을 향상시키도록 하는데 있다.In addition, another object of the present invention is to increase the surface area and cross-sectional area so that a stable flow rate is circulated to increase the heat dissipation area, thereby improving cooling efficiency.

또한, 본 발명의 또 다른 목적은 유로의 단면적을 최대한 크게하여 적은 용량의 펌프로도 안정적인 유량을 구비함으로써, 제조원가를 절감하도록 하는데 있다.In addition, another object of the present invention is to increase the cross-sectional area of the flow path as much as possible to provide a stable flow rate even with a small capacity pump, thereby reducing the manufacturing cost.

도 1a에 도시한 것은 종래 히트싱크의 구조를 도시한 평면도이고,1A is a plan view showing the structure of a conventional heat sink,

도 1b는 도 1a "A"-"A"선의 단면도이고,FIG. 1B is a cross sectional view taken along the line “A”-“A” of FIG. 1A,

도 2는 본 발명 히트싱크의 구성에 대해 상세히 설명하기 위해 도시한 분해사시도이고,Figure 2 is an exploded perspective view showing in detail for the configuration of the heat sink of the present invention,

도 3의 가)는 본 발명 히트싱크의 유로(流路) 형상에 대해 설명하기 위해 도시한 도 2 "b"-"b"선에서 바라본 평면도이고, 나)는 본 발명 유로의 단면구조에 대해서 설명하기 위해 도시한 상기 도 3 나) "B"-"B"선의 단면도이고,Fig. 3A) is a plan view seen from the line "b"-"b" of Fig. 2 shown to explain the flow path shape of the heat sink of the present invention, and b) the cross-sectional structure of the flow path of the present invention. 3B) is a cross-sectional view of the line “B”-“B” shown for explanation,

도 4의 가)와 나)는 본 발명 히트싱크 유로의 다른 실시예를 도시한 부분단면도이다.4A and 4B are partial cross-sectional views showing another embodiment of the heat sink flow path of the present invention.

*도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings

1;히트싱크 10;본체1; heat sink 10; body

11;유로 11a;공급단11; Euro 11a; Supply stage

11b;배출단 11c;사이벽11b; discharge end 11c; interwall

12;요철 20;뚜껑12; uneven 20; lid

21;공급구 22;배출구21; supply port 22; outlet port

본 발명은 개인용 컴퓨터(P.C)의 중앙처리장치를 냉각하는 히트싱크에 관한 것으로서, 특히, 유로의 방열면적을 크게 한 히트싱크에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink for cooling a central processing unit of a personal computer (P.C), and more particularly to a heat sink having a large heat dissipation area of a flow path.

본 발명은 상면의 중심에 요홈으로 형성된 공급단과, 상기 공급단으로 부터 외측으로 연장되고 4각형상의 나선형으로 형성된 외측단에는 배출단이 형성된 유로와, 상기 유로의 측면과 바닥면에 수평상으로 다수열의 요철이 형성된 본체와;The present invention provides a supply end formed with a groove in the center of the upper surface, an outer end extending outward from the supply end and formed in a helical spiral shape, a flow path having a discharge end formed therein, and a plurality of horizontally on the side and bottom surfaces of the flow path. A main body in which irregularities of heat are formed;

상기 본체의 상측에 장착되는 중심에는 상기 공급단으로 냉각유체를 공급하도록 구비된 공급구와, 상기 배출단의 상측에 구비되어 승온된 냉각유체의 배출이 용이하도록 하는 배출구가 구비된 뚜껑을 포함하여 구성된다.The center mounted on the upper side of the main body comprises a supply port provided to supply the cooling fluid to the supply end, and a lid provided with an outlet provided in the upper side of the discharge end to facilitate the discharge of the elevated cooling fluid do.

또한, 본 발명의 유로는 단면상으로 라운드형, 또는 크랭크형, 삼각형중 어느 것 하나로 하여 방열면적을 크게한 특징이 있는 것이다.In addition, the flow path of the present invention is characterized in that the heat dissipation area is increased by one of round, crank and triangle in cross section.

이하, 첨부한 예시도를 참조로 하여 본 발명의 바람직한 실시예에 대해 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명 히트싱크의 구성에 대해 상세히 설명하기 위해 도시한 분해사시도이고, 도 3의 가)는 본 발명 히트싱크의 유로(流路) 형상에 대해 설명하기 위해 도시한 도 2 "b"-"b"선에서 바라본 평면도이고, 나)는 본 발명 유로의 단면구조에 대해서 설명하기 위해 도시한 상기 도 3 나) "B"-"B"선의 단면도이고, 도 4의가)와 나)는 본 발명 히트싱크 유로의 다른 실시예를 도시한 부분단면도이다.(이하, 종래의 구성과 동일한 구성은 동일명칭을 붙여 설명하되, 부호만 달리 붙여 설명한다.)FIG. 2 is an exploded perspective view illustrating the configuration of the heat sink of the present invention in detail, and FIG. 3A) FIG. 2B illustrates the flow path of the heat sink of the present invention. -b) is a plan view seen from the line "b", b) is a cross-sectional view of the line "B"-"B" of FIG. 3 shown for explaining the cross-sectional structure of the flow path of the present invention, and a) and b) of FIG. A partial cross-sectional view showing another embodiment of the heat sink flow path of the present invention. (Hereinafter, the same configuration as the conventional configuration will be described with the same name, but only with different reference numerals.)

도 2에 도시한 바에 의해, 본 발명 히트싱크(1)의 방열면적을 최대화하도록 하는 구성에 대해 상세히 설명한다.As shown in FIG. 2, the structure which maximizes the heat dissipation area of the heat sink 1 of this invention is demonstrated in detail.

도시한 바와 같이, 본 발명의 히트싱크(1)는 유로(11)가 나선으로 형성되되, 평면에서 볼 때, 전체적으로 4각형상을 구비하고 있다.As shown in the drawing, the heat sink 1 of the present invention has a flow path 11 formed in a spiral, and has a quadrangular shape as a whole when viewed in plan view.

상기한 바와 같이, 4각으로 유로(11)를 형성한 이유로는 본체(10)의 형상이 4각형으로 형성되어 있으므로, 상기 본체(10)의 표면적을 최대한 활용할 수 있도록 하기 위한 것이다.As described above, the reason why the flow path 11 is formed in the quadrangular shape is that the main body 10 is formed in a quadrangular shape, so that the surface area of the main body 10 can be utilized to the maximum.

상기 유로(11)는 전체적으로 소정의 깊이를 갖는 요홈으로 형성되고, 중심에는 상기 뚜껑(20)의 중심에 구비된 공급구(21)로 냉각유체가 공급되는 공급단(供給段)(11a)이 형성된다.The flow path 11 is formed as a groove having a predetermined depth as a whole, and a supply end 11a through which a cooling fluid is supplied to a supply port 21 provided at the center of the lid 20 is provided at the center thereof. Is formed.

또한, 상기 유로(11)는 상기 중심에 형성된 공급단(10a)으로 부터 외측으로 상기 유로(11)를 나선형으로 순환하며 하측의 CPU(C)를 냉각하는데, 상기한 바와 같이, 평면상 4각으로 형성되어 상기 CPU(C)의 접촉면이 전면적으로 냉각되어 냉각효율을 크게하는 것이다.In addition, the flow path 11 circulates the flow path 11 helically from the supply end 10a formed at the center to the outside and cools the CPU C at the lower side. It is formed so that the contact surface of the CPU (C) is cooled to the whole to increase the cooling efficiency.

또한, 상기 나선형 유로(11)의 사이에는 사이벽(11c)이 형성되는데, 상기 사이벽(11c)의 양측면과 바닥면에는 수평방향으로 요철(12)이 형성되어 상기 냉각유체의 흐름을 용이하도록 하였다.In addition, between the spiral flow path 11 is formed between the wall 11c, on both sides and the bottom surface of the wall 11c is formed with irregularities 12 in the horizontal direction to facilitate the flow of the cooling fluid. It was.

다시 말해서, 상기 요철(12)이 형성된 이유로는 첫째로, 상기 공급단(10a)으로 부터 외측의 배출단(10b)으로 순환할 때, 상기 냉각유체의 저항이 발생하지 않고 안정적으로 흐르도록 가이드역할을 하는 것이고, 두번째로는 상기 CPU(C)로 부터 전달되는 열의 방열면적을 최대한 크게 하도록 하기 위한 것이다.In other words, the reason why the unevenness 12 is formed is as follows: First, when circulating from the supply end 10a to the discharge end 10b on the outside, the guide role serves to stably flow without resistance of the cooling fluid. Second, to maximize the heat dissipation area of the heat transferred from the CPU (C) as much as possible.

도 3의 가)와 나)에 도시한 바와 같이, 상기 요철(12)은 상기 유로(11)의 바닥면과 상기 유로(11) 사이의 사이벽(11c)의 양측면에 형성되어 있다.As shown in (a) and (b) of FIG. 3, the unevenness 12 is formed on both side surfaces of the wall 11c between the bottom surface of the flow path 11 and the flow path 11.

가)에 도시한 바와 같이, 순환하는 냉각유체는 유로(11) 내측에 전면적으로 형성된 요철(12)에 의해 용이하게 순환하도록 하는 것이다.As shown in a), the circulating cooling fluid is to be easily circulated by the unevenness 12 formed entirely in the flow path 11.

또한, 나)에 상세 도시한 바와 같이, 상기 요철(12)은 라운드형상으로 형성하여 단면적을 크게 하였고, 상기 라운드가 만나는 부위에도 라운드(R)를 형성하여 단면적을 크게함과 동시에 상기 유로(11)를 순환하는 냉각유체가 저항없이 원활한 흐름을 갖도록 하였다.In addition, as shown in detail b), the concave-convex 12 is formed in a round shape to increase the cross-sectional area, and the round (R) is also formed at a portion where the round meets to increase the cross-sectional area and at the same time the flow path 11 Cooling fluid circulating) had a smooth flow without resistance.

상기한 바와 같이, 원활한 흐름에 의해 소용량의 펌프(미도시)를 구비한 냉각시스템도 유량과 유속이 증가하여 상기 CPU(C)를 냉각하는 냉각효율이 높아짐으로, 적은 용량의 펌프에 의해 상기 CPU(C)의 냉각시스템의 제조원가를 절감할 수 있었다.As described above, the cooling system having a small capacity pump (not shown) by the smooth flow also increases the flow rate and flow rate, thereby increasing the cooling efficiency of cooling the CPU C. The manufacturing cost of the cooling system in (C) was reduced.

도 4에 도시한 것은 본 발명의 다른 실시예를 도시한 것이다.4 shows another embodiment of the present invention.

먼저, 가)에 도시한 것은 상술한 바와 같은 요철(12)을 소정의 간격을 구비한 삼각형요홈으로 형성된 것을 도시한 것이고, 나)에 도시한 것은 사각형요홈으로 형성된 크랭크식 요철(12)을 도시한 것이다.First, a) shows that the unevenness 12 as described above is formed into a triangular groove having a predetermined interval, and b) shows a crank-type unevenness 12 formed of a rectangular groove. It is.

상기 가)와 나)에 도시한 각각의 요철(12)도 각 단면형상이 만나는 코너부위에도 라운드(R)를 형성하여 유체의 저항을 최소화하도록 함과 동시에 단면적도 크게 하였다.Each of the irregularities 12 shown in (a) and (b) also forms a round (R) at the corners where each cross-sectional shape meets, thereby minimizing the resistance of the fluid and increasing the cross-sectional area.

상술한 바와 같이, 본 발명의 히트싱크(1)는 상기 중심의 공급단(11a)으로 냉각유체가 공급되고, 외측으로 열교환되며 승온된 냉각유체는 외측의 배출단(11b)으로 배출되어 도시하지 않은 냉각탱크로 보내짐으로써, 상기 CPU(C)에 이슬맺힘이 방지된다.As described above, in the heat sink 1 of the present invention, a cooling fluid is supplied to the supply end 11a of the center, heat exchanged to the outside, and the cooling fluid that is heated up is discharged to the discharge end 11b of the outside. By being sent to an uncooled tank, dew condensation is prevented in the CPU (C).

또한, 상기 냉각탱크로 보내진 승온유체는 상기 냉각탱크의 방열수단에 의해 방열되고, 다시 냉각유체로 변환되어 상술한 바와 같은 순환동작을 반복한다.In addition, the temperature rising fluid sent to the cooling tank is radiated by the heat radiating means of the cooling tank, and is converted into the cooling fluid again to repeat the circulation operation as described above.

본 발명은 상술한 특정 바람직한 실시예에 한정되지 아니하며 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 기술분야에서 통상의 지식을 가진자라면 누구든지 다양한 변형실시가 가능한 것은 물론이고, 그와 같은 변경은 청구범위 기재의 범위내에 있게된다.The present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by those skilled in the art without departing from the gist of the present invention as claimed in the claims. Such changes are intended to be within the scope of the claims.

상술한 바와 같이, 본 발명에 의하면, 히트싱크본체의 표면적을 최대한 활용하여 냉각유체와 열교환을 일으키는 표면적과 단면적을 증대하여 순환하는 냉각유체가 안정적인 유량으로 순환하도록 하여 방열면적을 크게함으로써, 냉각효율을 향상시킨 효과가 있다.As described above, according to the present invention, by utilizing the surface area of the heat sink body as much as possible, the surface area and cross-sectional area causing heat exchange with the cooling fluid are increased so that the circulating cooling fluid circulates at a stable flow rate, thereby increasing the heat dissipation area. It has the effect of improving.

또한, 유로의 단면적을 최대한 크게하여 적은 용량의 펌프로도 안정적인 유량을 구비함으로써, 제조원가를 절감한 효과가 있다.In addition, by increasing the cross-sectional area of the flow path as much as possible to provide a stable flow rate even with a small capacity pump, there is an effect of reducing the manufacturing cost.

또한, 상술한 요철은 의해 단면적을 크게함과 동시에 냉각유체의 흐름방향인 수평으로 형성되어 순환하는 냉각유체에 마찰저항이 발생하지 않아 유량과 유속이 안정되도록 한 효과가 있다.In addition, the above-mentioned concavities and convexities have an effect of increasing the cross-sectional area and at the same time forming the horizontal in the flow direction of the cooling fluid so that friction resistance does not occur in the circulating cooling fluid so that the flow rate and the flow rate are stabilized.

Claims (3)

개인용 컴퓨터(P.C)의 중앙처리장치(CPU)를 냉각하는 히트싱크 있어서,A heat sink for cooling the central processing unit (CPU) of the personal computer (P.C), 상면의 중심에 요홈으로 형성된 공급단과, 상기 공급단으로 부터 외측으로 연장되고 4각형상의 나선형으로 형성된 외측에 배출단이 형성된 유로와, 상기 유로의 사이벽 양측면과 바닥면 수평상에 다수열의 요철이 형성된 본체와;A supply end formed with a groove in the center of the upper surface, a flow path having an outlet end formed outside the supply end extending outward from the supply end and formed in a helical spiral shape, and a plurality of rows of irregularities A formed body; 상기 본체의 상측에 장착되는 중심에는 상기 공급단으로 냉각유체를 공급하도록 구비된 공급구와, 상기 배출단의 상측에 구비되어 승온된 냉각유체의 배출이 용이하도록 하는 배출구가 구비된 뚜껑을 포함하여 구성된 것을 특징으로 하는 방열면적을 크게한 CPU냉각용 히트싱크구조.A center mounted on the upper side of the main body includes a supply port provided to supply cooling fluid to the supply end, and a lid having an outlet provided at an upper side of the discharge end to facilitate the discharge of the heated cooling fluid. CPU cooling heat sink structure with a large heat dissipation area. 제1항에 있어서,The method of claim 1, 상기 요철은 단면상으로 라운드형, 또는 크랭크형, 삼각형 요철중 어느 것 하나인 것을 특징으로 하는 방열면적을 크게한 CPU냉각용 히트싱크구조.The unevenness of the CPU cooling heat sink structure having a large heat dissipation area, characterized in that any one of round, crank, triangular irregularities in cross section. 제1항에 있어서,The method of claim 1, 상기 히트싱크는 상기 중심의 공급단으로 냉각유체가 공급되고, 외측으로 열교환되며 승온된 냉각유체는 외측의 배출단으로 배출됨으로써, 상기 CPU에 이슬맺힘이 방지되는 것을 특징으로 하는 방열면적을 크게한 CPU냉각용 히트싱크구조.The heat sink is supplied with a cooling fluid to the supply terminal of the center, heat exchanged to the outside and the cooling fluid heated up is discharged to the discharge terminal of the outside, thereby increasing the heat radiation area, characterized in that dew condensation is prevented CPU heatsink structure.
KR10-2002-0003539A 2002-01-22 2002-01-22 Heat sink construction of largest radiant heat area KR100450326B1 (en)

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KR100498276B1 (en) * 2002-11-19 2005-06-29 월드이노텍(주) Cooling Device
KR100677617B1 (en) * 2005-09-29 2007-02-02 삼성전자주식회사 Heat sink assembly
CN101825402A (en) * 2010-04-15 2010-09-08 镇江市东亚电子散热器有限公司 Method for enhancing heat radiation effect of water-cooling radiator and water-cooling radiator
CN102790027A (en) * 2012-08-27 2012-11-21 无锡市福曼科技有限公司 Multi-runner water-cooling device for computer CPU (central processing unit)
KR200477833Y1 (en) * 2014-05-02 2015-07-28 매니코어소프트주식회사 Cooling device
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KR100498276B1 (en) * 2002-11-19 2005-06-29 월드이노텍(주) Cooling Device
KR100677617B1 (en) * 2005-09-29 2007-02-02 삼성전자주식회사 Heat sink assembly
US7388746B2 (en) 2005-09-29 2008-06-17 Samsung Electronics Co., Ltd. Heatsink assembly
CN101825402A (en) * 2010-04-15 2010-09-08 镇江市东亚电子散热器有限公司 Method for enhancing heat radiation effect of water-cooling radiator and water-cooling radiator
CN102790027A (en) * 2012-08-27 2012-11-21 无锡市福曼科技有限公司 Multi-runner water-cooling device for computer CPU (central processing unit)
KR200477833Y1 (en) * 2014-05-02 2015-07-28 매니코어소프트주식회사 Cooling device
WO2015167295A1 (en) * 2014-05-02 2015-11-05 Manycoresoft Co., Ltd. Cooling device
WO2015199410A1 (en) * 2014-06-23 2015-12-30 Manycoresoft Co., Ltd. Cooling device

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