KR20020019941A - Ground - Google Patents

Ground Download PDF

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Publication number
KR20020019941A
KR20020019941A KR1020020004879A KR20020004879A KR20020019941A KR 20020019941 A KR20020019941 A KR 20020019941A KR 1020020004879 A KR1020020004879 A KR 1020020004879A KR 20020004879 A KR20020004879 A KR 20020004879A KR 20020019941 A KR20020019941 A KR 20020019941A
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KR
South Korea
Prior art keywords
pipe
copper
copper pipe
grounding
molding
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KR1020020004879A
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Korean (ko)
Inventor
조옥현
Original Assignee
조옥현
손석기
(주) 태화전공
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Application filed by 조옥현, 손석기, (주) 태화전공 filed Critical 조옥현
Priority to KR1020020004879A priority Critical patent/KR20020019941A/en
Publication of KR20020019941A publication Critical patent/KR20020019941A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/66—Connections with the terrestrial mass, e.g. earth plate, earth pin
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G13/00—Installations of lightning conductors; Fastening thereof to supporting structure
    • H02G13/40—Connection to earth
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G13/00—Installations of lightning conductors; Fastening thereof to supporting structure
    • H02G13/80—Discharge by conduction or dissipation, e.g. rods, arresters, spark gaps
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G9/00—Installations of electric cables or lines in or on the ground or water
    • H02G9/02—Installations of electric cables or lines in or on the ground or water laid directly in or on the ground, river-bed or sea-bottom; Coverings therefor, e.g. tile

Abstract

PURPOSE: An earthing device is provided to maintain an earthing resistance permanently and to distribute a surge voltage rapidly and widely. CONSTITUTION: An earthing device includes a copper pipe, a mold body(1), and a connection terminal(4). The copper pipe is filled with an earthing resistance reduction agent in a gel state. A pipe cover(9) is combined with each of both ends of the copper pipe to seal the pipe. A copper wire is placed inside the copper pipe. The mold body molds a mixture of graphite, cement and sand into a shape surrounding the pipe. The connection terminal is combined with each of both ends of the copper wire exposed to the outside.

Description

접지장치{GROUND}Grounding Device {GROUND}

본 발명은 접지장치에 관한 것으로, 더욱 상세하게는 고압선철탑이나 고층건물, 통신장비나 전자계측장비, 전산장비, 기차레일 등의 접지를 위해 설치되는 접지장치에 관한 것이다.The present invention relates to a grounding device, and more particularly, to a grounding device installed for grounding of high-voltage wire towers, high-rise buildings, communication equipment or electronic measuring equipment, computer equipment, train rails and the like.

일반적으로, 접지장치는 땅속에 매설되어 고압선철탑이나 고층건물, 통신장비나 전자계측장비, 전산장비, 기차레일 등을 대지에 전기적으로 접속함으로써 과부하나 낙뢰 등과 같은 서지전압을 대지로 안전하게 확산시키게 되고, 이로써 상기와 같은 장비가 과부하나 낙뢰 등과 같은 서지전압에 의해 손상되는 현상을 차단하게 된다.In general, the grounding device is buried in the ground and electrically connects high voltage wire towers, high-rise buildings, communication equipment, electronic measuring equipment, computing equipment, train rails, etc. to the ground to safely spread surge voltages such as overload and lightning, etc. to the ground. This prevents the above equipment from being damaged by surge voltage such as overload or lightning.

종래의 접지장치에는 굴착된 땅속에 나동선을 한개이상 연결하여 삽입하고 접지저항 저감제를 유입하거나, 동판에 나동선을 연결하여 굴착된 땅속에 넣고 접지저항 저감제를 도포하는 등의 방식을 채택하고 있다.The conventional grounding device adopts a method such as inserting one or more bare wires into the excavated ground and injecting a grounding resistance reducing agent, or connecting the bare copper wire to the copper plate and putting it into the excavated ground and applying a grounding resistance reducing agent. .

이러한 종래의 접지장치는 나동선 또는 동판의 접지전극과 토양과의 전기적 접촉저항인 접지저항을 낮추기 위하여 접지저항 저감제를 사용하게 되는데, 토양의 성분이나 수분의 양에 따라 접지저항이 달라지기 때문에 일정한 접지저항을 유지하기 위해서라도 접지저항 저감제의 투입량이 유지되어야 하나, 사용중 투입된 접지저항 저감제가 유실되기 때문에 설정된 접지저항을 유지할 수 없게 되고, 이로써 제대로 접지가 이루어지지 못하는 문제가 있다.The conventional grounding device uses a grounding resistance reducing agent to lower the grounding resistance, which is an electrical contact resistance between the ground electrode of the copper wire or copper plate and the soil, and the grounding resistance varies depending on the soil composition or the amount of moisture. In order to maintain the grounding resistance, the input amount of the grounding resistance reducing agent should be maintained, but the grounding resistance reducing agent introduced during use is lost, so that the set grounding resistance cannot be maintained, thereby failing to properly ground.

결국, 종래의 접지장치는 시공 후 일정한 접지저항을 유지하기 위하여 지속적으로 접지저항 저감제를 보충하여야 하고, 기존의 접지저항 저감제의 경우 강전해질을 함유하고 있어 다량 사용하게 되면 나동선을 부식시키게 되는 등의 문제를 발생시키게 된다.As a result, the conventional grounding device must continuously replenish the grounding resistance reducing agent to maintain a constant grounding resistance after construction, and the existing grounding resistance reducing agent contains a strong electrolyte, which causes corrosion of bare wires when used in large quantities. Will cause problems.

본 발명은 이러한 종래의 문제점을 개선하기 위하여 안출된 것으로, 고압선철탑이나 고층건물, 통신장비나 전자계측장비, 전산장비, 기차레일 등의 접지를 위해 설치되는 장치로서, 밀폐된 동파이프에 겔형태의 접지저항 저감제를 충전하여나동선을 감쌈으로써 설정된 접지저항을 영구적으로 유지할 수 있고, 동파이프의 외부에 전도체인 성형몸체를 성형하여 토양과의 접촉면적을 극대화함으로써 서지전압을 신속하고도 광범위하게 확산시킬 수 있으며, 지형조건 및 접지저항값에 따라 그 시공이 용이한 접지장치를 제공함에 그 목적이 있다.The present invention has been made in order to improve such a conventional problem, the device is installed for the grounding of high-voltage wire towers, high-rise buildings, communication equipment, electronic measurement equipment, computer equipment, train rail, etc., a gel type in a sealed copper pipe It is possible to maintain the set ground resistance permanently by filling the ground resistance reducing agent of copper and to wrap the copper wire and to maximize the contact area with the soil by forming a molded body which is a conductor on the outside of the copper pipe. The purpose of the present invention is to provide a grounding device that can be diffused and easy to install according to the topographical conditions and grounding resistance values.

도1은 본 발명에 따른 접지장치의 일 실시예를 나타내는 사시도,1 is a perspective view showing an embodiment of a grounding apparatus according to the present invention;

도2는 본 발명에 따른 접지장치를 나타내는 부분절개 사시도,2 is a partial cutaway perspective view showing a grounding apparatus according to the present invention;

도3은 본 발명에 따른 접지장치의 다른 실시예를 나타내는 사시도,3 is a perspective view showing another embodiment of the grounding apparatus according to the present invention;

도4a 및 도4b는 본 발명에 따른 접지장치의 연결방법을 나타내는 예시도이다.4A and 4B are exemplary views illustrating a connection method of a grounding device according to the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

1: 성형몸체 2: 동파이프 3: 나동선 4: 연결터미널 6: 접지저항 저감제 7: 고정마개 9: 파이프덮개 10: 도포층성형홈 11: 수공 13: 전도체도포층DESCRIPTION OF SYMBOLS 1: Molded body 2: Copper pipe 3: Bare wire 4: Connection terminal 6: Grounding resistance reducer 7: Fixing plug 9: Pipe cover 10: Coating layer forming groove 11: Handmade 13: Conductor coating layer

상기한 목적을 달성하기 위하여 본 발명은 그 내부에 나동선을 관통시키고 겔상태의 접지저항저감제를 충전한 후, 그 양단에 각각 파이프덮개를 고정 결합하여 밀폐시킨 동파이프와; 흑연과 시멘트, 모래로 조성된 혼합물을 성형몰드에서 상기 동파이프를 감싸도록 성형시킨 성형몸체와; 상기 파이프덮개의 외측으로 노출된 상기 나동선의 양단에 각각 고정 결합시킨 연결터미널;로 구성되는 것을 특징으로 하는 접지장치를 제공하게 된다.In order to achieve the above object, the present invention includes a copper pipe which penetrates a bare copper wire therein and fills a ground resistance reducing agent in a gel state, and seals a pipe cover at both ends of the copper pipe; A molding body formed of a mixture made of graphite, cement, and sand so as to surround the copper pipe in a molding mold; It is to provide a grounding device comprising a; connecting terminal fixedly coupled to both ends of the bare copper wire exposed to the outside of the pipe cover.

이하, 첨부된 도면을 참조하여 본 발명을 상세히 설명하기로 한다.Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

도1은 본 발명에 따른 접지장치의 일 실시예를 나타내는 사시도이고, 도2는 본 발명에 따른 접지장치를 나타내는 부분절개 사시도이며, 도3은 본 발명에 따른 접지장치의 다른 실시예를 나타내는 사시도이고, 도4a 및 도4b는 본 발명에 따른 접지장치의 연결방법을 나타내는 예시도이다.1 is a perspective view showing an embodiment of a grounding device according to the present invention, Figure 2 is a partial cutaway perspective view showing a grounding device according to the present invention, Figure 3 is a perspective view showing another embodiment of a grounding device according to the present invention 4A and 4B are exemplary views illustrating a connection method of a grounding device according to the present invention.

본 발명에서는 동파이프(2)의 내부를 관통하도록 나동선(3)을 끼워넣은 후, 고농도의 접지저항 저감제(6)를 겔(Gel)상태로 동파이프에 충전시키게 되고, 이러한 상태에서 동파이프의 양단측에 파이프덮개(9)를 억지끼움상태로 고정 결합시켜 동파이프를 밀봉시키게 된다.In the present invention, after inserting the bare copper wire (3) to penetrate the inside of the copper pipe (2), a high concentration of ground resistance reducing agent (6) is filled in the copper pipe in a gel (Gel) state, in this state copper pipe The pipe cover 9 is fixedly coupled to the both ends of the interference fit state to seal the copper pipe.

여기서, 출원(출원번호 10-2000-9554)된 바 있는 접지저항 저감제(6)는 강전해질을 함유하는 기존의 저감제와 달리 중성전해질로 이루어져 동파이프(2)나 나동선(3)을 부식시키지 않게 된다.Here, the grounding resistance reducing agent (6), which has been filed (Application No. 10-2000-9554), is made of a neutral electrolyte, unlike the existing reducing agent containing a strong electrolyte, so as not to corrode the copper pipe (2) or the bare copper wire (3). Will not.

이처럼 파이프덮개(9)에 의해 밀봉된 동파이프(2)내에서 나동선(3)을 겔상태의 접지저항 저감제(6)로 감쌈으로써 토양과의 전기적 접촉저항인 접지저항을 60%이상 저감할 수 있게 된다.In this way, in the copper pipe 2 sealed by the pipe cover 9, the bare copper wire 3 is wrapped with the ground resistance reducing agent 6 in a gel state to reduce the ground resistance, which is an electrical contact resistance with the soil, by 60% or more. It becomes possible.

그리고, 나동선(3)과 접지저항 저감제(6)를 넣은 상태에서 밀봉된 동파이프(2)를 성형몰드에 넣고서 성형몸체(1)를 성형하게 되는데, 이때 성형몸체는 그 중심이 동파이프에 의해 관통되도록 성형이 이루어지게 된다.Then, the sealed copper pipe 2 is inserted into the molding mold in the state where the bare copper wire 3 and the ground resistance reducing agent 6 are put therein, and the molding body 1 is formed at the center of the molding body. Molding is made to penetrate by.

여기서, 성형몸체(1)는 흑연, 시멘트, 모래(규사)를 적정한 비율로 혼합하여 조성되며, 특히 전기의 양도체인 흑연을 혼합함으로써 전도성을 띠게 된다.Here, the molding body 1 is formed by mixing graphite, cement, sand (silica sand) in an appropriate ratio, and in particular, it becomes conductive by mixing graphite, which is a good conductor of electricity.

더욱이, 성형몸체(1)는 직육면체로 성형되어 있으나 땅속의 토양과 접하는 면적을 최대한 넓히기 위하여 원통형 등 여러가지 형상으로 성형될 수 있으며, 이로써 나동선(3)을 통해 전달되는 순간적인 서지전압을 신속하고도 광범위하게 대지로 확산시킬 수 있게 된다.Moreover, the molded body 1 is molded into a rectangular parallelepiped, but can be molded into various shapes such as a cylindrical shape in order to maximize the area of contact with the soil in the ground, thereby rapidly reducing the instantaneous surge voltage transmitted through the bare copper wires 3. It will be able to spread to the ground widely.

또한, 성형몸체(1)에는 양단측면을 제외한 각 측면에 하나 이상의 도포층성형홈(10)을 길이방향으로 성형하게 되고, 이 도포층성형홈(10)에 전도체인 은가루나 동가루 등을 경화시켜 만들어지는 전도체도포층(13)을 형성시키게 된다.In addition, the molding body 1 is formed by molding one or more coating layer forming grooves 10 in the longitudinal direction on each side except for both end sides, and hardening silver powder or copper powder, which is a conductor, in the coating layer forming grooves 10. The conductive coating layer 13 is made to form.

그리고, 전도체도포층(13)을 따라 다수의 수공(11)을 일정간격으로 이격하여 형성시키되 수공의 깊이가 전도체도포층과 성형몸체(1)를 관통하여 동파이프(2)의외주면에 이르도록 성형하게 된다.Then, a plurality of holes 11 are formed at regular intervals along the conductor coating layer 13 so that the depth of the hand passes through the conductor coating layer and the molding body 1 to reach the outer circumferential surface of the copper pipe 2. Molding.

여기서, 하나이상의 전도체도포층(13)은 성형몸체(1)와 토양 사이의 전위차를 현저히 감소시키면서 성형몸체(1)의 전도율을 향상시키어 고압의 서지전압을 신속하게 토양으로 전달하는 기능을 하게 된다.Here, the one or more conductor coating layers 13 improves the conductivity of the molded body 1 while significantly reducing the potential difference between the molded body 1 and the soil, thereby quickly delivering a high voltage surge voltage to the soil. .

특히, 다수의 수공(11)에는 토양으로부터의 수분이 충전되면서 동파이프(2)로 전달되는 일부의 서지전압을 충전되어 있는 수분을 이용하여 바로 토양으로 전달 확산시키게 된다.In particular, a number of hand 11 is filled with the moisture from the soil while some of the surge voltage delivered to the copper pipe (2) by using the moisture is filled to spread directly to the soil.

한편, 성형몸체(1)의 양단측으로 연장 돌출되는 동파이프(2)의 양단부에 각각 파이프덮개(9)를 억지끼움방식으로 결합시켜 동파이프를 밀폐시키게 되고, 다시 파이프덮개의 외측으로 연장되는 나동선(3)에 각각 고정마개(7)를 끼워 압착시키게 되면 고정마개에 의해 파이프덮개의 외측으로의 이탈을 방지하게 된다.On the other hand, the pipe cover 9 is coupled to the both ends of the copper pipe (2) protruding to both ends of the molded body (1) in an interference fit manner to seal the copper pipe, and again to the outer side of the pipe cover When each of the fixing stopper (7) is fitted in the (3) to be pressed to prevent the departure to the outside of the pipe cover by the fixing stopper.

그리고, 나동선(3)의 양 끝단에 각각 동재료의 연결터미널(4)을 끼워 고정시키게 되고, 연결터미널을 서로 중첩시켜 볼트로 조이면 각 나동선이 전기적으로 연결된다.Then, the connecting terminals 4 of the copper material are fixed to both ends of the bare wires 3, and the bare wires are electrically connected by overlapping the connecting terminals with each other and tightening the bolts.

여기서, 도4a 및 도4b에 도시한 바와 같이 본 발명에 따른 접지장치를 직렬 및 병렬연결 또는 메시연결 등으로 전기적 연결이 가능하며, 이러한 연결방법은 시공지형의 여러조건에 따라 선택할 수 있으며, 설정하고자 하는 접지저항값에 따라 전기적 연결방법을 달리 선택할 수 있다.4A and 4B, the grounding device according to the present invention can be electrically connected in series and parallel connection or mesh connection, and such a connection method can be selected according to various conditions of construction type. The electrical connection method can be selected differently according to the ground resistance value.

본 발명은 밀폐된 동파이프에 겔형태의 접지저항 저감제를 충전하여 나동선을 감쌈으로써 설정된 접지저항을 영구적으로 유지할 수 있고, 동파이프의 외부에 전도체인 성형몸체를 성형하여 토양과의 접촉면적을 극대화함으로써 서지전압을 신속하고도 광범위하게 확산시킬 수 있으며, 지형조건 및 접지저항값에 따라 그 시공이 매우 용이한 효과를 제공하게 된다.The present invention can permanently maintain the ground resistance set by filling a copper-type ground resistance reducing agent in a sealed copper pipe to wrap bare copper wires, and forming a molded body as a conductor on the outside of the copper pipe to improve the contact area with soil. By maximizing, surge voltage can be spread quickly and widely, and its construction is very easy depending on the terrain conditions and ground resistance values.

Claims (3)

그 내부에 나동선(3)을 관통시키고 겔상태의 접지저항저감제(6)를 충전한 후, 그 양단에 각각 파이프덮개(9)를 고정 결합하여 밀폐시킨 동파이프(2)와;A copper pipe (2) through which a bare copper wire (3) is penetrated therein and filled with a ground resistance reducing agent (6) in a gel state, and the pipe covers (9) are fixedly coupled to both ends thereof; 흑연과 시멘트, 모래로 조성된 혼합물을 성형몰드에서 상기 동파이프(2)를 감싸도록 성형시킨 성형몸체(1)와;A molding body (1) formed by molding a mixture composed of graphite, cement and sand to surround the copper pipe (2) in a molding mold; 상기 파이프덮개(9)의 외측으로 노출된 상기 나동선(3)의 양단에 각각 고정 결합시킨 연결터미널(4);로 구성되는 것을 특징으로 하는 접지장치.And a connection terminal (4) fixedly coupled to both ends of the bare copper wire (3) exposed to the outside of the pipe cover (9). 제1항에 있어서,The method of claim 1, 상기 성형몸체(1)에는 측면에 하나이상의 도포층성형홈(10)이 길이방향으로 형성되고, 상기 도포층성형홈(10)에 은가루나 동가루를 경화시킨 전도체도포층(13)이 형성되는 것을 특징으로 하는 접지장치.One or more coating layer forming grooves 10 are formed in the molding body 1 in the longitudinal direction, and a conductive coating layer 13 formed by curing silver powder or copper powder is formed in the coating layer forming grooves 10. Earthing device, characterized in that. 제1항 또는 제2항에 있어서,The method according to claim 1 or 2, 상기 전도체도포층(13)에는 다수의 수공(11)이 상기 성형몸체(1)를 거쳐 동파이프(2)의 외주면에 이르는 깊이로 형성되는 것을 특징으로 하는 접지장치.The conductor applying layer (13) is a grounding device, characterized in that a plurality of hands (11) are formed to a depth reaching the outer peripheral surface of the copper pipe (2) via the molding body (1).
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100610604B1 (en) * 2005-02-04 2006-08-09 (주)의제전기설비연구원 A carbon low-resistance grounding module and the method of the same
WO2007049834A1 (en) * 2005-10-25 2007-05-03 Kui-Yeun Kim The constitution and method making of the stainless covered wire
KR100805958B1 (en) * 2007-06-12 2008-02-21 (주)의제전기설비연구원 Grounding electrode coated with nano metal and manufacturing method thereof
KR101064342B1 (en) * 2011-05-19 2011-09-14 (주)옴니엘피에스 A graphite carbon grounding module and the method of the same
CN103001098A (en) * 2012-12-04 2013-03-27 铜川供电局 Method for improving anti-corrosion capacity of grounding grid of transmission line tower
KR101477460B1 (en) * 2014-04-16 2014-12-29 조옥현 Grounding apparatus
KR20150089906A (en) * 2014-01-27 2015-08-05 제룡산업 주식회사 sheet type ground plate
KR20160016331A (en) * 2014-08-05 2016-02-15 제룡산업 주식회사 Sheet type ground plate, and grounding construction of an electric pole utilizing the same
CN106992365A (en) * 2017-05-08 2017-07-28 河南中多科技发展有限公司 A kind of expansion type earthing or grounding means and its earthing method
CN109616786A (en) * 2018-12-14 2019-04-12 国网山东省电力公司济南供电公司 A kind of transmission line of electricity surge water conservancy diversion earthing or grounding means
KR20200117126A (en) * 2019-04-03 2020-10-14 주식회사 티지오 Improved earthing discharge device
CN112332126A (en) * 2020-12-03 2021-02-05 河南四达电力设备股份有限公司 Graphite-based flexible grounding device for high-soil-resistivity area power distribution network
CN113270738A (en) * 2021-05-28 2021-08-17 国网河南省电力公司西峡县供电公司 Improved structure of grounding down lead of power transmission line tower

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JPH07153542A (en) * 1993-12-01 1995-06-16 Three Bond Co Ltd Manufacture of grounding electrode
JPH08165647A (en) * 1994-12-15 1996-06-25 Kurosawa Kensetsu Kk Ground anchor construction method and its fixation member
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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100610604B1 (en) * 2005-02-04 2006-08-09 (주)의제전기설비연구원 A carbon low-resistance grounding module and the method of the same
WO2007049834A1 (en) * 2005-10-25 2007-05-03 Kui-Yeun Kim The constitution and method making of the stainless covered wire
KR100805958B1 (en) * 2007-06-12 2008-02-21 (주)의제전기설비연구원 Grounding electrode coated with nano metal and manufacturing method thereof
KR101064342B1 (en) * 2011-05-19 2011-09-14 (주)옴니엘피에스 A graphite carbon grounding module and the method of the same
CN103001098B (en) * 2012-12-04 2015-04-22 铜川供电局 Method for improving anti-corrosion capacity of grounding grid of transmission line tower
CN103001098A (en) * 2012-12-04 2013-03-27 铜川供电局 Method for improving anti-corrosion capacity of grounding grid of transmission line tower
KR20150089906A (en) * 2014-01-27 2015-08-05 제룡산업 주식회사 sheet type ground plate
KR101477460B1 (en) * 2014-04-16 2014-12-29 조옥현 Grounding apparatus
KR20160016331A (en) * 2014-08-05 2016-02-15 제룡산업 주식회사 Sheet type ground plate, and grounding construction of an electric pole utilizing the same
CN106992365A (en) * 2017-05-08 2017-07-28 河南中多科技发展有限公司 A kind of expansion type earthing or grounding means and its earthing method
CN109616786A (en) * 2018-12-14 2019-04-12 国网山东省电力公司济南供电公司 A kind of transmission line of electricity surge water conservancy diversion earthing or grounding means
KR20200117126A (en) * 2019-04-03 2020-10-14 주식회사 티지오 Improved earthing discharge device
CN112332126A (en) * 2020-12-03 2021-02-05 河南四达电力设备股份有限公司 Graphite-based flexible grounding device for high-soil-resistivity area power distribution network
CN113270738A (en) * 2021-05-28 2021-08-17 国网河南省电力公司西峡县供电公司 Improved structure of grounding down lead of power transmission line tower
CN113270738B (en) * 2021-05-28 2022-10-18 国网河南省电力公司西峡县供电公司 Improved structure of grounding down lead of transmission line tower

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