KR20020013674A - Folded meander line type multi-layered Chip Dielectric Ceramic Antenna - Google Patents

Folded meander line type multi-layered Chip Dielectric Ceramic Antenna Download PDF

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KR20020013674A
KR20020013674A KR1020000047073A KR20000047073A KR20020013674A KR 20020013674 A KR20020013674 A KR 20020013674A KR 1020000047073 A KR1020000047073 A KR 1020000047073A KR 20000047073 A KR20000047073 A KR 20000047073A KR 20020013674 A KR20020013674 A KR 20020013674A
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South Korea
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antenna
dielectric
chip antenna
folded
layer dielectric
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KR1020000047073A
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Korean (ko)
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KR100378861B1 (en
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우종명
이종환
김현학
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우종명
김왕섭
(주)쎄라스택
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q11/00—Electrically-long antennas having dimensions more than twice the shortest operating wavelength and consisting of conductive active radiating elements
    • H01Q11/02—Non-resonant antennas, e.g. travelling-wave antenna
    • H01Q11/08—Helical antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas

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Abstract

PURPOSE: A multi-layer dielectric chip antenna having a surface mounting folded meander line structure is provided to reduce size and thickness of the antenna and be mounted on a surface of an electric appliance. CONSTITUTION: A multi-layer dielectric chip antenna comprises multi-layer dielectric block, a conductor strip of a shape of a meander line folded over the dielectric block. The multi-layer dielectric chip antenna is manufactured by forming Ag electrodes to reduce internal conductor loss during a chip process and a hole for connecting the Ag electrodes. The dielectric block is a low temperature fired dielectric that is co-fired with the Ag electrodes and has a dielectric index of 6-7 and a quality coefficient of 5000-7000. The multi-layer dielectric chip antenna is attached to a surface of a circuit board of a co-planar wave guide feeding structure having a ground plane, with a feeding line extended above the ground plane and connecting an antenna feeding point(1) to a substrate feeding line.

Description

표면실장형 폴디드 민더라인 구조의 적층형 유전체 세라믹 칩 안테나{Folded meander line type multi-layered Chip Dielectric Ceramic Antenna}Folded meander line type multi-layered Chip Dielectric Ceramic Antenna}

본 발명은 기존의 헬리컬 구조의 적층형 유전체 칩 안테나의 협대역 및 저이득의 단점을 보완하기 위해 방사소자인 도체띠를 폴디드 민더라인 구조 및 스테핑 헬리컬 구조로 적층형 유전체 봉상에 형성시킴으로써 도체띠간의 간격을 이격시켜 상호결합을 줄이고 수평편파출력에 기여하는 수직소자의 배열을 일치시킴으로써 광대역화 및 이득향상을 목적으로 한 표면실장형 민더라인 구조및 스텝핑 헬리컬 구조의 적층형 세라믹 유전체 칩 안테나 발명에 관한 것이다.In order to compensate for the narrow band and low gain of the conventional helical stacked dielectric chip antenna, the present invention provides a conductor band as a radiating element on a stacked dielectric rod by using a folded midder line structure and a stepping helical structure. The invention relates to the invention of a multilayer ceramic dielectric chip antenna with a surface-mounted meander line structure and a stepping helical structure for the purpose of widening and gain by matching the arrangement of vertical elements contributing to the horizontal polarization output and reducing mutual coupling by spacing. will be.

본 발명이 속하는 기술분야는 무선휴대단말기및 가전기기등에 사용되는 안테나 분야이다.The technical field to which the present invention belongs is the field of antennas used in wireless portable terminals and home appliances.

종래의 휩 안테나의 경우 단말기에 장착될 때 돌출이 되어 파손의 위험이 있고 단말기 외부에 전류가 흐르게 되는 단점이 있다. 또한 단말기내에 사용되는 판형 역F 안테나 역시 그 크기를 감소시키는 데 제한이 있어 단말기 부피를 줄이는것이 제한된다. 한편 단말기 내부 회로기판상에 표면장착시킬 수 있는 기존의 칩안테나는 벌크(bulk)형이거나 헬리컬 구조의 적층형 유전체 칩 안테나들이 있으나 이들은 편파특성이 좋지 않거나 협대역인 경우가 대부분이다.Conventional whip antennas are protruded when mounted to a terminal, which may cause damage and cause current to flow outside the terminal. Also, the plate inverted-F antenna used in the terminal is also limited in reducing its size, thereby reducing the terminal volume. On the other hand, existing chip antennas that can be surface mounted on the internal circuit board of the terminal are bulk or helical stacked dielectric chip antennas, but they are often poor polarization characteristics or narrow band.

본 발명의 표면실장형 폴디드 민더라인 구조의 적층형 세라믹 유전체 칩 안테나는 [도 1] 과 [도 2] 에서 나타낸 바와 같이 소형의 칩 안테나를 회로 기판상에 부착하여 사용하므로 안테나 위치공간을 줄일 수 있으나 접지면이 작을 경우 접지면에 흐르는 전류가 크게 되어 패턴에 다소 영향을 받게 된다. 따라서 작은 접지면으로도 충분한 접지효과를 얻을 수 있도록 이에 대한 개선이 요구되기도 한다.The stacked ceramic dielectric chip antenna of the surface-mounted folded midder line structure according to the present invention uses a small chip antenna attached to a circuit board as shown in FIG. 1 and FIG. However, if the ground plane is small, the current flowing in the ground plane becomes large and the pattern is affected. Therefore, improvement is required to obtain a sufficient grounding effect even with a small ground plane.

[도 1] 는 민더라인(meander line) 형태를 가진 도체띠를 적층형 직육면체 유전체상에 접은 형태(Folded)로 형성시킨 폴디드 민더라인 구조의 적층형 유전체 세라믹 칩 안테나의 구조.1 is a structure of a laminated dielectric ceramic chip antenna having a folded midder line structure in which a conductor strip having a meander line shape is formed in a folded form on a laminated rectangular parallelepiped dielectric.

[도 2] 는 코플레나 급전(Co-planar feeding) 상에 폴디드 민더라인 구조의 적층형 세라믹 유전체 칩 안테나의 표면실장된 구조.FIG. 2 is a surface mounted structure of a stacked ceramic dielectric chip antenna of folded midder line structure on Co-planar feeding. FIG.

[도 3] 은 [도 1] 에서의 안테나 상부면상의 도체띠를 경사지게 형성하여 수직부분을 일치시켰으며 배면의 도체띠를 수평으로 형성시킨 표면실장형 폴디드 민더라인 구조의 적층형 유전체 세라믹 칩 안테나의 구조3 is a multilayer dielectric ceramic chip having a surface-mounted folded midder line structure in which the conductor bands on the top surface of the antenna in FIG. 1 are inclined to match the vertical parts, and the conductor bands on the back surface are formed horizontally. Structure of antenna

[도 4] 는 계단형 도체띠를 적층형 직육면체 유전체상에 접힌 헬릭스형으로 형성시킨 스텝핑 헬리컬 구조의 적층형 유전체 안테나의 구조4 is a structure of a stepped helical structure laminated dielectric antenna in which a stepped conductor strip is formed in a helix shape folded on a stacked rectangular parallelepiped dielectric.

[도 5] 는 기존의 헬리컬 구조의 적층형 칩 안테나의 구조5 is a structure of a stacked chip antenna of a conventional helical structure

[도 6] 은 [도 1] 의 표면실장형 폴디드 민더라인 구조의 적층형 세라믹 유전체 칩 안테나의 반사손실FIG. 6 is a reflection loss of the multilayer ceramic dielectric chip antenna of the surface-mounted folded midder line structure of FIG.

[도 7] 은 [도 1] 의 표면실장형 폴디드 민더라인 구조의 적층형 세라믹 유전체 칩 안테나의 H-면 패턴.FIG. 7 is an H-plane pattern of the multilayer ceramic dielectric chip antenna of the surface-mounted folded midder line structure of FIG. 1. FIG.

[도 8] 은 [도 1] 의 표면실장형 폴디드 민더라인 구조의 적층형 유전체 세라믹 칩 안테나의 E-면 패턴.FIG. 8 is an E-plane pattern of a stacked dielectric ceramic chip antenna of the surface mount folded midder line structure of FIG. 1. FIG.

[도 1] , [도 2] , [도 3] , [도 4] , [도 5] 에서 ① : 급전점, ② : 상부면상의 수평방사소자, ③ : 상부면상의 수직방사소자, ④ : 고정점, ⑤ : 하부면상의 수평방사소자, ⑥ : 하부면상의 수직방사소자, ⑦ : 상부면 방사소자, ⑧ : 하부면 방사소자.[Fig. 1], [Fig. 2], [Fig. 3], [Fig. 4], [Fig. 5], ①: feeding point, ②: horizontal radiating element on the upper surface, ③: vertical radiating element on the upper surface, ④: Fixed point, ⑤: horizontal radiating element on the lower surface, ⑥: vertical radiating element on the lower surface, ⑦: upper radiating element, ⑧: lower radiating element.

본 발명의 안테나는 소형화·경량화를 위해 칩공정을 이용하였다. 칩공정시 내부도체손실을 감소시키기 위해 Ag전극을 사용하였고 내부에 Ag전극을 연결하기 위하여 홀을 형성시켜 Ag전극을 상하로 연결하였다. Ag전극과 동시소결이 가능하도록 ZnCoNb2O6에 Glass(SiO2-B2O3계)를 첨가시켜 유전율이 6∼7이고 품질계수가 5000∼7000인 저온소결용 세라믹 유전체 조성을 이용하여 도체띠로 이루어진 패턴설계과정과 칩 공정을 통해 PCS 주파수 대역을 전부 포함하는 경량화 및 소형화된 적층형 세라믹 유전체 칩 안테나를 제작하였다. 또한 본 발명의 안테나는 현재 사용중인 휴대단말기의 회로기판에 직접 적용할 수 있도록 [도 2] 에 나타낸 바와 같이 접지면을 갖는 코플레나웨이브가이드 급전구조의 회로기판표면에 부착하여 연결하여 사용되어질 수 있도록 설계되었다. 이 때 기판의 안테나 부착면에서 급전선을접지면 위로 연장하여 형성시켜 안테나 급전점과 기판의 급전선을 연결시킴으로써 안테나를 부착하였다.The antenna of the present invention uses a chip process for downsizing and weight reduction. The Ag electrode was used to reduce the internal conductor loss during the chip process, and the Ag electrode was connected up and down by forming a hole to connect the Ag electrode inside. Glass (SiO 2 -B 2 O 3 type ) is added to ZnCoNb 2 O 6 to co-sinter with the Ag electrode. Through the pattern design process and chip process, the light weighted and miniaturized multilayer ceramic dielectric chip antenna including the PCS frequency band was fabricated. In addition, the antenna of the present invention is to be used by attaching to the circuit board surface of the coplanar waveguide feeding structure having a ground plane as shown in Figure 2 so that it can be applied directly to the circuit board of the mobile terminal in use. It was designed to be. At this time, the antenna was attached by connecting the feed point of the antenna and the feed line of the substrate by extending the feed line from the antenna attachment surface of the substrate to the ground plane.

[도 6] 은 [도 1] 에 나타낸 본 발명의 안테나의 반사손실 특성을 나타낸 것이다. 측정 결과 주파수 1.81GHz에서 반사손실 26.616dB, -10dB 대역폭은 152MHz로 나타났다. 이 대역폭은 현재 사용되고 있는 PCS 주파수 대역을 전부 포함할 수 있는 대역폭이다. 따라서 본 발명의 칩 안테나 1개만으로 PCS 대역 송신과 수신이 동시에 가능하다고 할 수 있다.FIG. 6 shows the return loss characteristic of the antenna of the present invention shown in FIG. The measurement result shows that the return loss 26.616dB and -10dB bandwidth is 152MHz at 1.81GHz. This bandwidth can cover all of the PCS frequency bands currently in use. Therefore, it can be said that only one chip antenna of the present invention can transmit and receive the PCS band simultaneously.

[도 7] 은 본 발명의 안테나의 H-면 방사패턴을 나타낸다. 약 2dB정도의 레벨차이는 보이고 있으나 거의 전방향성 패턴 특성이 나타나고 있으며 H-면 평균이득은 약 -9dBd이다.7 shows the H-plane radiation pattern of the antenna of the present invention. The level difference of about 2dB is shown, but the omnidirectional pattern characteristic is shown, and the average gain of H-plane is about -9dBd.

[도 8] 은 본 발명의 안테나의 E-면 방사패턴을 나타낸다. 완벽한 8자형 패턴은 아니지만 전체적으로 볼 때 충분한 8자형 패턴의 범주에 들어간다고 할 수 있어 모노폴의 방사패턴 특성을 보였다.8 shows an E-plane radiation pattern of the antenna of the present invention. Although it is not a perfect 8-shaped pattern, it can be said to fall into the category of sufficient 8-shaped pattern as a whole.

본 발명의 안테나는 무선휴대단말기에 사용되는 기존의 휩 안테나와 판형 역F 안테나를 대체할 수 있는 칩 안테나로서 모노폴 안테나와 유사한 특성을 가지며 휩 안테나와 판형 역F 안테나의 경우와는 달리 회로기판상에 직접 부착할 수 있고 작은 접지면을 필요로 하기 때문에 단말기의 부피를 감소시킬 수 있다. 또한 소형으로 가전기기등에 부착할 시 기기외관의 손상없이 작은 공간에 표면부착할 수 있는 특징이 있으며 세라믹 시트의 적층생산 기법에 의해 저가로 대량생산이 가능하여 경제적이라 할 수 있다.The antenna of the present invention is a chip antenna that can replace the conventional whip antenna and the plate inverted F antenna used in the wireless portable terminal, and has similar characteristics to the monopole antenna, and unlike the case of the whip antenna and the plate inverted F antenna, It can be attached directly to and requires a small ground plane, reducing the volume of the terminal. In addition, when it is small and attached to home appliances, it can be attached to a small space without damaging the appearance of the device. It is economical because mass production is possible at low cost by the laminated production technique of ceramic sheet.

Claims (4)

세라믹 유전체상에 도체띠를 [도 1] 에 나타낸 바와 같이 폴디드 민더라인 구조를 좌우 상측으로 감아올린 폴디드 민더라인 구조의 적층형 세라믹 유전체 칩 안테나.1. A multilayer ceramic dielectric chip antenna having a folded midder line structure in which a conductor band is wound on a ceramic dielectric on a left and right side as shown in FIG. 1. 청구항 1에 있어서 수직도체띠를 일직선으로 일치시킨 폴디드 민더라인구조의 적층형 세라믹 유전체 칩 안테나.The multilayer ceramic dielectric chip antenna of claim 1, wherein the vertical conductor band is aligned in a straight line. 청구항 1에 있어서 하층 유전체 표면상에서의 도체띠가 수평을 이루고 상층 유전체 표면상의 수평도체띠가 경사지게 만든 폴디드 민더라인구조의 적층형 세라믹 유전체 칩 안테나.The laminated ceramic dielectric chip antenna of claim 1, wherein the conductor bands on the lower dielectric surface are horizontal and the horizontal conductor bands on the upper dielectric surface are inclined. 적층형 유전체 표면상의 도체띠를 회전시키면서 상하 유전체 표면상에서는 계단 모양의 수직도체띠로 형성시킨 스텝핑 헬리컬 구조의 적층형 세라믹 유전체 칩 안테나.A multilayer ceramic dielectric chip antenna having a stepping helical structure in which a conductor band on a laminated dielectric surface is rotated, and a stepped helical structure is formed on a vertical dielectric surface on a top and bottom dielectric surfaces.
KR10-2000-0047073A 2000-08-14 2000-08-14 Folded meander line type multi-layered Chip Dielectric Ceramic Antenna KR100378861B1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030077273A (en) * 2002-03-26 2003-10-01 조인셋 주식회사 Ceramic chip antenna
KR20040001030A (en) * 2002-06-26 2004-01-07 우종명 Miniaturized Monopole Chip Antenna
KR20040024746A (en) * 2002-09-16 2004-03-22 주식회사 오토전자 Ceramic antenna for receiving a gps signal

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3166589B2 (en) * 1995-12-06 2001-05-14 株式会社村田製作所 Chip antenna

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030077273A (en) * 2002-03-26 2003-10-01 조인셋 주식회사 Ceramic chip antenna
KR20040001030A (en) * 2002-06-26 2004-01-07 우종명 Miniaturized Monopole Chip Antenna
KR20040024746A (en) * 2002-09-16 2004-03-22 주식회사 오토전자 Ceramic antenna for receiving a gps signal

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