KR200161481Y1 - Adhesive tape - Google Patents

Adhesive tape Download PDF

Info

Publication number
KR200161481Y1
KR200161481Y1 KR19950034743U KR19950034743U KR200161481Y1 KR 200161481 Y1 KR200161481 Y1 KR 200161481Y1 KR 19950034743 U KR19950034743 U KR 19950034743U KR 19950034743 U KR19950034743 U KR 19950034743U KR 200161481 Y1 KR200161481 Y1 KR 200161481Y1
Authority
KR
Grant status
Grant
Patent type
Prior art keywords
adhesive tape
tape
adhesive
Prior art date
Application number
KR19950034743U
Inventor
Kwan-Ho Jeong
Original Assignee
Hyundai Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49175Parallel arrangements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73215Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
KR19950034743U 1995-11-22 1995-11-22 Adhesive tape KR200161481Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR19950034743U KR200161481Y1 (en) 1995-11-22 1995-11-22 Adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR19950034743U KR200161481Y1 (en) 1995-11-22 1995-11-22 Adhesive tape

Publications (1)

Publication Number Publication Date
KR200161481Y1 true KR200161481Y1 (en) 1999-11-15

Family

ID=19429761

Family Applications (1)

Application Number Title Priority Date Filing Date
KR19950034743U KR200161481Y1 (en) 1995-11-22 1995-11-22 Adhesive tape

Country Status (1)

Country Link
KR (1) KR200161481Y1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100588148B1 (en) * 2004-07-20 2006-06-09 삼성전자주식회사 Refrigerator for kimchi
KR101210120B1 (en) 2006-12-10 2012-12-07 현대자동차주식회사 Black tape jigs
KR101403864B1 (en) * 2011-12-27 2014-06-09 제일모직주식회사 Dicing die bonding film
US9274360B2 (en) 2011-11-30 2016-03-01 Samsung Display Co., Ltd. Cushion sheet and display device having the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100588148B1 (en) * 2004-07-20 2006-06-09 삼성전자주식회사 Refrigerator for kimchi
KR101210120B1 (en) 2006-12-10 2012-12-07 현대자동차주식회사 Black tape jigs
US9274360B2 (en) 2011-11-30 2016-03-01 Samsung Display Co., Ltd. Cushion sheet and display device having the same
US10076890B2 (en) 2011-11-30 2018-09-18 Samsung Display Co., Ltd. Cushion sheet and display device having the same
KR101403864B1 (en) * 2011-12-27 2014-06-09 제일모직주식회사 Dicing die bonding film

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Year of fee payment: 11

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