KR200159408Y1 - Structure of supporting die for semiconductor package manufacturing device - Google Patents
Structure of supporting die for semiconductor package manufacturing device Download PDFInfo
- Publication number
- KR200159408Y1 KR200159408Y1 KR2019970014581U KR19970014581U KR200159408Y1 KR 200159408 Y1 KR200159408 Y1 KR 200159408Y1 KR 2019970014581 U KR2019970014581 U KR 2019970014581U KR 19970014581 U KR19970014581 U KR 19970014581U KR 200159408 Y1 KR200159408 Y1 KR 200159408Y1
- Authority
- KR
- South Korea
- Prior art keywords
- plate
- bottom plate
- support
- marking device
- semiconductor package
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
본 고안은 반도체 반도체 패키지 제조장비의 받침다이구조에 관한 것으로, 저면에 바퀴가 설치되어 마킹장치의 저면으로 슬라이딩되는 바닥판과, 상기한 바닥판이 마킹장치의 저면으로 슬라이딩 될 때 이를 안내하는 가이드레일과, 상기한 가이드레일에 안내되어 바닥판이 마킹장치의 외부로 슬라이딩되면 더 이상 슬라이딩되는 것을 방지하도록 바닥판의 상면 후단에 형성된 걸림턱과, 상기한 바닥판의 상부에 설치되어 높이 조절되는 받침판과, 상기한 받침판이 높이 조절되도록 받침판의 저면에 일측이 힌지 결합되고, 타측은 바닥판의 상부에 힌지 결합된 작동링크와, 상기한 작동링크에 의해 받침판이 일정 높이로 위치되면, 상기 작동링크를 고정하는 고정구로 이루어진 것이다.The present invention relates to a support die structure of a semiconductor semiconductor package manufacturing equipment, the bottom plate is provided with a wheel on the bottom sliding to the bottom of the marking device, and the guide rail for guiding this when the bottom plate is sliding to the bottom of the marking device And, guided by the guide rail and the locking plate formed on the upper end of the bottom plate to prevent the slide further when the bottom plate is slid out of the marking device, the support plate is installed on the top of the bottom plate and the height is adjusted When one side is hinged to the bottom of the base plate to adjust the height of the base plate, the other side hinged to the upper portion of the bottom plate, and when the base plate is positioned at a predetermined height by the operation link, the operation link It is made of fasteners to fix.
Description
본 고안은 반도체 반도체 패키지 제조장비의 받침다이구조에 관한 것으로, 더욱 상세하게는 반도체 패키지 제조장비의 저면으로 슬라이딩 되도록 받침다이를 설치하여 정비를 용이하게 하도록 된 것이다.The present invention relates to a support die structure of a semiconductor semiconductor package manufacturing equipment, and more particularly, to install a support die to slide to the bottom of the semiconductor package manufacturing equipment to facilitate maintenance.
일반적으로 반도체 패키지의 제조장비는 그 크기가 비교적 크게 되어 있어, 이러한 장비를 사용자가 사용하거나, 정비를 할 때에는 별도의 받침다이를 장비의 정면에 갖다 높은 상태에서 상기한 받침다이에 올라가서 장비를 사용하거나, 정비를 하였음으로서 많은 불편이 수반되었던 것이다.In general, the manufacturing equipment of the semiconductor package is relatively large in size, so when the user uses or maintains the equipment, a separate support die is placed on the front of the equipment, and the equipment is mounted on the support die in a high state. Or maintenance, many inconveniences were involved.
또한, 이와같이 별도의 받침다이를 사용할 때 특별하게 받침다이로 제작된 것이 없음으로서 사용자가 장비의 높은 위치로 올라갈 수 있는 것을 사용함으로서 작업환경이 나쁘고, 이로 인한 안전사고의 원인이 되었던 것이다.In addition, there is no special support die when using a separate support die in this way by using the user can climb to the high position of the equipment is bad working environment, which caused the safety accident.
본 고안의 목적은 이와같은 문제점을 해소하기 위하여 안출된 것으로서, 반도체 패키지 제조장비의 저면으로 슬라이딩 되도록 받침다이를 설치함으로서 작업환경을 개선하고, 안전사고를 미연에 방지할 수 있도록 된 반도체 패키지 제조장비의 받침다이구조를 제공함에 있다.The purpose of the present invention is to solve the above problems, by installing a support die to slide to the bottom of the semiconductor package manufacturing equipment to improve the working environment and to prevent the safety accident in advance semiconductor package manufacturing equipment To provide a supporting die structure.
제1도는 본 고안에 따른 반도체 패키지 제조용 마킹장치의 정면도.1 is a front view of a marking apparatus for manufacturing a semiconductor package according to the present invention.
제2a도와 2b도는 본 고안에 따른 받침다이의 작동을 나타낸 정면도.2a and 2b is a front view showing the operation of the support die according to the present invention.
제3도는 본 고안에 따른 받침다이의 구성을 나타낸 평면도.3 is a plan view showing the configuration of the support die according to the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 바닥판 2 : 바퀴1: bottom plate 2: wheels
3 : 걸림턱 4 : 받침판3: hanging jaw 4: supporting plate
5 : 작동링크 6 : 힌지5: operation link 6: hinge
7 : 고정구 8 : 가이드레일7: Fixture 8: Guide rail
이하, 본 고안을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제1도는 본 고안에 따른 받침다이가 설치된 반도체 패키지 제조장비의 일예를 나타낸 정면도이고, 제2a도와 2b도는 본 고안에 따른 받침다이의 작동상태를 나타낸 정면도이며, 제3도는 본 고안에 따른 받침다이의 평면도이다.1 is a front view showing an example of a semiconductor package manufacturing equipment installed with a support die according to the present invention, Figures 2a and 2b is a front view showing the operating state of the support die according to the present invention, Figure 3 is a support die according to the present invention Top view of the.
도시된 바와같이 반도체 패키지 제조장비의 저면으로 슬라이딩 되도록 설치된 받침다이의 구성은, 저면에 바퀴(2)가 설치되어 마킹장치의 저면으로 슬라이딩되는 바닥판(1)과, 상기한 바닥판(1)의 마킹장치의 저면으로 슬라이딩 될 때 이를 안내하는 가이드레일(8)과, 상기한 가이드레일(8)에 안내되어 바닥판(1)의 마킹장치의 외부로 슬라이딩되면 더 이상 슬라이딩되는 것을 방지하도록 바닥판(1)의 상면 후단에 형성된 걸림턱(3)과, 상기한 바닥판(1)의 상부에 설치되어 높이 조절되는 받침판(4)과, 상기한 받침판(4)이 높이 조절되도록 받침판(4)의 저면에 일측이 힌지(6) 결합되고, 타측은 바닥판(1)의 상부에 힌지(6) 결합된 작동링크(5)와, 상기한 작동링크(5)에 의해 받침판(4)이 일정 높이로 위치되면, 상기 작동링크(5)를 고정하는 고정구(7)로 이루어지는 것이다.As shown, the configuration of the support die installed to slide to the bottom of the semiconductor package manufacturing equipment, the bottom plate (1) and the bottom plate (1) which is provided with wheels (2) on the bottom sliding to the bottom of the marking device, Guide rails (8) for guiding them when sliding to the bottom of the marking device of the, and guided to the guide rails (8) when sliding to the outside of the marking device of the bottom plate 1 to prevent further sliding Hanging jaw (3) formed on the upper end of the upper surface of the plate (1), the support plate (4) is installed on the upper portion of the bottom plate (1) and the height adjustment, and the support plate (4) to adjust the height of the support plate (4) One side is coupled to the bottom of the hinge (6), the other side is the operating link (5) coupled to the hinge (6) on the top of the bottom plate (1), the support plate (4) by the operating link (5) When positioned at a certain height, consisting of a fixture (7) for fixing the operation link (5) The.
상기에 있어서, 받침판(4)에는 손잡이홀(4a)이 형성되어 있다. 이 손잡이홀(4a)을 이용하여 상기한 받침판(4)을 상부로 올리거나, 내리는 것이다. 또한, 상기한 받침판(4)의 상면에는 우레탄의 재질로 된 미끄럼방지부재(4')를 부착하여 작업자가 상기한 받침판(4)에 올라가 작업을 할 때 작업자가 미끄러지는 것을 방지하는 것이다.In the above, the support plate 4 is formed with a handle hole 4a. The support plate 4 is raised or lowered by using the handle hole 4a. In addition, by attaching a non-slip member (4 ') made of a urethane material on the upper surface of the support plate 4 to prevent the worker from slipping when the worker climbs on the support plate (4).
이와같이 구성된 본 고안은 반도체 패키지 제조방지를 이용하여 작업을 하거나, 또는 장비를 정비할 때 작업자가 반도체 패키지 제조방지의 높은 위치에서 작업을 할 수 있는 것으로, 이러한 받침다이는 평상시에는 마킹장치의 저부로 슬라이딩되고, 정비를 필요시 상기한 받침다이를 마킹장치(A)의 정면으로 슬라이딩시켜 사용하는 것이다.The present invention configured as described above allows the operator to work at a high position of the semiconductor package manufacturing prevention when the work is performed by using the semiconductor package manufacturing prevention, or when the equipment is maintained, and such a support die is usually used as the bottom of the marking device. The sliding die is used to slide the support die to the front of the marking device (A) if necessary.
이와같이 받침다이를 사용하기 위해서는 바닥판(1)의 저면에 설치된 바퀴(2)에 의해 마킹장치의 정면으로 슬라이딩 시키는 것으로, 이때 상기한 바닥판(1)의 양측은 가이드레일(8)에 안내되고, 마킹장치의 정면으로 완전히 슬라이딩되면 걸림턱(3)에 의해 상기한 바닥판(1)이 더 이상 빠지지 않는 것이다. 이와같이 바닥판(1)이 마킹장치(A)의 정면으로 슬라이딩되면 작동링크(5)에 힌지(6)로 결합된 받침판(4)을 상부로 올러 일정 높이를 유지하는 것으로, 이와같이 받침판(4)를 상부로 올릴 때에는 상기한 받침판(4)에 형성된 손잡이홀(4a)을 이용하는 것이다. 또한, 상기한 받침판(4)이 상부로 올려지면 고정구(7)에 의해 상기한 작동링크(5)가 더 이상 회동되지 않고, 상기한 받침판(4)을 고정 및 지지하는 것이다.In order to use the support die as described above, the wheels 2 installed on the bottom surface of the bottom plate 1 are slid to the front of the marking apparatus. At this time, both sides of the bottom plate 1 are guided to the guide rail 8. If the sliding plate completely slides toward the front of the marking device, the bottom plate 1 is no longer pulled out by the locking step 3. As such, when the bottom plate 1 slides toward the front of the marking device A, the support plate 4 coupled with the hinge 6 to the operation link 5 is lifted upward to maintain a predetermined height. When raising the upper portion is to use the handle hole (4a) formed in the support plate (4). In addition, when the supporting plate 4 is lifted to the upper portion, the operation link 5 is no longer rotated by the fastener 7, and the supporting plate 4 is fixed and supported.
이상의 설명에서 알 수 있듯이 본 고안에 의하면, 반도체 패키지 제조장비의 저면으로 슬라이딩 되도록 받침다이를 설치함으로서 작업환경을 개선하고, 안전사고를 미연에 방지할 수 있는 효과가 있다.As can be seen from the above description, according to the present invention, by installing the support die so as to slide to the bottom of the semiconductor package manufacturing equipment, there is an effect of improving the working environment and preventing accidents in advance.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970014581U KR200159408Y1 (en) | 1997-06-17 | 1997-06-17 | Structure of supporting die for semiconductor package manufacturing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019970014581U KR200159408Y1 (en) | 1997-06-17 | 1997-06-17 | Structure of supporting die for semiconductor package manufacturing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990001172U KR19990001172U (en) | 1999-01-15 |
| KR200159408Y1 true KR200159408Y1 (en) | 1999-10-15 |
Family
ID=19503311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019970014581U KR200159408Y1 (en) | 1997-06-17 | 1997-06-17 | Structure of supporting die for semiconductor package manufacturing device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200159408Y1 (en) |
-
1997
- 1997-06-17 KR KR2019970014581U patent/KR200159408Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR19990001172U (en) | 1999-01-15 |
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