KR20010111375A - Liquid jet device and method thereof - Google Patents

Abstract

The present invention relates to a liquid ejecting apparatus and a manufacturing method thereof, and in particular, the apparatus of the present invention includes a semiconductor substrate, a heat generating resistive layer formed on the semiconductor substrate, and a metal layer connected to both ends of the heat generating resistive layer for supplying current; A metal protective film formed of titanium covering the exothermic resistance layer exposed between the metal layers, a barrier layer formed on the metal protective film to define a liquid chamber on the exothermic resistor, and a liquid in the liquid chamber formed on the barrier layer to the outside. And a nozzle plate having an orifice ejected thereon. Therefore, in the present invention, the manufacturing cost can be reduced by configuring the metal protective film of the liquid injector with titanium, which is a material mainly used in the existing semiconductor memory process.

Description

Liquid injector and its manufacturing method {LIQUID JET DEVICE AND METHOD THEREOF}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid ejecting apparatus and a method for manufacturing the same, and in particular, in a liquid ejecting apparatus of an ink jet printer head, a liquid spray capable of reducing the cost by using a titanium metal film mainly used in a semiconductor memory manufacturing process. An apparatus and a method of manufacturing the same.

An ink jet printer sprays fine ink droplets (INK DROP) onto a print medium to print an image. Ink droplets are formed by the liquid spraying device.

The liquid injector includes a heat generating resistive layer, a liquid chamber, and a nozzle plate on the semiconductor substrate. The exothermic resistive layer is coded with a metal protective film in order to be chemically and mechanically protected from the ink.

When a current is applied to the heat generating resistive layer, heat generated in the heat generating resistive layer vaporizes the ink in the liquid chamber to generate bubbles, and the pressure in the liquid chamber is increased by the generated bubbles so that the ink in the chamber drops through the orifice. It is formed to be sprayed out.

Therefore, maintaining the correct resistance value of the heat generating resistor is very important for always forming ink droplets of constant size. The exothermic resistor undergoes a severe temperature change in a short time period, so that not only thermally and mechanically, but also a solvent such as water penetrates from the ink, thereby causing a risk of chemical corrosion.

Therefore, the metal protective film functions to protect the exothermic resistor from mechanical and chemical damage. The metal protective film protects the exothermic resistive layer from mechanical shocks and has a high chemical resistance to the ionic components contained in the ink component, so that there is no electrical corrosion or chemical corrosion. In addition, the metal protective film should transfer heat provided from the heat generating resistive layer well and have a sufficiently small coefficient of thermal expansion against severe temperature change.

Conventionally, since the metal protective film uses tantalum, the raw material is expensive, and tantalum is a material not mainly used in the conventional semiconductor memory manufacturing line. Therefore, when the liquid jetting device of the ink jet printer head is manufactured by using the existing semiconductor memory manufacturing line, the use of materials is different. Therefore, it is inevitable to introduce new equipment suitable for the material, thereby increasing the production cost. do.

An object of the present invention is to solve the problems of the prior art by using a conventional semiconductor memory manufacturing line using a material mainly used in semiconductor memory without replacing the new equipment, the liquid injection device that can be made cheap It is to provide a manufacturing method.

1 is a cross-sectional view showing the configuration of a liquid jet device of an ink jet printer head according to the present invention.

Figure 2 shows a table comparing the basic physical properties of tantalum, titanium and aluminum.

<Description of the symbols for the main parts of the drawings>

10 semiconductor substrate 12 field oxide film

14 active region 16 gate oxide film

18: gate electrode 20, 22: source and drain regions

24: thermal oxide film 26: interlayer insulating film

28: heat generating layer 30: metal layer

34: insulating protective film 36: opening

38: metal protective film 40: barrier layer

41 liquid chamber 42 nozzle plate

43: orifice

In order to achieve the above object of the present invention, the apparatus of the present invention comprises a semiconductor substrate, a heat generating resistive layer formed on the semiconductor substrate, a metal layer connected to both ends of the heat generating resistive layer for supplying current, and between the metal layer. A metal protective film formed of titanium covering the exposed exothermic resistance layer, a barrier layer formed on the metal protective film to define a liquid chamber on the exothermic resistor, and a liquid in the barrier layer formed on the barrier layer to spray the outside And a nozzle plate having an orifice formed thereon.

The method includes forming a field oxide film defining an active region in a semiconductor substrate, forming an active element in the active region, applying an interlayer insulating film to insulate the active element, and Forming a contact hole in the interlayer insulating film for external connection of the device, sequentially depositing a heat generating resistive layer and a metal layer on the resultant, and patterning a stacked structure of the heat generating resistive layer and the metal layer to form a metal wiring Forming a layer, applying an insulating protective film on the resultant, selectively removing the insulating protective film and the metal layer to expose a portion of the heat generating resistive layer, and applying the exposed heat generating resistive layer to the titanium metal protective film. Forming a barrier layer defining a liquid chamber on the metal protective film; Characterized in that it includes the step of forming the nozzle plate orifices are formed in which liquid is ejected to the outside in the liquid chamber barrier layer on the group.

Hereinafter, with reference to the accompanying drawings, it will be described in detail the present invention through an embodiment of the present invention.

1 shows a cross-sectional configuration of a liquid ejecting apparatus of an ink jet printer head according to the present invention. The liquid injector of the present invention includes an active element including a gate oxide film 16, a gate electrode 18, source and drain regions 20 and 22 on a silicon substrate 10, and a heat generating resistor formed of tantalum-aluminum alloy ( 28, a barrier layer 40 defining the liquid chamber 41, and a nozzle plate 42 having an orifice 43 formed thereon.

A field oxide film 12, a thermal oxide film (HTO) 24, and an interlayer insulating film (BPSG) 26 are formed between the heat generating resistor 28 and the substrate 10.

The tantalum-aluminum alloy heating resistor 28 is supplied with current by the aluminum metal layer 30. The heat generating resistor 28 is protected from ink by the nitride film, the insulating protective film 34 of SiC, and the titanium metal protective film 38.

By the barrier layer 40 formed on the titanium metal protective film 38, the liquid chamber 41 of the heating resistor 28 is in direct contact with the metal protective film 38 through the opening 36 formed in the aluminum metal layer 30. It is formed aligned with the part.

As described above, in the present invention, the heat generating resistor and the metal protective film of the liquid spray device are formed using titanium, which is mainly provided as a contact barrier layer in the conventional semiconductor memory process.

2 is a table comparing the basic physical properties of tantalum, titanium, and aluminum. Titanium has the highest electrical resistance compared to tantalum or aluminum, and thermal conductivity, thermal swelling coefficient, melting point, etc. are slightly lower than tantalum, but chemical resistance is good.

Corrosion was tested by testing the titanium film for 48 hours on the printer ink and found no ink penetration.

That is, even if titanium is used as a substitute for tantalum, it can be seen that there is no defect in the operation of the printer even if it is used as a heat generating resistor and a metal protective film for the print head.

Such a liquid jet is prepared as follows.

The field oxide film 12 is formed on the semiconductor substrate 10 by a LOCOS process to define the active region 14. After the gate oxide film 16 is formed in the active region 14, the gate electrode 18 is formed of polysilicon. The gate electrode 18 uses the field coral film as an ion implantation mask to deposit impurities into the active region 14. The source drain regions 20 and 22 are formed by implantation.

Subsequently, the thermal oxide film 24 is covered on the resultant, and then an interlayer insulating film 26 such as BPSG is covered.

The interlayer insulating film 26, the thermal oxide film 24, and the gate oxide film 16 are selectively etched in order to form source and drain contacts. Next, tantalum-aluminum is deposited by sputtering, and then aluminum is deposited by sputtering. These stacked tantalum-aluminum alloy layers 28 and aluminum metal layers 30 are patterned by a photolithography process to form metal wirings.

The nitride film and the SiC are sequentially stacked on the resultant metal wiring with the insulating protective film 34. The insulating protective film 34 and the metal layer 30 are etched by a photolithography process to open a portion provided as a heat generating resistor. Therefore, in other portions, the tantalum-aluminum alloy layer and the aluminum metal layer are laminated and provided as metal wires, but the portion exposed to the opening 38 has only a tantalum-aluminum alloy layer, so that the resistance increases as compared with the other metal wire parts. It is to be provided as a heat generating resistor.

Subsequently, titanium is deposited on the opening 36 and the insulating protective film 34 by a sputtering process and patterned by a photolithography process to form a metal protective film 38.

The barrier layer 40 is formed on the formed metal protective film 38 and the insulating protective film 34, and the liquid chamber 41 is formed by a photographic process. Thus, the liquid chamber 42 is formed to be aligned on the opening 36. The nozzle plate 42 having the orifice 43 is attached to the barrier layer 40 on which the liquid chamber 41 is formed to complete the liquid ejection apparatus.

As described above, in the present invention, by forming a metal protective film exposed to ink using titanium mainly used in the conventional semiconductor memory process, the liquid jet device of the ink jet printer head in the existing semiconductor memory manufacturing line without the addition of new equipment Because it can be manufactured can be made cheap.

Claims (2)

Semiconductor substrates; A heat generating resistive layer formed on the semiconductor substrate; Metal layers connected to both ends of the heating resistance layer to supply current; A metal protective film formed of titanium covering the heating resistance layer exposed between the metal layers; A barrier layer formed on the metal protective film to define a liquid chamber on the heat generating resistor; And a nozzle plate formed on the barrier layer and having an orifice through which liquid in the liquid chamber is sprayed to the outside. Forming a field oxide film defining an active region on the semiconductor substrate; Forming an active element in the active region; Applying an interlayer insulating film for insulating the active element; Forming a contact hole in the interlayer insulating layer for external connection of the active element; Sequentially stacking a heating resistance layer and a metal layer on the resultant product; Patterning the stacked structure of the heat generating layer and the metal layer to form a metal wiring; Applying an insulating protective film on the resultant product; Selectively removing the insulating protective film and the metal layer to expose a portion of the heat generating resistive layer; Applying the exposed heat generating resistive layer to the titanium metal protective film; Forming a barrier layer defining a liquid chamber on the metal protective film; And And forming a nozzle plate having an orifice on which the liquid in the liquid chamber is sprayed to the outside on the barrier layer.