KR20010086862A - Apparatus and Method of Sealing Aperture Injected Liquid Crystal in Liquid Crystal Display Panel - Google Patents

Abstract

PURPOSE: An apparatus and a method for sealing a panel injection hole are provided to prevent the injection of a sealant to the other portion except for an LCD panel injection hole by injecting simultaneously the sealant only to a multitude of LCD panel injection hole. CONSTITUTION: A sealant supply portion(20) supplies a sealant(8). A sealant supply pipe(21) connects a sealant box(14) with the sealant supply portion(20). The sealant box stores the sealant(8). A roller(16) is formed between the sealant box(14) and a multitude of panel. A micro-gauge(18) is installed parallel to a longitudinal direction of the roller(16). The panels are located vertically on a surface of the roller(16). The micro-gauge(18) controls a thickness of the sealant(8) covered on the roller(16). The sealant(8) is applied to a multitude of panel injection hole(4) by the rotation of the roller(16).

Description

Apparatus and Method of Sealing Aperture Injected Liquid Crystal in Liquid Crystal Display Panel}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for manufacturing a liquid crystal display (hereinafter referred to as "LCD"), and more particularly, to an apparatus and method for encapsulating an injection hole of a panel.

The liquid crystal display of the active matrix driving method displays a moving image using a thin film transistor (hereinafter, referred to as TFT) as a switching element. Such liquid crystal display devices can be miniaturized compared to CRTs, and are widely used in personal computers and notebook computers, as well as office automation devices such as photocopiers, mobile devices such as cell phones and pagers. .

The manufacturing process of the active matrix liquid crystal display device is divided into substrate cleaning, substrate patterning, alignment film formation, substrate bonding / liquid crystal injection, and mounting process. In the substrate cleaning process, foreign substances on the substrates before and after the upper and lower substrates are patterned are removed using a cleaning agent. In the substrate patterning process, the upper substrate is patterned and the lower substrate is patterned. A color filter, a common electrode, a black matrix, and the like are formed on the upper substrate. Signal lines such as data lines and gate lines are formed on the lower substrate, and TFTs are formed at intersections of the data lines and gate lines, and pixel electrodes are formed in the pixel region between the data lines and the gate lines so as to be connected to the drain electrodes of the TFTs. Is formed. In the substrate bonding / liquid crystal injection process, an alignment film is coated on the lower substrate and rubbed, followed by an upper / lower substrate bonding process using a seal material, liquid crystal injection, and an injection hole encapsulation process. Finally, in the mounting process, a tape carrier package (TCP) in which integrated circuits such as a gate drive integrated circuit and a data drive integrated circuit are mounted is connected to a pad portion on a substrate.

As described above, in the LCD manufacturing process, the injection hole encapsulation process is performed by a dip method, a pin transfer method, and a dispense method.

1 shows a sealing agent coating method by a dip method.

Referring to FIG. 1, a plurality of panels 2 into which liquid crystal is injected are positioned side by side in a vertical state on an encapsulant container 6 containing an encapsulant 8 having a predetermined area and depositing only one side thereof. At this time, the inlet 4 of the panel is located on the lower side of the sediment is deposited in the encapsulant (8). The inlet 4 of the panel thus precipitated is sealed by the sealing agent (8). However, the method of applying the encapsulant by the dip method has a disadvantage in that the encapsulant is stuck to the side portions other than the panel injection hole and thus needs to be removed by a cutting operation. Therefore, the device complementing this is a sealing agent coating method by the pin transfer method shown in FIG.

Referring to FIG. 2, a plurality of panels 2 into which liquid crystal is injected are placed in parallel with each other and face-to-face with one side of an encapsulant container 10 having a predetermined area. In this case, the plurality of panel inlets 4 are positioned at one-to-one contact with the encapsulant container 10. On the other hand, on one side of the encapsulant container 10 in contact with the panel 2, an encapsulant supply portion 11 facing the same size as the panel inlet 4 is located. The encapsulant supply unit 11 is a portion in which a groove is formed on one side of the encapsulant container 10 and the encapsulant 8 is filled. When the inlet 4 of the panel 2 is in contact with the encapsulant supply unit 11, the encapsulant 8 is sucked into the inlet 4 and sealed. However, the method of applying the encapsulant by the pin transfer method has a disadvantage in that the encapsulant is overflowed into the side of the panel other than the panel inlet in the process of encapsulating the encapsulant into the inlet of the panel. Therefore, the device supplementing this is a sealing agent coating method by the dispensing method shown in FIG.

Referring to FIG. 3, a plurality of panels 2 into which liquid crystal is injected are positioned side by side in a vertical state so that the injection holes 4 face upward. At this time, the dispenser 12 seals the encapsulant 8 by injecting the encapsulant 8 onto the inlet 4 of the panel instead of the encapsulant container 10. However, in the dispensing method of applying the encapsulant, the encapsulant injected into the inlet of the first panel and the last panel remains in a different state because the encapsulating agent is injected sequentially rather than simultaneously. Will be. Therefore, it is difficult to seal the inlet of the panel by curing the encapsulant with ultraviolet rays. It also takes a long time to inject the encapsulant into the inlet. In addition, it is difficult to control the amount of the encapsulant injected into the inlet of the panel. In addition, there is a disadvantage that the encapsulant overflows to the side other than the injection port.

Accordingly, it is an object of the present invention to provide an apparatus and method for encapsulating an injection hole by simultaneously absorbing a certain amount of the encapsulant in only a plurality of panel injection holes.

1 is a perspective view showing a sealing agent coating method by a conventional dip (Dip) method.

Figure 2 is a perspective view showing a sealing agent coating method by a conventional pin (Pin) transfer method.

Figure 3 is a perspective view showing a sealing agent coating method by a conventional dispensing (Dispense) method.

Figure 4 is a perspective view showing a sealing agent applying method using a sealing agent applying apparatus according to an embodiment of the present invention.

Figure 5 is a side view showing a sealing agent applying method using a sealing agent applying apparatus according to an embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

2: panel 4: inlet

6,10: sealing agent container 8: sealing agent

11,20: encapsulant supply unit 12: the dispenser

14: sealing box 16: roller

18: micro gauge 21: encapsulant supply pipe

R: roller running direction

In order to achieve the above object, the panel inlet encapsulation device of the present invention includes an encapsulant box containing an encapsulant, an encapsulant supply part for supplying an encapsulant to the encapsulant box, and an encapsulant supply pipe connecting the encapsulant supply part and the encapsulant box. And a roller for applying the encapsulant contained in the encapsulant box to the plurality of panel inlets by rotation, and a thickness adjusting portion for adjusting the thickness and flatness of the encapsulant present on the surface of the roller.

The method for encapsulating the plurality of panel inlets includes supplying an encapsulant to the encapsulant box, and simultaneously applying the encapsulant supplied to the encapsulant box to the plurality of panel inlets by rotation of a roller.

Other objects and features of the present invention in addition to the above objects will become apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 4 and 5.

4 and 5 illustrate a method of encapsulating the inlet of the panel according to an embodiment of the present invention.

4 and 5, the inlet encapsulation device according to the embodiment of the present invention includes an encapsulant supply unit 20, an encapsulant supply unit 20, and an encapsulant box 14 to supply an encapsulant 8. Encapsulant supply pipe 21 to connect, the encapsulant box 14 containing the encapsulant 8, the roller 16 located between the encapsulant box 14 and the plurality of panels 2, and the roller 16 Microgauge (18) is installed in parallel with the longitudinal direction of the). The encapsulant supply unit 20 is connected to the encapsulant box 14 to supply the encapsulant 8. The roller 16 is provided in parallel with the longitudinal direction of the sealing material box 14 on the sealing material 8 supplied to the sealing material box 14 through the sealing material supply pipe 21. The plurality of panels 2 into which the liquid crystal is injected are vertically side by side on the surface of the roller 16. At this time, the roller 16 and the plurality of panels 2 maintain the orthogonal state. The inlet 4 of the panel is located on the lower side that abuts orthogonal to the roller 16. The microgauge 18 is installed in parallel with the longitudinal direction of the roller 16 is installed in a direction opposite to the traveling direction (R) of the roller. The roller 16 rotates in the direction in which the microgauge 18 is located in a state in which the encapsulant 8 contained in the encapsulant box 14 is embedded. In this case, the microgauge 18 adjusts the encapsulant 8 adhered to the roller 16 to a constant thickness and flatness. The encapsulant 8, adjusted to a constant thickness and flatness, is simultaneously applied to the plurality of panel inlets 4 as the roller 16 rotates. As described above, the panel inlet encapsulation device simultaneously applies a plurality of panel inlets using a roller with an encapsulant, so that the encapsulant is not applied except for the inlet of the panel. In addition, since the encapsulant box is located under the roller, the inlet of the panel is applied, and the remaining encapsulant is returned to the encapsulant box for easy reuse. In addition, by encapsulating the thickness and flatness of the encapsulant is applied to a plurality of panel inlets at the same time by the micro-gauge can be adjusted the amount of encapsulant intake of the inlet. In addition, since the position of the roller contact can be adjusted according to the length of the inlet of the panel, there is no need to change the model of the roller according to the size of the panel.

As described above, since the panel inlet encapsulation device according to the present invention simultaneously applies a plurality of panel inlets using a roller with an encapsulant, the encapsulant is not applied except for the inlet of the panel. In addition, since the encapsulant box is located under the roller, the inlet of the panel is applied, and the remaining encapsulant is returned to the encapsulant box for easy reuse. In addition, by encapsulating the thickness and flatness of the encapsulant is applied to a plurality of panel inlets at the same time by the micro-gauge can be adjusted the amount of encapsulant intake of the inlet. In addition, since the position of the roller contact can be adjusted according to the length of the inlet of the panel, there is no need to change the model of the roller according to the size of the panel.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (5)

In the apparatus for applying the injection port of the plurality of liquid crystal display elements with a sealing agent, An encapsulant box for containing the encapsulant, An encapsulant supply unit for supplying the encapsulant to the encapsulant box, A roller for applying the encapsulant contained in the encapsulant box to the plurality of liquid crystal display injection holes by rotation; And a thickness adjusting part for adjusting the thickness and flatness of the encapsulating agent. The method of claim 1, The roller, An inlet encapsulation device for a liquid crystal display device, characterized in that disposed on the encapsulation box in parallel with the longitudinal direction of the box. The method of claim 1, The thickness adjusting unit, And an inlet encapsulation device for a liquid crystal display device, characterized in that it is installed at a position parallel to the length direction of the roller and opposite to the traveling direction. In the method of applying the injection holes of the plurality of liquid crystal display elements with a sealing agent, Supplying the encapsulant to an encapsulant box, And encapsulating the encapsulant contained in the encapsulant box on the plurality of liquid crystal display device injection holes at the same time by a roller. The method of claim 4, wherein Applying the encapsulant to the plurality of liquid crystal display injection hole, And adjusting the thickness and flatness of the encapsulant.