KR20010068578A - A co-extrusion polyester film for metal plate bonding, and a process of preparing for the same - Google Patents

A co-extrusion polyester film for metal plate bonding, and a process of preparing for the same Download PDF

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KR20010068578A
KR20010068578A KR1020000000553A KR20000000553A KR20010068578A KR 20010068578 A KR20010068578 A KR 20010068578A KR 1020000000553 A KR1020000000553 A KR 1020000000553A KR 20000000553 A KR20000000553 A KR 20000000553A KR 20010068578 A KR20010068578 A KR 20010068578A
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layer
chip
polyester
metal plate
surface friction
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KR100601299B1 (en
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김영석
송준명
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구광시
주식회사 코오롱
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C09J167/03Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl - and the hydroxy groups directly linked to aromatic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08J2367/03Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE: A coextruded polyester film for adhering metal plates is provided, which has excellent adhesibility to the metal plate and draw molding property and improves heat-proof property and shock-resistance of a metal can. And a method for preparing thereof is also provided. CONSTITUTION: The method comprises steps of: (i) surface-fractionating a copolymer polyester chip(A) containing 12-30 mol of isophthalic acid based on the total acid components and 3-10 mol of neopentyl glycol based on the total glycol components with a surface-fractionating device under a condition of the following formula (I): 1/70*PH/lr¬2 ; and (ii) after two-layer coextruding a copolymer polyester chip(B), which has an ethylene terephthalate as a main repeating unit, as a first layer and the surface-frictionated copolymer polyester chip as a second layer, biaxially orienting it. In the formula (I), P is a distance(millimeter) between screw pitches, H is a height(millimeter) of a screw peak, l is an average length(millimeter) of a chip, r is an average diameter(millimeter) of a chip and Q is a rotating speed(revolution per minute) of a surface-fractionating machine. The coextruded polyester film for adhering metal plates comprises a first layer of copolymer polyester having an ethylene terephthalate as a main repeating unit and a second layer of copolymer polyester containing 12-30 mol of isophthalic acid based on the total acid components and 3-10 mol of neopentyl glycol based on the total glycol components.

Description

금속판 접합용 공압출 폴리에스테르 필름 및 그의 제조방법 {A co-extrusion polyester film for metal plate bonding, and a process of preparing for the same}A co-extrusion polyester film for metal plate bonding, and a process of preparing for the same}

본 발명은 금속판 접합용 공압출 폴리에스테르 필름 및 그의 제조방법에 관한 것이다.The present invention relates to a coextruded polyester film for metal plate bonding and a method for producing the same.

지금까지 금속캔에는 내외면의 부식을 방지하기 위해 에폭시계, 페놀계 등의각종 열경화성 수지를 유기용제에 용해 또는 분산시켜 이를 금속표면을 피복하는 방법이 널리 행해지고 있었다. 최근 공정 간소화, 위생성 및 환경오염 방지 등을 목적으로 유기용제를 사용하지 않고 열가소성 수지 필름을 이용한 금속판 피복이 시도되고 있다. 주석도금강판, 크롬도금강판 또는 알루미늄 등의 금속판에 열가소성 수지 필름을 접합한 후 드로잉 등에 의하여 캔을 제조하는 방법에 대한 많은 연구가 진행되어 왔다. 이러한 열가소성 수지 필름의 원료로는 폴리올레핀, 폴리아미드 등이 시도 되었지만 이들의 필름은 성형가공성 및 제품 캔의 내열성, 보향성 등을 모두 만족시키는 것은 아니었다.Until now, in order to prevent corrosion of the inner and outer surfaces, various methods of dissolving or dispersing various thermosetting resins such as epoxy and phenol in organic solvents and coating them on metal surfaces have been widely performed. Recently, metal plate coating using a thermoplastic resin film has been attempted without using an organic solvent for the purpose of process simplification, hygiene and environmental pollution prevention. Many studies have been made on a method of manufacturing a can by drawing a thermoplastic resin film after bonding a thermoplastic resin film to a metal plate such as tin plated steel sheet, chromium plated steel sheet, or aluminum. Polyolefins, polyamides, and the like have been attempted as raw materials for such thermoplastic resin films, but these films did not satisfy all of the moldability and heat resistance of the product cans and the steering properties.

한편 폴리에스테르 중 폴리에틸렌테레프탈레이트는 화학적 및 물리적으로 안정하고 기계적 강도, 내열성, 내약품성, 기체 차단성 등이 우수하여 식품포장 용도로 널리 이용되고 있다. 이러한 폴리에틸렌테레프탈레이트 필름을 금속캔의 표면에 사용하기 위해서는 금속판과의 접착성, 접합시 불량이 발생하지 않을 것, 드로잉 성형시 불량이 발생하지 않을 것, 드로잉 성형 후 핀홀 등의 결함이 발생하지 않을 것 등의 특성이 요구된다.Meanwhile, polyethylene terephthalate in polyester is widely used for food packaging because it is chemically and physically stable, and has excellent mechanical strength, heat resistance, chemical resistance, and gas barrier property. In order to use the polyethylene terephthalate film on the surface of the metal can, the adhesion with the metal plate, no defects during bonding, no defects during drawing molding, and no defects such as pinholes after drawing molding And other characteristics are required.

이러한 특성을 만족시키기 위한 종래 방법으로 일본 공개 특허 소 56-10451호에서는 이축배향 폴리에틸렌테레프탈레이트 필름을 저용융점인 공중합 폴리에스테르 접착층을 통해 금속판에 적층하는 방법을 제안하고 있다.As a conventional method for satisfying such characteristics, Japanese Laid-Open Patent Publication No. 56-10451 proposes a method of laminating a biaxially oriented polyethylene terephthalate film on a metal plate through a copolyester adhesive layer having a low melting point.

2층의 금속접합용 필름을 제조하는 방법으로는 접착층을 라미네이션 하는 방법과 공압출에 의한 방법이 있다. 이중 공압출을 이용하여 2층 필름을 제조하는 방법은 필름의 제조공정중 열접착 특성을 부여하므로 라미네이션과 같은 추가공정이 필요하지 않는 장점이 있다.As a method of manufacturing the two-layer metal bonding film, there are a method of laminating an adhesive layer and a method by coextrusion. The method of manufacturing a two-layer film by using double coextrusion has an advantage of not requiring an additional process such as lamination because it imparts thermal adhesiveness during the manufacturing process of the film.

하지만 기존의 폴리에스테르 필름의 제조공정인 이축연신공정에서 폴리에틸렌테레프탈레이트층과 공중합폴리에스테르 접착층이 같은 열이력과 연신공정을 거치게 되므로 기술적 범위가 제한된다. 특히 열접착성, 내열성, 내수성 등의 특성을 만족하기 위한 폴리에틸렌테레프탈레이트층과 공중합 폴리에스테르 접착층의 수지선정이 중요하며, 이와 더불어 두 층간의 계면이 고르게 형성되기 위한 적합한 가공조건 설정이 중요하다.However, the technical scope is limited because the polyethylene terephthalate layer and the copolyester adhesive layer undergo the same thermal history and stretching process in the biaxial stretching process, which is a conventional polyester film manufacturing process. In particular, the resin selection of the polyethylene terephthalate layer and the copolyester adhesive layer to satisfy the characteristics such as heat adhesion, heat resistance, water resistance, etc. is important, and the setting of suitable processing conditions for the evenly formed interface between the two layers is important.

특히 접착층을 이루는 공중합 폴리에스테르 수지는 비결정성 수지가 이용되는데 상기의 금속 접합용 필름의 특성을 만족시키기 위해서는 접착층인 비결정성 수지의 압출량이 균일하여야 한다. 하지만 비결정성 공중합 폴리에스테르 수지는 낮은 유리전이온도에 비해 결정부분을 가지지 않으므로 압출시 압출기 피딩존(Feeding zone) 내부에서 칩의 과도한 형태 변형을 유발하거나 칩 간의 융착 등이 발생하여 압출량이 불균일 해 질수 있고 이는 최종 생산된 필름이 금속판 접합시 불량한 결과를 유발하는 문제가 있다.In particular, an amorphous resin is used as the copolyester resin forming the adhesive layer. In order to satisfy the characteristics of the metal bonding film, the extrusion amount of the amorphous resin as the adhesive layer should be uniform. However, the amorphous copolyester resin does not have a crystal part in comparison with the low glass transition temperature, so that the extrusion amount may be uneven due to excessive deformation of chips or fusion between chips in the extruder feeding zone during extrusion. This is a problem that the final produced film causes poor results when bonding the metal plate.

본 발명은 이와 같은 종래 기술의 문제점들을 해결하므로서 금속판과의 접합이 양호하며, 금속 캔 제조공정 중 드로잉(Drawing) 성형성이 우수하고, 금속캔의 내열성, 내충격성 및 보향성을 향상시킬 수 있는 금속판 접합용 공압출 폴리에스테르 필름 및 그의 제조방법을 제공하고자 한다.The present invention solves these problems of the prior art, and the bonding with the metal plate is good, excellent drawing moldability during the metal can manufacturing process, and can improve the heat resistance, impact resistance and steering properties of the metal can. The present invention provides a coextruded polyester film for joining a metal plate and a method of manufacturing the same.

도 1은 본 발명에 사용되는 표면마찰 장치의 단면도 이다.1 is a cross-sectional view of the surface friction apparatus used in the present invention.

※ 도면 중 주요부분에 대한 부호 설명※ Explanation of Codes on Major Parts of Drawings

1 : 칩 투입구 2 : 스크류 3 : 실린더1 chip inlet 2 screw 3 cylinder

4 : 칩 배출구 5 : 구동장치 6 : 스크류의 피치 간격4 chip outlet 5 drive 6 screw pitch

L : 실린더 길이 C : 실린더와 스크류 간격(Clearance)L: Cylinder length C: Cylinder and screw clearance

H : 스크류의 산 높이H: acid height of screw

본 발명은 금속판 접합용 공압출 폴리에스테르 필름 및 그의 제조방법에 관한 것이다. 더욱 구체적으로 본 발명은 제 1층이 에틸렌테레프탈레이트를 주반복 단위로 하는 공중합 폴리에스테르 이고, 제 2층(접착층)이 전체 산성분에 대하여 이소프탈산 성분이 12~30몰함유되어 있고, 네오펜틸글리콜 성분이 3~10몰함유되어 있는 공중합 폴리에스테르인 것을 특징으로 하는 금속판 접합용 공압출 폴리에스테르 필름에 관한 것이다.The present invention relates to a coextruded polyester film for metal plate bonding and a method for producing the same. More specifically, in the present invention, the first layer is a copolyester with ethylene terephthalate as the main repeating unit, and the second layer (adhesive layer) contains 12 to 30 moles of isophthalic acid components with respect to the total acid component, and neopentyl It is the co-extruded polyester film for metal plate joining which is a co-polyester containing 3-10 mol of glycol components.

이하 본 발명의 제조방법에 관하여 상세하게 설명한다.Hereinafter, the manufacturing method of the present invention will be described in detail.

본 발명은 접착층(제 2층)을 형성하는 공중합 폴리에스테르의 균일한 압출을 위하여 공압출 전에 이를 표면마찰 처리함을 특징으로 한다.The present invention is characterized in that it is subjected to surface friction treatment before coextrusion for uniform extrusion of the copolyester forming the adhesive layer (second layer).

구체적으로 전체 산성분에 대하여 이소프탈산 성분이 12~30몰함유되어 있고 전체 글리콜 성분에 대하여 네오펜틸글리콜 성분이 3~10몰함유되어 있는 공중합 폴리에스테르 칩(A)을 도 1의 표면마찰 장치에서 아래식(I)의 조건으로 표면마찰 처리한다.Specifically, the copolyester polyester chip (A) containing 12 to 30 moles of isophthalic acid component with respect to all acid components and 3 to 10 moles of neopentyl glycol component with respect to all glycol components is used in the surface friction apparatus of FIG. Surface friction treatment is performed under the conditions of the following formula (I).

≤ Q ≤(I) ≤ Q ≤ (I)

상기 식에서P는 스크류 피치사이의 간격(mm),H는 스크류 산의 높이(mm),l은 칩의 평균길이(mm),r은 칩의 평균지름(mm), Q는 표면마찰기의 회전속도(rpm) 이다.Where P is the distance between the screw pitches (mm), H is the height of the screw threads (mm), l is the average length of the chip (mm), r is the average diameter of the chip (mm), and Q is the rotation of the surface friction machine. Speed (rpm).

표면마찰 장치로는 도 1과 같은 마찰식 예비결정화 장치를 이용하는 것이 바람직 하다.It is preferable to use the friction type precrystallization apparatus as shown in FIG. 1 as the surface friction apparatus.

상기 공중합 폴리에스테르 칩(A)은 비결정이므로 마찰기 내에서 과도한 열이 발생하면 마찰기 내부에서 칩간의 융착이 발생하므로 운전속도를 적정수준 이하로 하여 마찰열을 조절 하여야 한다. 운전속도가 너무 느리게 되면 칩 표면에 충분한 마찰이 부여되지 않아 바람직 하지 못하다. 따라서 상기 식(I)의 조건으로 마찰을 부여하는 것이 바람직 하며, 더욱 바람직 하기로는 하기 식(Ⅱ)의 조건으로 마찰을 부여하는 것이 좋다.Since the copolyester chip (A) is amorphous, if excessive heat is generated in the friction machine, fusion between the chips occurs in the friction machine, so the frictional heat should be adjusted to an appropriate level or less. If the operating speed is too slow, it is not desirable because not enough friction is applied to the chip surface. Therefore, it is preferable to impart friction under the conditions of the above formula (I), and more preferably, to impart friction under the conditions of the following formula (II).

≤ Q ≤(Ⅱ) ≤ Q ≤ (Ⅱ)

상기 식에서P는 스크류 피치사이의 간격(mm),H는 스크류 산의 높이(mm),l은 칩의 평균길이(mm),r은 칩의 평균지름(mm), Q는 표면마찰기의 회전속도(rpm) 이다.Where P is the distance between the screw pitches (mm), H is the height of the screw threads (mm), l is the average length of the chip (mm), r is the average diameter of the chip (mm), and Q is the rotation of the surface friction machine. Speed (rpm).

상기 조건으로 표면마찰된 공중합 폴리에스테르 칩(A)은 전체 표면적 중 0.5이상에 요철이 발생 된다. 상기 표면마찰은 압출기 내부의 피딩 존 (Feeding Zone)에서 칩 상호간의 융착을 효과적으로 줄여주며 칩 상호간에 윤활성을 부여하여 칩의 변형을 막는 효과를 가져와 이들의 균일한 압출이 가능하도록 한다.The copolyester chip (A) surface friction under the above conditions is generated irregularities in more than 0.5 of the total surface area. The surface friction effectively reduces the fusion between the chips in the feeding zone (Feeding Zone) inside the extruder and gives the lubricity between the chips to prevent the deformation of the chip to enable uniform extrusion thereof.

다음으로 에틸렌테레프탈레이트를 주반복 단위로 하는 공중합 폴리에스테르 칩(B)을 제 1층으로, 상기 표면마찰시킨 공중합 폴리에스테르 칩(A)을 제 2층(접착층)으로 공압출한 후, 이축배향 하여 본 발명의 금속판 접합용 공압출 폴리에스테르 필름을 제조한다.Next, co-extrusion of the copolymerized polyester chip (B) having ethylene terephthalate as the main repeating unit as the first layer and the surface-polished copolymerized polyester chip (A) to the second layer (adhesive layer), followed by biaxial orientation To produce a coextruded polyester film for joining a metal plate of the present invention.

제 1층의 공중합 폴리에스테르수지는 방향족 디카르복실산 성분과 글리콜 성분을 중축합으로 제조한다. 방향족 디카르복실산의 구체적인 예로 테레프탈산, 이소프탈산, 나프탈렌디카르복실산, 디페녹시에탄디카르복실산, 디페닐디카르복실산, 디페닐에테르디카르복실산 등을 들수 있으며, 글리콜 성분으로는 에틸렌글리콜, 프로판디올, 부탄디올, 펜탄디올, 헥산디올, 네오펜틸글리콜 등을 들 수 있다. 이중 특히 테레프탈산과 에틸렌글리콜을 각각의 디카르복실산 성분과 글리콜 성분에 대해 97몰이상으로 하는 것이 바람직 하다.The copolyester resin of the first layer is prepared by polycondensation of an aromatic dicarboxylic acid component and a glycol component. Specific examples of the aromatic dicarboxylic acid include terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid, diphenoxyethanedicarboxylic acid, diphenyldicarboxylic acid, diphenyletherdicarboxylic acid, and the like. Ethylene glycol, propanediol, butanediol, pentanediol, hexanediol, neopentylglycol, etc. are mentioned. Especially, it is preferable to make terephthalic acid and ethylene glycol into 97 mol or more with respect to each dicarboxylic acid component and glycol component.

접착층인 제 2층의 공중합 폴리에스테르수지로는 방향족 디카르복실산 성분과 글리콜 성분을 중축합으로 제조한다. 방향족 디카르복실산의 구체적인 예로 테레프탈산, 이소프탈산, 나프탈렌디카르복실산, 디페녹시에탄디카르복실산, 디페닐디카르복실산, 디페닐에테르디카르복실산 등을 들수 있으며, 이중 테레프탈산과 이소프탈산이 바람직 하다. 글리콜 성분으로는 에틸렌글리콜, 프로판디올, 부탄디올, 펜탄디올, 헥산디올, 네오펜틸글리콜 등을 들수 있으며, 이중 에틸렌글리콜과 네오펜틸글리콜이 바람직 하다.As a copolyester resin of the 2nd layer which is an adhesive layer, an aromatic dicarboxylic acid component and a glycol component are manufactured by polycondensation. Specific examples of the aromatic dicarboxylic acid include terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid, diphenoxyethanedicarboxylic acid, diphenyldicarboxylic acid, diphenyletherdicarboxylic acid, and the like. Isophthalic acid is preferred. Ethylene glycol, propanediol, butanediol, pentanediol, hexanediol, neopentylglycol, etc. are mentioned as a glycol component, Among these, ethylene glycol and neopentylglycol are preferable.

본 발명의 접착층 공중합 폴리에스테르에는 전체 산 성분에 대하여 이소프탈산 성분이 12~30몰함유되어 있으며, 전 글리콜 성분에 대하여 네오펜틸글리콜 성분이 3~10몰함유되어 있다. 이소프탈산 성분이 12몰미만의 경우 접착력이 저하되고, 30몰를 초과하는 경우에는 내열성이 저하하는 문제가 발생한다. 또한 네오펜틸글리콜 성분이 3몰미만인 경우에는 접착력이 저하되고, 10몰를 초과하게 되면 유리전이온도가 저하되어 내열성이 저하된다.The adhesive layer copolyester of the present invention contains 12 to 30 moles of isophthalic acid component with respect to all acid components, and 3 to 10 moles of neopentyl glycol component with respect to all glycol components. If the isophthalic acid component is less than 12 moles, the adhesive force is lowered, and if the isophthalic acid component is more than 30 moles, the problem of deterioration in heat resistance occurs. In addition, when the neopentyl glycol component is less than 3 moles, the adhesive force is lowered, and when it exceeds 10 moles, the glass transition temperature is lowered and the heat resistance is lowered.

한편 제 1층 및 제 2층의 공중합 폴리에스테르 수지를 제조함에 있어서, 공지의 첨가제, 예를 들면 중축합 촉매, 분산제, 결정화촉진제, 블로킹 방지제 등을 첨가해도 무방하며, 무기물 등도 본 발명의 효과를 손상시키지 않는 범위 내에서 첨가하여도 무방하다. 첨가가능한 무기물의 예로는 이산화티탄, 이산화규소, 탄산칼슘 등이 있으며 2종 이상을 혼합하여 사용하여도 무방하다.In the preparation of the copolyester resin of the first layer and the second layer, a known additive such as a polycondensation catalyst, a dispersant, a crystallization accelerator, an antiblocking agent, or the like may be added, and the inorganic substance may also have the effect of the present invention. You may add in the range which does not damage. Examples of the inorganic substance that can be added include titanium dioxide, silicon dioxide, calcium carbonate, and the like, and may be used by mixing two or more kinds.

본 발명에 있어서 공중합 폴리에스테르 칩 및 필름의 물성은 아래 방법으로 평가한다.In the present invention, the physical properties of the copolyester chip and the film are evaluated by the following method.

·표면마찰 정도(요철발생 면적비)Surface friction degree (surface irregularity area ratio)

컴팩트 마이크로 버젼 시스템(Compact Micro Vision System) 회사의 하이-스피드 KⅡ 2200모델을 이용해 400배의 배율로 칩의 표면을 촬영 하였다. 칩은 표면마찰기에서 5분 간격으로 20번 임의로 샘플링하여 임의 부분을 3회 촬영한 후 표면에 전체 면적에 대하여 마찰에 대한 요철이 발생한 부분의 면적비를 계산하여 평균을 구하였다.The chip surface was captured at 400x magnification using the high-speed KII 2200 model from Compact Micro Vision System. The chip was randomly sampled 20 times at a 5-minute interval from the surface friction machine and photographed randomly three times, and the average was calculated by calculating the area ratio of the unevenness to friction on the entire area.

·공압출 계면의 균일성 평가Uniformity evaluation of coextrusion interface

코린사(Collin사)의 45파이, 30파이 싱글 스크류 압출기와 공압출 다이를 이용해 200㎛ 미연신 필름을 공압출하여 5분 간격으로 20회 샘플링하여 제 1층의 두께나 제 2층의 두께를 하이-스코프(Hi-Scope)를 이용해 측정 하였다. 이때 제 1층은 150㎛, 제 2층은 50㎛의 두께를 가지도록 조건을 설정하였다.Co-extruded 200 µm unstretched film 20 times at 5 minute intervals using a Colin company's 45- and 30-pi single screw extruders and co-extrusion dies to determine the thickness of the first layer or the second layer. Measurement was made using a Hi-Scope. At this time, the conditions were set such that the first layer had a thickness of 150 µm and the second layer had a thickness of 50 µm.

◎ : 제 2층의 두께 최대치와 최소치의 차이 < 2㎛◎: difference between maximum and minimum thickness of the second layer <2 μm

○ : 제 2층의 두께 최대치와 최소치의 차이 < 5㎛○: difference between the maximum value and the minimum value of the thickness of the second layer <5 μm

× : 제 2층의 두께 최대치와 최소치의 차이 > 5㎛X: difference between the maximum value and the minimum value of the thickness of the second layer> 5 µm

·열접착성 평가Thermal adhesive evaluation

틴 프리 스틸을 200~220℃로 가열한 후 고무롤을 이용해 실시예에서 제조한 필름을 압착하였다. 이때 압착압력은 30kg/㎡ 속도 100m/min으로 하였다. 이후 이 필름을 인스트롱(Instron)을 이용하여 접착력 시험을 시행 하였다.After heating the tin free steel to 200-220 degreeC, the film produced in the Example was crimped | bonded using the rubber roll. At this time, the crimping pressure was set to 30 kg / m 2 speed 100 m / min. The film was then subjected to an adhesion test using Instron.

이하 실시예 및 비교실시예를 통하여 보다 구체적으로 살펴본다. 그러나 본 발명이 하기 실시예에만 한정되는 것은 아니다.It looks at in more detail through the following examples and comparative examples. However, the present invention is not limited only to the following examples.

실시예 1Example 1

제 1층 수지로는 산성분 테레프탈산 98몰와 이소프탈산 2몰, 글리콜 성분으로는 에틸렌글리콜만을 이용하여 중축합된 고유점도 0.6㎗/g인 폴리에스테르수지를 제조한다. 제 2층 접착수지로는 산성분 테레프탈산 87몰와 이소프탈산 13몰, 글리콜 성분으로는 에틸렌글리콜 95몰와 네오펜틸글리콜 5몰로 중축합된 고유점도 0.69㎗/g인 폴리에스테르 수지를 제조한다. 이때 제 2층 공중합 폴리에스테르 수지의 형태는 평균지름 2.6mm, 길이 3.2mm의 봉형태로 한다. 제 2층 공중합 폴리에스테르 수지칩을 스크류 회전속도 30rpm, 스크류의 피치간격 120mm, 스크류의 산의 높이 120mm의 표면마찰기에서 표면마찰 처리한다. 이렇게 제조된 제 1층 및 제 2층용 수지를 공압출 다이를 이용해 공압출하여 필름을 제조한 뒤 통상의 방법으로 이축연신하여 본 발명의 필름을 제조한다. 표면마찰 처리한 칩의 요철발생 면적비 및 제조한 필름의 물성을 평가한 결과는 표 2와 같다.A polyester resin having an intrinsic viscosity of 0.6 dl / g polycondensed using only 98 moles of acid component terephthalic acid and 2 moles of isophthalic acid as the first layer resin and only ethylene glycol as the glycol component is prepared. As the second layer adhesive resin, a polyester resin having an intrinsic viscosity of 0.69 dl / g polycondensed with 87 moles of acid component terephthalic acid and 13 moles of isophthalic acid and 95 moles of ethylene glycol and 5 moles of neopentyl glycol as a glycol component is prepared. At this time, the shape of the second layer co-polyester resin is in the form of a rod having an average diameter of 2.6 mm and a length of 3.2 mm. The second layer co-polyester resin chip is subjected to surface friction treatment with a surface friction machine having a screw rotational speed of 30 rpm, a pitch interval of 120 mm, and a screw height of 120 mm. The first layer and the second layer resin thus prepared are coextruded using a coextrusion die to prepare a film, and then biaxially stretched by a conventional method to produce the film of the present invention. Table 2 shows the results of evaluating the uneven surface area ratio of the surface friction treatment chip and the properties of the film.

실시예 2Example 2

제 2층(접착층)의 이소프탈산 및 네오펜틸글리콜 함량, 표면마찰기의 운저조건(rpm)을 표 1과 같이 변경한 것을 제외하고는 실시예 1과 동일한 공정 및 조건으로 공압출 폴리에스테르 필름을 제조한다. 표면마찰 처리한 칩의 요철발생 면적비 및 제조한 필름의 물성을 평가한 결과는 표 2와 같다.The coextruded polyester film was prepared in the same process and conditions as in Example 1, except that the isophthalic acid and neopentyl glycol content of the second layer (adhesive layer) and the clouding condition (rpm) of the surface friction machine were changed as shown in Table 1. Manufacture. Table 2 shows the results of evaluating the uneven surface area ratio of the surface friction treatment chip and the properties of the film.

<표 1> 제조조건<Table 1> Manufacturing Conditions

구분division 제 2층(접착층)의 조성Composition of the second layer (adhesive layer) 표면마찰기 운전조건(rpm)Surface Friction Operating Condition (rpm) 이소프탈산 함량(전체산성분 대비 몰)Isophthalic acid content (mol compared to total acid component) 네오펜틸글리콜 함량(전체글리콜 성분 대비 몰)Neopentylglycol content (mole relative to the total glycol component) 실시예1Example 1 1313 55 3030 실시예2Example 2 2020 33 3030 실시예3Example 3 1010 88 4040 실시예4Example 4 1313 55 5050 실시예5Example 5 1313 55 1515 실시예6Example 6 1313 55 1010 비교실시예1Comparative Example 1 77 22 3030 비교실시예2Comparative Example 2 3535 1515 5050 비교실시예3Comparative Example 3 1313 55 8585

<표 2> 물성평가 결과<Table 2> Property Evaluation Results

구분division 표면마찰 처리된 칩의요철발생 면적비()Area of unevenness generation of chip subjected to surface friction treatment () 필름의 물성Properties of the film 공압출 계면의 균일성Uniformity of coextrusion interface 열 접착성(g/cm)Thermal adhesiveness (g / cm) 실시예1Example 1 6666 559559 실시예2Example 2 5757 605605 실시예3Example 3 6868 571571 실시예4Example 4 8989 521521 실시예5Example 5 2626 511511 실시예6Example 6 1414 485485 비교실시예1Comparative Example 1 6565 215215 비교실시예2Comparative Example 2 -- -(표면마찰시 융착발생)-Fusion occurs during surface friction -(표면마찰시 융착발생)-Fusion occurs during surface friction 비교실시예3Comparative Example 3 -- -(표면마찰시 융착발생)-Fusion occurs during surface friction -(표면마찰시 융착발생)-Fusion occurs during surface friction

본 발명은 공압출시 표면마찰된 비결정성의 접착층 수지를 사용하기 때문에 접착층의 균일한 압출이 가능하여 금속판과 접착층의 접합이 매우 양호하다.In the present invention, since the surface friction-based amorphous adhesive layer resin is used during the co-extrusion, it is possible to uniformly extrude the adhesive layer, so that the bonding between the metal plate and the adhesive layer is very good.

아울러 캔 제조공정 중 드로잉 성형성이 우수하며, 제조된 금속캔의 내열성, 내충격성 및 보향성이 향상된다.In addition, the drawing moldability during the can manufacturing process is excellent, and the heat resistance, impact resistance and steering properties of the manufactured metal cans are improved.

Claims (4)

(ⅰ)전체 산성분에 대하여 이소프탈산 성분이 12~30몰함유되어 있고 전체 글리콜 성분에 대하여 네오펜틸글리콜 성분이 3~10몰함유되어 있는 공중합 폴리에스테르 칩(A)을 도 1의 표면마찰 장치에서 아래식(I)의 조건으로 표면마찰 시킨 다음 (ⅱ)에틸렌테레프탈레이트를 주반복 단위로 하는 공중합 폴리에스테르 칩(B)을 제 1층으로, 상기 표면마찰시킨 공중합 폴리에스테르 칩(A)을 제 2층(접착층)으로 공압출한 후, 이축배향 함을 특징으로 하는 금속판 접합용 공압출 폴리에스테르 필름의 제조방법.(Iii) The surface friction apparatus shown in FIG. 1 is a co-polyester chip (A) containing 12 to 30 moles of isophthalic acid component relative to the total acid component and 3 to 10 moles of neopentyl glycol component relative to the total glycol component. Surface friction under the condition of the following formula (I), and then (ii) the copolymer polyester chip (B) having ethylene terephthalate as the main repeating unit as the first layer, and the surface friction copolymer polyester chip (A) Biaxially oriented after coextrusion with a 2nd layer (adhesive layer), The manufacturing method of the co-extrusion polyester film for metal plate joining characterized by the above-mentioned. ≤ Q ≤(I) ≤ Q ≤ (I) 상기 식에서P는 스크류 피치사이의 간격(mm),H는 스크류 산의 높이(mm),l은 칩의 평균길이(mm),r은 칩의 평균지름(mm), Q는 표면마찰기의 회전속도(rpm) 이다.Where P is the distance between the screw pitches (mm), H is the height of the screw threads (mm), l is the average length of the chip (mm), r is the average diameter of the chip (mm), and Q is the rotation of the surface friction machine. Speed (rpm). 1항에 있어서, 표면마찰된 공중합 폴리에스테르 칩(A)의 전체 표면적 중 0.5이상에 요철이 발생하도록 표면마찰 시킨 것을 특징으로 하는 금속판 접합용 공압출 폴리에스테르 필름의 제조방법.The method for producing a co-extruded polyester film for joining a metal plate according to claim 1, wherein surface rubbing is performed such that unevenness occurs in 0.5 or more of the total surface area of the surface friction copolymerized polyester chip (A). 제 1층이 에틸렌테레프탈레이트를 주반복 단위로 하는 공중합 폴리에스테르 이고, 제 2층이 전체 산성분에 대하여 이소프탈산 성분이 12~30몰함유되어 있고, 네오펜틸글리콜 성분이 3~10몰함유되어 있는 공중합 폴리에스테르인 것을 특징으로 하는 금속판 접합용 공압출 폴리에스테르 필름.The first layer is a copolyester with ethylene terephthalate as the main repeating unit, and the second layer contains 12 to 30 moles of isophthalic acid component and 3 to 10 moles of neopentyl glycol component with respect to all acid components. The co-extruded polyester film for metal plate joining which is co-polyester which is present. 3항에 있어서, 공압출 폴리에스테르 필름 전체중량 대비 제 1층의 함량이 50~90중량이고 제 2층의 함량이 10~50중량인 것을 특징으로 하는 금속판 접합용 공압출 폴리에스테르 섬유.The coextruded polyester fiber for joining a metal sheet according to claim 3, wherein the content of the first layer is 50 to 90 weights and the content of the second layer is 10 to 50 weights relative to the total weight of the coextruded polyester film.
KR1020000000553A 2000-01-07 2000-01-07 A co-extrusion polyester film for metal plate bonding, and a process of preparing for the same KR100601299B1 (en)

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KR100349505B1 (en) * 2000-01-10 2002-08-21 주식회사 코오롱 Manufacturing method of polyester copolymer pellet for injection molding

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