KR20010063207A - Ic socket for ball grid array - Google Patents

Abstract

PURPOSE: An integrated circuit socket is provided to exactly seat a semiconductor integrated circuit onto the internal surface of a guide of an integrated circuit socket. CONSTITUTION: An integrated circuit socket(300) includes an adapter(60) for fixing a plurality of contacts(50). A slide(40) is slidingly mounted on the adapter. A guide(170) has four edge members in which at least one guide projections are formed. The guide has an empty rectangular shape and is mounted on the slide. A holder(80) is rotatedly mounted on the adapter. A cover(20) is installed over the slide and the guide and covers the slide and the guide. When a semiconductor integrated circuit(200) is loaded, the cover drives the slide and the holder and each of the edges of the semiconductor integrated circuit is guided into the guide projection. When the semiconductor integrated circuit is mounted in place, the holder grasps the semiconductor integrated circuit so that it can be maintained in place.

Description

Integrated circuit socket for ball grid array {IC SOCKET FOR BALL GRID ARRAY}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit socket for a ball grid array (BGA). More particularly, the present invention relates to an integrated ball socket (BGA) integrated circuit socket for securing a semiconductor integrated circuit. Relates to a circuit socket.

In response to the miniaturization and high functionality of electronic devices, surface mounting has become more popular in mounting individual components, and most components have been surface-mounted except for heavy and heavy components such as power meters.

The use of portable computers, portable mobile terminals, personal computers, etc., which are equipped with printed circuit boards by using the surface mount technology as described above, is rapidly growing because of the high integration and miniaturization of surface-mount semiconductor integrated circuits. This is because the size of the substrate is very small and can be miniaturized. For example, the use of an integrated circuit socket for a ball grid array on the central processing unit board of a A4 paper size portable computer reduces the size of the central processing unit board to less than one-quarter of its original size.

A conventional integrated circuit socket for a ball grid array will be described with reference to FIGS. 1 and 2.

First, in FIG. 1, when a loader (not shown) is operated to load a semiconductor integrated circuit (IC) 200 into the integrated circuit socket 100, the cover 20 descends by a stroke of 2.5 mm, and the cover ( The slide 40 is moved in the arrow direction A on the drawing by the slide operation cam 30 that is integrated with 20). Then, the semiconductor integrated circuit 200 is in contact with the contact 50 and the semiconductor integrated circuit 200 is fixed by the integrated circuit holder 80. 70 is an integrated circuit guide for accurately loading the semiconductor integrated circuit 200 on the slide 40, 60 is an adapter to which the contact 50 is fixed.

As shown in FIG. 2, the inclined surface 74 having a predetermined inclination angle is formed in the guide 70, and the semiconductor integrated circuit 200 is guided along the inclined surface 74 and seated on the slide 40. . In addition, a cover 20 surrounding the guide 70 is mounted to the outside of the guide 70.

However, the semiconductor integrated circuit 200 is likely to generate burrs (parts having shapes such as lumps caused by debris, scratches, etc.), particularly in the corners thereof during the manufacturing process or other processes. In a conventional ball grid array integrated circuit socket having a configuration as described above, when the integrated circuit 200 is guided along the guide 70, a jam lamp may occur, and thus, the seating at the correct position may not be performed. That is, when the integrated circuit 200 is guided along the guide 70, a burr formed at the corner portion of the integrated circuit 200 may be caught by the edge portion of the guide 70 to prevent accurate guidance. Accordingly, in the conventional ball grid array integrated circuit socket, there is a problem in that the mounting rate of the integrated circuit 200 is relatively low. In particular, when the size of the outside of the semiconductor integrated circuit is large, since a lot of burrs are generated especially in the corner portion of the semiconductor integrated circuit 200, this problem becomes more serious.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems in the prior art, and an object of the present invention is to provide an integrated circuit socket for a ball grid array in which a semiconductor integrated circuit can be accurately guided and seated on an inner surface of a guide of an integrated circuit socket. To provide.

1 is a front sectional view showing an integrated circuit socket for a general ball grid array.

2 is a front sectional view showing a guide of a conventional integrated circuit socket for a ball grid array.

3 is a front sectional view showing an integrated circuit socket for a ball grid array according to the present invention.

Figure 4 is a plan view showing a guide according to the present invention

5 is a front sectional view showing a guide according to the present invention;

Explanation of symbols on the main parts of the drawings

10: body 20: cover

30: cam for slide operation 40: slide

50: contact 60: adapter

70170: Guide 72: Corner

73: protrusion 74: inclined surface

80: integrated circuit holder 100,300: integrated circuit socket

171: side member 173: guide protrusion

174: guide surface 175: curved portion

176: inclined portion 200: semiconductor integrated circuit

Ball circuit array integrated circuit socket of the present invention for achieving the above object,

An adapter for securing a plurality of contacts,

A slide mounted to slide on the adapter;

A guide mounted on the slide, the guide having a hollow rectangular shape having four side members each having at least one guide protrusion protruding inwardly on an inner surface thereof;

A holder rotatably mounted on the adapter;

A cover installed above the slide and the guide to cover the slide and the guide,

When the semiconductor integrated circuit is loaded, the cover operates the slide and the holder, each side of the semiconductor integrated circuit is guided in contact with the guide protrusion, and the holder when the semiconductor integrated circuit is mounted in place. Is characterized in that for holding the semiconductor integrated circuit in place.

Preferably, each of the guide protrusions is formed with a guide surface that is curved at the upper end and inclined inwardly toward the lower side.

Hereinafter, the configuration and operation of the ball circuit array integrated circuit socket according to an embodiment of the present invention will be described in detail with reference to FIGS.

3 shows an integrated circuit socket 300 for a ball grid array in accordance with one embodiment of the present invention. As shown, the integrated circuit socket 300 for the ball grid array includes an adapter 60 for securing a plurality of contacts 50 and a slide mounted to slide on the adapter 60 by the cam 30. 40, a guide 170 mounted on the slide 40 to guide the semiconductor integrated circuit 200, and a cover 20 installed above the slide 40 and the guide 170 to cover these members. do.

In addition, a holder 80 is rotatably installed on the adapter 60, and the holder 80 holds and holds the semiconductor integrated circuit 200 in place when the semiconductor integrated circuit 200 is mounted.

4 and 5 show plan and side cross-sectional views of the guide 170 employed in the integrated circuit socket 300 for the ball grid array. As shown, the guide 170 has four side members 171 to have a hollow rectangular shape. In the center of the inner surface 172 of each side member 171 is formed two guide protrusions 173 spaced apart from each other at a predetermined interval, so that the guide 170 is a total of eight guide protrusions 173 Equipped. Each guide protrusion 173 protrudes inward from the inner surface 172 of the side member 171, and as shown in an enlarged view in FIG. 5, an upper end is curved on the inner surface of the guide protrusion 173 and the inner side toward the lower side thereof. A guide surface 174 extending obliquely is formed.

Hereinafter, a process of loading the integrated circuit 200 into the integrated circuit socket 300 for the ball grid array according to the exemplary embodiment having the above configuration will be described.

First, when the loader (not shown) is operated to load the semiconductor integrated circuit 200 into the integrated circuit socket 300 shown in FIG. 3, the cover 20 is lowered, and the slide 20 is integrated with the cover 20. The slide 40 slides on the adapter 60 by the cam 30. In addition, the semiconductor integrated circuit 200 is guided downward by the guide 170. Four side portions of the semiconductor integrated circuit 200 come into contact with the guide protrusion 173 of the guide 170 first. . Then, the four side portions of the semiconductor integrated circuit 200 are smoothly guided along the inclined portion 176 below the curved portion 175 of the upper end of the guide protrusion 173 of the guide 170. Therefore, even if a burr is formed at an edge portion of the semiconductor integrated circuit 200, the burr does not prevent accurate loading of the semiconductor integrated circuit 200.

In this manner, when the semiconductor integrated circuit 200 is completely lowered and loaded in place, the holder 80 rotates to support the semiconductor integrated circuit 200. Then, the semiconductor integrated circuit 200 is contacted with the contact 50 and fixed by the integrated circuit holder 80 to complete loading.

As described above, in the integrated circuit socket for a ball grid array according to the present invention, at least one convex guide protrusion is formed inside the guide, and even if there is a burr or the like at the corner of the semiconductor integrated circuit, Since the edge portion contacts the guide protrusion first, the semiconductor integrated circuit can be safely seated correctly along the guide surface of the guide protrusion.

Accordingly, the present invention provides an integrated circuit socket for a ball grid array that enables a semiconductor integrated circuit to be guided and seated accurately on the inner surface of a guide of an integrated circuit socket.

In addition, various modifications, changes, additions, etc. will be possible within the spirit and scope of the present invention, and such modifications should be regarded as belonging to the following claims.

Claims (2)

An adapter for securing a plurality of contacts, A slide mounted to slide on the adapter; A guide mounted on the slide, the guide having a hollow rectangular shape having four side members each having at least one guide protrusion protruding inwardly on an inner surface thereof; A holder rotatably mounted on the adapter; A cover installed above the slide and the guide to cover the slide and the guide, When the semiconductor integrated circuit is loaded, the cover operates the slide and the holder, each side of the semiconductor integrated circuit is guided in contact with the guide protrusion, and the holder when the semiconductor integrated circuit is mounted in place. And the gasket holds the semiconductor integrated circuit and holds it in place. The method of claim 1, Each of the guide protrusions is a ball grid array integrated circuit socket, characterized in that the guide surface is bent and extending inclined inwardly toward the bottom downward.