KR20010057123A - Manufacturing method for chip parts - Google Patents

Manufacturing method for chip parts Download PDF

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Publication number
KR20010057123A
KR20010057123A KR1019990058901A KR19990058901A KR20010057123A KR 20010057123 A KR20010057123 A KR 20010057123A KR 1019990058901 A KR1019990058901 A KR 1019990058901A KR 19990058901 A KR19990058901 A KR 19990058901A KR 20010057123 A KR20010057123 A KR 20010057123A
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KR
South Korea
Prior art keywords
electrode
ceramic sheet
terminal electrode
chip
chip block
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KR1019990058901A
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Korean (ko)
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KR100349124B1 (en
Inventor
박성열
이대형
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이형도
삼성전기주식회사
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Priority to KR1019990058901A priority Critical patent/KR100349124B1/en
Publication of KR20010057123A publication Critical patent/KR20010057123A/en
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Publication of KR100349124B1 publication Critical patent/KR100349124B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Abstract

PURPOSE: A method for manufacturing a chip component is provided to minimize variation in electric characteristic, form a precise terminal electrode and improve productivity. CONSTITUTION: A ground electrode(140), a marking(130) and a terminal electrode(150) are formed by a printing to be electrically separated from each other on the first ceramic sheet which is laminated and printed. An inside electrode(100) is formed such that both ends of the inside electrode is protruded to an upper surface on the second ceramic sheet which is laminated and printed on the first ceramic sheet. A chip block(120) is formed by forming the ground electrode and the terminal electrode on the third ceramic sheet which is laminated and printed on the second ceramic sheet. A lateral surface electrode(150) is formed by a printing to be connected at least a part of the terminal electrode which is formed on an upper surface of the chip block and to be connected at least a part of the inside electrode. The chip block is formed by cutting a green bar in a standard size.

Description

칩부품 제조방법{MANUFACTURING METHOD FOR CHIP PARTS}Chip part manufacturing method {MANUFACTURING METHOD FOR CHIP PARTS}

본 발명은 핸드폰등에 사용되는 칩 부품으로 분할기인 스플리터(SPLITTER)에 있어서, 칩부품의 단자전극 형성시 복수개 적층되어 형성되는 세라믹 시트의 상면에 상면 단자전극을 먼저 인쇄한후 상기 상면 단자전극에 연결토록 측면에 단자전극을 인쇄하여 단자전극 형상을 위한 별도의 설비가 불필요한 칩 부품 제조방법에관한 것이다.The present invention, in the splitter (SPLITTER) as a chip component used in a mobile phone, etc., first printing the upper terminal electrode on the upper surface of the ceramic sheet formed by stacking a plurality of the terminal electrode of the chip component and then connected to the upper terminal electrode The terminal electrode is printed on the side so that a separate device for the shape of the terminal electrode is unnecessary and the chip component manufacturing method is unnecessary.

일반적으로, 최근에는 전자 및 통신기기의 비약적인 발달과 더블어 상기 전자 및 통신기기의 빈번한 사용빈도에 따른 상호간의 간섭에 의해 통신장애 등의 문제가 자주 발생하고 있으며, 이에따라 무선통신 기기 및 멀티미디어의 사용에 따라 발생되는 악화된 전자기적 환경을 개선하고자 각국의 전자기 장애규제가 강화되고 있는 추세이다.In general, in recent years, due to the rapid development of electronic and communication devices and the interference of each other due to the frequent use frequency of the electronic and communication devices, problems such as communication failures frequently occur, and accordingly the use of wireless communication devices and multimedia In order to improve the deteriorated electromagnetic environment, the electromagnetic interference regulation of each country is strengthening.

특히 스플리터(SPLITTER)는, 기존의 부품들과 달리 양단에 외부전극을 형성하는 것이 아니고, 제품의 위아래에 전극을 형성하여 외부회로에 장착토록 하며, 상기 외부전극의 형상은 균일해야만 전기적인 특성편차가 줄어들수 있는 것이다.In particular, the splitter, unlike conventional components, does not form external electrodes at both ends, but forms electrodes on the top and bottom of the product to be mounted in an external circuit. Can be reduced.

이와같은 기술과 관련된 종래의 칩 부품의 단자 형성장치는 도1에 도시한 바와같이, 복수의 세라믹시트가 적층되어 형성되는 칩블록(1)의 상면에 마킹(2)이 일체로 인쇄되고, 상기 마킹(2) 이 형성되는 칩블록(1)의 상하면과 칩블록(1)의 측면에 단자전극(3)을 일체로 형성토록 고무롤러(4)가 설치되며, 상기 고무롤러(4)의 외경측에 단자전극(3)을 형성토록 도전성 페이스트가 충진되는 다수의 페이스트 저장홀(5)이 일체로 형성되는 구성으로 이루어 진다.In the terminal forming apparatus of a conventional chip component related to such a technique, as shown in FIG. 1, the marking 2 is integrally printed on the upper surface of the chip block 1 formed by stacking a plurality of ceramic sheets. The rubber roller 4 is installed on the upper and lower surfaces of the chip block 1 on which the marking 2 is formed and the terminal electrodes 3 are integrally formed on the side of the chip block 1, and the outer diameter of the rubber roller 4 is provided. A plurality of paste storage holes 5 filled with the conductive paste to form the terminal electrode 3 on the side are formed integrally.

상기와 같은 칩 부품의 단자형성장치는, 복수의 세라믹시트가 적층되어 인쇄될때 일측면에 돌출토록 마킹(1)이 일체로 인쇄되어 칩블록(1)의 형성시 상면에 마킹(2)이 형성되고, 상기 마킹(2)을 기준점으로 칩블록(1)의 상하면과 칩블록(1)의 측면에 단자전극(3)을 일체로 형성토록 도전성페이스트가 충진되는 고무롤러(4)를칩블록(1)에 압착하며, 이때 고무롤러(4)의 페이스트 저장홀(5)에 충진되는 도전성 페이스트가 칩블록(1)에 전사되어 단자전극(3)을 형성토록 한다.In the terminal forming apparatus of the chip component as described above, when a plurality of ceramic sheets are stacked and printed, the marking 1 is integrally printed on one side so that the marking 2 is formed on the upper surface when the chip block 1 is formed. And a rubber roller 4 filled with conductive paste so that the terminal electrode 3 is integrally formed on the upper and lower surfaces of the chip block 1 and the side of the chip block 1 with the marking 2 as a reference point. ), Wherein the conductive paste filled in the paste storage hole 5 of the rubber roller 4 is transferred to the chip block 1 to form the terminal electrode 3.

이때, 상기 고무롤러(4)의 탄성에 의해 페이스트 저장홀(5)에 충진되는 도전성 페이스트는 칩블록(1)의 측면및 그 양측의 상하면및 전후면 일부까지 전사되어 단자전극(3)을 형성토록 되는 것이다.At this time, the conductive paste filled in the paste storage hole 5 by the elasticity of the rubber roller 4 is transferred to the upper and lower surfaces and a portion of the front and rear surfaces of the chip block 1 to form the terminal electrode 3. It is forever.

그러나, 상기와 같은 칩 부품의 단자전극 형성장치는, 칩부품(1)중 고무롤러(1)의 접촉면과 수평상태에 있는 면(측면)은 도전성 페이스트의 도포에 문제가 없지만 접촉면과 수직상태인 면(앞,뒤면)의 도포가 힘들게 됨은 물론 그 도포량을 조절하기 힘들어 균일한 단자전극(3)의 형성이 힘들어 특성편차가 증가하게 되고, 단자전극(3)을 형성하기 위한 고무롤러(4)와 같은 별도의 장치를 필요로 하게 되는 단점이 있었던 것이다.However, in the terminal electrode forming apparatus of the chip component as described above, the surface (side) of the chip component 1 which is in the horizontal state with the contact surface of the rubber roller 1 has no problem in applying the conductive paste, but is perpendicular to the contact surface. It is difficult to apply the surface (front, back), as well as difficult to control the coating amount of the uniform terminal electrode (3) is difficult to form a characteristic deviation increases, the rubber roller (4) for forming the terminal electrode (3) There was a disadvantage that requires a separate device such as.

본 발명은 상기한 바와같은 종래의 여러 문제점들을 개선하기 위한 것으로서 그 목적은, 단자전극 형성을 위한 별도의 장치가 필요없으며, 칩부품에 단자전극을 인쇄에 의하여 단자전극의 도포량을 일정하기 유지함으로써 전기적인 특성편차가 최소화 되고, 정밀한 단자전극의 형성이 가능하며, 추가적인 설비 및 공정이 불필요하여 작업을 단순화함으로써 생산성을 향상시킬수 있도록 한 칩 부품 제조방법을 제공하는데 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. Its purpose is to eliminate the need for a separate device for forming a terminal electrode, and to maintain a constant coating amount of the terminal electrode by printing the terminal electrode on a chip part. The present invention provides a method for manufacturing chip components that minimizes electrical characteristic deviations, enables the formation of precise terminal electrodes, and improves productivity by simplifying operations because additional equipment and processes are unnecessary.

도1은 종래의 칩 부품 단자전극 형성상태를 도시한 개략도1 is a schematic diagram showing a conventional chip component terminal electrode formation state;

도2는 본 발명에 따른 칩 부품의 상면 단자전극 형성상태를 도시한 평면도2 is a plan view showing a top terminal electrode formation state of a chip component according to the present invention;

도3은 본 발명에 따른 칩 부품의 단자전극 형성상태를 도시한 개략도3 is a schematic diagram showing a terminal electrode formation state of a chip component according to the present invention;

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

120...칩블록 130...마킹120 ... chip block 130 ... marking

140...상면접지전극 150...측면전극140 Top ground electrode 150 Side electrode

170...칩부품 180...그린바170 Chips 180 Green Bar

상기 목적을 달성하기 위한 기술적인 구성으로서 본 발명은, 적층 인쇄되는 제1세라믹 시트에 접지전극과 마킹및 단자전극을 형성하는 단계,The present invention as a technical configuration for achieving the above object, the step of forming a ground electrode, a marking and a terminal electrode on the first ceramic sheet to be laminated printed;

상기 제1 세라믹 시트에 적층 인쇄되는 제2 세라믹 시트에 양단이 상면으로 돌출토록 내부전극을 형성하는 단계,Forming internal electrodes on both sides of the second ceramic sheet laminated on the first ceramic sheet so as to protrude upward;

상기 제2 세라믹 시트에 적층인쇄되는 제3세라믹 시트에 접지전극과 단자전극을 형성시켜 칩블록을 형성하는 단계,Forming a chip block by forming a ground electrode and a terminal electrode on the third ceramic sheet laminated and printed on the second ceramic sheet;

상기 칩블록 상면에 형성되는 단자전극과 접속토록되며, 칩블록 측면에 형성되는 내부전극과 연결토록 되는 인쇄에 의해 형성되는 측면전극을 포함하는 구성으로 이루어진 칩 부품 제조방법을 마련함에 의한다.By providing a chip component manufacturing method comprising a side electrode formed to be connected to the terminal electrode formed on the upper surface of the chip block, the printing is connected to the internal electrode formed on the side of the chip block.

이하, 첨부된 도면에 의거하여 본 발명의 실시예를 상세하게 설명하면 다음과 같다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도2는 본 발명에 따른 칩 부품의 상면 단자전극 형성상태를 도시한 평면도이고, 도3은 본 발명에 따른 칩 부품의 단자전극 형성상태를 도시한 개략도로서 본 발명은, 복수개의 제1,제2,제3 세라믹 시트부(110A)(110B)(110C)가 적층 인쇄될때 일정패턴의 내부전극(100)을 갖는 칩블록(120)을 형성하고, 이때 상기 세라믹 시트부(110A)의 일측면 즉 칩블록(120)의 형성시의 상면(U)에 위치토록 마킹(130)이 일체로 돌출 인쇄되고, 상기 마킹(130)은, 칩블록(120)의 형성시 내부전극(100)과 전기적으로 분리되어 외부에서의 기준점으로 인식된다.2 is a plan view showing a top terminal electrode formation state of a chip component according to the present invention, and FIG. 3 is a schematic view showing a terminal electrode formation state of a chip component according to the present invention. When the second and third ceramic sheet parts 110A, 110B and 110C are laminated and printed, a chip block 120 having an internal electrode 100 having a predetermined pattern is formed, and at this time, one side of the ceramic sheet part 110A is formed. That is, the marking 130 is integrally projected and printed on the upper surface U when the chip block 120 is formed, and the marking 130 is electrically connected to the internal electrode 100 when the chip block 120 is formed. It is separated from and recognized as an external reference point.

또한, 상기 칩블록(120)의 하측에 적층 인쇄되어 형성되는 제1및 제3세라믹 시트부(110A)(110C)에는, 칩블록(120)의 형성시 상면(U)및 하면(미도시)의 적어도 일부와 측면(S)에 접하도록 상면접지전극(140)과 상면단자전극(140A)이 인쇄되고, 이때 상기 제1세라믹시트부(110A)에는 내부전극(100)과 접지전극 및 단자전극과 분리토록 되는 마킹(130)이 일체로 인쇄된다.In addition, the first and third ceramic sheet parts 110A and 110C formed by being laminated and printed on the lower side of the chip block 120 may have an upper surface U and a lower surface (not shown) when the chip block 120 is formed. The upper ground electrode 140 and the upper terminal electrode 140A are printed to be in contact with at least a portion and the side surface S of the upper surface electrode 140 and the upper terminal electrode 140A. In this case, the first ceramic sheet part 110A has an internal electrode 100 and a ground electrode and a terminal electrode. Marking 130 to be separated from and printed integrally.

상기 세라믹 시트부(110A)(110B)(110C)를 적층하여 형성되는 칩블록(120)의 측면(S)을 연마하여 그 절단면에 형성되는 단자전극(140A)과 연결토록 측면전극(150)을 인쇄하고, 또한 하면을 연마하여 양측의 접지전극(140)을 전극(미도시)의 인쇄에 의해 일체로 형성하여 칩부품(170)이 완성된다.The side surface S of the chip block 120 formed by stacking the ceramic sheet parts 110A, 110B, and 110C is polished, and the side electrode 150 is connected to the terminal electrode 140A formed on the cut surface thereof. After printing, the lower surface is polished and the ground electrodes 140 on both sides are integrally formed by printing the electrodes (not shown), thereby completing the chip component 170.

한편, 상기 칩블록(120)은, 다수의 마킹(130)과 상면단자전극(140A)및 상면접지전극(140)이 일체로 인쇄되는 그린바(180)에 다수개 일체로 형성되며, 상기 그린바(180)는, 상면단자전극(140A)및 상면접지전극(140)의 대략 중앙부에 절단부(190)가 형성되어 절단함으로써 다수의 칩블록(120)을 일체로 형성하게 된다.On the other hand, the chip block 120, a plurality of markings 130, the top terminal electrode 140A and the top ground electrode 140 is integrally formed on the green bar 180 is integrally printed with a plurality, the green The bar 180 is formed by cutting the cutting unit 190 at substantially the center of the upper terminal electrode 140A and the upper ground electrode 140 to form a plurality of chip blocks 120 integrally.

상기 그린바(180)에 형성되는 칩블록(120)을 절단하여 그 절단면을 연마하고, 이때 절단면에 돌출되는 내부전극(100)과 전기적으로 연결토록 되면서 상하면의 상면단자전극(140A)및 상면접지전극(140)에 연결토록 되는 측면단자전극(150)을 인쇄하는 구성으로 이루어 진다.The chip block 120 formed on the green bar 180 is cut to polish the cut surface, and at this time, the upper terminal electrode 140A and the upper ground of the upper and lower surfaces are electrically connected to the internal electrode 100 protruding from the cutting surface. It is made of a configuration for printing the side terminal electrode 150 to be connected to the electrode 140.

이와같은 구성으로 이루어진 본 발명의 작용을 설명하면 다음과 같다.Referring to the operation of the present invention made of such a configuration as follows.

도2 및 도3에 도시한 바와같이, 일정패턴을 갖는 내부전극(100)이 복수의 세라믹 시트부(110A)(110B)(110C) 적층시 그 내측에 일정패턴을 갖도록 일체로 형성되고, 이때 상기 내부전극(100)의 단부는 칩블록(120)의 측면(S)에 돌출되면서 접하도록 된다.2 and 3, the internal electrode 100 having a predetermined pattern is integrally formed to have a predetermined pattern inside the plurality of ceramic sheet parts 110A, 110B, 110C when stacked. The end of the internal electrode 100 is in contact with the protruding side (S) of the chip block 120.

그리고, 상기 세라믹 시트부(110B)의 적층에 의한 칩블록(120)의 형성시 칩블록(120)의 일측면에 마킹(130)이 일체로 인쇄되어 칩부품(170)을 외부부품(기판)등에 실장시 기준점을 역활을 수행토록 하며, 상기 마킹(130)은 내부전극(100)과 전기적으로 분리되는 더미전극(dummy)으로서 세라믹 시트(110A)(110C)의 일측면에 돌출토록 인쇄된다.In addition, when the chip block 120 is formed by stacking the ceramic sheet part 110B, the marking 130 is integrally printed on one side of the chip block 120 to form the chip component 170 as an external component (substrate). It serves to serve as a reference point when mounted on the back, the marking 130 is a dummy electrode (dummy) electrically separated from the internal electrode 100 is printed to protrude on one side of the ceramic sheet (110A) (110C).

또한, 상기 칩블록(120)의 형성시 그 내측에 적층되는 제2세라믹 시트부(110B)에는, 완성되는 칩블록(120) 측면(S)에 돌출토록 내부전극(100)의 양단이 돌출되고, 상기 제1및 제3세라믹시트부(110A)110C)에는 상면의 적어도 일부와 측면에 각각 접하면서 돌출토록 형성되는 상면접지전극(140)이 일체로 인쇄되고, 상기 제1세라믹 시트부(110A)에 마킹(130) 또한 일체로 인쇄되어 형성되며, 상기 상면접지전극(140)은 내부전극(100)과 분리되어 외부부품에 실장시 접지전극으로서의 역활을 수행한다.In addition, when the chip block 120 is formed, both ends of the internal electrode 100 protrude from the second ceramic sheet part 110B stacked inside the chip block 120 to protrude from the side surface S of the chip block 120. The first and third ceramic sheet parts 110A and 110C are integrally printed with a top ground electrode 140 formed to protrude while contacting at least a portion and a side of the upper surface, respectively, and the first ceramic sheet part 110A. The marking 130 is also integrally printed and formed, and the upper ground electrode 140 is separated from the internal electrode 100 to serve as a ground electrode when mounted on an external component.

그리고, 상기 상면단자전극(140A)은, 내부전극(100)의 양단에 각각 연결될때 외부부품에 접속되어 입출력 단자로서의 역활을 수행토록 된다.When the upper terminal electrode 140A is connected to both ends of the internal electrode 100, the upper terminal electrode 140A is connected to an external component to serve as an input / output terminal.

상기 세라믹 시트부(110A)(110B)(110C)를 적층할때 칩블록(120)이 완성되고, 상기 칩블록(120)의 상면(U)에 형성되어 외부부품과 연결토록 되는상면단자(140A)을 내부전극(100)과 연결토록 하는 측면전극(150)은, 세라믹시트부를 적층할때 마킹(130)과 상면접지전극(140)및 상면단자전극(140A)이 일체로 형성되는 칩블록(120)의 측면(S)에 인쇄에 의해 일체로 형성된다.When stacking the ceramic sheet parts 110A, 110B, and 110C, the chip block 120 is completed, and is formed on the upper surface U of the chip block 120 to be connected to external components 140A. The side electrode 150 connecting the internal electrode 100 to the internal electrode 100 includes a chip block in which the marking 130, the top ground electrode 140, and the top terminal electrode 140A are integrally formed when the ceramic sheet part is stacked. It is formed integrally by printing on the side surface S of 120.

이때, 상기 측면전극(150)은, 칩블록(120)의 내측에 형성되는 내부전극(100)과 제1및 제3세라믹시트부(110A)(110C)에 형성되는 상면단자전극(140A)을 연결토록 형성되며, 마킹(130)과 상면접지전극(140)및 상면단자전극(140A)이 일체로 형성되는 칩블록(120)의 측면(S)을 절단하여 연마한후 상면단자전극(140A)및 내부전극(100)의 적어도 일부와 접속되어 전기적으로 연결토록 측면전극(150)을 인쇄나 전사에 의해 형성한다.In this case, the side electrode 150 may include an internal electrode 100 formed inside the chip block 120 and an upper terminal electrode 140A formed in the first and third ceramic sheet parts 110A and 110C. It is formed so as to connect, and cut and polished the side (S) of the chip block 120 is formed integrally with the marking 130, the top ground electrode 140 and the top terminal electrode (140A), the top terminal electrode (140A) And a side electrode 150 connected to at least a portion of the internal electrode 100 so as to be electrically connected to each other.

상기 칩블록(120)의 측면은 절단후 연마공정에 의해 내부전극(100)이 돌출되는 상태에서 그 상측에 측면전극(150)이 형성됨으로써 내부전극(100)과 상면단자전극(140A)이 상호 전기적으로 연결토록 되며, 상기 공정에 의해 칩부품(170)이 완성토록 된다.The side of the chip block 120 has a side electrode 150 formed on the upper side in the state in which the internal electrode 100 is protruded by a polishing process after cutting, so that the internal electrode 100 and the upper terminal electrode 140A mutually Electrically connected, the chip component 170 is completed by the above process.

한편, 상기 칩블록(120)은, 복수의 마킹(130)과 상면단자전극(140A)및 상면접지전극(140)이 일체로 인쇄되는 그린바(180)에 다수개를 일체로 제작할수 있도록 되며, 상기 그린바(180)는, 상면단자전극(140A)및 상면접지전극(140)의 대략 중앙부에 절단부(190)가 형성되어 절단한후 연마를 수행함으로써 다수의 칩블록(120)을 일체로 형성하게 된다.On the other hand, the chip block 120, the plurality of markings 130, the top terminal electrode 140A and the top ground electrode 140 can be integrally manufactured in a plurality of green bar 180 is printed integrally. In addition, the green bar 180 is formed by cutting the cutting unit 190 at a substantially central portion of the upper terminal electrode 140A and the upper ground electrode 140, and then cutting and polishing the chip blocks 120 integrally. To form.

상기 그린바(180)에 형성되는 칩블록(120)을 절단하여 그 절단면을 연마하고, 이때 절단면에 돌출되는 내부전극(100)과 상면단자전극(140A)을 전기적으로 연결토록 측면전극(150)이 인쇄및 전사에 의해 형성되는 것이다.The chip block 120 formed on the green bar 180 is cut to polish the cut surface, and the side electrode 150 is electrically connected to the inner electrode 100 and the upper terminal electrode 140A that protrude from the cut surface. This is formed by printing and transferring.

이상과 같이 본 발명에 따른 칩 부품 제조방법에 의하면, 단자전극 형성을 위한 별도의 장치가 필요없으며, 칩부품에 단자전극을 인쇄하여 단자전극의 도포량을 일정하기 유지함으로써 전기적인 특성편차가 최소화 되고, 정밀한 단자전극의 형성이 가능하며, 추가적인 설비 및 공정이 불필요하여 작업을 단순화함으로써 생산성을 향상시킬수 있도록 하는 등의 우수한 효과가 있는 것이다.As described above, according to the method of manufacturing a chip component according to the present invention, a separate device for forming a terminal electrode is not required, and electrical characteristic deviation is minimized by printing a terminal electrode on the chip component and maintaining a constant coating amount of the terminal electrode. It is possible to form a precise terminal electrode, and it is possible to improve productivity by simplifying operations because additional equipment and processes are unnecessary.

Claims (3)

적층 인쇄되는 제1세라믹 시트에 상호 전기적으로 분리토록 접지전극과 마킹및 단자전극을 인쇄에 의해 형성하는 단계,Forming a ground electrode, a marking, and a terminal electrode by printing on the first ceramic sheet to be printed by lamination so as to be electrically separated from each other; 상기 제1 세라믹 시트에 적층 인쇄되는 제2 세라믹 시트에 양단이 상면으로 돌출토록 내부전극을 형성하는 단계,Forming internal electrodes on both sides of the second ceramic sheet laminated on the first ceramic sheet so as to protrude upward; 상기 제2 세라믹 시트에 적층인쇄되는 제3세라믹 시트에 접지전극과 단자전극을 형성시켜 칩블록을 형성하는 단계,Forming a chip block by forming a ground electrode and a terminal electrode on the third ceramic sheet laminated and printed on the second ceramic sheet; 상기 칩블록 상면에 형성되는 단자전극의 적어도 일부와 접속토록 되면서 내부전극의 적어도 일부와 접속토록 인쇄에 의해 측면전극을 형성하는 단계를 포함하여 구성되는 것을 특징으로 하는 칩 부품 제조방법And forming a side electrode by printing so as to be connected to at least a part of the terminal electrode formed on the upper surface of the chip block and to be connected to at least a part of the internal electrode. 제 1항에 있어서, 상기 칩블록은, 일정규격으로 다수의 상면단자전극및 마킹이 일체로 인쇄되는 그린바를 일정 규격으로 절단하여 형성되는 것을 특징으로 하는 칩부품 제조방법The method of claim 1, wherein the chip block is formed by cutting a green bar having a plurality of upper terminal electrodes and markings integrally printed to a predetermined standard to a predetermined standard. 제 1항에 있어서, 상기 단자전극 및 접지전극은, 칩블록의 상면 및 측면과 적어도 일부분이 각각 접하도록 형성되는 것을 특징으로 하는 칩부품 제조방법The method of claim 1, wherein the terminal electrode and the ground electrode are formed so as to be in contact with at least a portion of the upper surface and the side surface of the chip block, respectively.
KR1019990058901A 1999-12-18 1999-12-18 Manufacturing method for chip parts KR100349124B1 (en)

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KR0177678B1 (en) * 1996-05-10 1999-04-15 이형도 Ceramic chip capacitor
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