KR20010019893A - Heat activatable, pressure-sensitive adhesive composition - Google Patents

Heat activatable, pressure-sensitive adhesive composition Download PDF

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KR20010019893A
KR20010019893A KR1019990036571A KR19990036571A KR20010019893A KR 20010019893 A KR20010019893 A KR 20010019893A KR 1019990036571 A KR1019990036571 A KR 1019990036571A KR 19990036571 A KR19990036571 A KR 19990036571A KR 20010019893 A KR20010019893 A KR 20010019893A
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meth
acrylate
adhesive composition
heat
group
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KR1019990036571A
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Korean (ko)
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KR100405303B1 (en
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장석기
양세우
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성재갑
주식회사 엘지화학
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/14Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/064Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/066Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters

Abstract

PURPOSE: Provided is a heat active adhesive composition, which is excellent in cohesive force at room temperature as well as fluidity when temperature is raised, and is applicable for in a seat, a film, a label and a tape. CONSTITUTION: The heat active adhesive composition contains i) 100pts.wt. of an acrylic copolymer having 200,000-2,000,000 of molecular weight obtained by copolymerizing a) 55-99.3pts.wt. of methacrylic acid ester monomer, b) 0.5-20pts.wt. of alpha, beta-unsaturated carboxylic acid monomer, c) 0.1-20pts.wt. of tert-amine compound having vinyl group, and d) 0.1-5pts.wt. of a vinyl monomer containing hydroxyl group; ii) 0.01-5pts.wt. of a crosslinking agent; and iii) 1-100pts.wt. of an adhesion-providing resin.

Description

가열활성 점착제 조성물{HEAT ACTIVATABLE, PRESSURE-SENSITIVE ADHESIVE COMPOSITION}Heat-active adhesive composition {HEAT ACTIVATABLE, PRESSURE-SENSITIVE ADHESIVE COMPOSITION}

[산업상 이용 분야][Industrial use]

본 발명은 점착제 조성물에 관한 것으로, 특히 가열활성(heat activatable) 효과가 우수한 점착제품을 제조하기 위하여 사용되는 고기능성 감압점착제(pressure sensitive agent) 조성물에 관한 것이다. 상세하게는 가열시 유동특성이 우수하여 열에 의하여 활성화되는 반면에, 상온에서는 응집력이 우수하여 높은 접착강도를 보유하는 가열활성 점착제 조성물에 관한 것이다.The present invention relates to a pressure-sensitive adhesive composition, and more particularly to a high functional pressure sensitive agent composition used to prepare a pressure-sensitive adhesive product excellent in heat activatable effect. Specifically, the present invention relates to a heat-activated pressure-sensitive adhesive composition having excellent flow characteristics when heated and activated by heat, while having high cohesive strength at room temperature.

[종래 기술][Prior art]

점착제는 사용의 용이성 때문에 시트, 필름, 라벨, 테이프 등 매우 다양한 용도로 사용되며, 최근에는 여러가지 고기능성 및 내구 신뢰성이 요구되는 광학필름용 점착제까지도 그 적용분야가 확대되고 있다.The pressure-sensitive adhesive is used for a wide variety of applications such as sheets, films, labels, and tapes because of its ease of use, and recently, the field of application of the pressure-sensitive adhesive for optical films, which requires various high functionalities and durability, has been expanded.

일반적으로 점착제는 고무계, 아크릴계, 및 실리콘계 등이 있는데, 이중에서 아크릴계 점착제가 다양한 응용특성으로 가장 널리 사용되고 있다.Generally, there are rubber-based, acrylic-based, and silicone-based adhesives, of which acrylic adhesives are most widely used for various application characteristics.

일반적인 아크릴계 점착제는 주로 상온에서 가벼운 압력을 가해주면 우수한 점착 특성을 나타내는데, 이는 점착제를 구성하는 폴리머 분자가 유동 특성을 가지고 있어서 압력에 민감하게 작용하여 피착제에 접착하게 되는 것을 이용한 것이다.A general acrylic pressure-sensitive adhesive mainly exhibits excellent adhesive properties when light pressure is applied at room temperature. This is because the polymer molecules constituting the pressure-sensitive adhesive have flow characteristics, and thus are sensitive to pressure and adhere to the adherend.

일반적으로 가열활성 점착제는 반사시트, 내구성 레이블, 전자부품고정용 등 매우 다양한 용도를 가지고 있는데 다양한 피착체에 대한 우수한 접착성 및 응집력이 필요한 동시에 장시간의 내구 신뢰성도 요구된다. 또한 사용상에 있어서 부착 전 위치선정 등 편의를 도모하기 위하여 가열 전 상온에서의 약간의 점착특성도 함께 요구되고 있다.In general, heat-active adhesives have a wide variety of uses, such as reflective sheets, durable labels, and fixing electronic components, and require excellent adhesion and cohesion to various adherends, and at the same time, long-term durability reliability is also required. In addition, some adhesive properties at room temperature before heating are also required in order to facilitate convenience such as positioning before attachment in use.

일반적인 점착제는 통상 100 내지 2000 gm/in의 부착력을 나타내는데 비하여 가열활성 점착제는 보다 안정된 점착특성을 부여하기 위하여 가열하여 부착하게 되며, 부착 후 상온에서 2000 내지 5000 gm/in 정도의 높은 접착강도를 나타낸다. 그러나 가열하여 부착하기 위해서는 승온시 유동특성이 우수해야 하는데, 일반적인 가열활성 점착제는 상온 응집력을 낮추어야만 유동특성이 좋아지는 단점이 있다. 즉, 상온 응집력을 위하여 가교밀도를 향상시키면 승온시 유동성이 낮아지고, 승온시 유동성을 증진시키면 상온 응집력이 낮아지는 경우가 많다.In general, the pressure-sensitive adhesive usually exhibits an adhesive force of 100 to 2000 gm / in, while the heat-activated pressure-sensitive adhesive is heated and attached to give more stable adhesive properties, and has a high adhesive strength of about 2000 to 5000 gm / in at room temperature after the adhesion. . However, in order to heat and attach, the flow characteristics should be excellent at elevated temperatures. In general, the heat-active adhesive has a disadvantage in that the flow characteristics are improved only by reducing the cohesive force at room temperature. That is, if the crosslinking density is improved for the cohesion at room temperature, the fluidity is lowered at elevated temperature, and if the fluidity at the elevated temperature is enhanced, the coagulation force is often lowered.

한편, 미국특허 제3,635,754에는 온도활성 점착제 조성물이 개시되어 있는데 결정성 물질의 상변화 현상을 이용하여 상온에서는 택(tack) 특성이 없고, 가열된 상태에서 강한 접착특성을 발현하는 것이 특징이다. 그러나 일시적인 접착강도만 부여하고 있다.On the other hand, U.S. Patent No. 3,635,754 discloses a temperature-active adhesive composition, which has no tack characteristic at room temperature by using a phase change phenomenon of a crystalline material, and is characterized by expressing strong adhesive properties in a heated state. However, only temporary adhesive strength is given.

미국특허 제4,199,646호에는 열에 의하여 강한 부착력이 유발되는 가열활성 점착제가 개시되어 있는데, 아크릴계 폴리머에 반응형 핫멜트(hotmelt) 접착제를 블렌딩한 것으로 반응성 관능기를 이용하여 상용화한 것이다. 그리고 일반 탄성체 타입의 점착제 유동특성을 향상시키기 위하여 열경화성 접착제의 조성물로 개선을 시도하였는데 점착제 제조 공정이 복잡하고, 접착강도가 너무 강한 단점이 있다.U. S. Patent No. 4,199, 646 discloses a heat-activated pressure-sensitive adhesive that causes strong adhesion by heat, which is a blend of a reactive hotmelt adhesive to an acrylic polymer and commercialized using a reactive functional group. And to improve the pressure-sensitive adhesive flow characteristics of the general elastomer type was tried to improve the composition of the thermosetting adhesive, the pressure-sensitive adhesive manufacturing process is complicated, the adhesive strength is too strong disadvantages.

미국특허 제4,427,744호에는 온도에 따른 첨가제의 상호작용을 이용한 가열활성 점착제가 개시되어 있는데, 첨가제의 선택이 제한되어 있어서 점착물성의 조절이 쉽지 않은 단점이 있다.U.S. Patent No. 4,427,744 discloses a heat-activated pressure-sensitive adhesive using an interaction of additives with temperature, and the selection of additives is limited, which makes it difficult to control adhesive properties.

미국특허 제4,248,748호에는 아크릴계 점착제 등에 과량의 점착성 부여 수지를 첨가한 가열활성 점착제가 개시되어 있다.U. S. Patent No. 4,248, 748 discloses a heat-activated pressure-sensitive adhesive in which an excess pressure-sensitive resin is added to an acrylic pressure-sensitive adhesive.

또한 상기 종래기술들은 첨가제의 배합과정을 통하여 가열활성 점착제를 제안한 것으로 사용되는 수지의 가열활성 효율성이 낮고, 제조공정이 복잡한 단점이 있다.In addition, the prior art has a disadvantage of low heat activity efficiency of the resin used to propose a heat activated pressure-sensitive adhesive through the compounding process of the additive, a complicated manufacturing process.

본 발명은 상기 종래기술의 문제점을 고려하여, 가열시 유동특성이 우수하여 피착제와의 초기접촉(wetting)을 활성화시키며, 부착 후 사용온도인 상온에서는 가교되어 접착제와 같이 응집력이 우수하여 작업특성 및 물성이 현격하게 향상된 가열활성 점착제 조성물을 제공하는 것을 목적으로 한다.The present invention takes into account the problems of the prior art, it is excellent in flow characteristics during heating to activate the initial contact (wetting) with the adherend, and after the attachment at room temperature, the use temperature is crosslinked and excellent cohesive force, such as adhesive, work characteristics And it is an object to provide a heat-active pressure-sensitive adhesive composition with significantly improved physical properties.

본 발명의 다른 목적은 점착제를 이루는 주성분인 아크릴계 공중합체 수지의 가열활성 특성을 변화시켜 효율성을 높이고, 제조방법도 단순한 가열활성 점착제 조성물을 제공하는 것이다.Another object of the present invention is to improve the efficiency by changing the heat-active properties of the acrylic copolymer resin as a main component of the pressure-sensitive adhesive, and to provide a simple heat-active pressure-sensitive adhesive composition.

본 발명의 또 다른 목적은 상온에서의 응집력이 우수하고, 승온시 분자간 결합력이 낮아지는 산염기 상호작용을 이용하여 유동특성을 부여하는 아크릴계 공중합체 조성물을 사용하는 가열활성 점착제 조성물을 제공하는 것이다.Still another object of the present invention is to provide a heat-activated pressure-sensitive adhesive composition using an acrylic copolymer composition having excellent cohesive force at room temperature and imparting flow characteristics by using an acidic group interaction in which the intermolecular binding force is lowered at elevated temperatures.

[과제를 해결하기 위한 수단][Means for solving the problem]

본 발명은 상기 목적을 달성하기 위하여,The present invention to achieve the above object,

a) ⅰ) 탄소수 1 내지 12의 알킬기를 갖는 (메타)아크릴산에스테르 단량체a) iii) a (meth) acrylic acid ester monomer having an alkyl group having 1 to 12 carbon atoms

55∼99.3 중량부;55 to 99.3 parts by weight;

ⅱ) α,β 불포화카르복실산 단량체 0.5∼20 중량부;Ii) 0.5 to 20 parts by weight of an α, β unsaturated carboxylic acid monomer;

ⅲ) 비닐기를 갖는 3급 아민화합물 0.1∼20 중량부; 및Iii) 0.1 to 20 parts by weight of a tertiary amine compound having a vinyl group; And

ⅳ) 수산기를 포함하는 비닐계 단량체 0.1∼5 중량부Iii) 0.1 to 5 parts by weight of a vinyl monomer containing a hydroxyl group

를 공중합하여 얻은 아크릴계 공중합체 100 중량부;100 parts by weight of an acrylic copolymer obtained by copolymerizing;

b) 가교제 0.01∼5 중량부; 및b) 0.01 to 5 parts by weight of a crosslinking agent; And

c) 점착성 부여 수지 1∼100 중량부c) 1 to 100 parts by weight of tackifying resin

를 포함하는 가열활성 점착제 조성물을 제공한다.It provides a heat-active adhesive composition comprising a.

[작 용][Action]

본 발명은 상온에서의 응집력이 우수하고, 승온시 분자간 결합력이 낮아지는 산-염기 상호작용을 이용하여 유동특성을 부여할 수 있는 아크릴계 공중합체 조성물을 가열활성 점착제의 조성물에 포함시킴으로써 우수한 응집력과 유동특성을 나타내도록 한 것이다.The present invention provides an excellent cohesive force and fluidity by incorporating an acrylic copolymer composition having excellent cohesive force at room temperature and giving flow characteristics by using an acid-base interaction in which the intermolecular binding force is lowered at an elevated temperature. It is intended to exhibit the characteristics.

이를 위하여 상기 a)의 점착성을 부여하는 아크릴계 공중합체는 일반적인 용액중합법, 광중합법, 벌크(bulk)중합법, 서스펜젼(suspension)중합법, 에멀젼(emulsion)중합법 등을 사용하여 제조한다. 특히 가열활성 점착제를 위하여 승온과정에서 중합하는 것이 바람직하며, 이는 중합할 때 단량체들의 상호작용에 의한 중합반응의 불균일화를 감소시키기 위한 것이다. 중합온도는 50∼140 ℃가 바람직하며, 단량체들이 균일하게 혼합된 상태에서 개시제를 첨가하는 것이 바람직하다. 점착제의 점탄성 특성은 주로 고분자 사슬의 분자량, 분자량분포 및 분지구조의 존재량에 의존하는데 주로 분자량에 의하여 결정되며, 바람직한 분자량은 10만 내지 200만이며, 일반적으로 잘 알려진 라디칼 공중합 과정을 거쳐 제조할 수 있다.To this end, the acrylic copolymer imparting the tackiness of a) is prepared using a general solution polymerization method, a photopolymerization method, a bulk polymerization method, a suspension polymerization method, an emulsion polymerization method, or the like. . Particularly, it is preferable to polymerize in a temperature rising process for the heat-active adhesive, which is to reduce the heterogeneity of the polymerization reaction by the interaction of the monomers during the polymerization. As for polymerization temperature, 50-140 degreeC is preferable, and it is preferable to add an initiator in the state in which monomer was mixed uniformly. Viscoelastic properties of the pressure-sensitive adhesive mainly depends on the molecular weight of the polymer chain, molecular weight distribution, and the amount of branched structure, which is mainly determined by the molecular weight, and the preferred molecular weight is 100,000 to 2 million. Can be.

상기 a)의 아크릴계 공중합체를 제조하는데 사용되는 원료들에 있어서, 상기 ⅰ)의 탄소수 1 내지 12의 알킬기를 갖는 (메타)아크릴산에스테르 단량체는 알킬기가 장쇄 형태로 되면 점착제의 응집력이 낮아지기 때문에 고온 하에서 응집력을 유지하기 위하여 알킬기의 탄소수를 4 내지 8의 범위에서 선택하는 것이 더욱 바람직하다.In the raw materials used to prepare the acrylic copolymer of a), the (meth) acrylic acid ester monomer having an alkyl group having 1 to 12 carbon atoms of (i) has a high cohesive force of the pressure-sensitive adhesive when the alkyl group is in a long chain form under high temperature. It is more preferable to select the carbon number of an alkyl group in the range of 4-8 in order to maintain cohesion force.

사용량은 a)의 아크릴계 공중합체 100 중량부 내에서 55 내지 99.3 중량부가 바람직하고, 더욱 바람직하게는 60 내지 97 중량부를 투입하여 공중합시키는 것이 효과적이다. 사용량이 55 중량부 이하인 경우는 점착제의 초기 점착 특성이 낮아지게 되고 비용이 상승하는 요인을 제공한다. 또한 과도하게 사용될 경우에는 응집력이 낮아지게 된다.The usage-amount is preferably 55 to 99.3 parts by weight within 100 parts by weight of the acrylic copolymer of a), and more preferably 60 to 97 parts by weight to copolymerize. When the amount used is 55 parts by weight or less, the initial adhesive properties of the pressure-sensitive adhesive is lowered and the cost increases. In addition, when used excessively, cohesion becomes low.

상기 ⅰ)의 탄소수 1 내지 12의 알킬기를 갖는 (메타)아크릴산에스테르 단량체의 예로는 부틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 에틸(메타)아크릴레이트, 메틸(메타)아크릴레이트, n-프로필(메타)아크릴레이트, 이소프로필(메타)아크릴레이트, t-부틸(메타)아크릴레이트, 펜틸(메타)아크릴레이트, n-옥틸(메타)아크릴레이트, 이소노닐(메타)아크릴레이트 등이 있다. 또한 점착제의 유리전이온도를 조절할 목적 및 다른 기능특성을 부여하기 위하여 아크릴로니트릴, 스티렌, 글리시딜(메타)아크릴레이트, 비닐아세테이트 등의 공중합 단량체가 사용될 수 있으며, 이들 단량체들은 단독 또는 2 종 이상 혼합하여 사용할 수도 있다.Examples of the (meth) acrylic acid ester monomer having an alkyl group having 1 to 12 carbon atoms of iii) include butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, ethyl (meth) acrylate, and methyl (meth) acryl. Rate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, n-octyl (meth) acrylate, isononyl (meth) acrylic Rate and the like. In addition, copolymerization monomers such as acrylonitrile, styrene, glycidyl (meth) acrylate, and vinyl acetate may be used to control the glass transition temperature of the pressure-sensitive adhesive and to impart other functional properties. It can also mix and use above.

상기 a)의 아크릴계 공중합체를 제조하는데 사용되는 원료들에 있어서, 상기 ⅱ)의 α,β 불포화카르복실산 단량체는 a)의 아크릴계 공중합체 100 중량부 내에서 0.5 내지 20 중량부 포함시켜 공중합시키는 것이 바람직하다. 0.5 중량부 미만의 사용은 접착력을 저하시키고, 20 중량부를 초과하여 사용하면 응집력 상승에 의하여 승온 유동특성을 저하시키게 된다. 이러한 α,β 불포화카르복실산 단량체의 예로는 아크릴산, 메타크릴산, 이타콘산, 말레이산, 말레인산 무수물 등이 있으며, 이들은 필요시 단독 또는 혼합하여 사용할 수 있다.In the raw materials used to prepare the acrylic copolymer of a), the α, β unsaturated carboxylic acid monomer of ii) is copolymerized by including 0.5 to 20 parts by weight within 100 parts by weight of the acrylic copolymer of a). It is preferable. Use of less than 0.5 parts by weight lowers the adhesive force, when used in excess of 20 parts by weight will lower the elevated temperature flow characteristics due to the increase in cohesive force. Examples of such α, β unsaturated carboxylic monomers include acrylic acid, methacrylic acid, itaconic acid, maleic acid, maleic anhydride, and the like, and these may be used alone or in combination.

상기 a)의 아크릴계 공중합체를 제조하는데 사용되는 원료들에 있어서, 상기 ⅲ)의 비닐기를 갖는 3급 아민화합물은 카르복실산 작용기와 상호작용하여 온도에 따른 가열활성 기능을 부여하는 것으로, a)의 아크릴계 공중합체 100 중량부 내에서 0.1 내지 20 중량부 포함시켜 공중합시키는 것이 바람직하다. 0.1 중량부 미만의 사용은 가열활성 효과가 낮고, 20 중량부 이상을 사용하면 승온 유동 특성을 감소시키게 된다. 이러한 비닐기를 갖는 3급 아민화합물의 예로는 디메틸아미노에틸(메타)아크릴레이트, 디메틸아미노프로필(메타)아크릴레이트, 디에틸아미노에틸(메타)아크릴레이트, 디에틸아미노프로필(메타)아크릴레이트 등이 있으며, 이외에도 비닐기를 포함하는 다른 3급 아민화합물들이 본 발명의 목적에 부합하는 한 모두 사용될 수 있다.In the raw materials used to prepare the acryl-based copolymer of a), the tertiary amine compound having a vinyl group of iii) interacts with a carboxylic acid functional group to impart a heat-activating function according to temperature. It is preferable to copolymerize 0.1-20 weight part in 100 weight part of acrylic copolymers of this. The use of less than 0.1 parts by weight has a low heat-activating effect, and the use of 20 parts by weight or more reduces the temperature rising flow characteristics. Examples of tertiary amine compounds having such a vinyl group include dimethylaminoethyl (meth) acrylate, dimethylaminopropyl (meth) acrylate, diethylaminoethyl (meth) acrylate, diethylaminopropyl (meth) acrylate, and the like. In addition, any other tertiary amine compound including a vinyl group may be used as long as it is suitable for the purpose of the present invention.

상기 a)의 아크릴계 공중합체를 제조하는데 사용되는 원료들에 있어서, 상기 ⅳ)의 수산기를 포함하는 비닐계 단량체는 단독으로 또는 가교제와 반응하여 승온시 점착제가 응집파괴되지 않도록 화학결합에 의해 응집력을 부여하는 것으로, 특히 상기 b)의 가교제와 반응하여 부분 가교 구조를 형성할 수 있다. 이 단량체는 a)의 아크릴계 공중합체 100 중량부 내에서 0.1 내지 5 중량부 포함시켜 공중합시키는 것이 바람직하다. 0.1 중량부 미만의 사용은 승온시 응집파괴가 일어나기 쉬우며, 5 중량부 이상의 사용은 승온 유동 특성을 감소시키게 된다. 이러한 수산기를 포함하는 비닐계 단량체의 예로는 2-하이드록시에틸(메타)아크릴레이트, 2-하이드록시프로필(메타)아크릴레이트, 2-하이드록시에틸렌글리콜(메타)아크릴레이트, 2-하이드록시프로필렌글리콜(메타)아크릴레이트 등이 있으며, 이들은 필요시 단독또는 혼합하여 사용할 수 있다. 이외에도 수산기를 포함하는 다른 비닐계 단량체들이 본 발명의 목적에 부합하는 한 모두 사용될 수 있다.In the raw materials used to prepare the acrylic copolymer of a), the vinyl monomer including the hydroxyl group of iii) is used alone or by reacting with a crosslinking agent to increase the cohesive force by chemical bonding so that the pressure-sensitive adhesive is not destroyed when the temperature is elevated. In particular, it is possible to react with the crosslinking agent of b) to form a partially crosslinked structure. It is preferable to copolymerize this monomer by including 0.1-5 weight part in 100 weight part of acryl-type copolymers of a). Use of less than 0.1 parts by weight tends to cause cohesive failure at elevated temperatures, and use of more than 5 parts by weight will reduce the elevated flow characteristics. Examples of vinyl monomers containing such hydroxyl groups include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxyethylene glycol (meth) acrylate, and 2-hydroxypropylene. Glycol (meth) acrylates and the like, and these may be used alone or in combination if necessary. In addition, other vinyl monomers including a hydroxyl group may be used as long as they meet the object of the present invention.

상기 b)의 가교제는 이소시아네이트계, 에폭시계, 아지리딘계, 블록화된 이소시아네이트계 등이 사용될 수 있는데 이중에서 이소시아네이트계가 사용상 용이하다. 이 가교제는 a)의 아크릴계 공중합체 100 중량부에 대하여 0.01 내지 5 중량부 사용되는데 이들은 가교구조를 통하여 승온시 점착제의 유지력을 증진시켜 부착신뢰성을 향상시키는 역활을 한다. 이러한 가교제의 예로, 이소시아네이트계는 톨리렌디이소시아네이트, 디페닐메탄디이소시아네이트, 헥사메틸렌디이소시아네이트, 트리메틸올프로판의 톨리렌디이소시아네이트의 부가물 등이 있으며, 에폭시계는 에틸렌글리콜디글리시딜에테르, 트리글리시딜에테르, 트리메틸올프로판트리글리시딜에테르, N,N,N',N'-테트라글리시딜에틸렌디아민 등이 있다.The crosslinking agent of b) may be an isocyanate-based, epoxy-based, aziridine-based, blocked isocyanate-based, etc. Among them, isocyanate-based is easy to use. The crosslinking agent is used in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the acrylic copolymer of a). These crosslinking agents enhance the holding strength of the pressure-sensitive adhesive at elevated temperatures through the crosslinking structure, thereby improving adhesion reliability. Examples of such a crosslinking agent include tolylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, adduct of tolylene diisocyanate of trimethylolpropane, and the epoxy type is ethylene glycol diglycidyl ether and triglycis. Diethyl ether, trimethylolpropane triglycidyl ether, N, N, N ', N'-tetraglycidylethylenediamine, and the like.

상기 c)의 점착성 부여 수지는 점착제의 초기 점착 특성을 향상시키는 것으로 a)의 아크릴계 공중합체 100 중량부에 대하여 1 내지 100 중량부 사용된다. 과량 사용은 점착제의 응집력을 감소시키므로 적절하게 첨가되어야 한다. 이러한 점착성 부여 수지의 예로는 (수첨)하이드로카본계 수지, (수첨)로진 수지, (수첨)로진에스테르 수지, (수첨)터펜 수지, (수첨)터펜페놀 수지, 중합로진 수지, 중합로진에스테르 수지 등이며, 이들은 단독 또는 2 종 이상 혼합하여 사용될 수 있다.The tackifying resin of c) is used in an amount of 1 to 100 parts by weight based on 100 parts by weight of the acrylic copolymer of a) to improve the initial adhesive properties of the pressure-sensitive adhesive. Excessive use reduces the cohesion of the adhesive and should be added as appropriate. Examples of such tackifying resins include (hydrogenated) hydrocarbon resins, (hydrogenated) rosin resins, (hydrogenated) rosin ester resins, (hydrogenated) terpene resins, (hydrogenated) terpene phenol resins, polymerized rosin resins, and polymerized rosin esters. Resins and the like, and these may be used alone or in combination of two or more thereof.

본 발명의 가열활성 점착제 조성물은 상기 성분 이외에 특정 목적을 위하여 에폭시 수지 및 경화제 등을 혼합하여 사용할 수 있으며, 자외선 안정제, 산화 방지제, 조색제, 보강제, 충전제 등도 적절히 첨가하여 사용할 수 있다. 또한 일반적으로 잘 알려진 적절한 광개시제의 첨가로 광중합 경화방법에 의하여 제조될 수도 있다.The heat-activated pressure-sensitive adhesive composition of the present invention can be used by mixing an epoxy resin, a curing agent, and the like for a specific purpose in addition to the above components, and can also be used by appropriately adding ultraviolet stabilizers, antioxidants, colorants, reinforcing agents, fillers and the like. It may also be prepared by the photopolymerization curing method with the addition of suitable photoinitiators, which are generally well known.

본 발명의 가열활성 점착제 조성물은 가교밀도가 10 내지 90 를 나타내는 것이 바람직하다.It is preferable that the heat-active adhesive composition of this invention shows the crosslinking density of 10-90.

본 발명의 가열활성 점착제 조성물은 가열활성이 필요한 점착 제품에 용도 제한없이 사용될 수 있으며, 특히 반사시트, 구조용 점착시트 등의 산업용 시트, 사진용 점착시트, 차선표시용 점착시트, 광학용 점착제품, 또는 전자부품용 점착제 등에 적절히 사용될 수 있다.The heat-activated pressure-sensitive adhesive composition of the present invention can be used in the adhesive products requiring heat activity without limitation, in particular, industrial sheets, such as reflective sheets, structural adhesive sheets, photographic adhesive sheets, lane marking adhesive sheets, optical adhesive products, Or an adhesive for an electronic component.

이하의 실시예 및 비교예를 통하여 본 발명을 상세히 설명한다. 단 실시예는 본 발명을 예시하기 위한 것이지 이들 만으로 한정되는 것은 아니다.The present invention will be described in detail through the following examples and comparative examples. However, the examples are only for illustrating the present invention and are not limited thereto.

[실시예]EXAMPLE

실시예 1Example 1

(아크릴계 공중합체 제조)(Acrylic copolymer production)

질소가스가 환류되고 온도조절이 용이하도록 냉각 장치가 설치된 1000 ㎖ 용량의 반응기에 표 1에 나타낸 조성과 같이 n-부틸아크릴레이트(BA; n-butylacrylate) 52 중량부, 메틸아크릴레이트(MA; methylacrylate) 35 중량부, 아크릴산(AA; acrylic acid) 7 중량부, 디에틸아미노에틸메타크릴레이트(DEAMA; diethylaminoethylmethacrylate) 5중량부, 2-하이드록시에틸(메타)아크릴레이트(2-HEMA; 2-hydroxyethyl(metha)acrylate) 1 중량부의 단량체 혼합물 및 용제로 에틸아세테이트(EAc; ethylacetate) 100 중량부를 투입하였다.52 parts by weight of n-butylacrylate (BA; n-butylacrylate), methylacrylate (MA; methylacrylate) as shown in Table 1 in a 1000 ml reactor equipped with a refrigeration system to facilitate nitrogen temperature reflux and temperature control. ) 35 parts by weight, acrylic acid (AA) 7 parts by weight, diethylaminoethyl methacrylate (DEAMA; diethylaminoethylmethacrylate) 5 parts by weight, 2-hydroxyethyl (meth) acrylate (2-HEMA; 2-hydroxyethyl 100 parts by weight of ethylacetate (EAc) was added as a monomer mixture and 1 part by weight of (metha) acrylate.

산소를 제거하기 위하여 질소가스를 20 분 동안 공급하고, 70 ℃로 온도를 유지하고, 균일하게한 후, 반응개시제로 벤조일퍼옥사이드(BPO; benzoylperoxide) 0.035 중량부를 50 농도로 에틸아세테이트에 희석시켜 투입하여 10 시간 동안 반응시켜서 최종 아크릴계 공중합체를 제조하였다.In order to remove oxygen, nitrogen gas was supplied for 20 minutes, maintained at 70 ° C., uniformed, and then diluted with ethyl acetate to 0.035 parts by weight of benzoylperoxide (BPO) as a reaction initiator at 50 concentration. After the reaction for 10 hours to prepare a final acrylic copolymer.

제조된 아크릴계 공중합체의 분자량은 폴리스티렌 표준 시료를 이용하여 측정하고, 그 결과를 표 1에 나타내었다.The molecular weight of the prepared acrylic copolymer was measured using a polystyrene standard sample, and the results are shown in Table 1.

(가열활성 점착제 조성물 제조)(Preparation of a heat-active adhesive composition)

표 2과 같이 상기에서 얻은 아크릴계 공중합체 100 중량부에 가교제로 트리메틸올프로판의 톨리렌디이소시아네이트 부가물 2 중량부를 에틸아세테이트 용액에 50 농도로 희석시킨 용액과 점착성부여 수지로 로진에스테르 수지(허큘리스사 제조 포랄85) 30 중량부를 균일하게 혼합하여 가열활성 점착제 조성물을 제조하였다.As shown in Table 2, 2 parts by weight of the tolylene diisocyanate adduct of trimethylolpropane with a crosslinking agent in 100 parts by weight of the acryl-based copolymer obtained above was diluted to 50 concentrations in an ethyl acetate solution and a rosin ester resin (A Hercules Co., Ltd.). 30 parts by weight of foam 85) was uniformly mixed to prepare a heat-active adhesive composition.

(가열활성 점착층 제조)(Heat active adhesive layer production)

상기에서 제조된 가열활성 점착제를 코팅성을 고려하여 적정의 농도로 희석하고, 균일하게 혼합한 후 이형지에 코팅하고, 건조하여 50 ㎛ 두께의 균일한 가열활성 점착층을 얻었다.The heat-active adhesive prepared above was diluted to an appropriate concentration in consideration of coating property, uniformly mixed, coated on a release paper, and dried to obtain a uniform heat-active adhesive layer having a thickness of 50 μm.

(합판 가공에 의한 점착시트 제조)(Manufacture of adhesive sheet by plywood processing)

상기에서 제조된 점착층을 라미네이터를 사용하여 80 ㎛ 두께의 표면처리된 폴리에스테르 필름에 가열 합판 가공하여 점착시트를 제조하였다.The pressure-sensitive adhesive layer was prepared by heat-laminating a pressure-sensitive adhesive layer prepared above to a surface treated polyester film having a thickness of 80 μm using a laminator.

(초기 접착 특성 평가)Initial adhesive property evaluation

상기에서 제조된 점착시트를 2.54 cm x 12.7 cm의 크기로 절단하여 초기 접착 특성(위치 선정 특성)을 측정하여 평가하였다. 이 측정은 특정 각도와 박리속도에 따라 달라지나 180。의 박리강도를 사용하여 상대 평가하였다.The pressure-sensitive adhesive sheet prepared above was cut to a size of 2.54 cm x 12.7 cm, and the initial adhesive properties (positioning properties) were measured and evaluated. This measurement depends on the specific angle and peel rate, but was evaluated relative to the peel strength of 180 °.

부착시킬 피착재는 에틸아세테이트로 깨끗이 세척한 스텐레스스틸판을 사용하였는데, 측정에 사용하기 전에 24 시간 동안 25 ℃, 50 의 습도 조건의 항온항습조에서 방치하였다.The adherend to be adhered was a stainless steel plate washed with ethyl acetate, which was left in a constant temperature and humidity bath at 25 ° C. and 50 ° C. for 24 hours before use for measurement.

점착시트를 뒤편의 이형필름을 제거시키고, 스텐레스스틸판에 위치시켜 무게 2 kg의 고무 스퀴즈롤로 압착시켜서 20 분 경과 후에 300 mm/min의 박리속도로 측정하고 그 접착강도를 다음과 같이 평가하여 표 2에 기재하였다.The adhesive sheet was removed from the backside film, placed on a stainless steel plate and pressed with a rubber squeeze roll weighing 2 kg. After 20 minutes, the adhesive sheet was measured at a peeling speed of 300 mm / min. The adhesive strength was evaluated as follows. 2 is described.

초기 접착력이 100 gm/in 이하인 경우를 ○로 표시하고, 100∼200 gm/in 인경우를 △로 표시하고, 200 gm/in 이상인 경우를 X로 표시하였다.The case where the initial adhesive force is 100 gm / in or less is represented by ○, the case of 100 to 200 gm / in is represented by Δ, and the case where 200 gm / in or more is represented by X.

(180。 접착력)(180。 Adhesion)

상기에서 제조된 점착시트를 2.54 cm x 12.7 cm의 크기로 절단하여 180。 박리강도로 접착력을 평가하였다.The pressure-sensitive adhesive sheet prepared above was cut to a size of 2.54 cm x 12.7 cm to evaluate the adhesive strength at 180 ° peel strength.

부착시킬 피착재는 에틸아세테이트로 깨끗이 세척한 스텐레스스틸판을 사용하였는데, 측정에 사용하기 전에 24 시간 동안 25 ℃, 50 의 습도 조건의 항온항습조에서 방치하였다.The adherend to be adhered was a stainless steel plate washed with ethyl acetate, which was left in a constant temperature and humidity bath at 25 ° C. and 50 ° C. for 24 hours before use for measurement.

점착시트를 뒤편의 이형필름을 제거시키고, 스텐레스스틸판에 위치시키고, 80 ℃의 온도에서 3 분간 진공압착 방법을 사용하여 부착시켰다. 이 후에 상온으로 냉각시키고 20 분 경과한 후에 300 mm/min의 박리속도로 측정하고 그 접착강도를 표 2에 기재하였다.The adhesive sheet was removed from the backside release film, placed on a stainless steel plate, and adhered using a vacuum compression method at a temperature of 80 ° C for 3 minutes. After cooling to room temperature after 20 minutes was measured at a peeling rate of 300 mm / min and the adhesive strength is shown in Table 2.

(유지력)(retention)

상기에서 제조된 폴리에스테르 필름에 점착제 조성물이 코팅된 시료를 25 mm x 50 mm의 크기로 절단하여 유지력을 측정하여 시료의 내구신뢰성을 평가하였다.The durability of the sample was evaluated by cutting the sample coated with the pressure-sensitive adhesive composition on the polyester film prepared above to a size of 25 mm x 50 mm to measure the holding force.

부착시킬 피착재는 에틸아세테이트로 깨끗이 세척한 스텐레스스틸판을 사용하였는데, 측정에 사용하기 전에 24 시간 동안 25 ℃, 50 의 습도 조건의 항온항습조에서 방치하였다.The adherend to be adhered was a stainless steel plate washed with ethyl acetate, which was left in a constant temperature and humidity bath at 25 ° C. and 50 ° C. for 24 hours before use for measurement.

시료를 50 ℃의 온도로 유지되는 항온조를 이용하여 1 kg의 추를 적용하여 1 시간 동안 방치한 후 시료가 미끌어지는 거리(mm)를 측정하고 그 결과를 표 2에 기재하였다.After leaving the sample for 1 hour by applying a weight of 1 kg using a thermostat maintained at a temperature of 50 ℃ and measured the distance (mm) the sample slips and the results are shown in Table 2.

점착시트를 뒤편의 이형필름을 제거시키고, 스텐레스스틸판에 위치시키고, 80 ℃의 온도에서 3 분간 진공압착 방법을 사용하여 부착시켰다.The adhesive sheet was removed from the backside release film, placed on a stainless steel plate, and adhered using a vacuum compression method at a temperature of 80 ° C for 3 minutes.

(탈착시 오염)(Contamination at the time of desorption)

180。 박리강도로 접착력의 평가에서 승온 접착 후 상온으로 온도를 내리기 직전에 박리됨에 따른 스텐레스스틸판으로의 점착제 전사 현상을 관찰하여 다음과 같이 평가하여 표 2에 기재하였다.In the evaluation of the adhesive strength with 180 ° peel strength, the adhesive transfer phenomenon to the stainless steel plate was observed as it was peeled off immediately before the temperature was lowered to room temperature after adhesion.

잔류물이 거의 남지 않을 경우를 ○로 표시하고, 다소 오염될 경우를 △로 표시하고, 오염이 심각할 경우를 X로 표시하였다.The case where few residues remain is indicated by (circle), the case where some contamination is indicated by (triangle | delta), and the case where serious contamination is indicated by X.

실시예 2, 3Example 2, 3

표 1에 기재된 아크릴계 공중합체 제조를 위한 조성의 변경을 제외하고는 실시예 1과 같은 방법으로 아크릴계 공중합체, 가열활성 점착제 조성물, 가열활성 점착층 및 점착시트를 제조하였다. 평가는 실시예 1과 같은 방법으로 초기 접착 특성, 180。 접착력, 유지력, 및 탈착시 오염을 측정하고 표 2에 기재하였다.An acrylic copolymer, a heat-active adhesive composition, a heat-active adhesive layer, and a pressure-sensitive adhesive sheet were prepared in the same manner as in Example 1 except for changing the composition for preparing the acrylic copolymer shown in Table 1. The evaluation was performed in the same manner as in Example 1 to measure the initial adhesive properties, 180 ° adhesion, holding force, and contamination during desorption and are listed in Table 2.

비교예 1∼4Comparative Examples 1 to 4

표 1의 조성비와 같이 아크릴계 공중합체 제조를 위한 실시예 1의 조성에서 아크릴산(AA; acrylic acid), 디에틸아미노에틸메타크릴레이트(DEAMA; diethyl- aminoethylmethacrylate), 또는 2-하이드록시에틸(메타)아크릴레이트(2-HEMA; 2- hydroxyethyl(metha)acrylate)를 첨가하지 않거나 부분 첨가하여 공중합하고, 표 2의 조성비와 같이 가열활성 점착제 조성물의 조성에서 가교제, 또는 점착성부여 수지의 양을 변경하는 것을 제외하고는 실시예 1과 같은 방법으로 아크릴계 공중합체, 가열활성 점착제 조성물, 가열활성 점착층 및 점착시트를 제조하였다.Acrylic acid (AA), diethylaminoethyl methacrylate (DEAMA; diethylaminoethylmethacrylate), or 2-hydroxyethyl (meth) in the composition of Example 1 for preparing an acrylic copolymer as shown in Table 1 Copolymerization by adding or not adding acrylate (2-HEMA; 2-hydroxyethyl (metha) acrylate), and changing the amount of crosslinking agent or tackifying resin in the composition of the heat-active adhesive composition as shown in the composition ratios of Table 2. Except for the acrylic copolymer, a heat-active pressure-sensitive adhesive composition, a heat-active pressure-sensitive adhesive layer and an adhesive sheet were prepared in the same manner as in Example 1.

평가는 실시예 1과 같은 방법으로 초기 접착 특성, 180。 접착력, 유지력, 및 탈착시 오염을 측정하고 표 2에 기재하였다.The evaluation was performed in the same manner as in Example 1 to measure the initial adhesive properties, 180 ° adhesion, holding force, and contamination during desorption and are listed in Table 2.

구 분division 실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 비교예 1Comparative Example 1 비교예 2Comparative Example 2 비교예 3Comparative Example 3 비교예 4Comparative Example 4 아크릴계공중합체배합조성(중량부)Acrylic copolymer blend composition (parts by weight) BABA 52.052.0 52.052.0 40.040.0 59.059.0 59.059.0 59.059.0 52.552.5 MAMA 35.035.0 25.025.0 47.047.0 40.040.0 33.033.0 35.035.0 35.535.5 AAAA 7.07.0 13.013.0 7.07.0 00 7.07.0 00 7.07.0 DEAMADEAMA 5.05.0 9.09.0 5.05.0 00 00 5.05.0 5.05.0 2-HEMA2-HEMA 1.01.0 1.01.0 1.01.0 1.01.0 1.01.0 1.01.0 00 BPOBPO 0.0350.035 0.0350.035 0.0350.035 0.0350.035 0.0350.035 0.0350.035 0.0350.035 용제(EAc)Solvent (EAc) 100100 100100 100100 100100 100100 100100 100100 제조된 아크릴계공중합체 분자량Manufactured Acrylic Copolymer Molecular Weight 37만370,000 28만280,000 35만350,000 42만420,000 29만290,000 31만310,000 32만320,000

구 분division 실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 비교예 1Comparative Example 1 비교예 2Comparative Example 2 비교예 3Comparative Example 3 비교예 4Comparative Example 4 가열활성점착제조성물배합조성(중량부)Heated adhesive composition composition (parts by weight) 아크릴계공중합체Acrylic Copolymer 100100 100100 100100 100100 100100 100100 100100 가교제Crosslinking agent 2.02.0 2.02.0 2.02.0 2.02.0 2.02.0 2.02.0 00 점착성 부여수지Tackifying resin 3030 3030 3030 00 3030 00 3030 물성평가Property evaluation 초기 접착성Initial adhesion XX 180。접착력(gm/in)180。 Adhesive force (gm / in) 23002300 25002500 35003500 15001500 12001200 800800 20002000 유지력(mm)Holding force (mm) 0.5 이하0.5 or less 0.5 이하0.5 or less 0.5 이하0.5 or less 3.33.3 5.85.8 2.82.8 1.51.5 탈착시 오염Contamination at Desorption XX XX

본 발명의 가열활성 점착제 조성물은 승온시 유동특성이 우수하면서도 상온에서의 응집력이 우수하여 상온에서 높은 접착강도를 보유하는 조성물이며, 이 조성물은 시트, 필름, 라벨, 또는 테이프 등 가열활성이 필요한 점착 제품에 용도 제한없이 사용될 수 있으며, 특히 반사시트, 구조용 점착시트 등의 산업용 시트, 사진용 점착시트, 차선표시용 점착시트, 광학용 점착제품, 또는 전자부품용 점착제 등에 적절히 사용될 수 있다.The heat-activated pressure-sensitive adhesive composition of the present invention is a composition having a high adhesive strength at room temperature because of excellent flow characteristics at room temperature and excellent cohesive force at room temperature, and the composition is adhesive which requires heat activity such as sheet, film, label, or tape. The product can be used without any limitation, and in particular, it can be suitably used for industrial sheets such as reflective sheets, structural adhesive sheets, photographic adhesive sheets, lane marking adhesive sheets, optical adhesive products, or adhesives for electronic parts.

Claims (11)

a) ⅰ) 탄소수 1 내지 12의 알킬기를 갖는 (메타)아크릴산에스테르 단량체a) iii) a (meth) acrylic acid ester monomer having an alkyl group having 1 to 12 carbon atoms 55∼99.3 중량부;55 to 99.3 parts by weight; ⅱ) α,β 불포화카르복실산 단량체 0.5∼20 중량부;Ii) 0.5 to 20 parts by weight of an α, β unsaturated carboxylic acid monomer; ⅲ) 비닐기를 갖는 3급 아민화합물 0.1∼20 중량부; 및Iii) 0.1 to 20 parts by weight of a tertiary amine compound having a vinyl group; And ⅳ) 수산기를 포함하는 비닐계 단량체 0.1∼5 중량부Iii) 0.1 to 5 parts by weight of a vinyl monomer containing a hydroxyl group 를 공중합하여 제조되는 아크릴계 공중합체 100 중량부;100 parts by weight of an acrylic copolymer prepared by copolymerizing; b) 가교제 0.01∼5 중량부; 및b) 0.01 to 5 parts by weight of a crosslinking agent; And c) 점착성 부여 수지 1∼100 중량부c) 1 to 100 parts by weight of tackifying resin 를 포함하는 가열활성 점착제 조성물.Heating active pressure-sensitive adhesive composition comprising a. 제 1 항에 있어서,The method of claim 1, 상기 a)의 아크릴계 공중합체의 분자량이 20만 내지 200만인 가열활성 점착제 조성물.Heating active pressure-sensitive adhesive composition wherein the molecular weight of the acrylic copolymer of a) is 200,000 to 2 million. 제 1 항에 있어서,The method of claim 1, 상기 a)의 아크릴계 공중합체가 용액중합법, 광중합법, 서스펜션중합법, 및 에멀젼중합법으로 이루어진 군으로부터 선택되는 중합법으로 제조되는 가열활성 점착제 조성물.The acrylic copolymer of a) is a heat-activated pressure-sensitive adhesive composition prepared by a polymerization method selected from the group consisting of a solution polymerization method, a photopolymerization method, a suspension polymerization method, and an emulsion polymerization method. 제 1 항에 있어서,The method of claim 1, 상기 a)ⅰ)의 탄소수 1 내지 12의 알킬기를 갖는 (메타)아크릴산에스테르 단량체가 부틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 에틸(메타)아크릴레이트, 메틸(메타)아크릴레이트, n-프로필(메타)아크릴레이트, 이소프로필(메타)아크릴레이트, t-부틸(메타)아크릴레이트, 펜틸(메타)아크릴레이트, n-옥틸(메타)아크릴레이트, 및 이소노닐(메타)아크릴레이트로 이루어진 군으로부터 1 종 이상 선택되는 가열활성 점착제 조성물.(Meth) acrylic acid ester monomer which has a C1-C12 alkyl group of said a) iii) is butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, ethyl (meth) acrylate, methyl (meth) acryl Latex, n-propyl (meth) acrylate, isopropyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, n-octyl (meth) acrylate, and isononyl (meth) Heat-active adhesive composition selected from the group consisting of acrylates. 제 1 항에 있어서,The method of claim 1, 상기 a)ⅱ)의 α,β 불포화카르복실산 단량체가 아크릴산, 메타크릴산, 이타콘산, 말레이산, 및 말레인산 무수물로 이루어진 군으로부터 1 종 이상 선택되는 가열활성 점착제 조성물.The α, β unsaturated carboxylic acid monomer of a) ii) is at least one selected from the group consisting of acrylic acid, methacrylic acid, itaconic acid, maleic acid, and maleic anhydride. 제 1 항에 있어서,The method of claim 1, 상기 a)ⅲ)의 비닐기를 갖는 3급 아민화합물이 디메틸아미노에틸(메타)아크릴레이트, 디메틸아미노프로필(메타)아크릴레이트, 디에틸아미노에틸(메타)아크릴레이트, 및 디에틸아미노프로필(메타)아크릴레이트로 이루어진 군으로부터 선택되는 가열활성 점착제 조성물.Tertiary amine compounds having a vinyl group of a) iii) include dimethylaminoethyl (meth) acrylate, dimethylaminopropyl (meth) acrylate, diethylaminoethyl (meth) acrylate, and diethylaminopropyl (meth). Heat-active adhesive composition selected from the group consisting of acrylates. 제 1 항에 있어서,The method of claim 1, 상기 a)ⅳ)의 수산기를 포함하는 비닐계 단량체가 2-하이드록시에틸(메타)아크릴레이트, 2-하이드록시프로필(메타)아크릴레이트, 2-하이드록시에틸렌글리콜(메타)아크릴레이트, 및 2-하이드록시프로필렌글리콜(메타)아크릴레이트로 이루어진 군으로부터 1 종 이상 선택되는 가열활성 점착제 조성물.The vinyl monomer containing the hydroxyl group of said a) iii) is 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxyethylene glycol (meth) acrylate, and 2 -Heat-active adhesive composition selected from the group consisting of hydroxypropylene glycol (meth) acrylates. 제 1 항에 있어서,The method of claim 1, 상기 b)의 가교제가 톨리렌디이소시아네이트, 디페닐메탄디이소시아네이트, 헥사메틸렌디이소시아네이트, 및 트리메틸올프로판의 톨리렌디이소시아네이트의 부가물로 이루어진 이소시아네이트 군으로부터 선택되거나, 에틸렌글리콜디글리시딜에테르, 트리글리시딜에테르, 트리메틸올프로판트리글리시딜에테르, 및 N,N,N',N'-테트라글리시딜디아민으로 이루어진 에폭시 군으로부터 선택되는 가열활성 점착제 조성물.The crosslinking agent of b) is selected from an isocyanate group consisting of an adduct of tolylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, and tolylene diisocyanate of trimethylolpropane, or ethylene glycol diglycidyl ether, triglycis A heat-activated pressure-sensitive adhesive composition selected from the group consisting of dil ether, trimethylolpropanetriglycidyl ether, and N, N, N ', N'-tetraglycidyldiamine. 제 1 항에 있어서,The method of claim 1, 상기 c)의 점착성 부여 수지가 (수첨)하이드로카본계 수지, (수첨)로진 수지, (수첨)로진에스테르 수지, (수첨)터펜 수지, (수첨)터펜페놀 수지, 중합로진 수지, 및 중합로진에스테르 수지로 이루어진 군으로부터 1 종 이상 선택되는 가열활성 점착제 조성물.The tackifying resin of c) is (hydrogenated) hydrocarbon resin, (hydrogenated) rosin resin, (hydrogenated) rosin ester resin, (hydrogenated) terpene resin, (hydrogenated) terpene phenol resin, polymerized rosin resin, and polymerization furnace Heat-active adhesive composition selected from the group consisting of gin ester resins. 제 1 항에 있어서,The method of claim 1, 상기 a)ⅳ)의 수산기를 포함하는 비닐계 단량체와 b)의 가교제가 반응하여 부분 가교 구조를 형성하는 가열활성 점착제 조성물.A heat-activated pressure-sensitive adhesive composition wherein the vinyl monomer containing a hydroxyl group of a) i) and the crosslinking agent of b) react to form a partially crosslinked structure. 제 1 항에 있어서,The method of claim 1, 상기 가열활성 점착제 조성물의 가교밀도가 10 내지 90 인 가열활성 점착제 조성물.Heat-active adhesive composition whose crosslinking density of the said heat-active adhesive composition is 10-90.
KR10-1999-0036571A 1999-08-31 1999-08-31 Heat activatable, pressure-sensitive adhesive composition KR100405303B1 (en)

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