KR20010001602A - apparatus for preventing miss operation of an electric device using semiconductor chip and abrupt start of driving of vechiles - Google Patents

Abstract

PURPOSE: A wrong operation arrester of a semiconductor chip used electronic appliances is provided to prevent the electronic appliances from being wrongly operated by intercepting static electricity or electronic wave to a semiconductor chip. CONSTITUTION: A neutralizer(30) is frequently operated to neutralize a vehicle body(37) electrified in more than regular level by static electricity of a printing circuit board mounting an ECU(10). A static electricity settling circuit(35) discharges energy accumulated by the static electricity affecting electric displacement. Thereby, each component normally operates and feeds signals.

Description

Apparatus for preventing miss operation of an electric device using semiconductor chip and abrupt start of driving of vechiles}

The present invention relates to a device for preventing malfunction of an electronic device using a semiconductor chip and a device for preventing a vehicle from starting and using the device, and more particularly, removes static electricity causing abnormal operation of a semiconductor chip and prints electromagnetic waves introduced from the outside. Malfunction prevention device of an electronic device using a semiconductor chip that prevents a malfunction by shielding the influence on a circuit board or a semiconductor chip, and an automobile sudden start prevention device which prevents a sudden start accident of a vehicle equipped with an automatic transmission using the device. It is about.

Recently, with the development of the electrical and electronics-based industry, semiconductor chips having various functions have been developed. Such semiconductor chips are an essential component in configuring electronic devices for realizing specific functions.

The application range of the semiconductor chip is being used in various ways beyond the range of general home appliances, and automobiles are being developed to be operated by electronic control method to have advanced functions.

Semiconductor chips operate in a voltage driven or current driven manner and are designed to have a predetermined function. Recently, semiconductor chips have been developed in a low voltage manner to reduce power consumption and improve processing speed.

The above-mentioned general semiconductor chip is susceptible to external environment, in particular, electrostatic or electromagnetic waves, and when the electrostatic or electromagnetic wave affects a signal processed therein, the semiconductor chip often malfunctions.

In particular, in the case of automobiles, the damage of malfunction due to disturbance such as static electricity or electromagnetic waves has been seriously occurred recently, and most representatively, when a vehicle equipped with an automatic transmission is suddenly started to cause property loss and loss of life. Is generated.

An auto-start is an abnormal phenomenon in which the engine starts or stops suddenly while the driver starts the car while the vehicle is stopped and then presses or does not step on the accelerator paddle.

Finding the cause of the problem and preparing countermeasures are being studied in various ways.As for the current prevention technology, a shift lock device that can operate a transmission only when the brake paddle is pressed has been developed. Has the limit of physically stopping the sudden start state, and does not eliminate the cause, but simply remains to suppress the sudden start.

Sudden oscillation is mainly caused by the interference of electrostatic and electromagnetic wave irregular semiconductor chip operation, it is found that the electronic control device in which the semiconductor chip is mounted malfunctions and is generated regardless of the driver.

Specifically, the idle speed control valve (ISC) and the fuel injection device of the vehicle are operated by an electronic controller. Idle speed control valve is to control the idle speed by adjusting the air intake at the initial start, the fuel injection value is to inject the fuel in the optimal state based on the information obtained from the various sensors.

These are all controlled by an electronic controller which mounts a semiconductor chip, and the automatic transmission is controlled by a transmission electronic controller (TCU).

As described above, if the semiconductor chip is malfunctioned due to the influence of static electricity and electromagnetic waves, a dangerous accident such as malfunction of an electronic product or a car may occur.

Therefore, there is a demand for a method in which a semiconductor chip can be stabilized without being affected by static electricity and electromagnetic waves.

An object of the present invention is to prevent the semiconductor chip from being affected by static electricity or electromagnetic waves, thereby preventing malfunction of electronic devices or automobiles using the semiconductor chip.

Another object of the present invention is to prevent the static electricity stored in the semiconductor chip is discharged in the initial driving state to prevent the electronic device or the vehicle using the semiconductor chip from malfunctioning by the static electricity.

Still another object of the present invention is to shield the semiconductor chip from malfunctioning of the electronic chip or automobile using the semiconductor chip by electromagnetic waves.

1 is a circuit diagram showing a preferred embodiment of the malfunction prevention device of an electronic device using the semiconductor chip according to the present invention

FIG. 2 is an exploded perspective view illustrating mounting of a shielding case for shielding electromagnetic waves to a printed circuit board on which a semiconductor chip is mounted;

3 is a view showing another embodiment of a malfunction preventing apparatus for an electronic device using the semiconductor chip of the present invention.

4 is a perspective view illustrating a state in which a printed circuit board and a ground board are stacked.

5 is a partial cross-sectional view illustrating a vertical arrangement of a printed circuit board and a ground board.

6 is a partial cross-sectional view showing another embodiment of a printed circuit board.

Figure 7 is an exploded perspective view of a semiconductor chip and a printed circuit board showing another embodiment according to the present invention

FIG. 8 is a cross-sectional view illustrating an assembled state of the embodiment of FIG. 7. FIG.

9 is a cross-sectional view for explaining the assembled state of the embodiment of FIG.

Automotive sudden start prevention device according to the present invention is a printed circuit board mounted with an electronic control device for controlling the driving of the vehicle by interfacing various analog signals and digital signals, electrostatic mounted on the printed circuit board to sense the charging potential by the static electricity A sensor and a neutralizer may be provided to charge air by the sensing signal of the electrostatic sensor to discharge air containing positive and negative ions to the vehicle body to neutralize the charge stored in the vehicle body.

In addition, the vehicle sudden start prevention device is a printed circuit board for mounting the electronic control device for controlling the driving of the vehicle by connecting various analog signals and digital signals between the vehicle body forming the ground and ground of the components mounted on the printed circuit board And an electrostatic dissipation circuit electrically dissipated to dissipate static electricity stored in the vehicle body.

In addition, the electrostatic sensor mounted on the printed circuit board senses a charge potential by static electricity, and charges air by sensing signals of the static electricity sensor, thereby discharging air containing cations and anions to the vehicle body to discharge electric charges stored in the vehicle body. The neutralizer may be further provided to neutralize.

In addition, the printed circuit board may be assembled to be accommodated by the upper shield case and the lower shield case having an inner space, thereby shielding the electromagnetic waves from being introduced into the air.

An apparatus for preventing a malfunction of an electronic device using a semiconductor chip according to the present invention includes a printed circuit board mounted with an electronic control device in which various signals are interfaced to perform a predetermined control operation, and a printed circuit board mounted on the printed circuit board. An electrostatic sensor for sensing a charging potential by static electricity and a neutralizer for charging the air in response to the sensing signal of the electrostatic sensor to discharge the air containing the positive and negative ions in a predetermined direction in which the static electricity is formed to neutralize the stored charge Can be.

In addition, the present invention provides a printed circuit board mounted with an electronic control device in which semiconductor chips are combined so that various signals are interfaced to perform a predetermined control operation, and a portion between ground and ground of components mounted on the printed circuit board. It may also be provided with an electrostatic dissipation circuit for dissipating the static electricity that is electrically connected to the portion forming the ground.

In addition, the present invention is a printed circuit board in which a predetermined component is mounted to perform an electrical operation, the ground substrate having a ground layer having a predetermined shape and area, and is spaced in parallel to the printed circuit board and connected between the ground substrate and the vehicle body By switching the switching means; the switching means can be switched in conjunction with the operation of the components mounted on the printed circuit board to change the power storage state instantaneously to prevent the signal conversion by the power failure of the components.

In addition, the present invention is a printed circuit board and a predetermined component is mounted to perform an electrical operation, the printed circuit board is formed spaced apart a predetermined interval in a state in which the ground layer is separated from the wiring and components constituting the electronic control device in a predetermined shape and area; The switching means is connected between the ground layer and the vehicle body and switched so that the switching means changes the power storage state by switching the components mounted on the printed circuit board in conjunction with the operation to convert the signals by the static electricity of the components. Can be prevented.

In addition, in the present invention, a chip is bonded to a lead frame having a predetermined shape, the chip and the external lead formed on the lead frame are connected by wires, and are electrically connected to the outside through an external lead formed on the lead frame, and an end of the external lead. Has a bent shape in one direction, the bent portion of the outer lead is a semiconductor chip in which the chip, the lead frame and the wire is molded by an epoxy molding resin so as to be opened in one direction, predetermined components are mounted, and the semiconductor chip is mounted The printed circuit board and the semiconductor chip are assembled in a socket type to the printed circuit board, and the electromagnetic shielding is performed on the printed circuit board. The inclusion of a component may shield the electromagnetic waves from affecting the external lead. .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

A semiconductor chip is designed to perform predetermined functions for various kinds of electronic devices while being microprocessor or microcomputerized, and semiconductor chips having different functions are wired on a printed circuit board, and the device thus manufactured is installed in a predetermined product. The predetermined product has a function desired by the manufacturer.

As an example, in an electronic control apparatus installed in a vehicle, semiconductor chips having various functions are mounted on a printed circuit board as shown in FIG. 1, and the electronic control apparatus performs a control function required for driving a vehicle by combining them.

Controlling the mechanical mechanism of the vehicle is an electronic control device, and an electronic control device such as an electronic control unit or a transmission electronic control unit can be recognized as being converted into an abnormal signal by static electricity on the circuit even if a normal signal is input, in which case the vehicle is abnormal. It can be operated as. Static electricity at this time is caused by the charging of the vehicle body or electromagnetic waves.

Specifically, the central processing unit (CPU) configured in the electronic controller is operated by a digital signal, the central processing unit has a characteristic that is operated by the signal input of the level of several volts and several milliamps, and the body static electricity or When the circuit is charged with static electricity by the electrostatic induction of external electromagnetic waves, the input signal of several volts may be deformed.

Factors that can affect the signal input to the central processing unit at the design time of the electronic control unit of the circuit are considered by the rectifier or the filter. Therefore, the high pressure signal generated during the start-up or operation of the vehicle in actual driving It does not act as a factor causing malfunction.

However, due to a complex cause, high-voltage static electricity may be charged to the vehicle body, and a signal of the electronic controller may be modulated by electromagnetic waves introduced from the outside. Strong static electricity accumulated in the vehicle body may affect some circuits of the electronic control unit, and when the mechanical mechanism is driven by the electronic control unit such as starting or transmission operation, the signal of the electronic control unit may be converted. In addition, the electromagnetic wave may affect the conductor of the electronic control device to induce an alternating current having a frequency equal to its own frequency, and the incoming signal may be modified by the induced current.

The effects of static electricity described above may be considered at the device level, the level of the printed circuit board, and the level of the semiconductor chip, respectively.

The problem caused by static electricity considered at the device level among the foregoing is solved by the embodiment according to the present invention of FIG. 1.

Specifically, the electronic deterrence device 10 generally includes a plurality of components mounted on a printed circuit board having a predetermined area, and typically includes an analog / digital converter 12, a buffer 14, an input port 16, and an output. The port 18, the CPU 20, the memory 22, and the like are mounted. Then, an electrostatic sensor 24 for measuring the static electricity charged therein is mounted. These parts are then electrically connected by jumper lines or printed wiring lines on a printed circuit board.

The analog / digital converter 12 converts an analog signal input from the outside into a digital signal recognizable by the CPU 20, and the buffer 14 matches the digital signal input from the outside with the impedance of the CPU 20 side. To adjust the level.

The CPU 20 processes a signal input from the analog / digital converter 12 and the buffer 14 via the input port 16 according to a predetermined program using the memory 22, and the signal for the result is The output port 18 outputs a solenoid driving circuit (not shown), a motor driving circuit (not shown), a relay driving circuit (not shown), a display device driving circuit (not shown), and the like.

The electronic controller 10 includes an electrostatic sensor 24, and the electrostatic sensor 24 is configured to output a sensing signal to an external neutralizer 30.

Here, the static electricity sensor 24 senses the potential of the static electricity accumulated on the printed circuit board on which the electronic controller 10 is mounted and outputs a signal thereof, and the neutralizer 30 is input from the static electricity sensor 24. It operates according to the signal and operates when the potential with which static electricity is charged is above a certain level. The neutralizer 30 serves to neutralize the static electricity charged in the electronic controller 10 by charging general air with an electric field, converting the air into positive air having positive and negative ions, and discharging air containing positive and negative ions to the vehicle body. do.

In addition, the grounds of the analog / digital converter 12, the buffer 14, the input port 16, the CPU 20, and the output port 18 are connected to an external static electricity dissipation circuit 35 through the switch 33. do.

Here, the static electricity dissipation circuit 35 reduces the constant voltage of the vehicle body and the printed circuit board or the semiconductor chip by performing an operation of releasing energy by converting electric charges stored in components such as a printed circuit board or a semiconductor chip mounted thereon into heat. . Accordingly, the effect of lowering the potential of the static electricity charged in the electronic controller 10 is obtained.

In addition, the switch 33 is operated by a switching signal output from the CPU 20, and the time when the switch 33 is operated is a predetermined time or a control signal for shifting the vehicle before the electronic controller 10 is started. It may be set to a predetermined time before is generated.

A conductive component (a specific example, a wiring) included in a circuit formed by mounting components on a printed circuit board may be charged by the electrostatic induction action of the vehicle body and static electricity, and the signal input to the CPU 20 may be deformed. have.

Therefore, the neutralizer 30 is operated from time to time to neutralize the state in which the vehicle body 37 is charged to a predetermined level or more. Then, the state of charge caused by the static electricity of the printed circuit board on which the electronic controller 10 is mounted is eliminated. And the energy stored by the static electricity affecting the potential of the ground for each component mounted on the printed circuit board from time to time is discharged through the static electricity dissipation circuit 35 to eliminate the static electricity and ensure normal signal application and operation of each component. .

In this embodiment, the electrostatic dissipation circuit 35 has been illustrated to emit static electricity by heat, but is not limited thereto, and can be dissipated by converting energy stored by static electricity into light. Lamps can be used or additional lamps can be installed.

In addition, the electrostatic dissipation circuit 35 reduces the electric potential applied by the static electricity applied to the ground of each component by turning on the switch 33 for a predetermined time when the driving state of the vehicle is changed, that is, when starting or shifting. It is configured to make a turn, so a signal is normally transmitted when starting or shifting.

The printed circuit board on which the above-described electronic control device 10 is mounted may be covered using a shielding case to prevent the influence of electromagnetic waves. Referring to FIG. 2, the printed circuit board 40 may include screws 42. Is fixed to the frame of the vehicle body (not shown). The printed circuit board 40 is accommodated therein by assembling the upper shielding case 46 and the lower shielding case 48, and a screw 42 penetrates the lower shielding case 48 to be fixed to the frame of the vehicle body. It has a through hole 49. In this case, the screw 42 may reduce the vehicle charging by using an insulating material rather than a conductive material.

As described above, as shown in FIG. 2, shielding cases 46 and 48 having electromagnetic shielding functions are formed at upper and lower portions of the printed circuit board, so that noise components introduced from the outside are absorbed and dissipated in the shielding cases 46 and 48, and thus the inside of the printed circuit board is absorbed and extinguished. Does not affect the printed circuit board 40.

Therefore, the components mounted on the printed circuit board 40 have stability against electromagnetic waves.

On the other hand, the embodiment according to the present invention may be considered to prevent the malfunction due to static electricity at the level of the printed circuit board on which the semiconductor chip is mounted, in which case the embodiment may be configured as shown in Figs.

As shown in FIGS. 3 and 4, a ground substrate 52 is further formed below the printed circuit board 50 on which the electronic control device is mounted, and the switch 56 and the vehicle body 54 are disposed between the ground substrate 52 and the vehicle body 54. The static electricity dissipation circuit 55 is configured. The switch 56 is operated by applying a control signal for maintaining the turn-on state for a predetermined time at the moment of starting or shifting, and the static electricity of the ground substrate 52 is dissipated by the static electricity dissipation circuit 55.

The ground substrate 52 has a conductive film 52a formed over the entire surface of the predetermined surface as shown in FIG. 5. In addition, the printed circuit board 50 and the ground substrate 52 are disposed to maintain a spaced apart parallel interval as shown in FIG. 5.

As described above, the electrostatic capacitance C1 is formed between the printed circuit board 50 and the ground substrate 52 as shown in FIG. 3, and the electrostatic capacitance C2 is also formed between the ground substrate 52 and the frame 54 of the vehicle body. Is formed. The switch 56 is turned off.

The sum of the above-mentioned capacitances is C1 * C2 / (C1 + C2), and the amount of charge stored can be calculated by Equation 1 below.

Where Q is the amount of charged charge, C is the value of capacitance and V is the charged voltage.

The sum of the two series connected capacitances is considerably smaller than the capacitance C1. Therefore, the amount of charge that can be accumulated by two capacitances connected in series is less than the amount of charge that can be accumulated by the capacitance between the parallel and the printed circuit board and the ground substrate. Therefore, the charged voltage proportional to the amount of charge also changes.

Therefore, the switch 56 is momentarily turned on to partially dissipate the amount of charge in the static electricity dissipation circuit 55, and when the switch 56 is turned on, a loop is formed in which the capacitance C2 is excluded, thereby temporarily reducing the total capacitance value. A change occurs. Since the amount of charges affecting the printed circuit board 50 is reduced and the charged potential is decreased, the stability of the operation of the mounted component is ensured.

Considering that the situation such as sudden oscillation is caused by an incorrect input of a momentarily deformed signal due to static electricity, the amount of charged charge is momentarily reduced at the time of shifting, thereby preventing malfunction of the electronic controller.

Therefore, the operational stability of the electronic control apparatus mounted on the printed circuit board is guaranteed, thereby preventing malfunction such as sudden oscillation.

3 to 5 illustrate a separate ground substrate parallel to the printed circuit board as described above, the components of the same printed circuit board 58 are not mounted according to the intention of the manufacturer as shown in FIG. By constructing the ground layer 59 on the other side, the same effect as in the above embodiment can be obtained. In this case, the wiring 58a, the ground layer 59, and the vehicle body have the same mechanism as in FIG. This is avoided. In this state, the switch and the static electricity dissipation circuit can be mounted on the printed circuit board.

In addition, each semiconductor chip may be configured as shown in FIGS. 7 to 9 in order to obtain an electromagnetic shielding effect for each component mounted on a printed circuit board.

The conventional semiconductor chip 70 is commercialized by molding an epoxy molding resin 78 after the chip 74 is bonded onto the lead frame 72 and the wire 76 is bonded, and then is extended to the lead frame 72. The external lead 79 is exposed to the outside and has a function of connecting with a pattern on another component or a substrate.

According to the exemplary embodiment of the present invention, as shown in FIG. 8, the external lead 79 of the semiconductor chip has a socket shape inside the epoxy molding resin 78, and the pins are formed at positions corresponding to the corresponding positions on the printed circuit board 80. 82) is formed.

That is, as shown in FIG. 8, the semiconductor chip 70 bends an end portion of the external lead 79 connected to the chip 74 and the wire 76, and the chip 74 and the wire 76 with the epoxy molding resin 78. ) And the lid 70. In the molding process, the semiconductor chip 70 is configured such that the bent portion of the lead is exposed to one side of the groove having a shape and a size into which the pin 82 formed on the printed circuit board is insertable.

Accordingly, the semiconductor chip 70 is mounted in the socket type on the printed circuit board 80 as shown in FIG. 9, and the lead portion of the semiconductor chip is not exposed to the outside in the mounted state. Preferably, magnetic and conductive materials such as ferrite for electromagnetic shielding may be included or coated in the epoxy molding resin.

As a result, the external lead 79 to which the signal is applied is shielded so that electromagnetic waves are shielded, thereby preventing malfunction of the semiconductor chip due to the converted signal input.

As described above, the static electricity is prevented from affecting the signal controlling the driving of the vehicle, and the electromagnetic wave is shielded from affecting the printed circuit board or the semiconductor chip. Therefore, the stability of the operation of the electronic control apparatus of the vehicle is ensured, so that sudden start and stop is prevented.

As described above, the electronic device using the semiconductor chip may be prevented or blocked from being affected by static electricity and electromagnetic waves.

As described in detail above, the present invention has been described in detail with respect to preferred embodiments, but those skilled in the art to which the present invention belongs, various modifications of the present invention without departing from the spirit and scope of the present invention It will be appreciated that the modifications may be made.

Therefore, according to the present invention, malfunction of the electronic device using the semiconductor chip can be prevented, and accordingly, a possible accident can be prevented in advance, thereby maximizing the reliability of the electronic device.

In addition, in the case of a vehicle employing an automatic transmission, a situation such as sudden start is prevented, thereby preventing human and physical damage and ensuring safety in driving of the vehicle.

Claims (10)

A printed circuit board mounted with an electronic control device for controlling driving of a vehicle by interfacing various analog signals and digital signals; An electrostatic sensor mounted on the printed circuit board to sense a charging potential by static electricity; And a neutralizer for charging air by the sensing signal of the electrostatic sensor and discharging air containing cations and anions to the vehicle body to neutralize the electric charges stored in the vehicle body. A printed circuit board mounted with an electronic control device for controlling driving of a vehicle by interfacing various analog signals and digital signals; And And a static electricity dissipation circuit electrically connected between the ground of the components mounted on the printed circuit board and the vehicle body forming the ground to dissipate the static electricity stored in the vehicle body. The method of claim 2, An electrostatic sensor mounted on the printed circuit board to sense a charging potential by static electricity; And And a neutralizer for charging the air according to the sensing signal of the electrostatic sensor to discharge air containing positive and negative ions to the vehicle body to neutralize the electric charge stored in the vehicle body. The method of claim 2, The printed circuit board is assembled and accommodated by the upper shield case and the lower shield case having an inner space is a vehicle rapid oscillation device characterized in that the electromagnetic radiation emitted from the air is shielded from affecting the inside. A printed circuit board on which an electronic control device is mounted, in which various semiconductor signals are interfaced to perform a predetermined control operation; An electrostatic sensor mounted on the printed circuit board to sense a charging potential by static electricity; Electronic device using a semiconductor chip characterized in that it comprises a neutralizer for charging the air by the sensing signal of the electrostatic sensor to discharge the air containing the positive and negative ions in a predetermined direction in which the static electricity is formed to neutralize the stored charge Malfunction prevention device. A printed circuit board mounted with an electronic control device in which semiconductor chips are combined so that various signals are interfaced to perform a predetermined control operation; And Using a semiconductor chip comprising an electrostatic dissipation circuit electrically connected between the ground of the components mounted on the printed circuit board and the portion forming the ground to dissipate the static electricity accumulated in the ground forming portion Malfunction prevention device of the electronic device. The method of claim 6, The printed circuit board is assembled and accommodated by the upper shield case and the lower shield case having an inner space is shielded from affecting the electromagnetic waves introduced into the air to the inside of the electronic device using a semiconductor chip. A printed circuit board on which a predetermined component is mounted and an electrical operation is performed; A ground substrate having a ground layer having a predetermined shape and area and spaced apart from the printed circuit board in parallel; And Switching means connected between the ground substrate and the vehicle body and switched; the switching means switches the power supply state instantaneously by switching the components mounted on the printed circuit board in conjunction with an operation, thereby causing a signal due to a power failure of the components. Malfunction prevention device of electronic equipment using semiconductor chip which prevents transformation. A printed circuit board on which a predetermined component is mounted to perform an electrical operation, the printed circuit board being spaced apart by a predetermined interval in a state where the ground layer is separated from the wiring and the components constituting the electronic control device in a predetermined shape and area; And Switching means connected between the ground layer and the vehicle body and switched; the switching means switches the power supply state instantaneously by switching the components mounted on the printed circuit board in conjunction with an operation, thereby signaling the power failure of the components. Malfunction prevention device of electronic equipment using semiconductor chip which prevents transformation. A chip is bonded to a lead frame having a predetermined shape, the chip and the external lead formed on the lead frame are connected by wires, electrically connected to the outside through an external lead formed on the lead frame, and the ends of the external lead are bent in one direction. A semiconductor chip having a shape, and wherein the bent portion of the outer lead is molded with an epoxy molding resin such that the chip, the lead frame and the wire are opened in one direction; A printed circuit board on which predetermined parts are mounted, and pins for electrical connection with the external lead are protruded in an area where the semiconductor chip is mounted, and formed for each corresponding area; The semiconductor chip is assembled in a socket type to the printed circuit board, and the electromagnetic shielding component is contained in the epoxy molding resin, thereby preventing electromagnetic waves from affecting the external lead. Prevention device.