KR20000060106A - Anisotropic conductive film composition - Google Patents

Abstract

PURPOSE: A composition for anisotropic conductive adhesive film comprising heat sensitive or pressure sensitive pigment capable of indicating stable color variations with respect to temperature or pressure variation is provided which in advance removes the cause of a defect caused by the error of a processing condition or a bonding machine. CONSTITUTION: The composition for anisotropic conductive adhesive film comprises thermosetting resin, thermoplastic resin, a curing agent, conductive particles and pigments, wherein 0.1 to 50% by weight of the pigments contains based on the total resin. The composition has a transmissivity of 20% after the color of dye mixtures has already changed. The dye is heat sensitive or pressure sensitive pigment and an organic or inorganic compound and the change of color may be reversible or irreversible.

Description

Anisotropic conductive film composition

The present invention relates to a composition for anisotropic conductive adhesive film used for circuit connection, and more particularly to a composition for anisotropic conductive adhesive film visualized to directly confirm the connection reliability of the anisotropic conductive adhesive film during the process.

The anisotropic conductive adhesive film used in the conventional circuit connection is unable to confirm the reaction rate, which is a criterion for determining the connection reliability during the bonding process, so that the defect due to the process conditions and the failure of the bonding machine can not be confirmed in advance, which leads to considerable time and cost loss. Caused by.

In order to solve this problem, the present invention is expected to change the reaction rate even during the bonding process of the anisotropic conductive adhesive film by adding a Zion or pressure dye that can visualize the temperature or pressure applied during the bonding process to the composition of the anisotropic conductive adhesive film. By developing the components of the anisotropic conductive adhesive film to remove the defects caused by the process conditions or the error of the adhesive machine and to improve the connection reliability.

That is, the anisotropic adhesive film developed in the present invention changes the reaction rate indicating the connection reliability according to the change in the temperature or pressure of the bonding machine during the process, and the color of the anisotropic conductive adhesive film is changed in proportion to the change in the reaction rate. Because of this color change, the operator can immediately see the change in the reaction rate according to the process conditions.

Therefore, it is advantageous to secure connection reliability of the anisotropic conductive adhesive film by removing defect factors due to process conditions or errors in the adhesive in advance.

Hereinafter, the present invention will be described in more detail.

The present invention relates to an anisotropic conductive adhesive film which is one of the connection materials used to electrically connect the upper circuit and the lower circuit to couple and fix the circuit. It is characteristic to provide.

That is, the anisotropic conductive adhesive film provided by the present invention is characterized in that the thermosetting resin, thermoplastic resins, curing agents and accelerators, conductive particles, etc., characterized in that made of a Zion (pressure) dye to visually check the change in the reaction rate, in addition to the dispersion medium, Additives, such as antioxidant, can be used.

Thermosetting resins and thermoplastic resins that can be used herein include epoxy resins, melamine resins, polyurethane resins, polyimide resins, polyamide resins, polyethylene resins, polypropylene resins, natural rubbers, and the like. Aliphatic amines, aromatic amines, amides, acid anhydrides, phenols, imidazole derivatives and the like can be used. Nickel, gold, copper, tin, lead, etc. may be used alone or as an alloy for the conductive particles.

As a component that displays the reaction rate indicating the reliability of the splicing process as a visual color change in the splicing process, a cation dye that changes color with temperature, a pressure dye that changes color with pressure, or a mixture of zion dyes and pressure dyes may be used. Can be.

Pressure dyes are dyes that change color when a certain level of pressure is applied, or a compound having a structure that changes color due to electron movement, or a microcapsule type wrapped with a thermosetting resin or thermoplastic resin of an opaque material. As the microcapsules break, the dye flows out and changes color.

As the material of the microcapsules used herein, both thermosetting resins and thermoplastic resins may be used, and among them, urea formalin resin is most suitable.

Zion dyes are salt furnaces that change color when a certain level of temperature is applied.They revert back to their original color when the temperature is lowered, and they remain unchanged regardless of the temperature once the color is changed. There is an irreversible form.

The irreversible type of Zion dyes can be divided into inorganic compounds and organic compounds. In addition, Zion dyes of inorganic compounds include metal salts such as NiCO ₃ + CdS, COSiF ₆ , and CDCO ₃ . Leuco compounds, phenol compounds and the like.

Reversible Zion dyes can be divided into inorganic compound and organic compound form, and Ag ₂ Hgl ₄ , Cu ₂ Hgl ₄ and Hgl ₂ are metal complex salts. Sion dyes in the form include spiropyran compounds, cholesteric liquid crystals and the like.

Zion dyes and pressure dyes can be any color, especially yellow, orange, scarlet, pink, red, blue, green and black.

In view of the corrosion protection of the connection circuit, it is preferable to use a dye having an impurity ion (Na ⁺ , K ⁺ , Cl, SO ₄ ² ) contained in the sion and the pressure dye of 300 ppm or less, more preferably these impurities Preference is given to using high purity dyes of less than 100 ppm.

Example 1

Epikote 1002 (bisphenol A epoxy resin, Kumho Pienbi Chemical) and ethylene vinyl acetate copolymer were dissolved in toluene at a ratio of 70/30 to 40% solution, and then nickel (average particle size: 3-4) was used as a conductive particle. 10% of micrometer) is added and mixed.

20% of dicyandiamide was mixed with a curing agent, and Ag ₂ Hgl ₄ derivative, which is a metallic complex salt, was further mixed with a Zion dye.

The chlorine content was determined by ion chromatography, and the color was completely changed after 1 minute at 150 ° C, 30 seconds at 190 ° C, and 20 seconds at 210 ° C. The color changed in proportion to.

Example 2

Epikote 1002 (bisphenol A type epoxy resin, Kumho Pienbichemistry) and ethylene vinyl acetate copolymer were dissolved in toluene at a ratio of 70/30 to 40% solution, and then nickel (average particle size: 3-4) was used as a conductive particle. 10% of micrometer) is added and mixed.

Here, 20% of dicyandiamide was mixed with a curing agent, and 3% of a phenol derivative as an organic compound was further mixed with a pressure dye.

As a result of confirming the chlorine content by ion chromatography, the material was 250 ppm, and the calorific peak was 140 ° C. when the calorific peak was confirmed by DSC.

As a result of making the film with the solution made and checking the color change according to the temperature, the color did not change when the pressure was 5㎏ / ㎠, 40 seconds when the pressure was 10㎏ / ㎠ and 20 seconds when the pressure was 20㎏ / ㎠ Afterwards, the color changed completely and the color changed in proportion to the change in pressure applied to the composition.

Example 3

Epikote 1002 (bisphenol A epoxy resin, Kumho Pienbi Chemical) and ethylene vinyl acetate copolymer were dissolved in toluene at a ratio of 70/30 to 40% solution, and then nickel (average particle size: 3-4) was used as a conductive particle. 10% of micrometer) is added and mixed.

Here, 20% of dicyandiamide was mixed with a curing agent, and 1.5% of an Ag ₂ Hgl ₄ derivative as an epoxy complex salt and 1.5% of an phenol derivative as an organic compound were mixed with a Zion dye.

The chlorine content of the material was 210ppm using ion chromatography, and the calorific value peak was 138 degrees using the DSC of the thermal analyzer.

As a result of making a film with the solution made and checking the color change according to the temperature, when 20kg pressure was applied at a temperature of 210 degrees, the color changed completely in 20 seconds, which was proportional to the reaction rate.

As described above, the present invention adds a Zion or pressure dye which can visualize the temperature or pressure applied during the bonding process to the composition of the anisotropic conductive adhesive film so that the change in the reaction rate can be expected even during the bonding process of the anisotropic conductive adhesive film. Therefore, it eliminates defects caused by process conditions or adhesive errors and provides connection reliability.

Claims (6)

A composition for anisotropic conductive adhesive films comprising a thermosetting resin, a thermoplastic resin, a curing agent, conductive particles and a dye, wherein the content of the dye is 0.1-50% of the total content of the thermosetting resin and the thermoplastic resin. The composition for anisotropic conductive adhesive film according to claim 1, wherein the dye is a zion dye or a pressure dye and may be mixed and used in some cases. The composition for anisotropic conductive adhesive film of claim 1, wherein the composition has a light transmittance of 20% or more even after the color of the mixed dye is completely changed. 2. The composition for anisotropic conductive films according to claim 1, wherein the dye is an organic compound or an inorganic compound, and the change in color may be reversible or irreversible. The composition for anisotropic conductive adhesive film according to claim 2, wherein the zion dye has a chloride ion concentration of less than 300 ppm as determined by ion chromatography and a temperature at which the color is completely changed at 70 to 210 ° C. The composition for anisotropic conductive adhesive film according to claim 2, wherein the pressure coating has a chlorine ion concentration analyzed by ion chromatography of less than 300 ppm and a color change pressure of 0.1-50 kg / cm 2.