KR20000045070A - Ink jet printer head by using piezo effect and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A method for manufacturing an ink jet printer head by using piezo effect is provided to simplify the procedure by forming a pressure chamber and a nozzle simultaneously by etching and reduce the thickness of the nozzle. CONSTITUTION: A method for manufacturing an ink jet printer head by using piezo effect includes the steps of forming a mask pattern for forming a nozzle at one side on a bulk silicon substrate, doping B on the bulk silicon substrate formed with the mask pattern, forming SiO2 layer on the other side of the bulk silicon substrate, forming a predetermined pattern on the SiO2 layer for forming an ink injecting channel and etching the bulk silicon substrate corresponding to a partitioning wall part by using the SiO2 layer as a mask, removing the SiO2 pattern mask, forming SiO2 layer on the etching part and the other side of the bulk silicon from which the SiO2 pattern mask is removed, removing the SiO2 layer from a portion to be formed with a pressure chamber and a common ink channel by patterning the SiO2 layer, forming the pressure chamber, common ink channel and the nozzle simultaneously by etching the bulk silicon substrate by using the patterned SiO2 layer as a mask, forming an SiO2 film on inner walls of the pressure chamber and the common ink channel by coating SiO2 for preventing chemical reaction between the ink and Si, attaching a Si vibration plate on a surface facing to the nozzle plate, and forming a piezo structure on the Si vibration plate.

Description

Inkjet Printer Head Using Piezoelectric Effect and Manufacturing Method Thereof

The present invention relates to an ink jet printer head using a piezoelectric material and a manufacturing method thereof.

Conventionally, a thermal bubble jet printer head has been mainly used as a print head. Thermal bubble jet (Cannon & HP basic patent) is a method of ejecting ink by generating bubbles as heat. Instantaneous current flows through the heat conversion film in direct contact with the ink inside the printhead to generate heat due to the intrinsic resistance of the heat conversion film. This heat is transferred to the ink in contact with the heat conversion film so that the water-soluble ink rapidly rises above the boiling point. When the temperature of the ink rises above the boiling point, bubbles are formed, and the bubbles are applied to the surrounding ink to be discharged through the nozzle. At this time, the ejected ink is ejected to the ground while forming ink drops to minimize the surface energy inherent in the ink. This process is called drop-on-demand, which uses a computer to operate whenever needed.

At the moment when the bubbles disappear after the bubbles are generated in the thermal bubble jet, due to the high curvature of the bubbles, the impact of the bubbles on the protective film on the thermal conversion film is increased, resulting in cavitation damage. Is generated. For this reason, there are many restrictions on extending the life of the print head. In addition, since the ink is ejected only when bubbles are generated, the ink must be boiled at an appropriate temperature, so only ink that can boil at such an appropriate temperature can be used. Due to the physical properties of these inks, there are not many kinds of inks that can be used in thermal bubble jets. The limiting factor in the use of ink results in narrowing the application of the thermal bubble jet itself, such that the thermal bubble jet is primarily limited to desktop publication.

In addition, due to the high heat generated when bubbles are generated, the organic additives of the ink tend to react with the protective film located on the heat conversion film and adsorb to the protective film. These adsorbates interfere with heat transfer and do not effectively transfer heat generated in the heat conversion film to the ink. Therefore, even if a sufficient amount of heat to generate air bubbles is generated by the heat conversion film, in some cases, the adsorbed substances formed on the protective film are not sufficiently transferred to the ink, thereby preventing the ink from being ejected normally.

On the other hand, what has been proposed to solve the above problems is a printer head using a piezoelectric material of the non-heating method. However, ink jet printer heads using piezoelectric materials are generally limited in their use due to the cost increase resulting from complex assembly processes despite the excellent performance due to the assembly process due to the characteristics of piezoelectric materials.

That is, Piezo-electrinc impulse ink-jet is a printing method using a phenomenon that the volume changes when the piezoelectric element receives an electric field momentarily. When the piezoelectric element instantaneously changes its volume, it transmits a pressure wave to the ink, which travels to the nozzle at a speed of sound. Therefore, the nozzle ejects ink by the difference between the delivered pressure and atmospheric pressure. Various design examples using this principle have been published (Ulmann's encyclopedia of industrial chemistry).

First, the Xaar method forms a flow path in which ink flows by digging a groove through a mechanical process on a piezo-electric plate sintered in a manufacturing process. An electrode, a nozzle plate, a protective film, etc. are additionally formed in the piezoelectric plate in which the flow path was formed, and a printer head is manufactured. Piezoelectric plates are generally manufactured after the separation process and after the sintering process, and are made in the form of aggregates of irregular particles. When mechanically processing a piezoelectric plate to form an ink flow path, the amorphous piezoelectric plate irregularly pulls out particles. Particles where the particles are lost become voids in the piezoelectric material, which are theoretically cracked crack centers under low stress. As a result, production yields are significantly lower and production costs rise.

Next, the Epson Push Rod Design method is used in the form of a plurality of rods by mechanically processing a piezoelectric plate composed of multiple layers. Each bar is connected to a diaphragm at the top of the bar, which vibrates as the piezoelectric bar receives an electric field and changes its volume. Such a print head undergoes a considerable number of assembling processes, and even when the assembly is performed, ink droplets are not discharged uniformly unless precise assembly is required, so a high precision assembly process is required. As such, the high precision assembly process increases the cost and mechanically processes the rods, thereby limiting the packing density of the nozzle.

In the Epson Kyser method (patent), the diaphragm and the ink flow path are made of ZrO ₂ . In general, chemical bonds forming ceramic materials are weakly deformable because they are formed by ionic bonding, and must be subjected to a high temperature process because a material having desired physical properties is obtained by heating at a high temperature. Formability is also very weak and difficult to wet etch due to strong ionic bonds. Polycrystalline is usually used because it is difficult to obtain a sufficiently large form with a single crystal. However, in the case of polycrystalline, since the particles are irregularly distributed, it is difficult to perform uniformly when wet etching. Therefore, if the process control is not very precise, it is difficult to realize the uniformity of the printhead, and the precision process is accompanied, so that the production yield is significantly lowered. This approach has the disadvantage of easily increasing production costs due to this low production yield.

1 is a sectional view of a laminated ink jet recording head described in European Patent No. 0 659 562 A2. As shown, the laminated inkjet recording head basically comprises a nozzle plate 101 on which a nozzle 100 is formed, three communicating hole forming boards 201a, 201b, and 201c, and a pressure generating chamber forming board 301. ) And the diaphragm 400 are sequentially laminated (laminated) structure. In the pressure generating chamber 300, the ink stored in the ink storage container 800 is temporarily stored in the storage chamber 600a after passing through the inlet 700, and then filled through the ink inlet 600c and the communication hole 600b. Ink provided from an external ink container flows into the ink storage container 800 through the filter 900. The piezoelectric vibrator 500 is attached to the diaphragm 400 to generate pressure in the ink filled in the pressure generating chamber 300 according to a voltage signal applied thereto. The pressurized ink is discharged through the nozzle 100 through the communicating holes 200a, 200b, and 200c. However, in the inkjet recording head having such a structure, since the nozzle 100 and the ink injection hole 600c are together on the surface facing the diaphragm 400, the discharge pressure of the ink due to the vibration of the diaphragm 400 is divided. This exists. That is, since the pressure through which the ink is discharged through the nozzle 100 is transferred to the ink injection hole 600c, the phenomenon in which the ink injected into the pressure generating chamber 300 flows back easily occurs.

The present invention was devised to improve the above problems, and the structure and the manufacturing process are simplified as much as possible by integrating a nozzle and an ink flow path and directly attaching or forming a piezoelectric material to a diaphragm, and ink backflow during ink ejection. SUMMARY OF THE INVENTION An object of the present invention is to provide an inkjet printer head using a piezoelectric material that prevents the phenomenon as much as possible and a method of manufacturing the same.

1 is a vertical sectional view of a conventional laminated inkjet recording head,

2 is a schematic perspective plan view of the inkjet printer head using the piezoelectric material according to the present invention as viewed from the nozzle face;

3 is a schematic perspective plan view of the inkjet printer head using the piezoelectric material of FIG. 2 as viewed from a diaphragm having a piezoelectric plate formed thereon;

4 is a vertical cross-sectional view showing a cross section taken along the line AA ′ of FIG. 3,

5A to 5O are vertical cross-sectional views showing cross-sections after the step-by-step processing of the inkjet printer head using the piezoelectric material according to the present invention.

<Description of the symbols for the main parts of the drawings>

1. pressure chamber 2. nozzle

3. ink feed-in channel 4. common manifold

5. Main ink flow path 6. Upper electrode

7. Piezoelectric Plate 8. Common electrode

9. Diaphragm 10. SiO ₂ thin film

11.Si substrate 12.B-doped Si nozzle plate

13. SiO ₂ mask pattern 14. Photoresist (PR)

15. Diffusion barrier

The inkjet printer head using the piezoelectric material according to the present invention for achieving the above object, the nozzle plate and the diaphragm are formed on both sides of the bulk silicon substrate on which the pressure chamber and the common ink flow path are formed with one partition therebetween. The nozzle of the nozzle plate and the piezoelectric plate attached to the outside of the diaphragm are integrally formed to face each other with the pressure chamber interposed therebetween, and the partition wall has an ink inflow which allows ink of the common ink flow path to flow into the pressure chamber. A channel is formed, and the nozzle plate is formed of B doped silicon.

In the present invention, the ink inflow channel is formed in contact with the diaphragm, the diaphragm is formed of single crystal silicon, the diaphragm is formed with an injection hole for injecting the ink of the main ink bottle into the common ink flow path, SiO ₂ films are further formed on both sides of the barrier ribs inside the pressure chamber, on the barrier ribs of the common ink flow path, and on both sides of the nozzle plate to prevent the ink from reacting with Si. It is formed larger than the diameter, the diameter of the nozzle is formed to 30㎛ or less, the size of the ink inflow channel is formed to 30 ~ 70㎛, the inclination of both walls of the pressure chamber relative to the vertical plane of the nozzle plate It is formed to have an inclination of 45 ° to 60 ° to be further widened toward the diaphragm, or both walls of the pressure chamber is It is formed to form a vertical plane with the plate, the size of the pressure chamber is 200㎛ gap between the nozzle plate and the diaphragm, the partition wall of the nozzle plate side of the gap between the partition walls of the pressure chamber is formed to 200㎛, the piezoelectric The plate is formed of lead-zirconium-titanate, and a lower common electrode and an upper electrode are formed on both surfaces of the piezoelectric plate, respectively, and the lower common electrode is preferably formed of a conductive paste. The vibrating plate and the piezoelectric plate are preferable. It is also preferable to further provide a diffusion prevention film formed of Si ₃ N ₄ or ZrO ₂ between.

In addition, the inkjet printer head manufacturing method using a piezoelectric material according to the present invention for achieving the above object, (A) forming a mask pattern for forming a nozzle on one side of the bulk silicon substrate; (B) doping B into an upper surface of the bulk silicon substrate on which the mask pattern is formed; (C) respectively forming SiO ₂ films on the other side of the bulk silicon substrate; (D) forming a predetermined pattern on the SiO ₂ film to form an ink injection channel, and etching the bulk silicon substrate corresponding to the partition part by using the SiO ₂ pattern as a mask; (E) removing the SiO ₂ pattern mask; (F) forming a SiO ₂ film over the upper surface of the partition portion etching portion and the other side of the bulk silicon from which the SiO ₂ pattern mask is removed; (G) patterning the again formed SiO ₂ film to remove the SiO ₂ film formed in the portion where the pressure chamber and the common ink flow path are to be formed; (H) etching the bulk silicon substrate using the patterned SiO ₂ film as a mask to form a pressure chamber and a common ink flow path and simultaneously forming a nozzle; (I) comprising the steps of coating an inner wall and an ink injection channel an upper surface of the inner wall of the pressure chamber and the common ink passage to the SiO ₂ film is formed SiO ₂ in order to prevent mutual chemical reactions between the ink and the Si; (D) attaching a previously secured Si diaphragm to the nozzle plate opposing surface of the structure formed by the above processes; And (k) forming a piezoelectric structure on the Si diaphragm.

In the present invention, in the step (a), the nozzle forming mask pattern is formed by forming an SiO ₂ film and then etching the SiO ₂ film by photolithography, and etching the bulk silicon in the step (d). A KOH solution is used as an etchant in the above, wherein the re-formed SiO ₂ film is patterned by photolithography in step (g), and a KOH solution is used as an etchant for etching the bulk silicon substrate in step (h). In the step (d), the Si diaphragm is attached by an anode bonding method or a high temperature heating method, and the step (ka) is performed to prevent diffusion of the piezoelectric material during sintering on the Si diaphragm. Forming a diffusion barrier layer; (K-2) a sub step of coating a conductive paste for a lower common electrode on the diffusion barrier layer; (K-3) a sub step of attaching a piezoelectric plate on the conductive paste; (C-4) sub-sintering the piezoelectric plate; And (Ka-5) a sub-step of forming an upper electrode on the piezoelectric plate, wherein the diffusion barrier layer is formed of Si ₃ N ₄ or ZrO ₂ in the (K-1) sub-step. -3) In the sub-step, the piezoelectric plate is attached without being baked by screen printing method using lead-zirconium-titanate as the material, and in the sub-step (K-4), the sintering temperature is 1000 ° C or less. Preferably, in the step (k), the step (k-1) is eliminated, and the piezoelectric plate sintered in the (k-3) sub step is attached onto the conductive paste, and the (k-4) sub It is also desirable to eliminate the steps.

Hereinafter, an inkjet printer head using a piezoelectric material according to the present invention and a manufacturing method thereof will be described in detail with reference to the drawings.

Fig. 2 is a schematic perspective plan view of the inkjet printer head using the piezoelectric material according to the present invention as viewed from the nozzle face. This figure shows the structure of the ink flow channel and the position of the nozzle from the nozzle face of the printhead. Ink flow channels are fabricated by etching bulk silicon substrates. A reference numeral 1 denotes a pressure chamber positioned below the piezoelectric plate (see FIG. 3), a reference numeral 2 denotes a nozzle through which ink is discharged, and a reference numeral 3 denotes an ink injection channel for supplying ink to the pressure chamber 1. (ink feed-in channel), reference numeral 4 denotes a common ink manifold for supplying ink through the ink injection channel 3 to each of the pressure chambers 1 located below the piezoelectric plate (see FIG. 3). And reference numeral 5 denotes holes of the flow path or diaphragm for supplying ink from the ink bottle to the common ink flow path 4.

FIG. 3 is a schematic perspective plan view of the inkjet printer head using the piezoelectric material of FIG. 2 as viewed from a diaphragm having a piezoelectric plate. This figure mainly shows the structure of the ink flow path as seen from the diaphragm of the printer head, the piezoelectric plate and the arrangement of the upper and lower electrodes. Here, members 1, 3, 4, and 5 represent elements as described in FIG. 2, wherein member 6 is an upper electrode, member 7 is a piezoelectric plate, and member 8 is a common electrode formed under the piezoelectric plate ( common electrode).

4 is a vertical cross-sectional view showing a cross section taken along the line AA ′ of FIG. 3. This figure shows in detail the structure of the thin films as a cross-sectional view in the y direction of the coordinates shown in FIGS. 2 and 3. As shown, the inkjet printer head using the piezoelectric material according to the present invention basically includes a pressure chamber 1, an ink feed-in channel 3, and a common ink flow path 4. In order to form, a SiO ₂ thin film 10 is formed on an inner surface of a bulk Si substrate 11 having a chamber space, and a nozzle plate 12 on which a nozzle 2 is formed is B-doped. It is formed into a Si thin film. As such, since the nozzle plate 12 is formed of B-doped Si, if the doping of B is limited only to the portion where the nozzle is to be formed, the nozzle is simply formed in a simple manner and a protective layer for preventing chemical reaction with ink is required. No single layer structure is sufficient. And Si diaphragm 9 for generating the pressure which causes the ink in the pressure chamber 1 to discharge through the nozzle 2 is formed on the surface which opposes a nozzle. On the upper surface of the Si diaphragm 9, a piezoelectric element formed of the upper electrode 6, the piezoelectric plate 7, and the lower electrode 8 for vibrating the diaphragm 9 is attached. In some cases, a diffusion barrier 15 formed of Si ₃ N ₄ or ZrO ₂ may be inserted between the diaphragm 9 and the lower electrode 8 to prevent diffusion of the piezoelectric material when the piezoelectric plate 7 is formed. Here, the piezoelectric plate 7 is made of lead zirconium titanate. In particular, the size of the ink chamber 1 sets the gap between the nozzle plate surface and the diaphragm surface to about 200 μm, and the distance between both wall surfaces sets the gap between the nozzle plate side to about 200 μm, and the pressure generated by the vibration of the diaphragm 9. The ink chamber 1 is manufactured as follows so as to be transferred toward the nozzle 2 as much as possible to facilitate ink ejection.

First, the ink injection hole 3 is disposed to be in contact with the diaphragm 9 on the same surface, so that the pressure of the vibration plate vibrating in the vertical direction is transmitted toward the ink injection hole 3 to prevent the ink from flowing backward.

Secondly, the diameter of the ink injection hole 3 is set to about 30 to 70 µm, which is larger than 30 µm, which is the diameter of the nozzle 2.

Third, both wall surfaces of the pressure chamber 1 formed by etching Si are formed to extend toward the diaphragm 9 in a direction perpendicular to the surface of the B-doped Si nozzle plate 12 and an inclination of about 45 ° to 60 °. The pressure by the diaphragm 9 is concentrated towards the nozzle 2.

As described above, the inkjet printer head using the piezoelectric material according to the present invention has a structure in which the nozzle 2, the common ink flow passage 4 and the ink injection channel 3 are formed integrally with the pressure chamber 1 using Si. Can be made simple but its size is small. In addition, the piezoelectric plate 7 processes the piezoelectric material in a simple form and attaches it to the vibration plate 9 or forms a pattern of the piezoelectric material directly on the vibration plate 9 and co-fires it together. Is produced by. In the latter case, between the diaphragm 9 and the lower electrode 8, a diffusion barrier (not shown; see reference numeral 15 in FIG. 5O) is inserted to prevent the piezoelectric material from diffusing into the diaphragm 9 when the piezoelectric material is sintered. do.

An inkjet printer head using a piezoelectric material having the above structure is manufactured as follows.

In the inkjet printer head using the piezoelectric material according to the present invention, the nozzle and the ink flow path are integrally formed with the pressure chamber, and the piezoelectric plate may be attached to the vibrating plate by processing the piezoelectric material in a simple form, or the pattern of the piezoelectric material directly on the vibrating plate ( It is produced by forming a pattern and co-fire together. A wet etching method is used in the nozzle and ink flow path forming process. This is a well known and economic way. By introducing a micro-fabrication process applied to such Si, there is an advantage of widening the range of the print head design, manufacturing costs can be reduced, and the print head can be manufactured precisely. This means that it is possible to economically produce a print head capable of producing high-resolution prints. Such a manufacturing method will be described in detail with reference to FIGS. 5A to 5O.

First, a process of forming a B doping layer for forming a nozzle plate, as shown in FIGS. 5A and 5B, in order to prevent B from being doped in a portion corresponding to a nozzle, a mask pattern (pattern) is formed by photolithography. ). In FIG. 5A, an SiO ₂ thin film 13 ′ is coated on one side of the bulk Si substrate 11. Next, after coating a photoresist on the upper surface of the SiO ₂ thin film 13 ′, ultraviolet light is irradiated to an area other than a portion corresponding to the nozzle and exposed to ultraviolet light. Subsequently, when the exposed portion is removed, the photoresist 14 remains only in the portion corresponding to the nozzle. Using the photoresist 14 as a mask, as illustrated in FIG. 5B, the SiO ₂ thin film 13 ′ is selectively etched to form a SiO ₂ mask pattern 13.

Next, the photoresist 14 is removed, and as illustrated in FIG. 5C, the B-doped Si thin film 12 is doped by using the SiO ₂ mask pattern 13 to dop B into all regions other than the portion corresponding to the nozzle. ).

Next, a process for forming an ink feed-in channel for supplying ink to the pressure chamber and the pressure chamber through bulk etching, as shown in FIG. It is necessary to form an etching pattern of a portion corresponding to an ink feed-in channel. In FIG. 5D, the SiO ₂ thin film 10a is coated on the other side of the bulk Si substrate 11. Next, after coating a photoresist on the SiO ₂ thin film 10a, UV light is exposed to a portion corresponding to an ink feed-in channel. Subsequently, when the exposed portion is removed, the portion corresponding to the ink feed-in channel is exposed.

Next, Fig., An ink injection channel and etching the exposed SiO ₂ layer (10a) to form a SiO ₂ pattern (10b), and the SiO ₂ pattern (10b) as a mask, as shown in 5e (ink feed- the Si substrate 11 of the portion corresponding to the in channel) is etched. At this time, the exposed SiO ₂ layer 10a portion is wet etched using a water-soluble HF solution. The chemical reactions involved are as follows.

SiO ₂ + ₆ HF → H ₂ SiF ₆ + 2H ₂ O

When the SiO ₂ layer 10 reaches the Si substrate 11 as the etching proceeds, the etching of the Si substrate 11 proceeds at a relatively slow speed, so Si is an etch barrier in the SiO ₂ etching process using HF aqueous solution. Semiconductor integrated circuit processing technology, WR Runyan, KE Bean, Addison-Wesley Publishing Company Inc., 1990, New York, USA. The Si substrate 11 is etched using a KOH aqueous solution. The chemical reactions involved in the etching of Si atoms are:

Si + H ₂ O + 2KOH → K ₂ SiO ₃ + 2H ₂

During Si wet etching process, SiO ₂ is hardly etched (e.g., when etching solution containing KOH 250 grams, Normal Propanol 200 grams, H ₂ O 800 grams), Si is etched at a rate of 1 μm per minute at 80 degrees Celsius. SiO ₂ is etched at 20 kW / min, Semiconductor integrated circuit processing technology, WR Runyan, KE Bean, Addison-Wesley Publishing Company Inc., 1990, New York, USA) In etching, SiO ₂ serves as an etch barrier.

Next, as shown in FIG. 5F, the SiO ₂ pattern 10b is removed.

Next, as shown in FIG. 5G, the SiO ₂ layer 10c is again coated. This is necessary to form a mask pattern for etching an Si substrate for forming a pressure chamber and a common ink manifold.

Next, as shown in FIG. 5H, the SiO ₂ layer 10c is etched using a photolithograpy process as in FIGS. 5A and 5B to form a pressure chamber and a common ink manifold. An etching SiO ₂ pattern 10d is formed. The SiO ₂ applied on the upper surface of the ink feed-in channel 4 and the upper surface of the portion of the pressure chamber 1 remains, and the remaining SiO ₂ layer is removed.

Next, as shown in FIG. 5I, the Si substrate 11 is etched using the SiO ₂ pattern 10d as a mask to form a pressure chamber 1 and a common ink manifold 4. At this time, the Si of the undoped portion of the B-doped Si thin film 12 on the upper surface of the pressure chamber 1 is also etched to form the nozzle 2 and the mask pattern 13 for forming the nozzle is also removed.

Next, as shown in Fig. 5J, the pressure chamber 1 and the common ink flow path 4 and the ink feed-in channel 3 are prevented to prevent the mutual chemical interaction between the ink and the Si. coated with SiO ₂ to form an SiO ₂ film (10e).

Next, as shown in Fig. 5K, a single-crystal Si diaphragm (membrane form) 9 secured in advance is attached to the opposite surface of the nozzle plate 12 in the structure formed in the above process. At this time, the Si diaphragm is attached to the structure by using anodic bonding (anodic bonding) method or by high temperature heating bonding.

Next, FIG. 5L forms a diffusion barrier 15 of Si ₃ N ₄ or ZrO ₂ to prevent the piezoelectric material from diffusing when the piezo-electrinc materials are sintered. This step does not need to be performed when the piezoelectric plate is separately manufactured and attached.

Next, as shown in FIG. 5M, a lower common electrode 8 is formed. The lower common electrode 8 is formed by coating a conductive paste by screen printing. This conductive paste serves as an adhesive for attaching the piezoelectric plate 7.

Next, as shown in FIG. 5N, a piezoelectric plate 7 made of lead zirconium titanate is attached to the lower common electrode 8, that is, conductive paste as an adhesive, and then sintered. .

Next, as shown in FIG. 5O, the upper electrode 6 is formed on the upper surface of the piezoelectric plate to complete the device.

As described above, in the inkjet printer head using the piezoelectric material according to the present invention, since the nozzle, the common ink flow path, and the ink injection channel are formed integrally with the pressure chamber using Si, the structure can be simplified and the size thereof can be reduced. . Therefore, the resolution of a printed matter can be raised. The bulkhead structure of the pressure chamber is made obliquely by using a bulk Si wafer, so the pressure wave is concentrated toward the nozzle, so the pressure wave loss inside the pressure chamber is small, so the energy use is efficient. Can be used. In particular, by using a Si thin film doped with B as the nozzle plate, the layer of the nozzle plate is simpler than using a silicon on insulator (SOI).

In addition, in the manufacturing method, since the nozzle is integrally manufactured, there is no need to use Pick & Place equipment for attaching the nozzle to the print head, so the process is simple and no nozzle plate is used to manufacture the nozzle. The cost required is reduced. The formation of the flow path through which the ink is moved forms the Si wafer using a direct wet etching method, thereby facilitating the process and reducing the production cost. Wet etching using Si wafers is easy to form complex ink flow paths, and therefore, various types of print heads can be manufactured. As a diaphragm, since a Si thin plate is used, two regular diaphragms can be used. The material of the piezoelectric plate is sintered at 1000 ° C using lead-zirconium titanate, so that the piezoelectric plate can be directly sintered on Si when the piezoelectric plate is attached. When the piezoelectric plate is sintered directly on Si, the pattern is formed using screen printing, which reduces the gap between the nozzles. In particular, since the nozzle is etched while forming the pressure chamber at the same time, the process is simple, and the thickness of the nozzle is reduced, so that the limiting factor of CPI (channel per inch) due to anisotropic etching during etching is reduced. In this case, the thickness of commercially available Si is limited. In this case, a thinner thickness of Si than SOI can be used to help improve the CPI. In the case of using SOI, an excimer laser is used to Although the nozzle is formed, this method has the advantage of directly forming the nozzle through bulk etching without using an excimer laser.

Claims (27)

A nozzle plate and a diaphragm are formed on both sides of a bulk silicon substrate on which a pressure chamber and a common ink flow path are formed, with one partition interposed therebetween, and a piezoelectric body attached to the nozzle of the nozzle plate and the outside of the diaphragm with the pressure chamber therebetween. The plate is integrally formed to face each other, the partition wall is formed with an ink inflow channel for introducing the ink of the common ink flow path into the pressure chamber, the nozzle plate is a piezoelectric material characterized in that the B is doped with silicon Inkjet printer head using a. The method of claim 1, And the ink inlet channel is formed to contact the diaphragm. The method of claim 1, The diaphragm is an inkjet printer head using a piezoelectric material, characterized in that formed of single crystal silicon. The method of claim 1, And the injection plate is formed in the diaphragm to inject the ink of the main ink container into the common ink flow path. The method of claim 1, Ink jet printer head using a piezoelectric material, characterized in that the SiO ₂ film is further formed on the upper surface of both partition walls in the pressure chamber, the partition walls of the common ink flow path and both surfaces of the nozzle plate to prevent the ink from reacting with Si. . The method of claim 1, And the ink inflow channel has a size larger than the diameter of the nozzle. The method of claim 1, The nozzle has a diameter of less than 30㎛, the ink inlet channel size of the inkjet printer head using a piezoelectric material, characterized in that formed in 30 ~ 70㎛ or more. The method of claim 1, The inclination of both walls of the pressure chamber is formed to have an inclination of 45 ° to 60 ° with respect to the vertical plane of the nozzle plate is formed so as to further open toward the diaphragm, the inkjet printer head using a piezoelectric material. The method of claim 1, Both walls of the pressure chamber are formed to form a vertical plane with the nozzle plate, the inkjet printer head using a piezoelectric material. The method of claim 1, The size of the pressure chamber is 200㎛ interval between the nozzle plate and the diaphragm, and the partition wall spacing of the nozzle plate side of the gap between the partition walls of both the pressure chamber is formed to 200㎛ inkjet printer head using a piezoelectric material. The method of claim 1, The piezoelectric plate is an inkjet printer head using a piezoelectric material, characterized in that formed of lead-zirconium-titanate. The method of claim 1, An inkjet printer head using a piezoelectric material, characterized in that lower common electrodes and upper electrodes are formed on both surfaces of the piezoelectric plate, respectively. The method of claim 12, The lower common electrode is an inkjet printer head using a piezoelectric material, characterized in that formed of a conductive paste. The method of claim 1, An inkjet printer head using a piezoelectric material, characterized in that a diffusion barrier is further formed between the diaphragm and the piezoelectric plate. The method of claim 14, The diffusion barrier is an inkjet printer head using a piezoelectric material, characterized in that formed of Si ₃ N ₄ or ZrO ₂ . (A) forming a nozzle pattern mask pattern on one side of the bulk silicon substrate; (B) doping B into an upper surface of the bulk silicon substrate on which the mask pattern is formed; (C) respectively forming SiO ₂ films on the other side of the bulk silicon substrate; (D) forming a predetermined pattern on the SiO ₂ film to form an ink injection channel, and etching the bulk silicon substrate corresponding to the partition part by using the SiO ₂ pattern as a mask; (E) removing the SiO ₂ pattern mask; (F) forming a SiO ₂ film over the upper surface of the partition portion etching portion and the other side of the bulk silicon from which the SiO ₂ pattern mask is removed; (G) patterning the again formed SiO ₂ film to remove the SiO ₂ film formed in the portion where the pressure chamber and the common ink flow path are to be formed; (H) etching the bulk silicon substrate using the patterned SiO ₂ film as a mask to form a pressure chamber and a common ink flow path and simultaneously forming a nozzle; (I) comprising the steps of coating an inner wall and an ink injection channel an upper surface of the inner wall of the pressure chamber and the common ink passage to the SiO ₂ film is formed SiO ₂ in order to prevent mutual chemical reactions between the ink and the Si; (D) attaching a previously secured Si diaphragm to the nozzle plate opposing surface of the structure formed by the above processes; And (K) forming a piezoelectric structure on the Si diaphragm; A method of manufacturing an inkjet printer head using a piezoelectric material, comprising. The method of claim 16, The method of manufacturing the inkjet printer head using the piezoelectric material as claimed in (a), wherein the nozzle pattern mask pattern is formed by forming an SiO ₂ film and then etching the SiO ₂ film by a photolithography method. The method of claim 16, The method of manufacturing an inkjet printer head using a piezoelectric material, characterized in that using the KOH solution as an etchant in the process of etching the bulk silicon in the step (d). The method of claim 16, The method of manufacturing an inkjet printer head using a piezoelectric material, wherein the SiO ₂ film formed again in the step (g) is patterned by a photolithography method. The method of claim 16, A method of manufacturing an inkjet printer head using a piezoelectric material, wherein a KOH solution is used as an etchant for etching the bulk silicon substrate in the step (h). The method of claim 16, The method of manufacturing an inkjet printer head using a piezoelectric material, wherein the attaching of the Si diaphragm is performed by an anode bonding method or a high temperature heating method in the step (d). The method of claim 16, wherein (K) step, (Ka-1) forming a diffusion barrier layer on the Si diaphragm to prevent diffusion of the piezoelectric material during sintering; (K-2) a sub step of coating a conductive paste for a lower common electrode on the diffusion barrier layer; (K-3) a sub step of attaching a piezoelectric plate on the conductive paste; (C-4) sub-sintering the piezoelectric plate; And (K-5) sub-step of forming an upper electrode on the piezoelectric plate; A method of manufacturing an inkjet printer head using a piezoelectric material, comprising. The method of claim 22, And the diffusion barrier layer is formed of Si ₃ N ₄ or ZrO ₂ in the sub-step (ka-1). The method of claim 22, The piezoelectric plate is a lead-zirconium titanate as a material in the sub-step (K-3). The method of claim 22, And the piezoelectric plate is attached in a non-fired state by screen printing in the sub-step (K-3). The method of claim 22, In the sub-step (K-4), the sintering temperature is 1000 ° C. or less. The method of claim 16, wherein in step (k), Using the piezoelectric material, the step (ka-1) is eliminated, the piezoelectric plate sintered in the step (ka-3) is attached onto the conductive paste, and the step (ka-4) is removed. Method for producing an inkjet print head.