KR20000034549A - Control equipment and control method of wafer processing apparatus - Google Patents

Abstract

PURPOSE: The control equipment and the control method of a wafer processing apparatus is provided so that it can jet a wafer processing substance at the same time among the nozzles which jet the wafer processing substance, and that it can prohibit effectively to be coagulated the wafer processing substance in the nozzles. CONSTITUTION: The control equipment of a wafer processing apparatus consists of the following sections according to function; the nozzle grouping section forming the data of a nozzle group by grouping the nozzle units by at least two groups in accordance with a fixed goal of a wafer processing operation; the forming section of the jet data forming the jet operation data of the above nozzle units at the base of the above data from nozzle group and the above data from the jet operation; and the performance section of the jet operation to carry out individually the jet of the wafer processing substance in every nozzle units among the above nozzle groups at the base of the data from the above jet operation.

Description

Wafer processing device control device and control method

The present invention relates to a control apparatus and a control method of a wafer processing apparatus, and more particularly, to a control apparatus and a control method of a wafer processing apparatus for controlling a coating process and a developing process of a wafer.

Generally, a wafer factory is referred to as a spinner system, and a wafer transfer device for transferring a wafer to a predetermined working position on a semiconductor work line, and a processing unit for processing a wafer, that is, a coater unit, an exposure unit, and a baker unit. Have A coater unit and a developing unit usually have a plurality of them to form a coater unit module and a developing unit module, respectively.

The wafer transfer device is composed of a conveyor system, a transfer robot, and the like, each of which loads a wafer into a cassette and transfers the wafer between processing units.

FIG. 7 is a schematic configuration diagram of a chamber containing a coater unit and a wafer suction chuck. As shown in this figure, the coater unit 131a includes a plurality of nozzles 135a, 135b, and 135c. And a nozzle moving driver 143 and a nozzle injection driver 145 for driving the nozzles 135a, 135b, and 135c, respectively. One end of the nozzles 135a, 135b, and 135c is exposed in the chamber 133, and the other end is connected to the processing material compression container 147a, 147b, and 147c containing the wafer processing material. Each nozzle 135a, 135b, 135c, the nozzle movement driving part 143, and the nozzle injection driving part 145 integrally form one nozzle unit. The processing material compression containers 147a, 147b, and 147c contain photosensitive agents, primer chemicals, and the like, and the wafer processing materials are nozzles 135a, 135b, and 135c by a predetermined pumping system. ) Is injected into the chamber 133.

On the other hand, the developing unit has a configuration similar to that of the coater unit.

The operation of the wafer processing apparatus having such a configuration will be briefly described as follows.

The wafer is moved near the chamber 133 in a state of being loaded into a cassette by a conveyor system (not shown) and then supported by the chuck 137. The wafer 139 adsorbed to the chuck 137 is a coating process of spraying a photoresist and the like to uniformly apply the surface of the wafer to the photoresist, and a soft baking process and a hard baking process of heating and cooling the wafer to enhance adhesion of the photoresist. Exposure process for transferring a pattern on a mask to a wafer surface by exposure to a baking process, ultraviolet rays, a developing process for selectively removing unmultiplexed photoresist, and an oxide film for selectively removing an oxide film deposited on a wafer. It is moved by the conveyor system again through the etching process and the photoresist removal process to remove the multiplexed photoresist. Here, the wafer 139 adsorbed to the chuck 137 during the coating process is rotated by the drive motor 141, and the nozzles 135a, 135b, and 135c included in the coater unit 131a and the developing unit move the nozzle. After being moved onto the wafer by the driving unit 143, the wafer processing material is sprayed in accordance with the driving of the nozzle injection driving unit 145.

The work in the wafer processing apparatus having such a configuration is performed uniformly through a predetermined control apparatus, and the control apparatus of such a wafer processing apparatus is shown in Figs.

4 is a schematic block diagram of a control apparatus of a conventional wafer processing apparatus, FIG. 5 is a schematic block diagram of a conventional coater module control apparatus, and FIG. 6 is a block diagram of the coater unit controller shown in FIG.

As shown in FIG. 4, the control apparatus of the conventional wafer processing apparatus is parallel to the host computer 101, the host system controller 103 connected to the host computer 101, and the host system controller 103 in parallel. Sub-system control device 104, i.e., wafer transfer control device 105, coater module control device 107, exposure control device 109, baker module control device 111, and developing module control device 113 connected to each other. Have

The host computer 101 has an auxiliary memory (not shown) for storing initial data necessary for the operation of the wafer processing apparatus, such as a process execution routine, a recipe, and the like of the subsystem control apparatus 104. Here, a resp means a set of data necessary for a processing operation, such as rotational speed data of a wafer, position data on a wafer of a nozzle, injection time data of a nozzle, and processing material data for each injection nozzle, and is identified by a predetermined respite number. The contents of the data of each respite are different, and the contents can be changed by the operator through a predetermined input device.

The subsystem control device 104 has a memory (not shown) that can store initial data from the auxiliary memory of the host computer 101, respectively.

The construction of the coater module control device 107 and the development module control device 113 among the subsystem control device 104 is the same. Hereinafter, the configuration of the coater module control device 107 will be described.

As shown in FIGS. 5 and 6, the coater module control device 107 is a coater unit controller (1 to 1) connected to the memory 109 and the coater units 131a, 131b, 131c ... 114a, 114b, 114c ...), and these coater unit controllers 114a, 114b, 114c ... have the same configuration. Hereinafter, the coater unit controller 114a will be described.

The coater unit controller 114a has an injection job control unit 121 connected to the coater unit 131a, and a communication unit 115 connected to the host system control device 103 and the injection job control unit 121, respectively. The injection job control unit 121 has a injection control signal generation unit 123 connected to the coater unit 131a and a job execution data analysis unit 122 connected to the communication unit 115.

The operation of the controller of the wafer processing apparatus having such a configuration will be described below.

When operating power is applied to the wafer processing apparatus, the initial data stored in the auxiliary memory of the host computer 101 is read out and stored in the memory of the subsystem control apparatus 104. In particular, the memory of the coater module control device 107 and the developing module control device 113 is read out from the auxiliary memory of the host computer 101 and stored.

The wafer processing target job input through the predetermined input device is converted into a job command code for each work line by the host computer 101 which manages the entire semiconductor work line and transferred to the upper system control device 103.

The upper system control device 103 prepares a work plan for each work line according to the work command code, and generates a work execution message and transmits the work execution message to the lower system control device 104. At this time, the job execution message transmitted to the coater module control device 107 includes a recipe number to be executed by the coater unit controllers 114a, 114b, and 114c.

The subsystem control device 104 analyzes the job execution message and generates a predetermined job control signal to execute the job in the conveyor system, the transfer robot, the coater unit, and the like.

Referring to the control operation of the coater module control unit 107 and the development module control unit 113 of the subsystem control unit 104 is as follows.

The control in the coater module control device 107 and the developing module control device 113 are performed in the same manner independently of each other. Hereinafter, the control operation of the coater module control device will be described.

The control in the coater module controller 107 is performed in the unit of the coater unit controllers 114a, 114b, and 114c, and the coater unit controllers 114a, 114b, and 114c are connected to the coater units 131a, 131b, and 131c, respectively. To control. At this time, the host system controller 103 permits the coater unit controllers 114a, 114b, and 114c to sequentially control in a round robin manner or the like. Hereinafter, a case where control is allowed to the coater unit controller 114a from the upper system controller 103 will be described.

The host system controller 103 transmits the job execution message to the injection job controller 121 via the communication unit 115. The injection job control unit 121 controls the coater unit 131a to perform a coating job corresponding to the job execution message. First, the job execution data analysis unit 122 analyzes a job execution message and generates injection job data about a job recipe to be executed in the coater unit 131a and a recipe file in which the job recipe is stored. The injection control signal generation unit 123 reads the process execution routine and the response from the memory 109 to generate a predetermined operation control signal so that the operation corresponding to the response can be performed in the coater unit 131a. This job control signal includes a nozzle moving drive unit, a nozzle injection driving unit, a drive signal of a rotating drive motor of the wafer, and the like.

The nozzle moving driver and the nozzle injection driver drive the nozzles according to the injection job control signal generated by the injection control signal generation unit 123, respectively, so that the injection of the wafer processing material from the coater unit 131a is performed.

While the coater unit controller 114a controls the coater unit 131a, the other coater unit controllers 114b and 114c cannot control the coater units 131b and 131c connected thereto.

On the other hand, in each coater unit and the developing unit, anti-coagulation spraying is performed to prevent solidification of the wafer processing material at the nozzle. Anti-coagulation spray refers to spraying the wafer processing material remaining in the nozzle toward the outer region of the wafer. Such anti-coagulation spraying is performed under the control of the coater unit control unit and the developing unit control unit, respectively.

When the operating power is applied to the wafer processing apparatus, the initial data of the anti-coagulation injection is read from the auxiliary memory of the host computer 101 and stored in the memories of the coater module controller 107 and the developer module controller 113, respectively. The initial data of the anti-coagulant injection includes pre-dispense data, after-dispense data and auto-dispense data. Pre-solidification prevention and after-dispense refer to a certain period before and after the injection operation toward the wafer put into the processing operation, respectively, and automatic coagulation prevention injection at regular intervals during the idle period of the injection operation toward the wafer. It is what happens continuously. The control of the anti-coagulation injection is performed in the same manner in the coater module control device 107 and the development module control device 113. Hereinafter, the control operation of the anti-coagulation spraying in the coater module control device 107 will be described.

The injection control signal generation unit 123 reads initial data of the anti-solidification spray stored in the memory 109 and generates a predetermined anti-solidification control signal so that a corresponding anti-solidification spray is made in the coater unit 131a. At this time, the injection control signal generation unit 123 checks whether the pre-solidification prevention or post-solidification prevention injection is performed, and generates a job control signal of the coater unit to execute the injection of the wafer processing material toward the wafer.

However, according to the control apparatus of the wafer processing apparatus having such a configuration, the coater unit and the developing unit are controlled one-to-one by any one of the coater module controller and the development module controller, and the nozzles belonging to the same unit are determined wafers. It is controlled to spray only processed materials, so it can't be transferred between coater unit put into coating process and developing unit put into developing process and nozzles belonging to the same process. There was a problem that can not.

In addition, only one of the units put in the same process at a specific time can be sprayed, so it is not possible to execute spraying on all units at the same time in real time. There are a number of units in the unit, which causes a problem that the nozzle's anti-coagulation mechanism is complicated.

Accordingly, an object of the present invention is to provide a control apparatus and a control method of a wafer processing apparatus capable of rearranging nozzles for injecting a wafer processing material in accordance with a wafer processing target operation.

Another object of the present invention is to provide a control apparatus and a control method of a wafer processing apparatus capable of simultaneously injecting a wafer processing material between nozzles in real time.

It is still another object of the present invention to provide a control apparatus for a wafer processing apparatus and a method for controlling the same, which can effectively prevent solidification of the wafer processing material in the nozzle.

1 is a schematic block diagram of a control device of a wafer processing apparatus according to an embodiment of the present invention;

2 is a block diagram of the coater / developing module control device shown in FIG.

3 is a flowchart showing a control operation in a coater / development module control device of the control device of the wafer processing apparatus according to the embodiment of the present invention;

4 is a schematic configuration diagram of a control apparatus of a conventional wafer processing apparatus;

5 is a schematic block diagram of a conventional coater module control apparatus;

FIG. 6 is a block diagram of a coater unit controller shown in FIG. 5;

7 is a schematic configuration diagram of a chamber containing a coater unit and a wafer suction chuck.

Explanation of symbols on the main parts of the drawings

1, 101: host computer 3, 103: upper system control device

4, 104: Sub-system control device 5, 105: Wafer transfer control device

7: Coater / developing module control device 9, 109: exposure control device

11, 111: Baker module control device 13, 109: Memory

17: nozzle data generation unit 19, 115: communication unit

21, 121: injection operation control unit 22, 123: injection operation signal generation unit

23: message delivery unit 25, 122: job execution data analysis unit

31a, 31b, 31c, 131a, 131b, 131c: coater unit

32a, 32b, 32c: Developing unit 107: Coater module control device

114a, 114b, 114c: coater unit controller

135a, 135b, 135c: nozzle

The object of the present invention is a control apparatus for a wafer processing apparatus having at least two nozzle units capable of injecting a predetermined wafer processing material toward a wafer, according to the present invention, wherein the nozzle units are arranged in accordance with a predetermined wafer processing target operation. A nozzle grouping unit for generating nozzle group data by grouping at least two nozzle groups; An injection data generation unit for generating injection operation data of the nozzle units based on the nozzle group data and the wafer processing target operation; And a spraying operation execution unit for spraying the wafer processing material in each nozzle unit independently of the nozzle groups based on the spraying operation data.

Here, the nozzle grouping unit may be configured to group the nozzle units into at least one coater nozzle group performing a coating process and at least one developing nozzle group performing a developing process, thereby enabling the wafer to efficiently use a factory value.

At this time, the nozzle units belonging to the nozzle group performing the same process are again grouped into a plurality of nozzle groups according to the wafer processing material, and the nozzle units spraying the same wafer processing material are again sprayed with the wafer processing material. By grouping according to position, the efficiency of wafer processing can be increased.

The nozzle grouping unit may group the nozzle units into at least two nozzle groups according to the wafer processing material, and group the nozzle units that inject the same wafer processing material into positions on the target wafer to which the wafer processing material is to be injected. Can be configured to

And, the injection data generation unit generates the anti-solidification injection data so that the anti-solidification injection can be made periodically in each nozzle unit from the time of applying the operating power to the wafer processing device until it is blocked; The jetting operation execution unit can be configured to execute the solidification prevention spraying in each nozzle unit based on the solidification prevention spraying data, thereby effectively preventing solidification of the wafer processing material in the nozzle.

On the other hand, the above object is, according to another field of the present invention, in the method of controlling a wafer processing apparatus having at least two nozzle units capable of injecting a predetermined wafer processing material toward the wafer, wherein the nozzle units are predetermined wafers A nozzle grouping step of generating nozzle group data by grouping into at least two nozzle groups according to a machining target operation; An injection data generation step of generating injection operation data of the nozzle units based on the nozzle group data and the wafer processing target operation; And a spraying operation executing step of executing the spraying of the wafer processing material in each nozzle unit independently of the nozzle groups based on the spraying operation data.

Here, in the nozzle grouping step, the wafer may be efficiently used by grouping the nozzle units into at least one coater nozzle group performing a coating process and at least one developing nozzle group performing a developing process.

At this time, the nozzle grouping step, the nozzle unit belonging to the nozzle group performing the same process grouped into a plurality of nozzle groups according to the wafer processing material, the same wafer processing according to the position on the target wafer to spray the wafer processing material It is possible to increase the efficiency of the wafer processing operation by configuring to group the nozzle units for spraying the material.

The nozzle grouping may include grouping the nozzle units into at least two nozzle groups according to the wafer processing materials, and grouping the nozzle units that spray the same wafer processing materials according to positions on the target wafer to which the wafer processing materials are to be injected. Can be configured to

The spraying data generating step may include: solidifying prevention spraying data so that solidification preventing spraying may be performed at each nozzle unit periodically from the time of applying the operating power to the wafer processing apparatus until the wafer is shut off; In the spraying operation execution step, it is possible to effectively prevent the solidification of the wafer processing material in the nozzle by configuring to prevent the solidification spraying in each nozzle unit based on the solidification prevention spraying data.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic block diagram of a control apparatus of a wafer processing apparatus according to an embodiment of the present invention, and FIG. 2 is a block diagram of a coater / developing module control device shown in FIG.

As shown in FIG. 1, the control apparatus of the wafer processing apparatus according to the embodiment of the present invention includes a host computer 1, an upper system control device 3 connected to the host computer 1, and an upper system control. Sub-system controller 4 connected in parallel to the apparatus 3, i.e., wafer transfer controller 5, coater / development module controller 7, exposure controller 9 and baker module controller 11 Have

The host computer 1 has an auxiliary memory (not shown) that stores initial data such as process execution routines and responsiveness of the subsystem control apparatus 4. Each recipe is identified by a predetermined recipe number, and the operator can change the contents of the recipe through a predetermined input device.

The subsystem control apparatus 4 has a memory (not shown) which can store initial data from the auxiliary memory of the host computer 1, respectively.

The construction of the coater / development module control device 7 in the subsystem control device 4 is as follows.

As shown in Fig. 2, the coater / development module control device 7 includes a memory 13 for storing the execution routines of the coating process and the developing process, the coater units 31a, 31b, and 31c and the developing unit ( It has a spray job control unit 15 connected to 32a, 32b, and 32c, and a nozzle data generation unit 17 connected to a memory 13 and spray job control unit 15. The memory 13, the nozzle data generation unit 17, and the injection job control unit 15 are connected to the host system control device 3 via the communication unit 19.

Further, the injection job control unit 21 is the injection control signal generation unit 22 connected to the coater units 31a, 31b, 31c ..., the developing units 32a, 32b, 32c ..., and the memory 13; And a message transfer unit 23 connected to the communication unit 19 and a job execution data analysis unit 25 connected to the memory 13 and the message transfer unit 23.

The operation of the controller of the wafer processing apparatus having such a configuration will be described below. 3 is a flowchart showing a control operation of the coater / development module control device in the control device of the wafer processing apparatus according to the embodiment of the present invention.

When operating power is applied to the wafer processing apparatus (S10), initial data stored in the auxiliary memory of the host computer 1 is read out and loaded into each memory of the subsystem control apparatus 4 (S20). In particular, the memory 13 of the coater / development module control device 7 reads out and stores the respite from the auxiliary memory of the host computer 1.

In addition, when operating power is applied to the wafer processing apparatus (S10), the nozzle data generation unit 17 generates nozzle group data by grouping the nozzles into a plurality of nozzle group units having a unique identifier (S30). The unit data and the identifier data are transmitted to the host computer 1 via the communication unit 19 and the host system control device 3 and stored in the memory 13. At this time, the grouping in the nozzle data generation unit 17 is made based on the machining process, the wafer processing material, and the position of the nozzle on the wafer. The nozzle grouping method will be described in detail as follows.

First, when there is one target wafer, the nozzles are grouped into the coater unit # 1 and the developing unit # 1 according to the machining process, and when the number of nozzles belonging to the coater unit # 1 is plural, the group is divided into the photosensitive nozzle group and the primer nozzle group. When the number of nozzles belonging to the photosensitive nozzle group is plural, the group may be grouped into the (X1, Y1) position nozzles and the (X2, Y2) position nozzles. Here, (X1, Y1) and (X2, Y2) represent positions on the wafer when mapping the position of the wafer to the XY coordinate surface.

In the case of a large number of wafers, nozzles are coated with the same number of coaters as the wafers, such as the wafer # 1 coater unit, the wafer # 2 coater unit, the wafer # 1 developer unit, and the wafer # 2 developer unit, depending on the machining process. The unit and the developing unit can be grouped, and again, the coater unit for wafer # 1 can be grouped as described in the case where there is one target wafer.

Further, the nozzle data generation unit 17 generates nozzle state and nozzle state data indicating the state of nozzles belonging to each nozzle group, that is, whether normal operation is possible (S30), and the communication unit 19 and the upper system control device 3. The data is transferred to the host computer 1 through the computer and stored in the memory 13.

When the wafer processing target job is input through a predetermined input device (S40), the wafer processing target job is converted into a work command code for each work line by the host computer 1 which manages the entire semiconductor work line as a whole. Is sent to (3).

The upper system control device 3 prepares a work plan for each work line according to the work command code, and generates a work execution message and transmits the work execution message to the lower system control device 4 (S50). At this time, the job execution message delivered to the coater / development module control device 7 includes an identifier of a work target nozzle group and a respite number for each nozzle group.

The subsystem control device 4 generates predetermined job data and job control signals for executing the job in the conveyor system, the transfer robot, the coater unit and the like based on the job execution message.

The process of generating job data and job control signals in the coater / development module control device 7 in the subsystem control device 4 will now be described.

The job execution message generated by the host system controller 4 is transmitted to the message transfer unit 23 through the communication unit 19. The message transfer unit 23 temporarily stores the job execution message and transmits the job execution data to the job execution data analysis unit 25 at a time.

The job execution data analysis unit 25 analyzes each job execution message and generates injection job data about a job target nozzle group, a job recipe for each nozzle group, and a recipe file in which the job recipe is stored (S60). At this time, the generation of the injection operation data is made in the unit of the nozzle group, it is made of a multi-tasking method (Multi-Tasking Method) by the time sharing method (Time Sharing Method). In addition, it is preferable to adopt a mutual exclusion method in which access to the memory 13 is sequentially performed for each nozzle group when generating the injection work data. In the memory 13, a memory area is allocated to store rep files for each nozzle group, and an access pointer for each nozzle group is set.

The injection control signal generation unit 22 reads the execution routine and the response from the memory 13, and the injection operation according to the injection job data generated by the job execution data analysis unit 25 can occur in each nozzle group. Generate a spraying operation control signal (S70). The generation of the injection job control signal in the injection control signal generation unit 22 is performed in a multi-tasking method for each nozzle group as in the job execution data analysis unit 25, and the memory 13 ) Is also subject to mutual exclusion.

The nozzle movement driving unit and the nozzle injection driving unit respectively drive the nozzles in accordance with the injection operation control signals generated by the injection control signal generation unit 22, so that the coater units 31a, 31b, 31c ... and the developing units 32a, 32b, 32c ...), the injection of the wafer processing material is performed (S90).

Since the generation of the injection job data in the job execution data analysis unit 25 and the generation of the injection job control signal in the injection control signal generation unit 22 are independently performed between the nozzle groups, the nozzle data generation unit 17 According to the selection of grouping criteria, it is possible to adjust the level of nozzles that can be sprayed independently from the nozzle group hierarchy performing the same processing to the nozzle group hierarchy spraying the same wafer processing material. The nozzles may generate a spraying operation control signal so that the spraying operations are sequentially performed as in the prior art.

The communication unit 19 performs a signal interface function and the like in the signal transmission between the upper system control device 3 and the memory 13 and between the upper system control device 3 and the injection job control unit 15.

On the other hand, the control process of the anti-solidification injection in the control apparatus of the wafer processing apparatus according to an embodiment of the present invention will be described.

When operating power is applied to the wafer processing apparatus, the initial data of the anti-coagulation spray is read from the auxiliary memory of the host computer 1 and loaded into the memory 13 of the coater / development module control device 7. The initial data of the anti-coagulation spray is set so that the anti-coagulation spray occurs periodically at each nozzle regardless of whether or not the machining process is started from when the operating power is applied to the wafer processing apparatus until it is shut off. Here, the period of anti-coagulation spraying is preferably set in proportion to the use time and the frequency of use of the nozzle.

The injection control signal generation unit 22 reads initial data of the anti-solidification spray stored in the memory 13 and generates a predetermined anti-solidification spray control signal so that the corresponding anti-solidification spray can be executed in each nozzle (S80). . On the other hand, after the machining process is started, the injection control signal generation unit 22 checks the timing of the anti-solidification injection to generate the injection operation control signal so that the injection of the wafer processing material toward the wafer and the anti-solidification injection do not occur at the same time. desirable.

As described above, according to the present invention, since the nozzles introduced into the coating process and the developing process are arbitrarily selected and grouped into a predetermined nozzle group, the spraying operation data and the spraying operation control signal are independently generated between each nozzle group. By repositioning the nozzles according to the processing target work, that is, between nozzles put into the coating process and nozzles put into the developing process and, of course, nozzles put into the same process, the wafer can not only efficiently use the factory value but also simultaneously in real time between the nozzles. The wafer processing material can be sprayed to increase the efficiency of the wafer processing operation.

In addition, according to the present invention, since solidification prevention spraying is performed at each nozzle periodically from the time of supplying the operating power to the wafer processing apparatus until it is blocked, the solidification of the wafer processing material at each nozzle is effectively prevented in a simple manner. can do.

Claims (14)

A control apparatus of a wafer processing apparatus having at least two nozzle units capable of injecting a predetermined wafer processing material toward a wafer, A nozzle grouping unit for generating nozzle group data by grouping the nozzle units into at least two nozzle groups according to a predetermined wafer processing target operation; An injection data generation unit for generating injection operation data of the nozzle units based on the nozzle group data and the wafer processing target operation; And a spraying operation executing unit for executing the spraying of the wafer processing material in each nozzle unit independently of the nozzle groups based on the spraying operation data. The method of claim 1, And the nozzle grouping unit groups the nozzle units into at least one coater nozzle group performing a coating process and at least one developing nozzle group performing a developing process. The method of claim 2, And the nozzle grouping unit groups the nozzle units belonging to the nozzle group performing the same process into a plurality of nozzle groups according to the wafer processing material. The method of claim 3, wherein And the nozzle grouping unit groups the nozzle units for spraying the same wafer processing material according to the position on the target wafer to which the wafer processing material is to be sprayed. The method of claim 1, And the nozzle grouping unit groups the nozzle units into at least two nozzle groups according to a wafer processing material. The method of claim 5, And the nozzle grouping unit groups the nozzle units for spraying the same wafer processing material according to the position on the target wafer to which the wafer processing material is to be sprayed. The method of claim 1, The injection data generation unit generates solidification prevention injection data so that anti-solidification injection can be performed at each nozzle unit periodically from the time of applying the operating power to the wafer processing apparatus until the operation is cut off; And the spray operation execution unit executes the solidification prevention spraying in each nozzle unit based on the solidification prevention spraying data. A control method of a wafer processing apparatus having at least two nozzle units capable of injecting a predetermined wafer processing material toward a wafer, A nozzle grouping step of generating nozzle group data by grouping the nozzle units into at least two nozzle groups according to a predetermined wafer processing target operation; An injection data generation step of generating injection operation data of the nozzle units based on the nozzle group data and the wafer processing target operation; And a spraying operation executing step of executing the spraying of the wafer processing material in each nozzle unit independently of the nozzle groups based on the spraying operation data. The method of claim 8, The nozzle grouping step includes controlling the nozzle units into at least one coater nozzle group performing a coating process and at least one developing nozzle group performing a developing process. The method of claim 9, The nozzle grouping step, the control method of the wafer processing apparatus, characterized in that the nozzle units belonging to the nozzle group performing the same process grouped into a plurality of nozzle groups according to the wafer processing material. The method of claim 10, The nozzle grouping step, the control method of the wafer processing apparatus, characterized in that for grouping the nozzle units for injecting the same wafer processing material in accordance with the position on the target wafer to be sprayed. The method of claim 8, The nozzle grouping step, the method of controlling the wafer processing apparatus, characterized in that for grouping the nozzle units into at least two nozzle groups according to the wafer processing material. The method of claim 12, The nozzle grouping step, the control method of the wafer processing apparatus, characterized in that for grouping the nozzle units for injecting the same wafer processing material in accordance with the position on the target wafer to be sprayed. The method of claim 8, The jetting data generating step may include: generating anti-solidification injection data so that anti-solidification injection can be performed at each nozzle unit periodically from the time of applying the operating power to the wafer processing apparatus until it is shut off; And the spraying operation executing step is to perform solidification prevention spraying in each nozzle unit on the basis of the solidification prevention spraying data.