KR20000030340A - Phenolic foam and architectural panel using the same - Google Patents

Phenolic foam and architectural panel using the same Download PDF

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KR20000030340A
KR20000030340A KR1020000008789A KR20000008789A KR20000030340A KR 20000030340 A KR20000030340 A KR 20000030340A KR 1020000008789 A KR1020000008789 A KR 1020000008789A KR 20000008789 A KR20000008789 A KR 20000008789A KR 20000030340 A KR20000030340 A KR 20000030340A
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foam
phenol
phenolic
units
formalin
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KR1020000008789A
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KR100334039B1 (en
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송수호
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송수해
동신중공업 주식회사
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0061Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/02Condensation polymers of aldehydes or ketones with phenols only of ketones
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2361/00Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
    • C08J2361/04Condensation polymers of aldehydes or ketones with phenols only
    • C08J2361/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Building Environments (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: A phenolic foam as raw material of heat insulating material for construction which is excellent in heat resistance, fire retardancy, chemical resistance and sound proof property, and a panel for construction using the same are provided. CONSTITUTION: The phenolic foam is obtained from a method characterized in that 100 unit of phenolic resin is used which is produced by synthesis of formalin and at least one selected from the group consisting of a combination of methylol phenol, dimethylol phenol, trimethylol phenol, etc. produced by synthesis of phenol and formalin, cresol for conditioning, and bispheonls; 5 - 40 unit of a phosphoric plasticizer is combined for giving plasticity to the foam at the time of foam forming; 0.5 - 5 unit of a cell regulator is combined, consisting of siloxanes (H<SB POS="POST">2</SB>SiO- (H<SB POS="POST">2</SB>SiO)<SB POS="POST">n</SB> -SiH<SB POS="POST">3</SB>) for controlling cell distribution and size of the foam; and 3 - 20 unit of a blowing agent such as CFCs, HFCs or HCFCs is combined, which has foaming effect.

Description

페놀폼과 그것을 이용한 건축용 패널{PHENOLIC FOAM AND ARCHITECTURAL PANEL USING THE SAME}Phenolic foam and building panel using the same {PHENOLIC FOAM AND ARCHITECTURAL PANEL USING THE SAME}

본 발명은 페놀폼과 그것을 이용한 건축용 패널에 관한 것으로, 보다 상세하게는 화열 및 화학적으로 안정된 성질을 갖는 페놀 레진(Phenolic Resin)을 발포시킨 열경화성 플라스틱 폼(Foam)으로 난연성 및 내열성, 저발연성이 우수한 페놀폼과 그 페놀폼을 중간단열재로 제공하며 그 상면과 하면에 액상의 접착제를 분사하여 접합시킴으로 폼의 경도가 증가됨과 동시에 부식성을 해소시킨 건축용 패널에 관한 것이다.The present invention relates to a phenol foam and a building panel using the same. More specifically, it is a thermosetting plastic foam (Foam) foamed with phenolic resin having thermal and chemically stable properties, and has excellent flame resistance, heat resistance, and low smoke resistance. It provides phenolic foam and its phenolic foam as intermediate insulation material, and it is related with building panels that increase the hardness of foam and solve corrosiveness by spraying liquid adhesive on the upper and lower surfaces.

주지된 바와 같이, 최초에 제조된 페놀 레진(Phenolic Resin)은 1910년 미국의 L. H. BAEKELAND가 페놀과 포름알데이드(Formaldehyde)를 주원료로 하여 제조하였다.As is well known, the first phenolic resin (Phenolic Resin) was produced in 1910 by L. H. BAEKELAND, USA, based on phenol and formaldehyde.

이하, 레졸 타입의 액상수지를 이용한 페놀폼의 제조방법에 대해 간략하게 기술한다.Hereinafter, the manufacturing method of the phenol foam using the resol type liquid resin is briefly described.

레졸타입을 경화하는 방법에는 크게 가열에 의해서 경화하는 방법과, 산(Acid)에 의해 경화하는 방법으로 구분되는 바, 페놀폼의 경우에는 일반적으로 후자의 방법이 이용되고 있다.The method of curing the resol type is largely divided into a method of curing by heating and a method of curing by acid, and in the case of phenol foam, the latter method is generally used.

즉, 페놀 레진(Phenolic resol)에 다량의 강산을 첨가하여 교반하게 되면 열이 발생되면서 급속한 경화반응이 일어나게 되어 결국에는 불용 불융의 경화수지가 된다.In other words, when a large amount of strong acid is added to the phenol resin (Phenolic resol) and stirred, heat is generated and a rapid curing reaction occurs, resulting in an insoluble insoluble curing resin.

상기한 원리를 이용하여 레졸 타입으로부터 페놀폼을 제조하게 되는 데, 액상수지의 발포제로써 저비점 용제와 유연성을 부여하기 위한 가소제, 기포를 안정화하기 위한 계면활성제 등을 투입한다.The phenolic foam is prepared from the resol type using the above-mentioned principle. As a foaming agent of the liquid resin, a low boiling point solvent, a plasticizer for imparting flexibility, a surfactant for stabilizing bubbles, and the like are added.

상기 원료가 혼합된 수지에 일정량의 강산 경화제를 첨가 혼합하여 이때 발생되는 발열반응에 의한 열에 의해 용제를 기화시키고 경화반응에 의해 기체상태의 발포제가 셀(Cell) 내부에 존재하게 됨으로 페놀폼이 제작된다.Phenolic foam is prepared by adding and mixing a certain amount of strong acid hardener to the resin in which the raw materials are mixed, and vaporizing the solvent by heat generated by the exothermic reaction generated at this time, and the gaseous blowing agent is present in the cell by the curing reaction. do.

상기 페놀폼(Phenolic foam)의 일반적인 배합의 예는 다음과 같다.Examples of general formulation of the phenolic foam (Phenolic foam) is as follows.

Phenolic resin : 100Phenolic resin: 100

Freon-113 : 15Freon-113: 15

Emulsifier : 6Emulsifier: 6

PTSA(60% 수용액) : 6PTSA (60% aqueous solution): 6

상기 배합물을 혼합하여 소망하는 틀에 주입하게 되면 발열작용에 의해 단시간에 발포 경화되어 폼(Foam)이 얻어지게 된다. 상기한 방법으로 제조된 레졸폼은 발포조작이 용이한 반면, 경화제로써 강산을 사용하기 때문에 Cell 내부중에 산(Acid)이 잔존하게 되고 그로인해 상기 페놀폼에 부착되거나 인접된 금속을 부식시킨다는 단점이 있다.When the compound is mixed and injected into a desired mold, foam is cured in a short time by exothermic action to obtain a foam. While the resol foam prepared by the above method is easy to foam, the strong acid is used as a hardening agent, so that acid remains in the cell, thereby causing corrosion of the metal attached to or adjacent to the phenol foam. have.

특히, 상기 페놀폼(Phenolic Foam)이 건축용 패널의 중간 단열재로 사용되는 경우에는 그 페놀폼에 잔존하는 산(Acid)에 의한 패널의 외부판을 부식시키게 되므로 중간 단열재로의 사용이 매우 곤란하게 된다.In particular, when the phenolic foam (Phenolic Foam) is used as the intermediate insulation of the building panel is corroded to the outer plate of the panel by the acid (Acid) remaining in the phenolic foam is very difficult to use as an intermediate insulation. .

또한, 그 내부에 다수의 셀(Cell)이 존재하는 일반적인 페놀폼(Phenolic Foam)의 경우에는 건축용 단열재로 사용하기에는 그 표면의 부착력이 매우 떨어지게 되고, 경도가 낮으므로 접착력이 떨어지게 된다는 문제가 있다.In addition, in the case of a general phenol foam (Phenolic Foam) having a plurality of cells (Cell) therein, there is a problem that the adhesion of the surface is very low, the hardness is low, so that the adhesive strength is lowered for use as a building insulation.

본 발명은 상기한 종래 기술의 사정을 감안하여 이루어진 것으로, 강판의 양 내측벽에 액상의 접착제를 분사하고 그 내부에 일정 비율의 페놀 레진 및, 정포제, 가소제, 발포제, 경화제를 배합하여 교반시킴으로써 내열성, 난연성, 내약품성, 방음성이 우수해진 페놀폼을 발포시킨 건축용 패널을 제공함에 그 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made in view of the above-described state of the art, by injecting a liquid adhesive onto both inner walls of a steel sheet, and mixing and stirring a fixed ratio of a phenol resin, a foam stabilizer, a plasticizer, a foaming agent, and a curing agent therein. It is an object of the present invention to provide a building panel foamed with phenolic foam having excellent heat resistance, flame retardancy, chemical resistance, and sound insulation.

도 1a는 본 발명의 일실시예에 따른 페놀폼과 기타 폼에 대한 일산화탄소 발생량을 나타내는 그래프이다.Figure 1a is a graph showing the carbon monoxide generation amount for phenol foam and other foam according to an embodiment of the present invention.

도 1b는 본 발명의 일실시예에 따른 페놀폼과 기타 폼에 대한 시안화가스 발생량을 나타내는 그래프이다.Figure 1b is a graph showing the amount of cyanide generated for phenolic foam and other foams according to an embodiment of the present invention.

도 1c는 본 발명의 일실시예에 따른 페놀폼과 기타 폼에 대한 발연량의 경시적인 변화를 도시한 그래프이다.Figure 1c is a graph showing the change over time of the amount of smoke for phenolic foam and other foams according to an embodiment of the present invention.

도 2는 본 발명의 일실시예에 따른 페놀폼과 기타 폼에 대한 열전도율 비교 그래프이다.2 is a thermal conductivity comparison graph for phenol foams and other foams according to an embodiment of the present invention.

도 3은 페놀폼과 기타 폼의 치수안정성 비교 그래프이다.3 is a graph comparing the dimensional stability of phenol foams and other foams.

도 4는 본 발명의 실시예에 따른 페놀폼을 이용한 건축용 패널을 나타내는 사시도이다.4 is a perspective view showing a building panel using a phenol foam according to an embodiment of the present invention.

*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

PTSA;파라-톨루엔술파민산 XSA;크실렌술파민산PTSA; para-toluenesulfonic acid XSA; xylenesulfamic acid

PSA;페놀술파민산 PUR;폴리우레탄폼PSA; Phenolic sulfamic acid PUR; Polyurethane foam

PIR;폴리이소시아뉴레이트폼 PS;폴리스티렌폼PIR; Polyisocyanate Foam PS; Polystyrene Foam

2:페놀폼 4:상판2: phenolic foam 4: top plate

6:하판6: bottom plate

상기한 목적을 달성하기 위해, 본 발명의 바람직한 실시예에 따르면 페놀(Phenol)과 포르말린(Formalin)의 합성에 의해 생성된 메티올 페놀(Methyol Phenol), 디메티올 페놀(Dimethyol Phenol), 트리메티올 페놀(Trimethyol Phenol)의 조합으로 이루어진 레진, 또는 변성을 위한 크레졸(Cresol), 또는 비스페놀(Bisphenol)류중 적어도 하나이상과 포르말린의 합성으로 생성된 페놀 레진 100단위와; 상기 페놀 레진 100단위에 폼(Foam) 생성시 폼에 유연성을 부여하기 위한 가소제가 5∼40단위 배합되며; 상기 페놀 레진과 반응하여 페놀 폼을 경화시키기 위하여 황산(H2SO4)계 산화합물로 이루어진 5∼40단위의 경화제가 배합되고; 폼의 셀(Cell) 분포 및 크기 등을 조절하기 위하여 실록산(Siloxane; H2SiO-(H2SiO)n-SiH3)계로 이루어진 정포제가 0.5∼5단위 배합되고; 소정의 발포효과를 갖는 발포제가 3∼20단위 배합되어 구성된 것을 특징으로 하는 페놀폼이 제공된다.In order to achieve the above object, according to a preferred embodiment of the present invention, methol phenol (Methyol Phenol), dimethyol phenol (Dimethyol Phenol), trimethy produced by the synthesis of phenol (Phenol) and formalin (Formalin) 100 units of a phenol resin produced by synthesizing formalin with at least one of a resin consisting of a combination of Trimethyol Phenol, or Cresol or Bisphenol for denaturation; 5 to 40 units of plasticizer for imparting flexibility to the foam when foam is generated in 100 units of the phenol resin; 5 to 40 units of a curing agent composed of sulfuric acid (H 2 SO 4 ) -based acid compounds are mixed to react with the phenol resin to cure the phenol foam; In order to control the cell distribution and the size of the foam, a foaming agent made of a siloxane (Siloxane; H 2 SiO- (H 2 SiO) n-SiH 3 ) system is blended in 0.5 to 5 units; There is provided a phenol foam characterized by blending 3 to 20 units of a blowing agent having a predetermined foaming effect.

또한, 본 발명의 바람직한 다른 실시예에 따르면, 페놀(Phenol)과 포르말린(Formalin)의 합성에 의해 생성된 메티올 페놀(Methyol Phenol), 디메티올 페놀(Dimethyol Phenol), 트리메티올 페놀(Trimethyol Phenol)등의 조합 및, 변성을 위한 크레졸(Cresol), 비스페놀(Bisphenol)류와 포르말린과의 합성으로 생성된 페놀 레진과, 가소제와, 경화제와 정포제, 발포제가 배합 교반 발포된 페놀폼을 이용함에 있어서, 상기 페놀폼의 상부와 하부에 패널용 강판이 제공되며, 그 강판의 상/하 접착면에 우레탄 접착제를 분사시켜 상기 페놀폼과 강판을 접착시키과 동시에 상기 페놀폼이 직접 상기 강판과 접촉하는 것을 방지하도록 한 것을 특징으로 하는 페놀폼을 이용한 건축용 패널이 제공된다.Further, according to another preferred embodiment of the present invention, methol phenol (Methyol Phenol), dimethyol phenol (Dimethyol Phenol), trimetholol (Trimethyol) produced by the synthesis of phenol (Phenol) and formalin (Formalin) Phenol), a mixture of phenols, bisphenols and formalin, and a plasticizer, a curing agent, a foaming agent, and a foaming agent. In the upper and lower parts of the phenolic foam panel is provided, the urethane adhesive is sprayed on the upper and lower adhesive surface of the steel sheet to adhere the phenolic foam and the steel sheet and at the same time the phenolic foam is in direct contact with the steel sheet There is provided a building panel using a phenol foam, characterized in that to prevent.

바람직하게, 상기 페놀 레진과 반응하여 페놀 폼을 경화시키기 위하여 황산(H2SO4)계 산화합물로 이루어진 경화제가 5∼40단위 더 포함된다.Preferably, 5 to 40 units of a curing agent made of sulfuric acid (H 2 SO 4 ) -based acid compound is further included to react with the phenol resin to cure the phenol foam.

실시예Example

이하, 본 발명에 대한 페놀폼(Phenolic Foam)에 대한 성분 및 그 배합비를 상세하게 설명한다.Hereinafter, the components of the phenol foam (Phenolic Foam) and the blending ratio of the present invention will be described in detail.

-배합비(MIXING RATIO)-MIXING RATIO

1. 페놀 레진(Phenolic Resin) : 1001.Phenolic Resin: 100

-이하, 페놀 레진 100에 대한Hereinafter for phenol resin 100

2. 정포제(실리콘;Silicon) : 0.5∼52. Foaming agent (silicon): 0.5 to 5

3. 가소제 : 1∼403. Plasticizer: 1 ~ 40

4. 발포제(Blowing Agent) : 3∼204. Blowing Agent: 3 ~ 20

5. 경화제 : 5∼405. Curing agent: 5 ~ 40

이하, 상기한 페놀폼의 배합비에 대한 성분을 보다 상세하게 설명한다.Hereinafter, the component with respect to the compounding ratio of the said phenol foam is demonstrated in detail.

먼저, 상기 페놀 레진은 페놀(Phenol)과 포르말린(Formalin)의 합성에 의해 생성된 메티올 페놀(Methyol Phenol), 디메티올 페놀(Dimethyol Phenol), 트리메티올 페놀(Trimethyol Phenol) 레진과, 변성을 위한 크레졸(Cresol), 비스페놀(Bisphenol)류중 적어도 하나이상과, 포르말린과의 합성 생성물이다.First, the phenol resin is modified with methol phenol (Methyol Phenol), dimetholol phenol (Dimethyol Phenol), trimethyol phenol (Trimethyol Phenol) resin produced by the synthesis of phenol (Phenol) and formalin (Formalin) It is a synthetic product of at least one of cresol, bisphenols, and formalin.

한편, 상기 가소제는 폼(Foam) 생성시 폼에 유연성을 부여하기 위한 첨가제로 TCPP, TDCPP, TCEP 등 인(P)계열의 가소제가 사용되며, 그 비율은 상기 페놀 레진이 100단위일 경우에 1∼40단위의 가소제가 배합된다.On the other hand, the plasticizer is a plasticizer of the phosphorus (P) series such as TCPP, TDCPP, TCEP is used as an additive to give flexibility to the foam during foam generation, the ratio is 1 when the phenol resin is 100 units A plasticizer of -40 units is blended.

또한, 상기 실리콘 정포제는 폼의 셀(Cell) 분포 및 셀(Cell)의 크기를 조절하기 위한 것으로, L-6900, L-5421, B-8408, B-8462 등의 실록산(Siloxane; H2SiO-(H2SiO)n-SiH3)계가 사용되며, 그 비율은 상기 페놀 레진이 100단위일 경우에 0.5∼5단위의 정포제가 배합되게 된다.In addition, the silicon foam stabilizer is to control the cell distribution and the size of the cell (Cell) of the foam, such as L-6900, L-5421, B-8408, B-8462 (Siloxane; H 2 A SiO- (H 2 SiO) n-SiH 3 ) system is used, and the proportion of the foaming agent is 0.5 to 5 units when the phenol resin is 100 units.

그리고, 상기 발포제는 CFC계의 CFC-11 또는 HCFC계의 HCFC-141b가 사용되거나 오존파괴 및 지구온난화에 따른 환경문제가 대두됨에 따라 그에 상응하는 발포효과를 갖는 HFC 또는 Pentane계의 대체 발포제가 사용된다. 배합비는 상기 페놀 레진이 100단위일 때 3∼20단위의 발포제가 배합된다.In addition, the foaming agent is a CFC-11 CFC-11 or HCFC-141b of HCFC-based or as an environmental problem due to ozone depletion and global warming, HFC or Pentane-based alternative blowing agent having a corresponding foaming effect is used do. When the compounding ratio is 100 units of the phenol resin, 3 to 20 units of blowing agent are blended.

상기 경화제는 페놀 레진과 반응하여 페놀 폼을 경화시키는 것으로, 파라-톨루엔 술파민산(P-TSA; Para-Toluene Sulfamic Acid), 크실렌 술파민산(X.S.A; Xylene Sulfamic Acid), 페놀 술파민산(P.S.A; Phenol Sulfamic Acid) 등의 황산계 산 화합물이 주로 사용되며, 배합되어 상기 페놀폼의 물성에 영향을 미치게 된다.The curing agent reacts with the phenol resin to cure the phenolic foam. Para-toluene sulfamic acid (P-TSA; Para-Toluene Sulfamic Acid), xylene sulfamic acid (XSA; Xylene Sulfamic Acid), phenol sulfamic acid (PSA; Phenol Sulfuric acid-based compounds such as sulfuric acid) are mainly used, and are compounded to affect the physical properties of the phenolic foam.

또한, 상기 경화제의 배합비는 폼의 용도에 따라 상기 페놀 레진이 100단위일 때 5∼40단위의 경화제가 배합된다.In addition, the mixing | blending ratio of the said hardening | curing agent mix | blends 5-40 units of hardening | curing agents when the said phenol resin is 100 units according to a use of foam.

본 발명은 상기한 원료의 구성에 국한되는 것이 아니며, 본 발명의 기술적 범위를 이탈하지 않는 범위내에서 다양한 첨가제, 예컨대 다른 성분의 발포제의 추가 및 변경 정도에 따른 다양한 실시예로의 변형까지 포함한다.The present invention is not limited to the configuration of the raw materials described above, and includes modifications to various embodiments according to the degree of addition and modification of various additives, such as other components, without departing from the technical scope of the present invention. .

이하, 상기한 구성에 의해 제조된 페놀폼의 특성을 각종 유사단열재와 비교한다.Hereinafter, the characteristic of the phenol foam manufactured by the said structure is compared with various pseudo insulating materials.

상기 페놀폼은 폴리 우레탄폼(PUR) 등 종래의 유기계 단열재보다 난연성, 저발연성 등에서 우수한 특성을 나타낸다. 지금까지 응용되었던 종래의 페놀폼은 경도가 약하며, 그 페놀폼과 밀착되는 금속을 부식시키며, 부착성이 떨어지므로 건축용으로 사용되기 어려운 특성이 있었으나, 상기 페놀폼은 그 문제점이 해결되었다.The phenolic foam exhibits superior properties in flame retardancy, low smokeability, and the like than conventional organic insulation such as polyurethane foam (PUR). Conventional phenolic foam that has been applied until now has a weak hardness, and the corrosion of the metal in close contact with the phenolic foam, the adhesion is difficult to use for construction, but the phenolic foam has solved the problem.

이하, 상기 페놀폼이 건축용 패널의 단열재로 적합한 이유에 대하여 설명한다.Hereinafter, the reason why the said phenol foam is suitable as a heat insulating material of a building panel is demonstrated.

일반적으로, 플라스틱 폼(Plastic Foam)의 연소시에 주로 발생되는 유독가스는 일산화탄소(CO)와 시안가스(CYAN GAS)이다.In general, toxic gases mainly generated during combustion of plastic foam are carbon monoxide (CO) and cyan gas (CYAN GAS).

도 1a는 본 발명의 일실시예에 따른 일산화탄소 발생량을 나타내는 그래프이며, 도 1b는 본 발명의 일실시예에 따른 시안가스발생량을 나타내는 그래프, 도 1c는 발연량의 경시적인 변화를 도시한 그래프이다.Figure 1a is a graph showing the amount of carbon monoxide generated according to an embodiment of the present invention, Figure 1b is a graph showing the amount of cyanide gas generated according to an embodiment of the present invention, Figure 1c is a graph showing the change over time of the amount of smoke. .

도 1a, 도 1b, 도 1c에 도시된 바와 같이, 본 발명에 따른 페놀폼은 난연성 및 내열성이 뛰어나다.As shown in Figure 1a, Figure 1b, Figure 1c, the phenolic foam according to the present invention is excellent in flame retardancy and heat resistance.

이를 참조하면, 도 1a의 X축은 실험경과시간을 나타내며, Y축은 일산화탄소의 발생량을 농도(ppm)로 나타내는 바, 시험시료는 폴리우레탄폼과 페놀폼이다.Referring to this, the X axis of Figure 1a represents the experimental elapsed time, the Y axis represents the generation amount of carbon monoxide in concentration (ppm), the test sample is a polyurethane foam and phenol foam.

상기 폴리우레탄폼은 연소시작후 약 6시간이 경과하게 되면 발생되는 일산화탄소의 농도가 600ppm이상이 되나 그에 반하여 상기 페놀폼의 경우에는 연소시작후 10시간 가량이 소요된 상태에서도 일산화탄소의 농도가 200ppm이하로 건축용으로 적합함을 알 수 있다.The polyurethane foam has a carbon monoxide concentration of 600 ppm or more when about 6 hours have elapsed after the start of combustion. On the other hand, in the case of the phenol foam, the concentration of carbon monoxide is 200 ppm or less even when 10 hours have been taken after the start of combustion. It can be seen that it is suitable for construction.

한편, 도 1b의 X축은 실험경과시간을 나타내며, Y축은 시안가스의 농도(ppm)를 나타내고, 시료는 폴리우레탄폼과 페놀폼이다.On the other hand, the X axis of Figure 1b represents the experimental elapsed time, the Y axis represents the concentration of cyan gas (ppm), the samples are polyurethane foam and phenol foam.

상기 폴리우레탄폼은 연소시작후 약 7시간이 경과하게 되면 인체에 치명적인 시안가스가 600ppm이상 발생되나 그에 반하여 상기 페놀폼의 경우에는 연소시작후 10시간 가량이 소요된 상태에서도 시안가스가 거의 검출되지 않으므로 건축용으로 적합함을 알 수 있다.When about 7 hours have elapsed after the start of combustion, the polyurethane foam generates more than 600 ppm of cyan gas, which is fatal to the human body. On the other hand, in the case of the phenol foam, the cyan gas is hardly detected even after 10 hours of combustion. Therefore, it can be seen that it is suitable for construction.

한편, 도 1c의 X축은 실험경과시간을 나타내며, Y축은 발연량을 나타낸다.On the other hand, the X axis of Figure 1c represents the experimental elapsed time, the Y axis represents the amount of smoke.

이를 참조하면, 스틸렌폼과 폴리 우레탄폼(PUR)의 경우에는 연소시작 후 채 1분이 경과되기 전에 80∼100단위(부피;시료량에 따라 변화)의 발연이 이루어지고, 상기 폴리이소시아뉴레이트의 경우에는 연소시작 후 약 1분가량이 경과되면 40단위정도의 발연이 이루어지며, 상기 페놀폼의 경우에는 연소시작 후 5분이상이 경과되어도 극히 미소한 발연상태를 나타내고 있다.Referring to this, in the case of styrene foam and polyurethane foam (PUR), a smoke of 80 to 100 units (volume; changes depending on the amount of sample) occurs less than 1 minute after the start of combustion, and in the case of the polyisocyanate In about 1 minute after the start of combustion, about 40 units of smoke are produced, and in the case of the phenol foam, even after 5 minutes or more after the start of combustion, a very minute smoke state is shown.

따라서, 상기 경질우레탄(PUR) 및, PS폼(Poly stylene foam), 폴리이소시아뉴레이트에 비하여 상기 페놀폼은 거의 발연이 이루어지지 않아 연소에 대한 높은 안정성을 갖는다.Therefore, the phenolic foam is hardly smoked as compared to the hard urethane (PUR), poly foam foam, and polyisocyanurate, and thus has high stability against combustion.

플라스틱폼과의 연소열 비교표Combustion heat comparison table with plastic foam 폼의 종류Type of form 페놀폼(Phenolic Foam)Phenolic Foam 폴리우레탄폼(PUR)Polyurethane Foam (PUR) 폴리이소시아누레이트폼(PIR)Polyisocyanurate Foam (PIR) 연소열(Kcal/Kg)Heat of combustion (Kcal / Kg) 13891389 26582658 16281628

상기 표 1은 각종 폼에 대한 연소열을 나타내는 것으로, 연소시 폼에 의해 발생되는 연소열이 상기 폴리 우레탄폼(PUR)의 경우에는 1Kg당 2658Kcal이며, 상기 이소시아 누레이트폼(PIR)은 1Kg당 1628Kcal로, 1Kg당 발생되는 연소열량이 높음에 비하여, 상기 페놀폼의 경우에는 1Kg당 1389Kcal로 기타의 폼에 비하여 중량(Kg)당 연소열량이 매우 적다.Table 1 shows the heat of combustion for the various foams, the heat of combustion generated by the foam during combustion is 2658Kcal per 1kg in the case of the polyurethane foam (PUR), the isocyanurate foam (PIR) is 1628Kcal per 1kg As compared with the high combustion heat generated per 1 Kg, the phenol foam has a very small amount of combustion heat per weight (Kg) compared to other foams at 1389 Kcal per 1 Kg.

따라서, 상기 페놀폼(Phenolic Foam)은 건축용 패널로 사용되기에 매우 적합한 고품질임을 알 수 있다.Therefore, it can be seen that the phenolic foam (Phenolic Foam) is a high quality that is very suitable for use as a building panel.

플라스틱폼과의 내열성 비교표Heat resistance comparison table with plastic foam 폼의 종류Type of form 페놀 폼(Phenolic Foam)Phenolic Foam 폴리우레탄 폼(PUR)Polyurethane Foam (PUR) 폴리스티렌 폼(PS)Polystyrene Foam (PS) 최고사용온도(상시)℃Operating temperature (normal) ℃ 150℃150 ℃ 100∼200℃100 ~ 200 ℃ 70℃70 ℃ 한 계 상 태Limit State 210℃(변색)210 degrees Celsius (color change) 140℃(경화)140 degrees Celsius (cure) 70℃(수축)70 degrees Celsius (shrink)

상기 표 2는 각종 플라스틱폼의 내열성을 비교한 표이다.Table 2 is a table comparing the heat resistance of various plastic foams.

상기 표에 따르면, 폴리스티렌 폼(PS)은 최고사용 가능온도가 70℃로서 70℃부터 폼의 수축이 발생되며, 폴리우레탄 폼(PUR)은 최고사용 가능온도가 200℃이지만 140℃부터 폼의 경화가 일어나게 되므로 그 고유특성인 단열성을 잃게 되는 것에 반하여, 상기 페놀폼의 경우에는 최고사용 가능온도가 150℃로 기타의 플라스틱 폼(폴리우레탄폼, 폴리스티렌폼)에 비하여 내열성이 우수하다는 것을 알 수 있다.According to the table, polystyrene foam (PS) is the maximum usable temperature is 70 ℃, the foam shrinkage occurs from 70 ℃, polyurethane foam (PUR) the maximum usable temperature is 200 ℃ but curing the foam from 140 ℃ In this case, the phenol foam has a maximum usable temperature of 150 ° C., which is superior in heat resistance to other plastic foams (polyurethane foam and polystyrene foam). .

이하, 단열성에 대하여 기타 플라스틱 폼과 페놀폼을 비교 설명한다.Hereinafter, other plastic foams and phenol foams are compared with respect to heat insulation.

상기한 단열성은 열전도율(K-factor)에 의하여 평가되며 열전도율이 낮을수록 단열성이 우수한 단열재이다.The thermal insulation is evaluated by the thermal conductivity (K-factor), and the lower the thermal conductivity, the better the thermal insulation.

단열성 비교는 표 3과 도 2를 참조한다. 도 2는 각종 플라스틱폼과 본 발명에 따른 페놀폼의 열전도율을 비교한 그래프이다.See Table 3 and FIG. 2 for adiabatic comparison. Figure 2 is a graph comparing the thermal conductivity of various plastic foams and phenolic foam according to the present invention.

각종 단열재 비교표Comparison table of various insulation materials 단열재insulator 페놀폼Phenolic Foam 폴리우레탄(PUR)Polyurethane (PUR) PS폼(Poly stylene)PS foam (Poly stylene) 아이소핑크Isopink 락 울(RockWool)Rock Wool 글라스울(GlassWoolGlass Wool 열전도도(Kcal/mh℃)Thermal conductivity (Kcal / mh ℃) 0.021∼0.0260.021-0.026 0.015∼0.0200.015 to 0.020 0.0320.032 0.0230.023 0.0230.023 0.0380.038

표 3에 의하면 상기 페놀폼은 PS(Poly stylene)폼, 아이소핑크, 락울, 글라스울에 비하여 유사하거나, 낮은 열전도도를 나타내고 있으며, 경질 우레탄의 경우는 상기 페놀폼보다 낮은 열전도도를 나타내기는 하나 도 2에 도시된 바와 같이, 상기 폴리 우레탄은 열전도율이 불안정한 그래프를 갖는 반면, 상기 페놀폼은 안정된 열전도 기울기를 갖는다.According to Table 3, the phenolic foam shows a similar or lower thermal conductivity than that of PS (Poly stylene) foam, iso pink, rock wool, and glass wool, and in the case of hard urethane, it shows lower thermal conductivity than the phenol foam. As shown in FIG. 2, the polyurethane has a graph of unstable thermal conductivity, while the phenolic foam has a stable thermal conductivity slope.

또한, 상기 페놀폼은 극저온(-196℃)에서 고온(210℃)까지 넓은 범위의 온도범위에서도 우수한 단열성능을 갖는다.In addition, the phenolic foam has excellent thermal insulation performance in a wide range of temperature range from cryogenic (-196 ℃) to high temperature (210 ℃).

한편, 건축용 패널의 단열재로써 상기 페놀폼이 사용되기 위해서는 선팽창계수에 대한 고려가 필요하다. 선팽창계수란 단위온도의 상승에 대하여 팽창하는 길이의 비로 표시된다.On the other hand, it is necessary to consider the coefficient of linear expansion in order to use the phenolic foam as a heat insulating material for building panels. The coefficient of linear expansion is expressed as the ratio of the length of expansion to the rise of the unit temperature.

상기 단열재로서의 폼에 대한 선팽창계수가 높게 되면 온도변화에 민감하게 수축/팽창하게 되므로 상기 건축용 패널의 외부 금속판에 폼이 부착되었을 때 온도변화에 따라 그 폼이 쉽게 그 외부 금속판으로부터 이탈되어 상기 건축용 패널을 지지하지 못하게 되어 금속판에 변형이 생기게 되고, 그 단열성 및 패널의 강도가 급속하게 떨어지게 된다.When the coefficient of linear expansion of the foam as the heat insulating material becomes high, the foam contracts / expands sensitively to temperature change, so when the foam is attached to the outer metal plate of the building panel, the foam is easily detached from the outer metal plate according to the temperature change. It is not supported to cause deformation of the metal plate, the thermal insulation and the strength of the panel is rapidly dropped.

도 3은 본 발명의 일실시예에 따른 페놀폼의 치수안정성 비교 그래프이다.Figure 3 is a graph of the dimensional stability of phenolic foam according to an embodiment of the present invention.

이를 참조하면, 본 발명에 따른 페놀폼은 다른 유기성 단열재와 비교할 때 선팽창계수가 작기 때문에 온도변화에 대하여 신축성이 적고, 치수안정성이 뛰어나다.Referring to this, the phenolic foam according to the present invention has a low elasticity against temperature change and excellent dimensional stability because the coefficient of linear expansion is smaller than that of other organic insulating materials.

도 3에 도시된 바와 같이, 폴리스치렌폼은 50℃에서부터 서서히 단위길이(Cm)에 대한 치수가 변형되어 약 100℃가 될 때 40%가량의 치수변화율을 보이게 된다. 즉, 건축용 패널로 상기 폴리스치렌폼이 사용되었을 때 주위온도가 100℃까지 상승하게 되면 패널의 외부판 내측에 최초 부착되었을 때의 치수보다 40%가량 길이가 변화되게 된다.As shown in FIG. 3, the polystyrene foam shows a dimensional change rate of about 40% when the dimension for the unit length Cm is gradually changed from 50 ° C. to about 100 ° C. FIG. In other words, when the polystyrene foam is used as a building panel, when the ambient temperature rises to 100 ° C., the length is changed by about 40% from the dimension when it is first attached to the inner side of the panel.

또한, 폴리우레탄폼은 도 3에 도시된 바와 같이, 주위온도가 대략 125℃까지 상승하게 된 상태에서 연속사용하게 되면 최고 치수변화율(20%)을 나타내게 되므로 고온사용시 부적합함을 알 수 있다.In addition, as shown in Figure 3, the polyurethane foam exhibits the highest dimensional change rate (20%) when used continuously in a state where the ambient temperature rises to approximately 125 ℃, it can be seen that it is unsuitable at high temperatures.

반면에, 페놀폼의 경우에는 선팽창계수가 (30∼40)×10-6(Cm/Cm·℃)로서 1Cm두께의 시료가 1℃증가함에 따라 (30∼40)×10-6(Cm/Cm·℃)의 팽창이 일어나게 된다.On the other hand, in the case of phenol foams, the coefficient of linear expansion (30-40) × 10 -6 (Cm / Cm · ° C) was increased by 1 ° C. (30-40) × 10 -6 (Cm / Cm 占 폚) expansion occurs.

예컨대, 주변온도가 200℃까지 상승되어도 약간의 수측만이 일어날 뿐 거의 변형이 일어나지 않게 되어 건축용 패널의 내부에 단열재로써 사용되는 중간재로는 적합함을 알 수 있다.For example, even when the ambient temperature rises to 200 ° C., only a few water sides occur, and almost no deformation occurs, and thus, it can be seen that it is suitable as an intermediate material used as a heat insulating material in the interior of a building panel.

내약품성 비교표Chemical Resistance Comparison Table 약 품 명About product name 내약품성Chemical resistance 약 품 명About product name 내약품성Chemical resistance 20% 염산20% hydrochloric acid 안 정An Jung 초산에스테르Acetic acid ester 안 정An Jung 10% 초산10% acetic acid 광 유Mineral oil 10% 유산10% legacy 수산화나트륨수용액Sodium hydroxide solution 농류산Farm products 부풀음Swelling 수산화칼슘수용액Calcium hydroxide solution 부풀음Swelling 암모니아수ammonia 안 정An Jung 염화암모늄수용액(포화)Ammonium chloride solution (saturated) 안 정An Jung 벤 젠Ben Jen 수산화칼륨수용액Potassium hydroxide solution 부풀음Swelling 칼슘수용액Calcium Aqueous Solution 사염화탄소Carbon tetrachloride 안 정An Jung 해 수Sea water 무수 초산Acetic anhydride 알 콜Alcohol

상기 표 4는 본 발명의 일실시예에 따른 페놀폼의 내약품성에 대한 실험표이다.Table 4 is an experimental table for the chemical resistance of the phenolic foam according to an embodiment of the present invention.

페놀폼은 농류산 및 수산화나트륨, 수산화칼륨수용액에 대해 미소한 부풀음이 발생되나, 그외의 각종 화학약품에 대해 매우 안정된 반응을 보인다. 이는 상기 페놀폼의 원료중 내약품성이 강한 페놀레진이 50%이상 혼합되어 있기 때문인 것으로, 상기 페놀폼은 화재의 위험성이 높은 공장, 또는 각종 화학공장 및 해수에 인접된 곳의 공장에 사용되는 건축용 패널의 중간단열재로 사용되기에 적합하다.Phenolic foam has a slight swelling in the presence of concentrated acids, sodium hydroxide and potassium hydroxide solution, but shows a very stable reaction to various other chemicals. This is because phenolic resin having a strong chemical resistance of 50% or more is mixed in the raw material of the phenolic foam, and the phenolic foam is used for a factory with high risk of fire, or a chemical plant and a plant adjacent to seawater. It is suitable to be used as middle insulation of panel.

제한산소요구량 비교표(LIMITED OXYGEN INDEX;LOI)LIMITED OXYGEN INDEX; LOI LOI(%)LOI (%) 폴리스치렌 FOAMPolystyrene FOAM 19.5 %19.5% 폴리우레탄폼(PUR)Polyurethane Foam (PUR) 25 %25% 폴리이소시아누레이트폼(PIR)Polyisocyanurate Foam (PIR) 29 %29% 페놀폼Phenolic Foam 40 %40%

표 5는 본 발명의 일실시예에 따른 제한산소요구량에 대한 비교표를 나타내는 바, 폼이 연소되는 데 요구되는 최저 산소비율로 나타내어지며, 예컨대 제한산소요구량(LOI)이 클수록 난연성이 좋게 된다.Table 5 shows a comparison table for the limiting oxygen demand according to an embodiment of the present invention, which is represented by the minimum oxygen ratio required to burn the foam, for example, the higher the limiting oxygen demand (LOI), the better the flame retardancy.

상기한 표에 의하면, 폴리스치렌폼과 폴리 우레탄폼, 폴리이소시아누레이트폼은 LOI가 30%이하로 40%인 페놀폼에 비하여 연소시 요구되는 산소량이 작은 만큼 용이하게 연소되며, 페놀폼은 기타의 플라스틱폼(폴리스치렌폼, 폴리우레탄폼 등)에 비하여 연소시 요구되는 산소량이 많으므로 산화되기가 매우 어렵다.According to the above table, polystyrene foam, polyurethane foam, and polyisocyanurate foam are easily burned due to the small amount of oxygen required for combustion as compared to phenol foam having a LOI of 30% or less and 40%. Compared to plastic foam (polystyrene foam, polyurethane foam, etc.), the amount of oxygen required for combustion is very difficult to oxidize.

따라서, 페놀폼은 건축용 패널의 중간재로써 사용되기에 적합하다는 것을 알 수 있다.Thus, it can be seen that phenolic foam is suitable for use as an intermediate material for building panels.

이하, 상기 페놀폼이 패널의 중간단열재로 사용되는 건축용 패널에 대하여 상세하게 설명한다.Hereinafter, the building panel in which the said phenol foam is used as an intermediate | middle insulation material of a panel is demonstrated in detail.

도 4는 본 발명의 다른 실시예에 따른 페놀폼을 이용한 건축용 패널을 나타내는 사시도이다.Figure 4 is a perspective view showing a building panel using a phenol foam according to another embodiment of the present invention.

이를 참조하면, 상기한 실시예에 의해 제조된 페놀폼(2)의 상부와 하부에 패널용 강판(2,4)이 제공되며, 그 강판(2,4)의 상/하 접착면에 페놀폼과의 접착력강화를 위하여 우레탄 접착제를 분사시키고 상기 페놀폼(2)을 접착시키게 되면 상기 페놀폼(2)이 상기 강판(2,4)의 상/하 피접착부에 견실하게 접착되게 된다.Referring to this, panel steel sheets 2 and 4 are provided on the upper and lower portions of the phenolic foam 2 prepared according to the above embodiment, and phenolic foams are provided on the upper and lower adhesive surfaces of the steel sheets 2 and 4. When the urethane adhesive is sprayed and the phenol foam 2 is adhered to enhance the adhesion between the phenolic foam 2 and the phenolic foam 2, the phenolic foam 2 is firmly adhered to the upper and lower adhesive parts of the steel sheets 2 and 4.

이때, 상기 강판과 밀착되어 접착되는 상기 페놀폼은 강판과의 사이에 상기 우레탄 접착제를 분사시켜 접착시키므로 접착력이 강화됨과 동시에 상기 우레탄 접착제에 의해 상기 페놀폼이 직접 강판과 접촉되지 않으므로 그 산성으로 인해 상기 강판이 부식되는 것을 효과적으로 방지할 수 있게 된다.In this case, the phenolic foam that is in close contact with the steel sheet is adhered by spraying the urethane adhesive between the steel sheet and the adhesive force is enhanced and the phenolic foam is not directly in contact with the steel sheet by the urethane adhesive due to its acidity It is possible to effectively prevent the steel sheet from corroding.

한편, 본 발명의 일실시예에 따른 페놀폼은 단지 본 실시예에 국한된 것이 아니며, 본 발명의 범위내에서 다양하게 변경되어 실시되는 것이 가능하다.On the other hand, phenolic foam according to an embodiment of the present invention is not limited to this embodiment, it can be carried out variously modified within the scope of the present invention.

상기한 바와 같이, 본 발명에 따른 페놀폼에 의하면 일정량의 페놀레진과 정포제, 가소제, 발포제를 교반시킴으로써 난연성, 내열성 및 단열성, 내약품성, 가공성이 우수한 페놀폼이 제작되어 일반 건축용 패널의 중간재 및, 화재의 위험성이 높은 공장 및 화학공장 또는 해안에 인접된 조립식 건물의 건축용 패널의 중간재로 그 페놀폼이 적합하게 이용될 수 있다.As described above, according to the phenol foam according to the present invention by stirring a predetermined amount of phenol resin, foam stabilizer, plasticizer, foaming agent, a phenol foam excellent in flame retardancy, heat resistance and heat insulation, chemical resistance, processability is produced, For example, the phenolic foam may be suitably used as an intermediate material for building panels of high-risk fires, chemical plants or prefabricated buildings adjacent to the coast.

또한, 패널제조시 상기 우레탄 접착제를 이용하여 페놀폼과 그 외부의 강판을 접착시키므로 상기 페놀폼이 직접 강판과 접촉하지 않아 강판이 부식되는 것을 효과적으로 방지할 수 있게 된다.In addition, since the phenolic foam and the external steel sheet is bonded by the urethane adhesive during panel manufacturing, the phenolic foam does not directly contact the steel sheet, thereby effectively preventing corrosion of the steel sheet.

Claims (2)

페놀(Phenol)과 포르말린(Formalin)의 합성에 의해 생성된 메티올 페놀(Methyol Phenol), 디메티올 페놀(Dimethyol Phenol), 트리메티올 페놀(Trimethyol Phenol)의 조합으로 이루어진 레진, 또는 변성을 위한 크레졸(Cresol), 또는 비스페놀(Bisphenol)류와 포르말린 중 적어도 하나이상과, 포르말린과의 합성으로 생성된 페놀 레진 100단위와;Resin consisting of a combination of methol phenol (Methyol Phenol), dimethyol Phenol, Trimethyol Phenol produced by the synthesis of phenol and formalin, or for modification At least one of cresol or bisphenol and formalin, and 100 units of phenol resin produced by synthesizing formalin; 상기 페놀 레진 100단위에 폼(Foam) 생성시 폼에 유연성을 부여하기 위한 가소제가 5∼40단위 배합되며;5 to 40 units of plasticizer for imparting flexibility to the foam when foam is generated in 100 units of the phenol resin; 상기 페놀 레진과 반응하여 페놀 폼을 경화시키기 위하여 황산(H2SO4)계 산화합물로 이루어진 5∼40단위의 경화제가 배합되고;5 to 40 units of a curing agent composed of sulfuric acid (H 2 SO 4 ) -based acid compounds are mixed to react with the phenol resin to cure the phenol foam; 폼의 셀(Cell) 분포 및 크기 등을 조절하기 위하여 실록산(Siloxane; H2SiO-(H2SiO)n-SiH3)계로 이루어진 정포제가 0.5∼5단위 배합되고;In order to control the cell distribution and the size of the foam, a foaming agent made of a siloxane (Siloxane; H 2 SiO- (H 2 SiO) n-SiH 3 ) system is blended in 0.5 to 5 units; 소정의 발포효과를 갖는 발포제가 3∼20단위 배합되어 구성된 것을 특징으로 하는 페놀폼.A phenol foam characterized by comprising 3 to 20 units of a blowing agent having a predetermined foaming effect. 페놀(Phenol)과 포르말린(Formalin)의 합성에 의해 생성된 메티올 페놀(Methyol Phenol), 디메티올 페놀(Dimethyol Phenol), 트리메티올 페놀(Trimethyol Phenol) 및, 변성을 위한 크레졸(Cresol), 비스페놀(Bisphenol)류중 적어도 하나이상과 포르말린과의 합성으로 생성된 페놀 레진과, 가소제와, 경화제와 정포제, 발포제가 배합 교반된 페놀폼을 이용함에 있어서,Methyol Phenol, Dimethyol Phenol, Trimethyol Phenol produced by the synthesis of Phenol and Formalin, Cresol for denaturation, In using phenolic foam in which at least one of bisphenols and a phenol resin produced by the synthesis of formalin, a plasticizer, a curing agent, a foaming agent and a blowing agent are mixed and stirred, 상기 페놀폼(2)의 상부와 하부에 패널용 강판(2,4)이 제공되며, 그 강판(2,4)의 상/하 접착면에 우레탄 접착제를 분사시켜 상기 페놀폼과 강판을 접착시키과 동시에 상기 페놀폼이 직접 상기 강판과 접촉하는 것을 방지하도록 한 것을 특징으로 하는 페놀폼을 이용한 건축용 패널.Panel steel sheets (2,4) are provided on the upper and lower portions of the phenolic foam (2), and urethane adhesive is sprayed on the upper and lower adhesive surfaces of the steel sheets (2,4) to bond the phenolic foam and the steel sheet. At the same time, the building panel using a phenol foam, characterized in that to prevent the phenol foam is in direct contact with the steel sheet.
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