KR20000025328A - Processing monitoring apparatus of semiconductor devices fabrication facility - Google Patents
Processing monitoring apparatus of semiconductor devices fabrication facility Download PDFInfo
- Publication number
- KR20000025328A KR20000025328A KR1019980042360A KR19980042360A KR20000025328A KR 20000025328 A KR20000025328 A KR 20000025328A KR 1019980042360 A KR1019980042360 A KR 1019980042360A KR 19980042360 A KR19980042360 A KR 19980042360A KR 20000025328 A KR20000025328 A KR 20000025328A
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- South Korea
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- manufacturing
- facility
- measurement data
- semiconductor device
- host computer
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Abstract
Description
본 발명은 반도체 장치를 제조하기 위한 제조설비에 관한 것으로서, 더욱 상세하게는 반도체 장치를 제조하기 위한 공정이 이루어지는 제조설비에 메모리를 갖는 프로세서와 모니터를 설치하여 계측설비에 의해 계측되는 계측 데이터를 공정 완료후 디스플레이할 수 있도록 된 반도체 장치 제조설비의 공정 모니터장치(processing monitoring apparatus of semiconductor devices fabrication facility)에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing facility for manufacturing a semiconductor device, and more particularly, to a process for manufacturing a semiconductor device by installing a processor having a memory and a monitor and processing the measurement data measured by the measurement facility. The present invention relates to a process monitoring apparatus of a semiconductor device fabrication facility that can be displayed after completion.
종래의 반도체 장치 제조설비는 공정을 진행한 후 해당 공정의 입력 파라미터(input parameter)인 온도, 압력, 가스 등을 콘트롤러(controller)에 저장하여 출력이 가능하도록 구성되어 있다.Conventional semiconductor device manufacturing equipment is configured to store and output temperature, pressure, gas, and the like, which are input parameters of the process, in a controller after the process is performed.
이러한 시스템은 제조설비에 별도의 메모리 카드 등을 이용하여 일정기간 동안의 진행제품에 대한 공정조건을 저장해 두고 필요시 화면에 디스플레이되도록 구성되어 있다.Such a system is configured to store process conditions for a product for a certain period of time by using a separate memory card in a manufacturing facility, and to be displayed on a screen if necessary.
제품이 진행된 후 정상적으로 진행되었는지 각종 계측장비를 이용하여 출력 파라미터인 두께, 저항, 먼지 등을 모니터하고 있으나, 제조설비에는 이를 콘트롤하는 시스템이 없어 별도의 작업대장이나 전산시스템을 이용하여 데이터를 가공하고, 이를 기초로 제품의 이상유무를 모니터하고 있다.After the product has progressed, it monitors the output parameters such as thickness, resistance, and dust by using various measuring equipments.However, since there is no system to control this in manufacturing facilities, data is processed using a separate work ledger or computer system. Based on this, the product is monitored for abnormalities.
다시 말하면, 상기한 바와 같은 방법은 작업대장 등을 사용함으로써 작업자의 작업부담을 가중시키며, 현장에서 엔지니어들이 이상유무를 모니터하기가 어렵다는 결점이 있다.In other words, the method as described above adds to the worker's work load by using a work ledger, etc., and it is difficult for engineers to monitor the presence of abnormalities in the field.
상기한 바와 같은 결점을 제거하기 위하여 제안된 본 발명의 목적은 반도체 장치를 제조하기 위한 공정이 이루어지는 제조설비에 메모리를 갖는 프로세서와 모니터를 설치하여 계측설비에 의해 계측되는 계측 데이터를 공정 완료후 디스플레이할 수 있도록 하는 반도체 장치 제조설비의 공정 모니터장치를 제공함에 있다.An object of the present invention proposed to eliminate the above-described drawbacks is to install a processor and a monitor having a memory in a manufacturing facility in which a process for manufacturing a semiconductor device is performed, and display measurement data measured by the measurement facility after the completion of the process. The present invention provides a process monitoring device for a semiconductor device manufacturing facility.
도1은 본 발명에 따른 반도체 장치 제조설비의 공정 모니터장치를 나타내는 구성도이다.1 is a block diagram showing a process monitoring apparatus of a semiconductor device manufacturing apparatus according to the present invention.
※ 도면의 주요 부분에 대한 부호의 설명※ Explanation of codes for main parts of drawing
1 : 제조설비 2 : 호스트 컴퓨터1 manufacturing facility 2 host computer
3 : 계측설비3: measuring equipment
상기한 목적을 달성하기 위한 본 발명의 반도체 장치 제조설비의 공정 모니터장치는 반도체 장치를 제조하기 위한 공정이 이루어지는 제조설비의 공정 파라미터를 계측하는 계측설비와, 제조설비의 전반적인 동작을 제어하면서 계측설비의 계측 데이터를 인가받아 제조설비로 전송하는 호스트 컴퓨터와, 이 호스트 컴퓨터의 제어하에 반도체 장치를 제조하기 위한 공정이 이루어지며, 계측 데이터를 인가받아 공정 완료후 디스플레이하게 되는 제조설비를 구비하는 것을 특징으로 한다.The process monitoring apparatus of the semiconductor device manufacturing equipment of the present invention for achieving the above object is a measuring equipment for measuring the process parameters of the manufacturing equipment is a process for manufacturing a semiconductor device, and measuring equipment while controlling the overall operation of the manufacturing equipment And a process for manufacturing a semiconductor device under the control of the host computer and receiving the measurement data of the host computer and transmitting the measurement data to the manufacturing facility. It is done.
이 제조설비에는 호스트 컴퓨터로부터 입력되는 계측 데이터를 입력받아 저장하였다가 공정 완료후 디스플레이하기 위한 메모리와 모니터가 내입되는 것이 바람직하다.In this manufacturing facility, a memory and a monitor for receiving and storing measurement data input from a host computer and displaying the same after completion of the process are preferably incorporated.
이하, 본 발명의 구체적인 실시예를 첨부한 예시도면을 참조하여 보다 상세히 설명한다.Hereinafter, with reference to the accompanying drawings, a specific embodiment of the present invention will be described in more detail.
도1을 참조하면, 제조설비(1)는 호스트 컴퓨터(2)의 제어하에 반도체 장치를 제조하기 위한 공정을 수행하게 되고, 이 때 각종 공정을 수행하면서 얻어지는 각종 데이터를 호스트 컴퓨터(2)로 전송하게 된다.Referring to FIG. 1, the manufacturing facility 1 performs a process for manufacturing a semiconductor device under the control of the host computer 2, and transmits various data obtained while performing various processes to the host computer 2 at this time. Done.
또한, 계측설비(3)는 반도체 장치를 제조하기 위한 공정이 이루어지는 제조설비(1)로부터 온도, 저항, 두께, 먼지 등을 계측하고, 이 계측 데이터를 호스트 컴퓨터(2)를 매개로 제조설비(1)의 메모리에 전송되어 저장되도록 한다.In addition, the measurement facility 3 measures temperature, resistance, thickness, dust, and the like from the production facility 1 in which the process for manufacturing a semiconductor device is performed, and the measurement data is transmitted to the production facility via the host computer 2 ( It is transferred to the memory of 1) to be stored.
이렇게 계측설비(3)로부터 전송되는 계측 데이터를 입력받은 제조설비(1)의 마이크로 프로세서는 이를 작업자가 보기 쉬운 형태로 편집하면서 진행중인 공정이 완료되기를 대기하게 된다.The microprocessor of the manufacturing facility 1, which receives the measurement data transmitted from the measurement facility 3, edits it in an easy-to-view form and waits for the ongoing process to be completed.
그리고, 진행중인 공정이 완료되게 되면 메모리에 저장되어있는 계측 데이터를 새롭게 편집된 형태로 모니터에 디스플레이하게 된다.When the ongoing process is completed, the measurement data stored in the memory is displayed on the monitor in a newly edited form.
이에 따라 작업자는 모니터에 디스플레이되는 온도, 두께, 저항, 먼지 등을 확인할 수 있는 것이다.Accordingly, the operator can check the temperature, thickness, resistance, dust, and the like displayed on the monitor.
따라서, 본 발명에 의하면 반도체 장치를 제조하기 위한 공정이 이루어지는 제조설비에 메모리를 갖는 프로세서와 모니터를 설치하여 계측설비에 의해 계측되는 계측 데이터를 공정 완료후 디스플레이하도록 함으로써, 제조설비에서도 계측설비에 의해 계측되는 두께, 저항, 먼지 등을 확인할 수 있는 것이다.Therefore, according to the present invention, a processor having a memory and a monitor are installed in a manufacturing facility in which a process for manufacturing a semiconductor device is made so that the measurement data measured by the measuring facility is displayed after the process is completed. The measured thickness, resistance, and dust can be checked.
이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980042360A KR20000025328A (en) | 1998-10-10 | 1998-10-10 | Processing monitoring apparatus of semiconductor devices fabrication facility |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980042360A KR20000025328A (en) | 1998-10-10 | 1998-10-10 | Processing monitoring apparatus of semiconductor devices fabrication facility |
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| Publication Number | Publication Date |
|---|---|
| KR20000025328A true KR20000025328A (en) | 2000-05-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980042360A KR20000025328A (en) | 1998-10-10 | 1998-10-10 | Processing monitoring apparatus of semiconductor devices fabrication facility |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100446925B1 (en) * | 2001-03-05 | 2004-09-08 | 가부시끼가이샤 히다치 세이사꾸쇼 | Process monitoring device for sample processing apparatus and control method of sample processing apparatus |
-
1998
- 1998-10-10 KR KR1019980042360A patent/KR20000025328A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100446925B1 (en) * | 2001-03-05 | 2004-09-08 | 가부시끼가이샤 히다치 세이사꾸쇼 | Process monitoring device for sample processing apparatus and control method of sample processing apparatus |
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