KR20000019347A - Bake apparatus - Google Patents

Abstract

PURPOSE: A bake apparatus is provided to improve a uniformity of the baking temperature being transport to a wafer by preventing a slide of the wafer. CONSTITUTION: A bake apparatus comprises a chamber(22) for blocking thermal emitting from outsides having a door(30) for moving a wafer(20) and a cover(32) for controlling inter temperature, a driving unit(24) formed in the chamber(22) for holding and rotating the wafer(20), and a heating plate(28) for baking a photoresist film formed on the wafer(20). The driving unit(24) further includes a supporter(34) for supporting the wafer(20), a motor(36) for rotating the supporter(34), and a cylinder(38) connected to the motor(36).

Description

Bake Device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bake device, and more particularly, to a bake device capable of uniformizing heat transferred to a wafer to cure the photoresist during the application and development of the photoresist on a wafer.

In general, in the process of manufacturing a semiconductor, in order to pattern a thin film on the wafer, a photosensitive film is coated on the wafer and subjected to exposure, development, and etching processes.

Here, approximately 90 to 300 inside the baking apparatus to increase the adhesion and uniformity of the photoresist film applied to the wafer in the subsequent steps of the photoresist coating process, the post-development process and the post-etch process, and to volatilize the solvent contained in the photoresist film. The wafer is cured at a temperature of about ℃, and the method of baking the wafer can be largely divided into conduction, convection, and infrared methods, and is classified into soft bake and hard bake according to the processing conditions according to each process.

The soft bake process is performed at a temperature for volatilizing the solvent contained in the photoresist film, and the hard bake proceeds with a longer curing time and temperature than the soft bake because the process is performed under conditions for ensuring densification and uniformity of the photoresist film.

This baking apparatus is a kind of oven, in particular, in the case of curing the wafer by conduction, heat is supplied from the heating plate to the photosensitive film through the wafer as the photosensitive film is set on the upper surface of the heating plate provided in the chamber. The hardening of will proceed.

1 is a perspective view schematically showing a conventionally known baking apparatus, and FIG. 2 is a front view seen from A of FIG. 1.

In the chamber 2, a heating plate 6 having a heater line 4 patterned on an upper surface thereof is installed, and a wafer 8 introduced through a door of the chamber 2 is set on an upper surface of the heating plate 6. In particular, the ceramic ball 10 is mounted on the upper surface of the heating plate 6 for uniform heat transfer to the wafer 8.

The space between the wafer 8 and the heating plate 6 stacked on the ceramic ball 10 is approximately 0.2 mm to allow uniform heat transfer, but particles 12 or more are generated during the heating process. As the wafer 8 is slightly inclined, the uniformity of heat applied to the entire wafer 8 is different. Such nonuniformity of heat transfer may be a fatal factor for wafer failure due to the characteristics of the semiconductor manufacturing process requiring precision.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a baking apparatus which improves the uniformity of heat transferred to the wafer by preventing the inclination of the wafer.

In order to achieve the above object, the present invention provides a chamber for controlling the outflow and inflow of the door into and out of the wafer, the chamber being insulated inside to block heat release to the outside, and It is provided with a driving means installed inside to support and rotate the wafer flowing into the door, and a heating plate for dissipating heat into the chamber.

In particular, the drive means may be composed of a support for supporting the wafer, a motor for rotating the support and a cylinder connected to the motor to move up and down.

Here, the support may be composed of at least one or more pins, or may be composed of a vacuum chuck to which a vacuum line is connected.

In addition, the motor may be rotated at 20 to 60 rpm.

The heating plate is installed above or to the side of the chamber to enable uniform heat transfer to the wafer.

1 is a perspective view schematically showing a conventionally known baking apparatus.

2 is a front view as seen from A of FIG.

Figure 3 is a perspective view schematically showing a baking apparatus according to the present invention.

4a to 4f are views showing the operation of the baking apparatus according to the present invention.

Figure 5 is a perspective view of a drive means of another embodiment according to the present invention.

6a to 6f are views showing the operation according to another embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

20 wafer 22 chamber

24 drive means 26 liner

28: heating plate 30: door

32: cover 34: support

36 motor 38 cylinder

40: drive shaft 42: vacuum chuck

44: vacuum hole 46: vacuum line

BEST MODE Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a perspective view of a baking apparatus according to the present invention.

As can be seen in the drawing, the baking apparatus includes a chamber 22 containing a wafer 20 to be heated therein, and a heating plate equipped with a driving means 24 and a liner 26 for supporting and rotating the wafer 20 simultaneously. It consists of 28.

The chamber 22 may be thermally insulated to prevent the heat generated therein from being discharged to the outside, and a door 30 which may be opened and closed upward and downward is installed at a side of the chamber 22 by an arm that is not shown. The wafer 20 is allowed to enter and exit the chamber 22, and a cover 32 that can be opened and closed may be mounted on an upper surface thereof to release heat generated by heating of the wafer 20 to the outside. The cover 32 is equipped with a heating plate 28 on which a liner 26 for supplying heat into the chamber 22 is installed.

On the other hand, the driving means 24 in accordance with the features of the present invention is installed in the chamber 22, the driving means 24 passes through the door 30 to the wafer 20 introduced into the chamber 22 It consists of the support body 34 to support, the motor 36 which rotates the support body 34, and the cylinder 38 provided below this motor 36, and the support body 34 raises and lowers. In particular, the motor 36 is rotated at a low speed of approximately 20 ~ 60rpm to ensure uniform heat transfer from the liner 26 to the wafer 20.

The support 34 may be composed of at least one or more pins. However, three supports 34 may be installed for a stable fixing position of the wafer 20.

Looking at the operating method of the wafer transfer device including such a support 34, first, the wafer 20 is coated with a photosensitive film by an arm (not shown) in the open state of the cover 32 of the chamber 22 in FIG. After entering into the chamber 22 through the door 30 is set to the top of the three pins, the support 34, the cylinder 38 after the cover 32 and the door 30 is closed, as shown in Figure 4b ) And the three pins are lowered to fix the wafer 20. Then, as shown in FIG. 4C, the liner 26 of the heating plate 28 is operated to dissipate heat and at the same time, the motor 36 rotates. The wafer 20 fixed to it also rotates together. The rotating wafer 20 is heated by the heat dissipated from the liner 26 and the photoresist film slowly cures. At this time, as the wafer 20 is rotated according to the characteristics of the present invention, the photosensitive film may be uniformly cured by curing and may be cured while adjusting the rotational speed of the motor according to the degree of curing of the photosensitive film. In addition, the heat transfer is not performed in a state where the heating plate 28 and the wafer 20 are in contact with each other, but the photosensitive film is cured by radiant heat. As the hardening occurs, the nonuniformity of heat transfer generated may be resolved.

On the other hand, when the set curing time is reached, as shown in FIG. 4D, the motor 36 stops rotating and the cylinder 38 operates to lift and lift the pin serving as the support body 34. As in 4e, the cover 32 of the chamber 22 is opened to release the heat filled in the chamber 22. Then, as shown in FIG. 4F, the door 30 is opened and the arm operates to support the support 34. The wafer 20 is withdrawn from the pin.

As another embodiment of the support body 34 described above, as shown in FIG. 5, a vacuum chuck 42 mounted to the drive shaft 40 of the motor 36 may be proposed. The vacuum chuck 42 forms a vacuum hole 44 at a central portion thereof, and connects a vacuum line 46 associated with the vacuum hole 44 to the lower part of the chamber 22 and an external vacuum pump (not shown). Connect it.

The operation and effects of the baking apparatus provided with such a support will be described based on FIGS. 6A to 6F.

First, as shown in FIG. 6A, in a state in which the cover 32 of the chamber 22 is opened, a wafer 20 coated with a photosensitive film by an arm (not shown) is drawn into the chamber 22 through the door 30. After the vacuum suction through the vacuum line 46 and the vacuum hole 44 is set in the state set to the upper end of the vacuum chuck 42 to chuck the wafer 20, the cover 32 as shown in Figure 6b ) And the door 30 is closed, the cylinder 38 is operated to lower the drive shaft 40 to return the vacuum chuck 42 on which the wafer 20 is mounted, and then, as shown in FIG. When the liner 26 is operated to dissipate heat and the motor 36 rotates, the wafer 20 fixed to the vacuum chuck 42 also rotates together. The rotating wafer 20 is heated by the heat dissipated from the liner 26 and the photoresist film slowly cures. At this time, as the wafer 20 is rotated according to the characteristics of the present invention, the photosensitive film may be uniformly cured by curing and may be cured while adjusting the rotational speed of the motor according to the degree of curing of the photosensitive film. In addition, the heat transfer is not performed in a state where the heating plate 28 and the wafer 20 are in contact with each other, but the photosensitive film is cured by radiant heat. As the hardening occurs, the nonuniformity of heat transfer generated may be resolved.

On the other hand, when the set curing time is reached, as shown in FIG. 6D, the motor 36 stops rotating, and the cylinder 38 operates to lift and lower the drive shaft 40 to chuck the wafer 20. 42) in place, open the cover 32 of the chamber 22 to release the heat filled inside the chamber 22 as in FIG. 6E, and then open the door 30 as shown in FIG. 6F. When the operation stops at the vacuum pump (not shown), the restraint of the wafer 20 is released from the vacuum chuck 42, and the arm is operated to pull out the wafer 20 from the vacuum chuck 42.

As described above, the embodiment of the present invention substantially solves the conventional problems.

That is, since the photosensitive film is cured while the heating plate and the wafer are in non-contact state, no particles are inclined due to particles generated between the lower surface of the wafer and the heating plate. Thus, the photosensitive film can be uniformly cured.

In addition, since the photoresist film is rotated by a motor and curing is performed, uniform curing of the photoresist film, which has been cured by local heat transfer in the structure of the conventional liner, is enabled.

Claims (6)

In the baking apparatus for curing the photosensitive film in the process of patterning a thin film on the surface of the wafer, the door 30 is the wafer 20 is entered and the cover 32 is provided with a cover 32 for intermittent flow in and out of the internal heat is provided The chamber 22 is thermally insulated to block heat dissipation to the outside, and the drive means 24 is installed inside the chamber 22 to support and rotate the wafer 20 introduced into the door 30 and rotate at the same time. And a heating plate (28) for dissipating heat into the chamber (22) to cure the photosensitive film. 2. The driving device (24) according to claim 1, wherein the driving means (24) is connected to the support (34) for supporting the wafer (20), the motor (36) for rotating the support (34), and the motor (36). A baking device, characterized in that consisting of a cylinder (38). 3. The baking apparatus according to claim 2, wherein said support (34) is at least one pin. 3. The baking apparatus according to claim 2, wherein the support (34) is a vacuum chuck (42) to which a vacuum line is connected. The baking apparatus according to claim 2, wherein the motor (36) is rotated at 20 to 60 rpm. 2. The baking apparatus according to claim 1, wherein the heating plate (28) is provided on the side of the cover (32) or the chamber (22).