KR20000007657A - Polycarbonate resin composition - Google Patents
Polycarbonate resin composition Download PDFInfo
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- KR20000007657A KR20000007657A KR1019980027105A KR19980027105A KR20000007657A KR 20000007657 A KR20000007657 A KR 20000007657A KR 1019980027105 A KR1019980027105 A KR 1019980027105A KR 19980027105 A KR19980027105 A KR 19980027105A KR 20000007657 A KR20000007657 A KR 20000007657A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
- C08K5/105—Esters; Ether-esters of monocarboxylic acids with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/527—Cyclic esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L2201/10—Transparent films; Clear coatings; Transparent materials
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Abstract
Description
본 발명은 폴리카보네이트 수지조성물에 관한 것으로, 더욱 상세하게는 고온내열성, 장기내열성, 내황변성 및 투명성이 양호하여 투명한 용도 특히, 고온에서 장기간 사용할 수 있는 제품에 유용한 폴리카보네이트 수지조성물에 관한 것이다.The present invention relates to a polycarbonate resin composition, and more particularly, to a polycarbonate resin composition useful for transparent applications, particularly for products that can be used for a long time at a high temperature due to good high temperature heat resistance, long term heat resistance, yellowing resistance and transparency.
폴리카보네이트는 투명성, 기계적 특성, 치수안정성, 전기적특성 및 치수안정성이 양호하여 우수한 엔지니어링 플라스틱으로 다방면으로 사용되고 있다.Polycarbonate is an excellent engineering plastic with good transparency, mechanical properties, dimensional stability, electrical properties, and dimensional stability, and has been used in various fields.
일반적으로 폴리카보네이트는 내열성이 우수하나, 투명성이 요구되는 용도로 사용할 때에는 특히 내황변성과 장기내열성이 우수하여야 한다. 그런데, 용융온도 이상에서 가공할 때나 유리전이온도 부근의 고온에서 장기적으로 사용할 때는 황변현상이 발생하고 내열성이 저하되는 문제점이 있다.In general, polycarbonate has excellent heat resistance, but when used for applications requiring transparency, it should be particularly excellent in yellowing resistance and long term heat resistance. However, when processing above the melting temperature or long-term use at a high temperature near the glass transition temperature, there is a problem that yellowing phenomenon occurs and the heat resistance is lowered.
따라서, 이를 개선하기 위해 일반적으로 유기포스파이트계 또는 포스포나이트계 화합물을 열안정제로서 첨가하여 폴리카보네이트 수지를 제조하는 바, 이때는 포스파이트계 화합물을 단독으로 첨가하거나 유기포스파이트계와 페놀계의 열안정제를 혼합하여 첨가하고, 때로는 에폭시 화합물을 소량 혼합첨가하므로써 수지의 내황변성과 내열성을 향상시키고 있다.Therefore, in order to improve this, generally, an organic phosphite-based or phosphonite-based compound is added as a heat stabilizer to prepare a polycarbonate resin. In this case, a phosphite-based compound is added alone or an organic phosphite- and phenol-based The heat stabilizer is mixed and added, and sometimes a small amount of epoxy compound is added to improve the yellowing resistance and the heat resistance of the resin.
그런데, 페놀계 산화방지제는 거의 단독적으로 사용하지 않는 바, 이를 단독으로 사용할 경우 페놀레이트 두 분자의 결합반응에 의하여 황색의 발색단을 형성하기 때문이다. 이같은 현상은 폴리카보네이트의 가공이 이루어지는 300℃ 부근의 고온에서 더욱 심화된다.However, phenolic antioxidants are rarely used because they form a yellow chromophore by the binding reaction of two molecules of phenolate when used alone. This phenomenon is further exacerbated at a high temperature near 300 ° C. at which polycarbonate is processed.
유기포스파이트계 열안정제의 구체적인 예로는 트리스(노닐페닐)포스파이트, 디스테아릴펜타에리스리톨 디포스파이트, 트리스(2,4-디-t-부틸페닐)-포스파이트 또는 비스(2,6-디-t-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트 등이 있다.Specific examples of the organic phosphite thermal stabilizer include tris (nonylphenyl) phosphite, distearylpentaerythritol diphosphite, tris (2,4-di-t-butylphenyl) -phosphite or bis (2,6-di -t-butyl-4-methylphenyl) pentaerythritol diphosphite and the like.
상기와 같은 유기포스파이트계 열안정제와 혼합사용되는 페놀계 열안정제의 구체적인 예로는 2,6-디-t-부틸-4-메틸페놀, 2,6-디-t-부틸-4-sec-부틸페놀 또는 옥타데실-3-(3,5,-디-t-부틸-4-하이드록시페닐) 프로피오네이트 등이 있다.Specific examples of the phenolic heat stabilizer used in combination with the above organic phosphite heat stabilizer include 2,6-di-t-butyl-4-methylphenol, 2,6-di-t-butyl-4-sec- Butylphenol or octadecyl-3- (3,5, -di-t-butyl-4-hydroxyphenyl) propionate and the like.
일반적으로 이들 열안정제의 첨가량이 전체 수지조성물에 대하여 0.1중량부 미만일때는 이들을 첨가하지 않은 것보다 오히려 열안정성이 불량해져 황변현상을 보인다. 이러한 현상은 주로 포스파이트계 열안정제 중에서도 페놀레이트 성분이 많은 트리스(2,4-디-t-부틸페닐)-포스파이트 또는 테트라키스-(2,4-디-t-부틸-페닐)-4,4'-비스페닐렌 디포스파이트 등에서 나타난다.In general, when the amount of these thermal stabilizers is less than 0.1 parts by weight based on the total resin composition, the thermal stability is poor rather than the addition of these, and yellowing occurs. This phenomenon is mainly caused by tris (2,4-di-t-butylphenyl) -phosphite or tetrakis- (2,4-di-t-butyl-phenyl) -4 having a large amount of phenolate among phosphite-based heat stabilizers. , 4'-bisphenylene diphosphite and the like.
이들의 분자내 페놀레이트/인성분의 몰비는 각각 3과 2이다.The molar ratio of these intramolecular phenolates / phosphorus component is 3 and 2, respectively.
반면, 포스파이트계 열안정제의 첨가량이 전체 수지조성물에 대하여 1.0 중량부 초과면 열안정제 첨가량의 증가에 따른 첨가효과 상승이 적어 비경제적일 뿐만 아니라 내충격성, 투명성 등 제반물성을 오히려 감소시키는 경우가 있다.On the other hand, when the amount of the phosphite-based heat stabilizer is more than 1.0 parts by weight relative to the total resin composition, there is little increase in the effect of the addition of the heat stabilizer, which is uneconomical and reduces the overall physical properties such as impact resistance and transparency. have.
이들을 포함하는 열가소성 수지조성물을 혼련압출 제조할 때나 성형가공을 위한 압출 및 사출가공시에는 280∼320℃의 고온일 것이 요구되는 바, 이때 열안정제 자체의 열안정성이 충분히 양호하지 않으며, 특히 저분자량의 열안정제는 휘발성이 상대적으로 커서 압출가공시에 수반되는 진공에 의해 일부가 수지밖으로 제거될 수 있다.When kneading extrusion production of thermoplastic resin compositions including these, or during extrusion and injection processing for molding processing, it is required to have a high temperature of 280 to 320 ° C. At this time, the thermal stability of the thermal stabilizer itself is not sufficiently good, in particular, low molecular weight. The heat stabilizer is relatively volatile, and part of the heat stabilizer may be removed out of the resin by the vacuum accompanying the extrusion process.
따라서, 착색수지, 수지혼합물이나 강화수지 등과 같이 불투명한 용도의 제품에서는 황변현상이 어느 정도 발생하여도 제품의 색상과 외관에 크게 변화를 주지 않으므로 상기와 같은 열안정제를 일반적으로 사용할 수 있으나, 투명한 용도 특히, 고온에서 장기간 사용되는 제품에서처럼 약간의 황변현상으로도 제품의 외양에 영향을 미칠 수 있는 경우는 이들 열안정제를 사용하여 폴리카보네이트 수지의 열안정성이나 내황변성을 향상시키는 것은 어렵다.Therefore, in the case of opaque products such as colored resins, resin mixtures or reinforced resins, even if the yellowing phenomenon to some extent does not significantly change the color and appearance of the product, such a thermal stabilizer can be generally used, but transparent In particular, it is difficult to improve the thermal stability or the yellowing resistance of polycarbonate resins by using these heat stabilizers when the slight yellowing phenomenon can affect the appearance of the product as in a product used for a long time at high temperature.
본 발명의 목적은 분자량이 크고 휘발성이 작으면서 또한 열분해온도가 높은 포스파이트계와 페놀계의 열안정제를 혼합 사용하여 고온에서 장기간 사용시에도 열안정성과 내황변성이 우수한 폴리카보네이트 수지조성물을 제공하는 데 있다.It is an object of the present invention to provide a polycarbonate resin composition having excellent thermal stability and yellowing resistance even when used at a high temperature for a long time by using a mixture of a phosphite-based and phenol-based thermal stabilizer having a high molecular weight, a low volatility, and a high pyrolysis temperature. have.
이와같은 목적을 달성하기 위한 본 발명의 폴리카보네이트 수지조성물은 폴리카보네이트 수지 100 중량부, 테트라키스메틸렌(3,5-디-t-부틸-4-하이드록시하이드로시나메이트) 메탄 또는 옥타데실-3-(3,5-디-t-부틸-4-하이드록시페닐) 프로피오네이트 0.02∼0.18 중량부 및 비스(2,6-디-t-부틸-4-메틸페닐)펜타에리쓰리톨 디포스파이트 0.02∼0.18 중량부로 이루어진 것을 그 특징으로 한다.Polycarbonate resin composition of the present invention for achieving this purpose is 100 parts by weight of polycarbonate resin, tetrakisethylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate) methane or octadecyl-3 0.02 to 0.18 parts by weight of-(3,5-di-t-butyl-4-hydroxyphenyl) propionate and bis (2,6-di-t-butyl-4-methylphenyl) pentaerythritol diphosphite 0.02 It is characterized by consisting of-0.18 parts by weight.
이와같은 본 발명을 더욱 상세하게 설명하면 다음과 같다.The present invention will be described in more detail as follows.
본 발명에서 사용된 포스파이트계 열안정제는 비스(2,6-디-t-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트이며, 페놀계 열안정제는 옥타데실-3-(3,5,-디-t-부틸-4-하이드록시페닐) 프로피오네이트와 분자량이 크고 휘발성이 작으며 또한 열분해온도가 높은 테트라키스메틸렌 (3,5-디-t-부틸-4-하이드록시하이드로시나메이트) 메탄이다.The phosphite thermal stabilizer used in the present invention is bis (2,6-di-t-butyl-4-methylphenyl) pentaerythritol diphosphite, and the phenolic thermal stabilizer is octadecyl-3- (3,5, -di -t-butyl-4-hydroxyphenyl) propionate and tetrakisethylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate) methane with high molecular weight, low volatility and high pyrolysis temperature to be.
페놀계 열안정제에 있어서, 옥타데실-3-(3,5-디-t-부틸-4-하이드록시페닐) 프로피오네이트와 테트라키스메틸렌(3,5-디-t-부틸-4-하이드록시하이드로시나메이트) 메탄은 각각 단독으로 사용하거나 혼합사용할 수 있다.Octanesyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate and tetrakisethylene (3,5-di-t-butyl-4- hydride in phenolic heat stabilizers Oxyhydrocinnamate) methanes may be used alone or in combination.
포스파이트계 열안정제와 페놀계 열안정제의 첨가량은 각각 폴리카보네이트 수지 100 중량부에 대하여 0.02∼0.18 중량부인 것이 바람직하다.The amount of the phosphite thermal stabilizer and the phenol thermal stabilizer added is preferably 0.02 to 0.18 parts by weight based on 100 parts by weight of the polycarbonate resin.
만일, 포스파이트계 열안정제의 함량이 상기 범위를 벗어나 0.2 중량부 초과하더라도 그에 따른 열안정성 향상 효과가 크게 향상되지 않고 지나치게 과량으로 투입되면 오히려 물성이 감소된다. 페놀계 열안정제의 함량이 상기 범위를 벗어나면 역시 열안정성의 효과가 향상되지 않으며, 황색으로 변색될 가능성이 커지는 문제가 있다.If the content of the phosphite thermal stabilizer exceeds 0.2 parts by weight outside of the above range, the effect of improving the thermal stability is not greatly improved, and if excessively excessively added, the physical properties are reduced. If the content of the phenolic heat stabilizer is out of the above range, the effect of thermal stability is not improved, too, and there is a problem that the possibility of discoloration to yellow increases.
이러한 열안정제는 실제 수지제조 공정에서는 폴리카보네이트 수지 중합후의 압출가공공정 또는 폴리카보네이트의 컴파운딩 압출공정에서 용융혼합되며, 용도와 필요에 따라 이형제나 활제 등의 다른 첨가제들을 투입할 수도 있다.These heat stabilizers are melt mixed in the actual resin manufacturing process in the extrusion process after polycarbonate resin polymerization or the compounding extrusion process of polycarbonate, and other additives such as a release agent or a lubricant may be added depending on the use and need.
본 발명은 특히 내황변성과 열안정성이 뛰어난 폴리카보네이트에 관한 것으로, 여기서는 용액캐스팅 방법으로 열안정제들을 첨가한다.The present invention relates in particular to polycarbonates having excellent yellowing resistance and thermal stability, wherein the thermal stabilizers are added by a solution casting method.
한편, 본 발명에 사용되는 폴리카보네이트 수지는 ASTM D-1238 방법으로 측정한 용융흐름지수가 2∼15g/10분 이고, ASTM D-792 방법으로 측정한 밀도가 1.200∼1.215 g/㎤인 비스페놀 A와 포스겐으로부터 중합한 폴리카보네이트이다.On the other hand, the polycarbonate resin used in the present invention is a bisphenol A having a melt flow index of 2 to 15 g / 10 minutes measured by the ASTM D-1238 method and a density of 1.200 to 1.215 g / cm 3 measured by the ASTM D-792 method. And polycarbonate polymerized from phosgene.
이하, 본 발명을 실시예에 의거 상세히 설명하면 다음과 같은 바, 본 발명이 실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited by the Examples.
실시예 1Example 1
폴리카보네이트수지 100 중량부에 테트라키스메틸렌 (3,5-디-t-부틸-4-하이드록시하이드로시나메이트) 메탄 0.02 중량부와 비스 (2,6-디-t-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트를 0.18 중량부를 첨가하여 메틸렌 클로라이드 용매에 녹인 후 필름캐스팅방법으로 필름을 제조한 후 이를 강제순환식 오븐에서 300 ℃에서 1시간동안 가열시켜 특성을 측정하고, 그 결과를 표 1에 나타내었다.0.02 part by weight of tetrakisethylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate) methane and 100 parts by weight of polycarbonate resin and bis (2,6-di-t-butyl-4-methylphenyl) 0.18 parts by weight of pentaerythritol diphosphite was added and dissolved in a methylene chloride solvent. Then, a film was prepared by a film casting method, which was then heated in a forced-circulation oven at 300 ° C. for 1 hour to measure properties. The results are shown in Table 1 below. Indicated.
실시예 2Example 2
폴리카보네이트수지 100 중량부에 테트라키스메틸렌 (3,5-디-t-부틸-4-하이드록시하이드로시나메이트) 메탄 0.06 중량부와 비스 (2,6-디-t-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트 0.14 중량부를 첨가하여 상기 실시예 1과 동일한 방법으로 필름을 제조하였다.0.06 parts by weight of tetrakisethylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate) methane and 100 parts by weight of polycarbonate resin and bis (2,6-di-t-butyl-4-methylphenyl) 0.14 parts by weight of pentaerythritol diphosphite was added to prepare a film in the same manner as in Example 1.
실시예 3Example 3
폴리카보네이트수지 100중량부에 테트라키스메틸렌 (3,5-디-t-부틸-4-하이드록시하이드로시나메이트) 메탄 0.1 중량부와 비스 (2,6-디-t-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트 0.1 중량부를 첨가하여 상기 실시예 1과 동일한 방법으로 필름을 제조하였다.0.1 parts by weight of tetrakisethylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate) methane and 100 parts by weight of polycarbonate resin and bis (2,6-di-t-butyl-4-methylphenyl) 0.1 parts by weight of pentaerythritol diphosphite was added to prepare a film in the same manner as in Example 1.
실시예 4Example 4
폴리카보네이트수지 100 중량부에 테트라키스메틸렌 (3,5-디-t-부틸-4-하이드록시하이드로시나메이트) 메탄 0.14 중량부와 비스 (2,6-디-t-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트 0.06 중량부를 첨가하여 상기 실시예 1과 동일한 방법으로 필름을 제조하였다.0.14 parts of tetrakisethylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate) methane and 100 parts by weight of polycarbonate resin and bis (2,6-di-t-butyl-4-methylphenyl) A film was prepared in the same manner as in Example 1 by adding 0.06 parts by weight of pentaerythritol diphosphite.
실시예 5Example 5
폴리카보네이트수지 100 중량부에 테트라키스메틸렌 (3,5-디-t-부틸-4-하이드록시하이드로시나메이트) 메탄 0.18 중량부와 비스 (2,6-디-t-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트 0.02 중량부를 첨가하여 상기 실시예 1과 동일한 방법으로 필름을 제조하였다.0.18 parts by weight of tetrakisethylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate) methane and 100 parts by weight of polycarbonate resin and bis (2,6-di-t-butyl-4-methylphenyl) A film was prepared in the same manner as in Example 1 by adding 0.02 parts by weight of pentaerythritol diphosphite.
실시예 6Example 6
폴리카보네이트수지 100 중량부에 옥타데실-3-(3,5-디-t-부틸-4-하이드록시페닐) 프로피오네이트 0.14 중량부와 비스 (2,6-디-t-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트 0.06 중량부를 첨가하여 상기 실시예 1과 동일한 방법으로 필름을 제조하였다.0.14 parts by weight of octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate and 100 parts by weight of polycarbonate resin and bis (2,6-di-t-butyl-4- Methylphenyl) pentaerythritol diphosphite 0.06 parts by weight was added to prepare a film in the same manner as in Example 1.
실시예 7Example 7
폴리카보네이트수지 100 중량부에 옥타데실-3-(3, 5,-디-t-부틸-4-하이드록시페닐) 프로피오네이트 0.1 중량부와 비스 (2,6-디-3차-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트 0.1 중량부를 첨가하여 상기 실시예 1과 동일한 방법으로 필름을 제조하였다.0.1 part by weight of octadecyl-3- (3,5, -di-t-butyl-4-hydroxyphenyl) propionate and 100 parts by weight of polycarbonate resin and bis (2,6-di-tert-butyl- 4-methylphenyl) pentaerythritol diphosphite 0.1 part by weight was added to prepare a film in the same manner as in Example 1.
실시예 8Example 8
폴리카보네이트수지 100 중량부에 옥타데실-3-(3, 5,-디-t-부틸-4-하이드록시페닐) 프로피오네이트 0.06 중량부와 비스 (2,6-디-3차-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트 0.14 중량부를 첨가하여 상기 실시예 1과 동일한 방법으로 필름을 제조하였다.0.06 parts by weight of octadecyl-3- (3,5, -di-t-butyl-4-hydroxyphenyl) propionate and 100 parts by weight of polycarbonate resin and bis (2,6-di-tert-butyl- 4-methylphenyl) pentaerythritol diphosphite 0.14 parts by weight was added to prepare a film in the same manner as in Example 1.
실시예 9Example 9
폴리카보네이트수지 100 중량부에 테트라키스메틸렌 (3,5-디-t-부틸-4-하이드록시하이드로시나메이트) 메탄 0.1 중량부와 비스 (2,6-디-t-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트 0.1 중량부를 첨가하고 상기 실시예 1과 동일한 방법으로 필름을 제조하여 140℃에서 30일 동안 가열한 후 광투과도를 측정하였다.0.1 parts by weight of tetrakisethylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate) methane and 100 parts by weight of polycarbonate resin and bis (2,6-di-t-butyl-4-methylphenyl) 0.1 parts by weight of pentaerythritol diphosphite was added thereto, and a film was prepared in the same manner as in Example 1, and then heated at 140 ° C. for 30 days, and then the light transmittance was measured.
실시예 10Example 10
폴리카보네이트수지 100 중량부에 옥타데실-3-(3, 5-디-t-부틸-4-하이드록시페닐) 프로피오네이트 0.1 중량부와 비스 (2,6-디-t-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트 0.1 중량부를 첨가하고 상기 실시예 1과 동일한 방법으로 제조하여 140℃에서 30일 동안 가열한 후 광투과도를 측정하였다.0.1 part by weight of octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate and 100 parts by weight of polycarbonate resin and bis (2,6-di-t-butyl-4- 0.1 parts by weight of methylphenyl) pentaerythritol diphosphite was added and prepared in the same manner as in Example 1, and heated at 140 ° C. for 30 days to measure light transmittance.
비교예 1Comparative Example 1
폴리카보네이트수지만을 사용하여 상기 실시예 1과 동일한 방법으로 필름을 제조하였다.The film was prepared in the same manner as in Example 1 using only polycarbonate resin.
비교예 2Comparative Example 2
폴리카보네이트수지 100 중량부에 옥타데실-3-(3, 5-디-t-부틸-4-하이드록시페닐) 프로피오네이트 0.2 중량부를 첨가하여 상기 실시예 1과 동일한 방법으로 필름을 제조하였다.0.2 parts by weight of octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate was added to 100 parts by weight of polycarbonate resin to prepare a film in the same manner as in Example 1.
비교예 3Comparative Example 3
폴리카보네이트수지 100 중량부에 비스 (2,6-디-t-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트 0.2 중량부를 첨가하여 상기 실시예 1과 동일한 방법으로 필름을 제조하였다.0.2 parts by weight of bis (2,6-di-t-butyl-4-methylphenyl) pentaerythritol diphosphite was added to 100 parts by weight of polycarbonate resin to prepare a film in the same manner as in Example 1.
비교예 4Comparative Example 4
폴리카보네이트수지 100 중량부에 테트라키스메틸렌 (3,5-디-t-부틸-4-하이드록시하이드로시나메이트) 메탄 0.2 중량부를 첨가하여 상기 실시예 1과 동일한 방법으로 필름을 제조하였다.0.2 parts by weight of tetrakisethylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate) methane was added to 100 parts by weight of polycarbonate resin to prepare a film in the same manner as in Example 1.
비교예 5Comparative Example 5
열안정제를 포함하지 않는 폴리카보네이트수지를 상기 실시예 1과 동일한 방법으로 제조하여 140℃에서 30일 동안 가열한 후 광투과도를 측정하였다.The polycarbonate resin containing no heat stabilizer was prepared in the same manner as in Example 1 and heated at 140 ° C. for 30 days to measure light transmittance.
비교예 6Comparative Example 6
폴리카보네이트수지 100 중량부에 옥타데실-3-(3, 5-디-t-부틸-4-하이드록시페닐) 프로피오네이트 0.2 중량부를 첨가하고 상기 실시예 1과 동일한 방법으로 필름을 제조하여 140℃에서 30일 동안 가열한 후 광투과도를 측정하였다.0.2 parts by weight of octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate was added to 100 parts by weight of polycarbonate resin, and a film was produced in the same manner as in Example 1, 140. The light transmittance was measured after heating at 30 ° C. for 30 days.
비교예 7Comparative Example 7
폴리카보네이트수지 100 중량부에 비스 (2,6-디-t-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트 0.2 중량부를 첨가하고 상기 실시예 1과 동일한 방법으로 필름을 제조하여 140℃에서 30일 동안 가열한 후 상기의 방법으로 광투과도를 측정하였다.0.2 parts by weight of bis (2,6-di-t-butyl-4-methylphenyl) pentaerythritol diphosphite was added to 100 parts by weight of polycarbonate resin, and a film was prepared in the same manner as in Example 1 for 30 days at 140 ° C. After heating, the light transmittance was measured by the above method.
비교예 8Comparative Example 8
폴리카보네이트수지 100 중량부에 테트라키스메틸렌 (3,5-디-t-부틸-4-하이드록시하이드로시나메이트) 메탄 0.2 중량부를 첨가하고 상기 실시예 1과 동일한 방법으로 필름을 제조하여 140℃에서 30일 동안 가열한 후 상기의 방법으로 광투과도를 측정하였다.0.2 parts by weight of tetrakisethylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate) methane was added to 100 parts by weight of polycarbonate resin, and a film was prepared in the same manner as in Example 1, at 140 ° C. After heating for 30 days, the light transmittance was measured by the above method.
실험예Experimental Example
상기 실시예 및 비교예에 따라 제조된 폴리카보네이트 필름은 황변지수, 광투과도 및 분자량분포를 측정하기 위한 시료로, 25℃에서 10 중량%의 폴리카보네이트 수지조성물을 포함하는 메틸렌 클로라이드 용액으로부터 필름캐스팅 방법에 의하여 두께가 약 10 미크론 정도이며 이를 강제순환식 열오븐에서 가열시킨후 다음의 측정방법에 따라 평가되었다.Polycarbonate film prepared according to the above Examples and Comparative Examples is a sample for measuring the yellowing index, light transmittance and molecular weight distribution, the film casting method from a methylene chloride solution containing a polycarbonate resin composition of 10% by weight at 25 ℃ The thickness was about 10 microns and it was heated in a forced circulation oven and evaluated according to the following measurement method.
(평가방법)(Assessment Methods)
1. 황변지수(Yellow Index): 메틸렌 클로라이드에 녹인 용액으로 ASTM D1925-63J에 의거 측정하였다.1.Yellow Index: A solution dissolved in methylene chloride, measured according to ASTM D1925-63J.
2. 광투과도: 자외선분광기로 425nm 파장 광선의 광투과도를 측정하였다.2. Light transmittance: The light transmittance of 425 nm wavelength light beam was measured with the ultraviolet spectrometer.
3. 중량평균 분자량(Mw)과 분자량분포: 폴리카보네이트의 테트라하이드로푸란 용액을 이용하여 폴리스티렌 표준시료로 보정한 겔투과크로마토그래피법(GPC)으로 측정하였다.3. Weight average molecular weight (Mw) and molecular weight distribution: It measured by the gel permeation chromatography method (GPC) corrected with the polystyrene standard sample using the tetrahydrofuran solution of polycarbonate.
그 결과는 각각 표 2 및 표 3에 나타낸 바와 같다.The results are as shown in Table 2 and Table 3, respectively.
상기 표 1 및 2의 결과로부터, 본 발명에 따른 폴리카보네이트 수지조성물은 비교예에 따라 열안정제로서 단일 화합물을 사용한 수지조성물에 비하여 폴리카보네이트의 제품응용에서 중요하게 고려되는 내열성과 장기내열성에 따르는 광투과성 및 내황변성 등이 우수하고 분자량과 분자량분포의 유지가 양호한 제품특성을 나타냄을 알 수 있다.From the results of Tables 1 and 2, the polycarbonate resin composition according to the present invention is light according to the heat and long-term heat resistance that is considered important in the product application of polycarbonate as compared to the resin composition using a single compound as a heat stabilizer according to the comparative example It can be seen that the product characteristics are excellent, such as excellent permeability and yellowing resistance, and maintenance of molecular weight and molecular weight distribution.
이상에서 상세히 설명한 바와 같이, 본 발명에 따른 열안정제로서 테트라키스메틸렌 (3,5-디-t-부틸-4-하이드록시하이드로시나메이트) 메탄 또는 옥타데실-3-(3,5-디-t-부틸-4-하이드록시페닐) 프로피오네이트와 같은 페놀계 화합물 및 비스 (2,6-디-t-부틸-4-메틸페닐) 펜타에리스리톨 디포스파이트와 같은 포스파이트계 화합물을 혼합하여 제조된 폴리카보네이트 수지조성물은 고온내열성, 장기내열성, 내황변성 및 투명성이 양호하여 투명한 용도 특히, 고온에서 장기간 사용되는 제품에 유용하게 사용할 수 있다.As described in detail above, tetrakisethylene (3,5-di-t-butyl-4-hydroxyhydrocinnamate) methane or octadecyl-3- (3,5-di- as a heat stabilizer according to the present invention. prepared by mixing a phenolic compound such as t-butyl-4-hydroxyphenyl) propionate and a phosphite compound such as bis (2,6-di-t-butyl-4-methylphenyl) pentaerythritol diphosphite The polycarbonate resin composition has good high temperature heat resistance, long term heat resistance, yellowing resistance and transparency, and thus can be usefully used for transparent applications, especially for products used for a long time at high temperature.
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KR20150003669A (en) * | 2013-07-01 | 2015-01-09 | 주식회사 엘지화학 | Polycarbonate resin composition |
WO2022086231A1 (en) * | 2020-10-23 | 2022-04-28 | 주식회사 엘지화학 | Polycarbonate composition and molded articles thereof |
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KR20150003669A (en) * | 2013-07-01 | 2015-01-09 | 주식회사 엘지화학 | Polycarbonate resin composition |
EP3002315A4 (en) * | 2013-07-01 | 2017-03-22 | LG Chem, Ltd. | Polycarbonate resin composition |
WO2022086231A1 (en) * | 2020-10-23 | 2022-04-28 | 주식회사 엘지화학 | Polycarbonate composition and molded articles thereof |
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