KR20000006399U - Tray Holder for Semiconductor Chip Transport - Google Patents

Abstract

The present invention relates to a tray holder for carrying a plurality of semiconductor chips, wherein the trays for carrying and stacking a plurality of semiconductor chips are stacked in a plurality of layers to be combined into holding blocks on both sides. Assembled the first and second blocks and the protrusions on both sides of the stacked tray consisting of a plurality of first and second blocks formed on the one surface of the channel corresponding to the protrusions formed in the longitudinal direction on the sides corresponding to both sides of the tray do. Therefore, by assembling the trays for simply and easily stacking the semiconductor chips into blocks, the workability of the process of grouping the trays together without the damage of the trays is improved. In addition, there is no need to apply a separate automated equipment to the process of bundle the trays, there is an effect that the manufacturing cost is reduced.

Description

Tray Holder for Semiconductor Chip Transport

The present invention relates to a tray holder for transporting a semiconductor chip, and more particularly, a semiconductor for transporting stacked trays in a bundle by stacking a tray carrying and carrying a plurality of semiconductor chips in a plurality of layers and joining the holding blocks on both sides. It relates to a tray holder for chip transport.

In general, semiconductor chips are manufactured through wafer-level machining processes and chip-level assembly processes, and the completed semiconductor chips are shipped after a predetermined test process.

When shipping or moving a semiconductor chip, a flat tray having a cell structure capable of loading a plurality of them at a time is used. Usually, a plurality of trays are stacked in a stacked state.

The process of stacking a plurality of sheets is performed by manual or by using a separate automated equipment for banding, and the bundle of stacked trays is banded with a band 14 of polypropylene or electrostatic material.

In general, the tray 10 for loading a plurality of semiconductor chips has a cell structure in which individual semiconductor chips are accommodated as a rectangular flat plate as shown in FIG. 1. In addition, grooves 12 are formed at symmetrical positions adjacent to the ends of the long side portions of the individual trays 10, and the grooves 12 are used to catch the bands 14 when bending and to insert the fingers when the trays are transferred. Is used. In addition, protrusions 13 protruding in the longitudinal direction are formed at both short sides of the tray 10, and ends of the protrusions 13 are bent downward.

When stacking the individual trays 10 having the above-described structure in a plurality of layers, the empty tray located at the top is used for the cover, and the trays 10 in which the semiconductor chips are stacked are stacked thereunder.

However, in the method of stacking and bending the conventional tray 10 as described above to transfer or ship the tray 10, it is difficult to adjust the bending force, and sometimes the tray 10 is broken when bending with a force above a threshold value. Generated, it was difficult to adjust the bending length of the band (12).

In addition, the conventional tray 10 bending method has a problem in that it is required to add a difficult process of increasing the manufacturing cost or manually bending using a separate automated facility for bending.

An object of the present invention is to assemble a tray containing a plurality of semiconductor chips for transportation or shipment without damage by simply assembling a tray for loading a plurality of semiconductor chips using a holding block in a bundled state of a plurality of layers.

Another object of the present invention is to improve workability by simply fixing trays which are stacked or transported or shipped in multiple layers with holding blocks.

Further objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

1 is a perspective view illustrating a method of holding a conventional semiconductor chip tray.

2 is an assembly view showing a preferred embodiment of a tray holder for transporting a semiconductor chip according to the present invention.

The tray holder for carrying a semiconductor chip according to the present invention is formed by stacking a plurality of channels corresponding to protrusions formed in a lengthwise direction on both sides of a tray on which a plurality of semiconductor chips are stacked, the first and second blocks being formed on one surface thereof. Assemble the protrusions on both sides of the trays and the first and second blocks.

Here, the first and second blocks may be composed of an injection molding or an extrudate, and may be made of any one material of plastic, metal or alloy.

In addition, the uppermost protrusions of the first and second blocks are preferably fixed to the uppermost tray by forming a barrier at a lower portion thereof, and the end portions of the protrusions configured for channel formation may be bent upward.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

According to an embodiment of the present invention, as shown in FIG. 2, a pair of blocks 30 having a channel structure corresponding to the shape of the protrusions 22 arranged up and down on the side of the tray 20 stacked in multiple layers. ) Is configured.

Each tray 20 is formed with cells for loading a plurality of semiconductor chips on an upper surface thereof, and protruding portions 22 having predetermined lengths extending in the longitudinal direction of the short sides and end portions bent downward on both short sides of the tray 20, respectively. Is formed.

Therefore, as the trays 20 are stacked, the protrusions 22 of the trays 20 are arranged in a line up and down, and the blocks 30 are assembled with the plurality of protrusions 22 to fix the trays 20. Channels are formed on one surface, and each channel corresponds to a position where the protrusions 22 are formed, and the protrusions 22 are inserted into the channels of the holding block 30 during assembly.

The block 30 is rectangular in appearance, and the surface on which the channel for fixing the protrusions 22 of the trays 20 is formed has a length corresponding to the length of the protrusion 22, and the channel is the protrusion 22. The depth is enough to insert.

In addition, the aforementioned channels formed on one surface of the block 30 are formed in a predetermined number in a bundle unit, and as described above, the channels are vertically parallel to the protrusions 22 of the individual trays 20. It is divided by (34), the protruding jaw is formed above the end of the protrusion (34). In addition, the uppermost protrusion 32 formed to extend on the upper surface of the block extends slightly longer than the other protrusions 34 and has an obtuse shape downward. The protruding portion 32 holds the empty tray 20, which is raised for the cover at the top thereof, in a blunt shape to prevent the flow of the trays 20 during transportation or shipment.

The block 30 configured as described above is first coupled to the sides of the trays 20 in a state in which a predetermined number of trays 20 in which semiconductor chips are stacked in a predetermined number is stacked.

At this time, the protrusions 22 of the trays 20 are inserted one by one into the respective channels of the block 30, and the convex 30 is made of a solid material so that the distortion or flow is firmly supported. Therefore, when the bundles of the trays 20 are transported or shipped, gaps are generated between the trays so that semiconductor chips are not disturbed.

Here, the first and second blocks may be composed of an injection molding or an extrudate, and may be made of any one material of plastic, metal or alloy.

As described in detail above, the present invention has been described in detail with respect to the preferred embodiment, but those skilled in the art to which the present invention belongs, various modifications of the present invention without departing from the spirit and scope of the present invention It will be appreciated that the present invention may be modified or modified as described above.

Therefore, according to the present invention, there is an effect of improving the workability of a process of bundle-packing trays without damaging the tray by simply assembling the trays for stacking semiconductor chips into blocks and grouping them into a single bundle. In addition, there is no need to apply a separate automated equipment to the process of bundle the trays, there is an effect that the manufacturing cost is reduced.

Claims (6)

Protruding portions on both sides of the stacked trays comprising first and second blocks having a plurality of channels formed on a surface thereof corresponding to the protruding portions formed in the longitudinal direction on the side portions corresponding to both sides of the tray carrying the plurality of semiconductor chips. A tray holder for transporting semiconductor chips, comprising assembling the first and second blocks. The method of claim 1, The tray holder for transporting semiconductor chips, characterized in that the first and second blocks are composed of injection moldings. The method of claim 1, The first and second block is a tray holder for semiconductor chip transport, characterized in that consisting of the extrudate. The method of claim 1, The first and second blocks are semiconductor chip tray holder, characterized in that made of any one of plastic, metal or alloy. The method of claim 1, A tray holder for transporting semiconductor chips, characterized in that the uppermost protrusions of the first and second blocks secure a top tray by forming a barrier at a lower portion thereof. The method of claim 1, The tray holder for carrying a semiconductor chip, characterized in that the end portion of the protrusion formed to form the channel in the first and second blocks is bent upward.