KR19990088549A - 판모양의기판을비접촉지지하기위한공구 - Google Patents
판모양의기판을비접촉지지하기위한공구 Download PDFInfo
- Publication number
- KR19990088549A KR19990088549A KR1019990018959A KR19990018959A KR19990088549A KR 19990088549 A KR19990088549 A KR 19990088549A KR 1019990018959 A KR1019990018959 A KR 1019990018959A KR 19990018959 A KR19990018959 A KR 19990018959A KR 19990088549 A KR19990088549 A KR 19990088549A
- Authority
- KR
- South Korea
- Prior art keywords
- gas
- tool
- slit
- distribution chamber
- disposed
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 9
- 239000012530 fluid Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 30
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000012636 effector Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Abstract
Description
Claims (13)
- 평평한 바디(body)와 하나 이상의 지지표면으로 구성되고, 하나 이상의 가스 채널은 상기 바디 내에 설치되고 외부 가스 공급 단부로부터 내부 가스 배출 단부까지 뻗어있으며, 상기 배출 단부는 가스 분배 챔버와 연결되어 유체를 이동시키고, 상기 가스 분배 챔버를 통해 가스는 지지면과 평행하게 배치되고 외주와 90。 이상, 180。 이하의 각 α를 이루며 지지면으로 연장 구성된 동적 균형을 유지하는 가스 슬릿으로 통과하는, 판 모양의 기판을 비접촉 지지하기 위한 공구.
- 제 1 항에 있어서, 가스 분배 챔버는 가스 슬릿의 높이보다 더 높은 높이를 가지는 것을 특징으로 하는 공구.
- 제 1 항에 있어서, 가스 분배 챔버는 고리 모양을 취하는 것을 특징으로 하는 공구.
- 제 1 항에 있어서, 가스 슬릿은 가스 분배 챔버에 대해 방사상으로 배치되는 것을 특징으로 하는 공구.
- 제 1 항에 있어서, 가스 분배 챔버와 가스 슬릿은 바디 내부의 공동 표면과 공동 내부에 배치된 판 모양의 덮개의 대응하는 표면 사이에 배치되는 것을 특징으로 하는 공구.
- 제 5 항에 있어서, 상기 덮개는 바디에 단단히 고정되는 것을 특징으로 하는 공구.
- 제 5 항에 있어서, 스프레더는 덮개의 바닥면과 공동의 상부면 사이에 배치되는 것을 특징으로 하는 공구.
- 제 7 항에 있어서, 상기 스프레더는 방사상으로 뻗어있는 리브(rib)로 만들어지는 것을 특징으로 하는 공구.
- 제 7 항에 있어서, 상기 스프레더는 덮개 또는 바디의 각 부분인 것을 특징으로 하는 공구.
- 제 1 항에 있어서, 가스 채널의 배출 단부는 가스 슬릿에 대해 편심 배치되는 것을 특징으로 하는 공구.
- 제 1 항에 있어서, 가스 슬릿은 가스 배출 단부의 방향으로 좁아지는 것을 특징으로 하는 공구.
- 제 1 항에 있어서, 서로에 대해 이격되어 배치되고 가스 슬릿과 떨어져 지지면에 대해 수직으로 뻗어있는 둘 이상의 안내 장치로 이루어지는 것을 특징으로 하는 공구.
- 제 1 항에 있어서, 대향하여 배치된 제 1, 제 2 지지면, 둘 이상의 가스 채널, 두 개의 가스 분배 챔버 및 제 1, 제 2 지지면으로 각각 뻗어있는 두 개의 가스 슬릿으로 구성되는 것을 특징으로 하는 공구.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8735998P | 1998-05-29 | 1998-05-29 | |
US09/087,359 | 1998-05-29 | ||
US9/087,359 | 1998-05-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990088549A true KR19990088549A (ko) | 1999-12-27 |
KR100498779B1 KR100498779B1 (ko) | 2005-07-01 |
Family
ID=22204717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-1999-0018959A KR100498779B1 (ko) | 1998-05-29 | 1999-05-26 | 판 모양의 기판을 비접촉 지지하기 위한 공구 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5967578A (ko) |
EP (1) | EP0961309B1 (ko) |
JP (1) | JP3401637B2 (ko) |
KR (1) | KR100498779B1 (ko) |
AT (1) | ATE246399T1 (ko) |
DE (1) | DE69909893T2 (ko) |
TW (1) | TW417144B (ko) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
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US6322116B1 (en) * | 1999-07-23 | 2001-11-27 | Asm America, Inc. | Non-contact end effector |
US6481951B1 (en) * | 1999-09-16 | 2002-11-19 | Applied Materials, Inc. | Multiple sided robot blade for semiconductor processing equipment |
JP4391655B2 (ja) | 2000-02-22 | 2009-12-24 | インターナショナル・ビジネス・マシーンズ・コーポレーション | エアピンセット |
US6517130B1 (en) * | 2000-03-14 | 2003-02-11 | Applied Materials, Inc. | Self positioning vacuum chuck |
US6631935B1 (en) | 2000-08-04 | 2003-10-14 | Tru-Si Technologies, Inc. | Detection and handling of semiconductor wafer and wafer-like objects |
US6497403B2 (en) | 2000-12-28 | 2002-12-24 | Memc Electronic Materials, Inc. | Semiconductor wafer holder |
US6601888B2 (en) | 2001-03-19 | 2003-08-05 | Creo Inc. | Contactless handling of objects |
US6638004B2 (en) | 2001-07-13 | 2003-10-28 | Tru-Si Technologies, Inc. | Article holders and article positioning methods |
US6615113B2 (en) | 2001-07-13 | 2003-09-02 | Tru-Si Technologies, Inc. | Articles holders with sensors detecting a type of article held by the holder |
US6935830B2 (en) * | 2001-07-13 | 2005-08-30 | Tru-Si Technologies, Inc. | Alignment of semiconductor wafers and other articles |
CA2455283A1 (fr) * | 2004-01-26 | 2005-07-26 | Rejean Leblond | Systeme universel de securite (s.u.s.) |
TWI235412B (en) * | 2004-08-10 | 2005-07-01 | Ind Tech Res Inst | Method for manufacturing bonded wafer with ultra-thin single crystal ferroelectricity film |
US7354649B2 (en) | 2004-08-20 | 2008-04-08 | Semitool, Inc. | Semiconductor workpiece |
US20060040111A1 (en) * | 2004-08-20 | 2006-02-23 | Dolechek Kert L | Process chamber and system for thinning a semiconductor workpiece |
US20060046499A1 (en) * | 2004-08-20 | 2006-03-02 | Dolechek Kert L | Apparatus for use in thinning a semiconductor workpiece |
US7193295B2 (en) * | 2004-08-20 | 2007-03-20 | Semitool, Inc. | Process and apparatus for thinning a semiconductor workpiece |
US7288489B2 (en) * | 2004-08-20 | 2007-10-30 | Semitool, Inc. | Process for thinning a semiconductor workpiece |
DE102004045957A1 (de) * | 2004-09-22 | 2006-04-06 | Singulus Technologies Ag | Vorrichtung zum Halten und Transportieren eines Werkstücks mit einer ebenen Oberfläche |
JP4541824B2 (ja) * | 2004-10-14 | 2010-09-08 | リンテック株式会社 | 非接触型吸着保持装置 |
WO2007020008A2 (de) * | 2005-08-16 | 2007-02-22 | Josef Moser | Bewegungseinrichtung mit doppelseitigem saugbalken |
JP2007214529A (ja) * | 2006-01-13 | 2007-08-23 | Fluoro Mechanic Kk | ベルヌーイチャック |
CN102369088B (zh) * | 2009-03-31 | 2015-03-25 | Ats自动化加工系统公司 | 由弹簧稳定的真空抓持器组件 |
US10707099B2 (en) | 2013-08-12 | 2020-07-07 | Veeco Instruments Inc. | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle |
JP6128050B2 (ja) * | 2014-04-25 | 2017-05-17 | トヨタ自動車株式会社 | 非接触型搬送ハンド |
US9499908B2 (en) | 2015-02-13 | 2016-11-22 | Eastman Kodak Company | Atomic layer deposition apparatus |
US9506147B2 (en) | 2015-02-13 | 2016-11-29 | Eastman Kodak Company | Atomic-layer deposition apparatus using compound gas jet |
US9528184B2 (en) | 2015-02-13 | 2016-12-27 | Eastman Kodak Company | Atomic-layer deposition method using compound gas jet |
US9499906B2 (en) | 2015-02-13 | 2016-11-22 | Eastman Kodak Company | Coating substrate using bernoulli atomic-layer deposition |
CN106298618A (zh) * | 2015-06-26 | 2017-01-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 晶片传输装置 |
US10373858B2 (en) | 2016-04-06 | 2019-08-06 | Lam Research Corporation | Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal |
TWI797121B (zh) | 2017-04-25 | 2023-04-01 | 美商維克儀器公司 | 半導體晶圓製程腔體 |
CN110612601B (zh) * | 2017-05-11 | 2023-08-22 | 日商乐华股份有限公司 | 薄板状衬底保持指状件以及具有该指状件的运送机器人 |
JP2020535349A (ja) * | 2017-09-25 | 2020-12-03 | ダブリュシービー ロボティクス インコーポレイテッドWcb Robotics Inc. | 高流量低圧吸引デバイス |
FR3084518B1 (fr) * | 2018-07-25 | 2020-10-30 | Commissariat Energie Atomique | Dispositif de prehension d'une structure monocouche ou multicouche comportant un element de prehension rotatif et thermique |
GB202215215D0 (en) | 2022-10-14 | 2022-11-30 | Lam Res Ag | Device for conveying a wafer-shaped article |
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US3438668A (en) * | 1965-08-26 | 1969-04-15 | Gen Electric | Contactless lifter |
US3523706A (en) * | 1967-10-27 | 1970-08-11 | Ibm | Apparatus for supporting articles without structural contact and for positioning the supported articles |
US3539216A (en) * | 1968-01-11 | 1970-11-10 | Sprague Electric Co | Pickup device |
GB1513444A (en) * | 1974-09-06 | 1978-06-07 | Chemical Reactor Equip As | Pick-up devices for lifting and moving semiconductor wafers |
DE2609754A1 (de) * | 1976-03-09 | 1977-09-22 | Wacker Chemitronic | Halterung fuer das beidseitig beruehrungslose aufnehmen von scheiben |
JPS6351446U (ko) * | 1986-09-22 | 1988-04-07 | ||
US5080549A (en) * | 1987-05-11 | 1992-01-14 | Epsilon Technology, Inc. | Wafer handling system with Bernoulli pick-up |
AT389959B (de) * | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
GB8815553D0 (en) * | 1988-06-30 | 1988-08-03 | Mpl Precision Ltd | Vacuum chuck |
ATE171306T1 (de) * | 1993-02-08 | 1998-10-15 | Sez Semiconduct Equip Zubehoer | Träger für scheibenförmige gegenstände |
ATE174155T1 (de) * | 1993-02-08 | 1998-12-15 | Sez Semiconduct Equip Zubehoer | Träger für scheibenförmige gegenstände |
WO1997003456A1 (de) * | 1995-07-12 | 1997-01-30 | Sez Semiconductor-Equipment Zubehör Für Die Halbleiterfertigung Gesellschaft Mbh | Träger für scheibenförmige gegenstände, insbesondere siliziumscheiben |
-
1998
- 1998-05-29 US US09/087,359 patent/US5967578A/en not_active Expired - Lifetime
-
1999
- 1999-04-21 JP JP15037899A patent/JP3401637B2/ja not_active Expired - Lifetime
- 1999-05-14 DE DE69909893T patent/DE69909893T2/de not_active Expired - Lifetime
- 1999-05-14 AT AT99109589T patent/ATE246399T1/de active
- 1999-05-14 EP EP99109589A patent/EP0961309B1/en not_active Expired - Lifetime
- 1999-05-26 KR KR10-1999-0018959A patent/KR100498779B1/ko not_active IP Right Cessation
- 1999-05-28 TW TW088108863A patent/TW417144B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW417144B (en) | 2001-01-01 |
EP0961309B1 (en) | 2003-07-30 |
EP0961309A3 (en) | 2001-08-29 |
JPH11354611A (ja) | 1999-12-24 |
EP0961309A2 (en) | 1999-12-01 |
KR100498779B1 (ko) | 2005-07-01 |
DE69909893D1 (de) | 2003-09-04 |
JP3401637B2 (ja) | 2003-04-28 |
US5967578A (en) | 1999-10-19 |
ATE246399T1 (de) | 2003-08-15 |
DE69909893T2 (de) | 2006-10-05 |
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