KR19990086965A - Insulation plate for absorption of sound absorption of reinforced concrete structures and its manufacturing method - Google Patents

Abstract

The present invention disperses and absorbs shocks, vibrations, noises, etc. from the outside of multi-layered buildings, in particular, reinforced concrete structures in multiple directions. The insulating plate has a structure in which a foamed rubber layer, a metal foil layer, and a rubber chip layer are laminated in this order. After the foamed rubber layer is a flat plate of a conveyor system, the metal foil is adhered thereon, and then a rubber compound and a binder compound are coated thereon. Thereafter, by maintaining a constant temperature and pressure, it is produced by a method of adhesively bonding the three layers integrally.

Description

Insulation plate for absorption of sound absorption of reinforced concrete structures, and its manufacturing method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sound absorbing and insulating plate used in a multi-layered structure, in particular, a reinforced concrete structure, and a method of manufacturing the same. This structure is to disperse external shocks, vibrations, noises, etc. in multiple directions, thereby exhibiting excellent sound absorption and durability in a multi-layered structure.

Background Art Conventionally, dustproof rubber, which has been widely used in the form of a supporting member or a laminated member in a vehicle, a mechanical equipment, an air conditioning equipment, a ship, a building, a heavy equipment, an electronic field, or a sports article, has been used as a sound absorbing and insulating plate for a building. The rubber used as the main raw material for dust-proof rubber was ethylene-propylene rubber. However, the absorption and impact resistance of such ethylene-propylene rubber mainly satisfied only a limited range of requirements as a structural material for buildings, and ethylene-propylene rubber. Rubber has high hardness, low damping coefficient and dynamic modulus of elasticity, so it is difficult to expect the desired dust absorption, impact resistance and low rebound elasticity in practical applications.

As part of efforts to improve the dust-absorbing property of rubber, Korean Patent Publication No. 93-7695 (dust-proof and dust-absorbing rubber composition), blends two different rubbery norbornene polymers or one rubbery norbornene polymer Natural rubber, butyl rubber (IIR), ethylene-propylene-diene terpolymer (EPDM) rubber, chloroprene rubber (CR), styrene-butadiene rubber (SBR), etc. In the three-component system, it is disclosed that the process oil is added to be blended. However, such a composition is superior in strength and low hardness to conventional impact resistant rubber compositions or mixed compositions of rubber, silica, polymer resin, talc, and the like. Although it shows shock absorbency, the rubber composition itself changes the external shock in only one direction, so that the shock absorbency is not satisfactory. The disadvantage is that it is not economical.

On the other hand, in order to prevent environmental pollution by recycling resources, the rubber chip structure manufactured by combining a large amount of rubber chips processed into a chip size of a certain size by grinding with a powder processing method with an adhesive is sound-absorbed and dustproof. However, it has been studied how to use it as an insulating plate for insulation. However, only the structure of the rubber chip itself does not exhibit the absorption, sound absorption, heat insulation, and thermal insulation required in a multi-layered building, and does not satisfy the durability required as a building material. It became.

Accordingly, an object of the present invention is to solve the problems of the physical properties of various vibration absorbing insulation plates which have been conventionally used in a multi-layered structure. Specifically, the object of the present invention is to absorb sound absorbing using vibration-proof rubber. This is to overcome the problems of the physical properties of the insulating plate for absorption and the physical properties of the insulating plate for absorption of vibration using rubber chips.

1 is a perspective view showing a part of a vacuum absorbing and insulating plate according to the present invention,

Figure 2a is an analysis showing a load-displacement graph of the insulating plate according to the present invention,

Figure 2b is an analysis showing a load-displacement graph of the conventional natural carbon cork board,

Figure 2c is an analysis showing a load-displacement graph of a conventional rubber chip,

Figure 2d is an analysis showing a load-displacement graph of a conventional rubber chip sidewalk block,

Figure 3 is a manufacturing process diagram showing a step-by-step method of manufacturing a vacuum absorbing insulating plate according to the present invention in a conveyor system.

Explanation of symbols for the main parts of the drawings

A: metal foil layer E: rubber chip or rubber chip layer

B: Foam rubber layer F: Hopper

C: Conveyor Belt G: Compression Roller

D: Moving rotary roller H: Heating chamber

The present invention relates to a sound absorbing and insulating plate for a multi-layered structure, specifically, a flooring material having a structure in which a metal foil layer is bonded to a foam rubber layer, and a layer of rubber chips of a predetermined size is sequentially stacked thereon.

Referring to the present invention, the insulating plate through the drawings, as shown in Figure 1, has a structure in which the foamed rubber layer (B) and the rubber chip layer (E) are bonded to the upper and lower surfaces of the metal foil layer (A), respectively.

The foamed rubber layer (B) has a function of absorbing sound absorption and a uniform dispersion of waterproofing and load. The foamed rubber which can be used in the present invention includes natural rubber (NR), nitrile butadiene rubber (NBR), styrene butadiene rubber (SBR), Chloroprene rubber (CR), ethylene-propylene-diene terpolymer (EPDM), and the like, of which EPDM is most preferred. The foamed rubber layer includes ZnO, stearic acid, filler, process oil, vulcanizing agent, accelerator, foaming agent. And one or more mixtures selected from the group consisting of carbon. The thickness of the foam rubber layer is 0.5 to 10 mm, preferably 1 to 3 mm.

The metal foil layer (A) serves to disperse the shock, vibration and / or noise transmitted from the foamed rubber layer or the rubber chip layer in multiple directions to other layers, as well as reflecting radiant heat transmitted from other layers to insulate and insulate. The metal foil layer used in the present invention may be any metal which disperses mechanical energy in multiple directions and reflects radiant heat. Preferably, stainless steel or aluminum is used. Alloys with aluminum metal and / or other metals having a thickness of 2 mm may be used.

The rubber chip layer (E) is formed in the form of an aggregate in which a plurality of chips having a diameter of 2 to 7 mm, preferably 3 to 4 mm are bonded to each other by a binder, and a mixture of natural rubber, synthetic rubber, natural rubber and synthetic rubber Various rubbers may be used. Preferably, in terms of cost reduction and recycling of resources, tire chips made of used tires in the form of chips may be used, and the main component is natural rubber. If the thickness is less than ㎜, there are almost no voids between the rubber chips and the cushioning effect of the rubber chips is reduced, whereas if the diameter of the rubber chips is 5 mm or more, the voids become too large and the deflection phenomenon becomes severe and the adhesion between the rubber chips is large. Later, it is difficult to maintain the shape of the product. Latex (Ratex), chloroprene rubber (CR) or polyurethane are used as binders that play a role of interconnecting rubber chips. Preferably, polyurethane is used. The weight ratio of the rubber chip to the binder is preferably about 9: 1 to 12: 1, and when it is 12: 1 or more, it is possible to form a shape, but it is poor in durability. When the ratio is less than or equal to 1, the bonding ratio is high and economical. The thickness of the rubber chip layer is 8 to 20 mm, preferably 10 to 15 mm.

Bonding of the foamed rubber layer and the metal foil layer may be performed by various methods such as bonding by a general adhesive and bonding by thermal fusion. Examples of the adhesive that may be used for the bonding include a synthetic resin, a latex, a polyurethane, a rubber, and the like. Synthetic resins have a relatively low cure rate but are inexpensive. Polyurethanes have a high rate of cure but are expensive. Rubbers have a high rate of cure and are moderately priced. Latexes have a relatively low rate of cure.

The bonding of the metal foil layer and the foamed rubber layer may be performed by various methods such as adhesion by a general adhesive or adhesion by thermal fusion. Meanwhile, after temporarily applying a rubber chip layer to a thin metal layer coated with a synthetic resin film such as polyethylene, There is also a method in which the film is melted by applying heat and pressure to bond to the metal foil layer and the rubber chip layer.

The absorption plate of the present invention can be used as a flooring of a multi-layered building. The building can be used in any type of building as long as the building has a multi-layered structure such as reinforced concrete building, steel concrete building, and reinforced steel concrete building. It is useful for reinforced concrete buildings. The insulating plate of the present invention can be mounted on the slab surface of a building, and light-weight foamable concrete can be applied thereon.

The rubber chip of the present invention has a feature of good adhesion to the slab surface. That is, the surface of the rubber chip interconnected in a random form easily adheres to the slab surface, and thus almost independent of the smoothness of the slab surface. In addition, the structure of the rubber chips interconnected in a random form reduces the transmission speed of shocks, vibrations and / or noises, and the space formed between the rubber chips contributes to the improvement of absorbing force against such shocks. Done.

In the above description, the sound absorbing and insulating plate of the present invention is described as a three-layer structure of a foamed rubber layer, a metal foil layer, and a rubber chip layer. However, if necessary, a three-layer structure may be added by adding another layer to the three-layer structure, or such a three-layer structure. It can also be set as a multilayered structure by repetition of.

The dustproof and sound-absorbing insulating plate of the present invention also has excellent durability, which has a deep relationship with the elasticity of the insulating plate itself.

2A attached to the present specification shows a load-displacement graph of the insulating plate according to the present invention, in which the vertical axis represents the load (kg) and the horizontal axis represents the displacement (mm). Since the constant is linear, not only does it show excellent recoverability when it is removed after applying the load, but also the energy accumulated inside when the load is applied is consumed to restore the original state when the load is removed, so that the fatigue phenomenon of the structure does not occur. The elimination of this fatigue phenomenon plays an important role in the durability of the insulating plate, and the small spring constant value (1500 kg / mm / m 2) is beneficial for the improvement of the vibration and sound absorption against shock, vibration and noise. 2b to 2d show load-displacement graphs of conventional natural carbon cork boards (natural oak bark), rubber chips and board blocks, respectively. The number is not a linear value that can also be seen that the displacement is more stable as a very good anti-vibration and sound-absorbing effect, if the anti-vibration and sound-absorbing insulating sheet of high-bar, the present invention compared to the insulation panel of the present invention.

The present invention also relates to a method for producing such a vacuum absorbing and insulating plate.

After adhering the metal foil to the foamed rubber, the mixture of rubber chip and binder is applied, and then it can be produced at a pressure of 10 to 30 kg / cm 3 under a temperature of 100 to 200 ° C. for 1 to 5 minutes. In this case, it is difficult to exhibit the re-performance of the accelerator, and in the case of 200 ° C. or more, crosslinking occurs too early to cause heat resistance. When the pressure is 10 kg / cm 3 or less, there is a problem in weakening the rubber chip bonding force and maintaining smoothness. In the case of 30 kg / cm 3 or more, there is a problem in that the voids are reduced too much.

The vacuum absorbing and insulating plate of the present invention can be manufactured not only in a mold but also in a continuous process using a conveyor system, thereby increasing production efficiency.

An example using a conveyor system is shown in Fig. 3. First, after bonding the metal foil layer A to the foamed rubber layer B, it is moved by driving the rotary roller D on the conveyor belt C: (Step 1) In some cases, the bonding process between the foamed rubber layer (B) and the metal foil layer (A) can also be carried out on the conveyor belt (C). Here, the rubber chip (E) coated with the adhesive is hopper ( Sprinkle it onto the metal foil layer (A) via hopper: (F): (Step 2) Apply pressure on the rubber chip with a compression roller (C) to even out the surface of the rubber chip layer and crowd the coarse accumulated rubber chips. (Step 3). The laminated plate of insulating structure is passed through a heating chamber (H) at 100 to 200 ° C. to bond the rubber chips to each other, and to bond the rubber chip layer and the metal foil layer to each other (Step 4). Pressurize with G) to complete the adhesion (step 5).

Hereinafter, the content of the present invention will be described in more detail with reference to Examples, but the content of the present invention is not limited to the Examples.

Example

1) Preparation of EPDM Foam Rubber

5% zinc oxide, 1% stearic acid, 10% calcium carbonate as filler, 15% process oil, 2% sulfur as vulcanizing agent, tetramethylthiurab disulfide (TMTD) 1.7% as a promoter And 1% mercaptobenzothiazole (MBT), 20% OBSH (P, P`oxybis (benzene sulfonyl hydrazidel)) and / or CF (Azodicarbonamide) as a blowing agent, and 25% HAF, carbon black as a filler, After mixing at the kneader, let it stand at room temperature to mature, and then cool by cutting to match the thickness and width with a curry. The unfoamed rubber is foamed by applying an appropriate temperature and pressure.

2) Manufacture of rubber chip layer

The waste tire is cut to a length of about 3 mm by a powder processing method, and then formed into chips. Then, a latex-based binder is blended with rubber chips: binder (weight ratio) = 10: 1.

3) forming and gluing

Prepare the roll to which the aluminum foil and the EPDM foam rubber layer are adhered to the conveyor, and set the machine so that the mixture of rubber chip and binder can be sprayed at a certain speed through the hopper. After applying a pressure of kg / cm 3 to compact the rubber layer, a pressure of 15 kg / cm 3 is applied at intervals of 5 minutes at a temperature of 160 ° C. to obtain an insulating plate for absorbing sound absorption.

As described above, since the vibration absorbing and insulating plate of the present invention has three layers of a foamed rubber layer, a metal foil layer, and a rubber chip layer as a basic structure, the foamed rubber layer primarily absorbs shock, vibration, and / or noise transmitted from the outside. Energy is absorbed by the metal foil layer and is dispersed in multiple layers by the metal foil layer to absorb the rubber chip layer, thereby exhibiting excellent dust and sound absorbing effect, and also having excellent durability. There is also an effect of improving heat insulation and heat retention.

Claims (5)

Absorption-absorption insulation board of multi-layered structure with continuous structure of foam rubber layer, metal foil layer and rubber chip layer. The method of claim 1, wherein the foamed rubber layer is made of ethylene-propylene-diene terpolymer (EPDM), the metal foil layer is made of aluminum foil, the rubber chip layer is a rubber chip having a diameter of 2-7 mm to the adhesive Absorption-absorption insulation plate of multi-layered structure, which is a collection of rubber chips interconnected by According to claim 2, wherein the thickness of the foam rubber layer is 0.5 to 10mm, the thickness of the metal foil layer is 0.01 to 2mm, the thickness of the rubber chip layer is 8 to 20mm, the weight ratio of the adhesive to the rubber chip Is a 9: 1 to 12: 1 absorption sound absorption plate of a multi-layer structure. 4. The sound absorbing and insulating plate according to claim 2 or 3, wherein the rubber chip is a tire chip and the adhesive is polyurethane. After adhering the metal foil to the foamed rubber, the compound of rubber chip and adhesive is applied onto the metal foil, and then subjected to a temperature of 100 to 200 ° C. and a pressure of 10 to 30 kg / cm 2 for 1 to 5 minutes. A method for producing a sound absorbing and insulating plate of the multi-layered building of claim 5.