KR19990086180A - Leveling system of exposure equipment for semiconductor device manufacturing - Google Patents

Abstract

Disclosed is a leveling system of exposure equipment for manufacturing a semiconductor device. The present invention provides a leveling system for exposure equipment for manufacturing a semiconductor device including a light source unit, a position detection unit, a leveling control unit, and the like. The light source unit has light size adjusting means for adjusting the size of the light to emit the adjusted light. The light source unit includes light emitting means for emitting light and a collimate lens for converting the emitted light into balanced light. As the light size adjusting means, a moving means for changing the distance between the light emitting means and the collimating lens, an aperture or a revolver introduced in front of the collimating lens, or the like is used. The revolver has circular light transmissions of various sizes formed in the opaque body on concentric circles and controls the size of the balanced light passing through the circular light transmission.

Description

Leveling system of exposure equipment for semiconductor device manufacturing

TECHNICAL FIELD The present invention relates to a semiconductor device, and more particularly, to a leveling system of an exposure apparatus for leveling a semiconductor substrate.

Among the processes of manufacturing a semiconductor device, there is a process of using an exposure equipment such as a stepper. One of the important elements of the exposure process is a process in which the exposure surface, that is, the semiconductor substrate, maintains a constant angle, for example, perpendicular to the optical axis of the exposure light. To this end, a leveling process for adjusting the inclination of the exposure surface of the semiconductor substrate mounted on the exposure equipment is involved.

The leveling process corrects tilt distortion such as bending or torsion of the semiconductor substrate generated by the previous process. In other words, due to the distortion, the exposure surface is not perpendicular to the exposure optical axis in any unit chip or shot on the semiconductor substrate, making it difficult to focus the reticle image over the entire surface of the chip. do. By correcting this, the inclination of the semiconductor substrate is adjusted so that the image plane accurately obtains a sharp image over the entire chip surface on the semiconductor substrate.

1 schematically shows a conventional leveling system.

Conventional leveling systems convert light 15 emitted from light emit diodes (hereinafter referred to as " LEDs ") 10 from collimate lens 20 to planar light 25. The plane light 25 is incident on the semiconductor substrate 40. The cross section of the incident light, that is, the leveling detection surface 29, becomes a circle having a diameter of 19 mm. The center of the leveling detection surface 29 coincides with the center of the exposure field, and the reflected light 27 reflected on the semiconductor substrate 40 is focused by the condenser lens 50 and condensed by the detector 55. It is detected by the position signal. The surface inclination of the semiconductor substrate 40 may be known by the position signal detected by the detector 55. The driving signals 33 and 35, except for the fixed shaft 31, of the three axes of the leveling stage 30 on which the semiconductor substrate 40 is placed are driven by the position signal to adjust the inclination of the semiconductor substrate 40. do.

2 is a view schematically illustrating a problem of a conventional leveling system.

As described with reference to FIG. 1, in the leveling system, the size of the leveling detection surface 29 is fixed to a circle with a diameter of 19 mm. Accordingly, various problems may occur in leveling when used in various semiconductor devices having various shot sizes (or step pitches) 49 or chip sizes.

For example, accurate leveling is difficult when the shot 49 size is smaller than the leveling detection surface 29. That is, even in the normal leveling target area 47 where the normal leveling of FIG. 2 is performed, the area covered by the size of the leveling detection surface 29, that is, the area wider than the shot size, is not leveled in the specific shot 49. Can be measured by zone. As a result, shot leveling may be inaccurate and measurement reproducibility may be degraded.

In addition, at the edge of the semiconductor substrate 41, the leveling detection surface 29 is fixed as described above, so that the leveling detection surface 29 is out of the semiconductor substrate 41 or the focus or the leveling region 43 is not included. an area within 3 mm from the edge) and the like. As a result, the leveling may not be substantially performed at an edge such as the leveling impossible region 43 of the semiconductor substrate 41 or the shift leveling target region 45 adjacent thereto. In the shift leveling region 45, the measurement data data of the nearest shot 49 is used as a shortcut, or the leveling stage 30 is shifted into the leveling region 43 and measured at the position. The exposure process is performed by driving the leveling stage 30 using the data measured by the shift leveling. Accordingly, accurate leveling is difficult to implement at the edge. Therefore, the shot is centered in an area approximately 12.5 mm from the edge of the semiconductor substrate 41, that is, 3 mm of the leveling-free region 43 plus the radius 9.5 mm of the leveling detection surface 29. At (49) accurate leveling is difficult.

The technical problem to be achieved by the present invention is to adjust the size of the leveling detection surface according to the size of the shot to accurately measure the shot tilting by accurately measuring the shot leveling, as in the edge of the semiconductor substrate to close the measurement data to the leveling The present invention provides a leveling system for exposure equipment for manufacturing semiconductor devices, which can minimize the number of shots used and reduce the size of the leveling surface of the lever, thereby improving the accuracy of shot leveling at the edge.

1 and 2 are schematic diagrams for explaining a conventional leveling system.

3 to 5 are diagrams schematically illustrating a leveling system according to a first embodiment of the present invention.

6 and 7 are schematic views for explaining a leveling system according to a second embodiment of the present invention.

8 is a diagram schematically illustrating a leveling system according to a third embodiment of the present invention.

In order to achieve the above technical problem, an aspect of the present invention provides a leveling system of exposure equipment for manufacturing a semiconductor device including a light source unit, a position detector, and a leveling controller.

The light source unit has a light size adjusting means for adjusting the size of the light to emit the adjusted light. The scaled light has a size of about 100% to about 10% of the maximum exposure range of the exposure equipment. Preferably, the sized light has a size of about 22 mm to 2.2 mm in diameter. The light source unit includes light emitting means for emitting light and a collimated lens for converting the emitted light into balanced light. As the light emitting means, a light emitting diode is used. The light size adjusting means is provided as a moving means for changing the distance between the light emitting means and the collimating lens. The moving means changes the position of the light emitting means relative to the collimated lens. Alternatively, the light adjusting means is introduced in front of the collimating lens to adjust the size of the balanced light. The optical size adjusting means introduced in front of the collimated lens uses an aperture or a revolver. The revolver has circular light transmitting parts of various sizes formed in the opaque body on concentric circles and adjusts the size of the balanced light passing through the circular light transmitting parts.

Light irradiated from the light source unit is incident on the surface of the semiconductor substrate and reflected by the surface of the semiconductor substrate. The position detector detects the reflected light and detects an inclination of the semiconductor substrate as a signal. The position detector includes a condenser lens for condensing the reflected light and a position detector having a sensor for detecting the condensed light.

The leveling controller adjusts the inclination of the semiconductor substrate with the signal detected by the position detector. The leveling controller includes a leveling stage for supporting the semiconductor substrate and having a driving means, and a stage controller for driving the driving means by receiving a signal detected by the position detector to adjust the inclination of the leveling stage.

In order to achieve the above technical problem, another aspect of the present invention provides a leveling system of an exposure apparatus for manufacturing a semiconductor device including a light emitting unit, a collimating lens, a light size adjusting unit, a position detecting unit and a leveling adjusting unit.

The light emitting means emits light. The collimated lens converts the emitted light into balanced light. The light size adjusting means includes moving means for adjusting the size of the balanced light by changing a distance between the light emitting means and the collimating lens. The scaled balanced light has a size of about 100% to about 10% of the maximum exposure range of the exposure equipment. Preferably, the scaled balanced light has a size of about 22 mm to 2.2 mm in diameter. The moving means changes the position of the light emitting means relative to the collimated lens.

The scaled balanced light is incident and reflected on the surface of the semiconductor substrate. The position detector detects the reflected light reflected from the surface of the semiconductor substrate and detects the inclination of the semiconductor substrate as a signal. The leveling controller adjusts the inclination of the semiconductor substrate with the signal detected by the position detector.

In order to achieve the above technical problem, another aspect of the present invention provides a light emitting means for emitting light, a collimating lens for converting the emitted light into a balanced light, and introduced in front of the collimating stove to adjust the size of the balanced light. An optical size adjusting means having an aperture, a semiconductor substrate into which the adjusted balanced light is incident on a surface, a position detecting unit detecting a slope of the semiconductor substrate as a signal by detecting reflected light reflected from the surface of the semiconductor substrate, and the position Provided is a leveling system for exposure equipment for manufacturing a semiconductor device, including a leveling control unit for adjusting the inclination of the semiconductor substrate with a signal detected by the detection unit. The scaled balanced light has a size of about 100% to about 10% of the maximum exposure range of the exposure equipment. Preferably, the scaled balanced light has a size of about 22 mm to 2.2 mm in diameter.

In order to achieve the above technical problem, another aspect of the present invention provides a light emitting means for emitting light, a collimating lens for converting the emitted light into a balanced light, various sizes introduced in front of the collimating lens and formed in an opaque body. Means for adjusting the size of the balanced light passing through the circular light transmitting part on a concentric circle of the optical light adjusting means, a semiconductor substrate on which the adjusted balanced light is incident on a surface of the semiconductor substrate; Leveling of exposure equipment for manufacturing a semiconductor device comprising a position detecting unit for detecting the reflected light reflected from the surface to detect the inclination of the semiconductor substrate as a signal and a leveling adjusting unit for adjusting the inclination of the semiconductor substrate with the signal detected by the position detecting unit. Provide a system. The circular light transmitting part has a diameter of about 100% to 10% of the maximum exposure range of the exposure apparatus as a diameter to adjust the size of the balanced light passing through about 100% to 10% of the maximum exposure range. Preferably, the circular light transmitting portion has a size of about 22 mm to 2.2 mm in diameter to adjust the size of the passing balanced light to about 22 mm to 2.2 mm.

According to the present invention, the size of the leveling detection surface can be adjusted according to the size of the shot, so that shot tilting can be accurately measured to effectively compensate for the shot tilt, and the number of shots that use proximity measurement data for leveling, such as at the edge of a semiconductor substrate. It is possible to provide a leveling system of exposure equipment for manufacturing a semiconductor device, which can minimize the size and reduce the size of the leveling surface, thereby improving the accuracy of shot leveling at the edge.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shapes and the like in the drawings are exaggerated or simplified to emphasize a more clear description, and the elements denoted by the same reference numerals in the drawings mean the same elements.

3 to 5 are diagrams schematically illustrating the leveling system according to the first embodiment of the present invention.

3 schematically shows a leveling system according to a first embodiment of the present invention, FIG. 4 schematically shows a light size adjusting means used in the first embodiment of the present invention, and FIG. 5 shows a semiconductor substrate by a position signal. The tilt control method of 400 is schematically shown.

Referring to FIG. 3, the leveling system according to the first embodiment of the present invention includes a light source unit, a position detector, and a leveling controller.

The light source unit is provided with a light emitting means 100, a collimating lens 200 and the light size adjusting means. A light emitting diode may be used as the light emitting means 100. The collimated lens 200 converts the light emitted from the light emitting means 100 into balanced light and enters the semiconductor substrate 400. The light size adjusting means adjusts the size of the balanced light to adjust the size of the leveling detection surface, which is the size of the incident surface of the light on the semiconductor substrate 400. For example, the scaled balanced light may have a size of about 100% to 10% of the maximum exposure range of an exposure apparatus such as a stepper, so that the position of the leveling detection surface or the chip on the semiconductor substrate 400 The size of the leveling detection surface may be adjusted to a size suitable for the size or the size of the exposure shot. Preferably, since the lens full field of the stepper is about 22 mm, the size-controlled light may have a diameter of about 22 mm to 2.2 mm.

Referring to FIG. 4, as the light size adjusting means according to the first embodiment of the present invention, a moving means 110 for changing the distance between the light emitting means 100 and the collimating lens 200 may be used. For example, the movement means 110 connected to the light emitting diode used as the light emitting means 100 may be used. The moving means changes the position of the light emitting means 100 with respect to the collimated lens 200 by moving the light emitting means 100 to change its position. In this case, the size of the emitted light incident on the collimated lens 200, that is, the size of the incident surface changes. For example, the incident surface of the emitted light 151 when the light emitting means 100 is positioned near the collimator lens 200 is located far from the collimator lens 200 so that the light emitting means 100 is positioned. Is smaller than the incident surface of the emitted light 151a. Therefore, the size of the balanced light 251, 251a converted by the collimated lens 200 is also different, and the area where the balanced light 251, 251a is reflected, that is, the leveling detection surfaces 290, 290a The area also varies. Accordingly, the areas of the leveling detection surfaces 290 and 290a can be adjusted.

The reflected light 270, 270a reflected from the surface of the semiconductor substrate 400, for example, the leveling detection surfaces 290, 290a, is detected by the position detector as a position signal. The position detector includes a focusing lens 500 for focusing or focusing the reflected light, and a sensor 550 for sensing the focused reflected light. The sensor 550 uses a quadrature optical sensor, detects the intensity of the focused reflected light, and generates a position signal by generating a difference in current according to the intensity of light.

The position signal is transmitted to the stage controller 600 of the leveling controller through current voltage conversion (551 of FIG. 3). The stage controller 600 may be a focus controller 610 for converting a position signal and generating a driving command, and a controller 630 for determining the position signal and determining a driving command. Is done. The position signal is converted by an analog-digital conversion circuit through a multiplexer of the stage controller 600 and transmitted to the controller 630. The controller 630 detects and determines the inclination of the semiconductor substrate 400 based on the position signal. In addition, it is determined and commands to drive the leveling stage 300 to correct the inclination of the semiconductor substrate 400. The driving command is executed by the motor 331 connected to the driving point 330 of the driving point 330 of the leveling stage 300. The leveling stage 300 has three ground points, one is a fixed point 310, the other two has a driving point 330, etc. driven by the motor 331. The driving command is generated through a digital analog conversion circuit, a driving circuit, and the like and transmitted to the motor 331 through an amplifier 333 or the like. The degree of driving by the motor 331, that is, the amount of movement of the motor 331 is measured as a potentio signal by a potentiometer 337 connected to the driving connector 335 and transmitted to the multiplex. It is controlled by the controller 630.

Referring to FIG. 5, the tilt control, that is, the leveling method, of the semiconductor substrate 400 by the position signal will be described in detail as follows. The reflected light 273, 273a of the light 253, 253a of the light emitted by the collimating lens 200 and the light size adjusting means and reflected on the semiconductor substrate 400 is focused by the focusing lens 500. To reach the sensor 550. According to the position where the focused reflected light 273 reaches the sensor 550, the position signal generated by the current intensity or the like varies. That is, when the inclination of the semiconductor substrate 400 is appropriate (indicated by the solid line in FIG. 5), the focused reflected light 273 is focused at the center of the sensor 550. The position signal generated according to this is determined by the controller 630 of FIG. 3 to have completed leveling. The reflected light 273a when the semiconductor substrate 400 is inclined is out of the center of the sensor 550. In this case, the position signal detected is determined to be accompanied by leveling in the controller 630, and the inclination of the leveling stage 300 is adjusted by driving the motor 331 or the like. The sensor 550 uses a four-segmented optical sensor in which the surface where the reflected light 273 and 273a is focused is divided into four in order to detect a different position signal depending on the position at which the reflected light 273 and 273a converged.

When leveling is performed in this way, according to the first embodiment of the present invention, the size of the leveling detection surface 290 may be adjusted as necessary. In this way, the size of the leveling detection surface 290 can be adjusted, so that the leveling detection surface 290 has a size suitable for the shot size even when the shot (49 in FIG. 2) is smaller than the leveling detection surface 290. You can adjust the size. Therefore, accurate leveling is implemented according to the size of the shot, and thus can be applied to various semiconductor devices.

Further, at the edge of the semiconductor substrate 400, the leveling detection surface 290 having a smaller size, for example, a diameter smaller than the conventional diameter of 9.5 mm, may be used. Therefore, even in the shift leveling target area (45 in FIG. 2) and the like which is close to the leveling impossible area (43 in FIG. 2), the leveling can be performed based on the directly measured data, resulting in more accurate leveling and reproducibility. An increase can be implemented. In addition, since the leveling detection surface 290 having a small size of 9.5 mm or less in diameter is used, the shift leveling target area 43 or the like can be reduced. That is, although the leveling is not accurate in the region of approximately 12.5mm from the edge of the conventional semiconductor substrate 400, in the present invention, since the leveling data can be directly measured, accurate leveling is possible. Thus, the area in which shift leveling should be performed is reduced. Moreover, even when shift leveling is performed, the nearest data can be obtained from the leveling detection surface 290 of smaller size, so that more accurate leveling is possible. Accordingly, the chip of the edge portion of the semiconductor substrate 400 can also be used to increase the productivity.

6 and 7 are schematic views illustrating a leveling system according to a second embodiment of the present invention.

In the second embodiment, unlike the first embodiment, the diaphragm is introduced in front of the collimating lens by means of light size adjusting means. The same reference numerals as in the first embodiment used in the second embodiment denote the same members.

6 schematically shows a leveling system according to a second embodiment of the present invention, and FIG. 7 schematically shows a light size adjusting means used in the second embodiment of the present invention.

Specifically, the leveling system according to the second embodiment of the present invention, as in the first embodiment, the light emitting means 100 for emitting light 151, such as a light emitting diode, the collimating lens 200, the position detector and Leveling control unit and the like. Unlike the first embodiment, the aperture 230a is introduced in front of the collimating lens 200 as an optical size adjusting means to adjust the size of the balanced light 253. Referring to FIG. 7, the diaphragm 230a may adjust the size of the light passing portion, thereby reducing the size of the balanced light (253a of FIG. 6) passing through the diaphragm 230a. For example, the balanced light 253a passing through the aperture 230a may have a size of about 100% to 10% of the maximum exposure range of an exposure apparatus such as a stepper, and so on, on the semiconductor substrate 400 of FIG. 4. The size of the leveling detection surface may be adjusted to a size suitable for the position of the leveling detection surface or the size of the chip or the size of the exposure shot. Preferably, the balanced light 253a passing through the aperture 230a may have a diameter of about 22 mm to 2.2 mm. Accordingly, the area of the balanced light 253a incident on the semiconductor substrate 400, that is, the size of the leveling detection surface may be reduced or adjusted.

8 is a diagram schematically illustrating a leveling system according to a third embodiment of the present invention.

In the third embodiment, unlike the second embodiment or the first embodiment, a revolver having circular convex portions of various sizes on concentric circles is used as the light size adjusting means. The same reference numerals as those in the first or second embodiment used in the third embodiment denote the same members.

8 schematically shows a revolver 230b used in a leveling system according to a third embodiment of the present invention.

Specifically, the leveling system according to the third embodiment of the present invention, as in the first embodiment or the second embodiment, the light emitting means (100 in FIG. 3), the collimating lens 200, the position detector and the leveling adjustment It is provided with a part. Unlike the first embodiment or the third embodiment, a revolver 230b, which is introduced in front of the collimating lens 200 and adjusts the size of the balanced light (253 of FIG. 6), is used as the light size adjusting means. Referring to FIG. 8, the revolver 230b has an opaque body 235 and a circular light transmitting part 231 which is transparent in a concentric circle about a central axis 237 on the body 235.

The circular light transmitting part 231 is formed in various diameter sizes, and is adapted to the path of the balanced light (253 of FIG. 6) as the body 235 rotates about the central axis 237. That is, when the body 235 rotates, the light transmitting part 235 is positioned on the same path as the collimating lens 200. Accordingly, the balanced light 255 passing through the collimated lens 200 has a surface smaller than that of the balanced light 255, that is, the area passing through the light transmitting part 231. Can be entered into. Accordingly, the size of the balanced light incident on the semiconductor substrate 400 (253a of FIG. 6), that is, the size of the leveling detection surface is adjusted according to the size of the light transmitting part 231 of the revolver 230b. do. For example, the circular light transmitting unit 231 has a diameter of about 100% to 10% of a maximum exposure range of an exposure apparatus such as a stepper, and the like, so that the size of the passed balanced light 253a is equal to the maximum exposure range. It can be adjusted to about 100% to 10%. Preferably, the circular light transmitting part 231 may have a diameter of about 22 mm to 2.2 mm to adjust the size of the passed balanced light 253a to about 22 mm to 2.2 mm.

As mentioned above, although this invention was demonstrated in detail through the specific Example, this invention is not limited to this, It is clear that the deformation | transformation and improvement are possible by the person of ordinary skill in the art within the technical idea of this invention.

According to the present invention described above, the moving means for changing the distance between the light emitting means and the collimating lens, for example, the moving means for moving the light emitting means and the aperture introduced in front of the collimating lens or the light transmitting part having various sizes on the concentric circles It is possible to provide a leveling system having light size adjusting means such as a revolver. With such a leveling system, the size of the leveling detection surface can be adjusted as needed when leveling is performed. Therefore, even when the shot size is smaller than the leveling detection surface, the size of the leveling detection surface can be adjusted to a size suitable for the size of the shot. Therefore, accurate leveling is implemented according to the size of the shot, and thus can be applied to various semiconductor devices.

Furthermore, at the edge of the semiconductor substrate, the leveling detection surface 290 can be adjusted to a smaller size, for example, a smaller size than the conventional diameter of 9.5 mm. Leveling may be performed based on the measured data. Thus, more accurate leveling and increase in reproducibility can be realized. In addition, since a leveling detection surface having a small size of 9.5 mm or less in diameter is used, the range of the shift leveling target area or the like can be reduced. That is, although the leveling is not accurate in the region of approximately 12.5 mm from the edge of the conventional semiconductor substrate, in the present invention, since the direct leveling data can be measured, accurate leveling is possible. Thus, the area in which shift leveling should be performed is reduced. Moreover, even when shift leveling is performed, the nearest data can be obtained in the leveling detection surface of smaller size, so that more accurate leveling is possible. Accordingly, the chip located at the edge portion of the semiconductor substrate can also be used to increase the productivity.

Claims (22)

A light source unit for emitting light having a size adjusted by having a light size adjusting means for adjusting the size of light; A semiconductor substrate on which light emitted from the light source unit is incident on a surface; A position detector which detects the reflected light reflected from the surface of the semiconductor substrate and detects the slope of the semiconductor substrate as a signal; And And a leveling controller for adjusting the inclination of the semiconductor substrate with the signal detected by the position detector. The method of claim 1, wherein the scaled light is And a size of about 100% to about 10% of the maximum exposure range of the exposure equipment. The method of claim 2, wherein the scaled light is A leveling system for exposure equipment for manufacturing a semiconductor device, characterized by having a diameter of about 22 mm to 2.2 mm in diameter. The method of claim 1, wherein the light source unit Light emitting means for emitting light; And And a collimated lens for converting the emitted light into balanced light. The leveling system of exposure apparatus for manufacturing a semiconductor device according to claim 4, wherein the light emitting means is a light emitting diode. The leveling system of exposure apparatus for manufacturing a semiconductor device according to claim 4, wherein said light size adjusting means is a moving means for changing a distance between said light emitting means and said collimating lens. 7. The leveling system of exposure apparatus for manufacturing a semiconductor device according to claim 6, wherein said moving means changes the position of said light emitting means with respect to said collimated lens. The leveling system of exposure apparatus for manufacturing a semiconductor device according to claim 4, wherein the light size adjusting means is introduced in front of the collimating lens to adjust the size of the balanced light. The leveling system of exposure apparatus for manufacturing a semiconductor device according to claim 8, wherein the light size adjusting means is a cooker. The method of claim 8, wherein the light size adjusting means And a revolver for adjusting the size of the balanced light passing through the circular light transmitting part, having circular light transmitting parts of various sizes formed in the opaque body on a concentric circle. The method of claim 1, wherein the position detection unit A condenser lens for condensing the reflected light; And And a position detector having a sensor for sensing the focused light. The method of claim 1, wherein the leveling control unit A leveling stage supporting the semiconductor substrate and having drive means; And And a stage controller which receives the signal detected by the position detection unit and drives the driving means to adjust the inclination of the leveling stage. Light emitting means for emitting light; A collimated lens for converting the emitted light into balanced light; Light size adjusting means for controlling the size of the balanced light by changing a distance between the light emitting means and the collimating lens; A semiconductor substrate on which the balanced light having the size adjusted is incident on a surface thereof; A position detector which detects the reflected light reflected from the surface of the semiconductor substrate and detects the slope of the semiconductor substrate as a signal; And And a leveling control unit for adjusting the inclination of the semiconductor substrate with the signal detected by the position detection unit. The method of claim 13, wherein the size of the balanced light is And a size of about 100% to about 10% of the maximum exposure range of the exposure equipment. 15. The method of claim 14, wherein the scaled balanced light is A leveling system for exposure equipment for manufacturing a semiconductor device, characterized by having a diameter of about 22 mm to 2.2 mm in diameter. The method of claim 13, wherein the light size adjusting means And a moving means for changing the position of the light emitting means with respect to the collimated lens. Light emitting means for emitting light; A collimated lens for converting the emitted light into balanced light; Light size adjusting means introduced in front of the collimated stove and having an aperture for controlling the size of the balanced light; A semiconductor substrate on which the balanced light having the size adjusted is incident on a surface thereof; A position detector which detects the reflected light reflected from the surface of the semiconductor substrate and detects the slope of the semiconductor substrate as a signal; And And a leveling control unit for adjusting the inclination of the semiconductor substrate with the signal detected by the position detection unit. 18. The method of claim 17, wherein the scaled balanced light is And a size of about 100% to about 10% of the maximum exposure range of the exposure equipment. 19. The method of claim 18, wherein the scaled balanced light is A leveling system for exposure equipment for manufacturing a semiconductor device, characterized by having a diameter of about 22 mm to 2.2 mm in diameter. Light emitting means for emitting light; A collimated lens for converting the emitted light into balanced light; Light size adjusting means introduced in front of the collimating lens and having a circular light transmitting part of various sizes formed on an opaque body and having a revolver for adjusting the size of the balanced light passing through the circular light transmitting part; A semiconductor substrate on which the balanced light having the size adjusted is incident on a surface thereof; A position detector which detects the reflected light reflected from the surface of the semiconductor substrate and detects the slope of the semiconductor substrate as a signal; And And a leveling control unit for adjusting the inclination of the semiconductor substrate with the signal detected by the position detection unit. The method of claim 20, wherein the circular light transmitting portion Exposure of a semiconductor device manufacturing, characterized in that the size of the balanced light passing through the size of approximately 100% to 10% of the maximum exposure range of the exposure equipment is adjusted to approximately 100% to 10% of the maximum exposure range. Leveling system of equipment. The method of claim 21, wherein the circular light transmitting portion And having a size of about 22 mm to 2.2 mm in diameter to adjust the size of the balanced light passing through to about 22 mm to 2.2 mm.