KR19990052162A - Reticle horizontal / vertical alignment method using capacitive sensor - Google Patents

Abstract

According to the present invention, when a reticle containing a semiconductor circuit pattern is imported from a cassette or cartridge into a reticle chuck in an exposure apparatus such as a stepper or a scanner that forms the core of a semiconductor device, the reticle is a wafer or an optical system. The present invention relates to a reticle alignment device that not only horizontally aligns the reticle so that it can be positioned at a relatively proper position of the optical axis, but also vertical alignment in the optical axis direction. High precision can be obtained.

Description

Reticle horizontal / vertical alignment method using capacitive sensor

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a horizontal / vertical alignment method using a capacitive sensor. In particular, in an exposure apparatus such as a stepper or a scanner that forms the core of semiconductor device manufacturing, a reticle containing a semiconductor circuit pattern is cassette for actual exposure operation. Or, when brought into the reticle chuck from the cartridge, the reticle horizontality using a capacitive sensor that not only aligns the reticle horizontally so that the reticle can be positioned at the relative position of the wafer or optical system, but also vertically aligned in the optical axis direction It is about vertical alignment.

Semiconductor exposure equipment used to transfer electronic circuitry recorded on the reticle to the surface of the photoresist-coated wafer is now KrF excimer of 248nm through g-line and i-line with increasing minimum line resolution as semiconductor density increases. Laser light is being used, and ArF excimer laser step & scan exposure equipment with a wavelength of 193nm, which will be used for high density integrated circuits of more than 1GDRAM, will soon become practical.

The main performances of semiconductor exposure equipment include resolution, exposure area, and alignment accuracy. Especially in the semiconductor process requiring multiple pattern formation processes, the semiconductor circuit pattern formed on the layer formed in the previous process and the layer formed successively is precisely It is very important that they form overlapping. The performance of the exposure apparatus in this regard is the overlay accuracy of the circuit pattern, and in general, the exposure apparatus requires an overlap accuracy of 1/4 or less of the minimum pattern formed in the semiconductor circuit.

In order to achieve such wafer superposition accuracy, the wafer alignment to which the micropattern is transferred is important, but at the same time, the alignment of the reticle containing the circuit pattern is relatively important. The alignment accuracy of the reticle alignment system is the precision that the reticle alignment system must have in order to achieve the final overlap accuracy in the fabrication of semiconductor devices. It is defined as the overlap precision multiplied by the magnification of the projection optical system. If the magnification is X4, reticle alignment accuracy of about 0.24 μm (3σ) is required for 256M DRAM.

In addition to the horizontal alignment of the reticle, most of the exposure equipment also performs vertical alignment of the reticle, which is caused by a combination of magnification error or multiple exposure equipment depending on the relative position of the reticle and the wafer relative to the optical system. This is to correct the magnification error by adjusting the vertical position of the reticle vertically.

The reticle alignment method used in existing exposure equipment to align the reticle in the horizontal direction is to enlarge the alignment mark pre-engraved on the reticle using a microscope objective lens and manually align it through a TV monitor. Or the intensity of the diffracted light as an alignment signal by using the interference or diffraction effect of the aligned light diffracted by the alignment mark in the form of a diffraction grating, and the relative height of the reticle for vertical alignment. It measures by using optical or LVDT sensor and operates the actuator such as PZT and motor to correct the position.

However, these existing methods are fundamentally complicated because reticle alignment sensors are essentially separate for horizontal and vertical alignment of the reticle, and thus it is impossible to simultaneously perform alignment in two directions with one sensor. There was a problem that can not be bulky.

SUMMARY OF THE INVENTION An object of the present invention is to expose a reticle containing a semiconductor circuit pattern from a cassette or cartridge into a reticle chuck in an exposure apparatus such as a stepper or a scanner, which is the core of semiconductor device fabrication. In addition, the present invention provides a reticle horizontal / vertical alignment method using a capacitive sensor that not only aligns the reticle in a horizontal direction so as to come to a proper position of the optical system, but also enables vertical alignment in the optical axis direction at the same time.

Means for achieving the object of the present invention is a reticle alignment device using a capacitive sensor, the first process of facing the reticle 301, the capacitive sensor 305 below the reticle alignment mark 306, The second process of determining the position in the vertical direction by the voltage difference according to the relative distance between the reticle 301 and the capacitive sensor 305, and corrects the position error of the reticle 301 through the vertical stage 203 A third process is performed.

1 is a principle diagram for explaining the principle of the capacitive sensor.

2 is a circuit diagram for processing an electrical signal of the capacitive sensor used in FIG.

3 illustrates the concept of a reticle plane / vertical simultaneous alignment device using a capacitive sensor.

Indicative schematic.

4 is a schematic diagram showing the position and scanning direction of the capacitive sensor in the alignment device of FIG.

5 is an exemplary diagram of an electrical signal extracted in a state in which the vertical alignment of the reticle is made in the reticle alignment device as shown in FIG. 3.

6 is an exemplary diagram of an electrical signal extracted when the reticle is tilted in the reticle alignment device of FIG. 3.

7 is an exemplary view showing the position and direction of alignment marks to be formed on the reticle to be aligned.

** Description of symbols for the main parts of the drawing **

101: capacitive sensor 102: measuring object (or reticle)

201,202, 203,204: Diode 209: Oscillator

301: reticle 302: horizontal movement stage

303: vertical movement stage 304: chrome coated surface

305: capacitive sensor 306: reticle alignment mark

307: transparent area without chrome

401: Chrome-coated opaque area in the reticle alignment mark

402: transparent area of the alignment mark 403: scan direction of the reticle

404,405,406,407,408,409,410: Relative position of the capacitive sensor as the reticle scans

501: output signal voltage 502: stage scan start position

503: alignment mark left boundary position 504: alignment mark right boundary position

505: Stage scan end position 506 Align position

601: output signal voltage 602: stage scan start position

603: alignment mark left boundary position 604: alignment mark right boundary position

605: end stage scan position 606: alignment position

701: reticle 702: electronic circuit area

703: alignment mark in the reticle X direction 704: alignment mark in the reticle Y direction

1 is a view for explaining the principle of the capacitive sensor.

When a voltage is applied between two electrodes 101 and 102 facing in parallel, charge Q is accumulated between the electrodes. If the charge is Q, the voltage is V, and the capacitance is C, the relation between them can be expressed as C = Q / V, and the dielectric constant of the space between the two electrodes 101 and 102 is ε and the relative dielectric constant ε _s. When the capacitance C is expressed as the area S of the electrode and the distance D between the two electrodes, it can be expressed as C = εε _s S / D.

Also, if the relative dielectric constant ε _s and the area S are constant, the distance D between the electrodes is inversely proportional to the capacitance C, so that the output voltage e proportional to the electric capacitance C is linear by the capacitance-voltage conversion circuit having a linear relationship, e = KC. Where K is the conversion sensitivity of the capacitance-to-voltage conversion circuit.

In the previous equations, in the actual system, the dielectric constant ε, relative dielectric constant ε _s , the conversion sensitivity K and the area S of the circuit are constant, so if the constant K 'is set, D = (K εε _s S) / e = K' / e Can be represented. In these equations, we can see that the distance between the sensor and the workpiece is proportional to the output voltage e of the circuit.

2 is a diagram for explaining the principle of a circuit for converting capacitance into voltage.

In FIG. 2, C1 is the capacitance formed between the electrode and the measurement object, and the capacitance change ΔC1 occurs according to the distance D shown in FIG. 1. C2 is a capacitance for balancing the circuit corresponding to C1 + ΔC1, and is set so that the output voltage becomes 0 in a steady state.

If the diodes 201, 202, 203 and 204 have the same characteristics and C3 = C4, the output voltage of the circuit becomes zero when C1 = C2 (ΔC1 = 0). In the circuit as shown in FIG. 2, if the forward resistance of the diodes 201, 202, 203 and 204 is very small and can be ignored, the output voltage e corresponding to ΔC1 is given by the following equation (C1 = C2, C3 = C4). It can be represented by 1).

e = (-ΔC1 / C1) E sinωt / (C1 / C3) (1+ (ΔC1 / C1) + (C3 / C1)

As described above, the apparatus of FIG. 3 is used in the present invention for horizontal / vertical alignment of the reticle using the principle of the capacitive sensor described in FIGS. 1 and 2. Two independent capacitive sensors are needed to determine the x and y axis positions and the rotational error of the reticle. First, a position detection method for one axis will be described in FIG. 3.

The reticle 301 is mounted to a vertical stage 303 composed of an actuator such as PZT for movement in the vertical direction and a horizontal stage 302 for fine adjustment in the respective X, Y and Z directions. In an exposure apparatus such as a stepper, the chromium surface 304 of the reticle 301 in which the semiconductor circuit pattern is engraved faces toward the wafer surface when the exposure operation is performed, so the capacitive sensor 305 is placed under the reticle alignment mark 306. 301).

Capacitive sensors are commercially available as a kind of module. At this time, the capacitive sensor 305 is fixed through a mechanism or the like, and when the reticle stages 302 and 303 are scanned in the X and Y directions to detect the position in the horizontal direction, the chrome surface of the reticle alignment mark 306 ( 306 and the chromium-free region 307 pass through the capacitive sensor 305.

In this case, when the voltage change of the pulse type output through the capacitive sensor circuit is detected, the alignment position of the reticle 301 in the horizontal direction may be detected. Of course, the stages 302 and 303 for the transfer of the reticle 301 should be able to accurately know the current position using an encoder or interferometer in the form of a closed loop.

Next, the positioning method in the vertical direction (Z-axis) of the reticle 301 is a voltage according to the relative distance between the reticle 301 and the capacitive sensor 305, whether the stage is scanning or stopped. We can find position (height) in the vertical direction by car.

Accordingly, as shown in FIG. 3, in the reticle alignment device using the capacitive sensor 305 to be presented through the present invention, alignment of the reticle 301 with respect to the vertical and horizontal directions may be simultaneously performed.

FIG. 4 relates to the shape of the alignment marks in the reticle when the horizontal position of the reticle is detected using the alignment device of FIG. 3 and the position of the capacitive sensor when the stage is scanning.

401 represents a chrome region in the reticle alignment mark and 402 represents a transparent region without chromium. When the reticle is scanned in the direction 403 as shown in the figure, the relative position of the fixed capacitive sensor is continuously moved from 404 to 410, with each position 404 (405 (406) 407 (408) The output voltage at 409 and 410 is detected and used to detect the alignment of the reticle by comparing it with the position of the stage.

FIG. 5 illustrates an example of a change in voltage of the output signal 501 of the capacitive sensor circuit according to the scanning position when the reticle is not inclined and the vertical alignment is performed when the reticle is scanned using the alignment device of FIG. 3. It is a figure which shows.

When the stage starts scanning in the stationary state, the output signal 501 appears in pulse form at the edge portions 405 and 409 of the alignment mark of FIG. 4, where the starting point 502, the ending point 505, and The alignment points 506 are found by matching the positions of the points 503 and 504 where the pulses occur.

As shown in FIG. 5, in the vertical alignment of the reticle, there will be no slope of the output voltage signal 501 according to the scanning of the stage. However, as shown in FIG. 6, when the reticle is tilted, the slope of the output voltage signal 601 appears when scanning. In this case, the alignment point 605 may be found by matching the start point 602 of the stage with the end point 605 and the positions 603 and 604 of the point where the pulse is generated.

FIG. 7 is a view of the shape of the alignment mark and each position in the reticle 701 required for vertical / horizontal position detection of the reticle using the alignment apparatus of FIG. 3.

The reticle alignment marks 703 and 704 are located outside the electronic circuit region 702 and are composed of alignment marks 703 in the X-axis direction and alignment marks 704 in the Y-axis direction, respectively. Each alignment mark is used to detect a position in the X direction and a position in the Y axis direction through scanning of the reticle stage.

In the present invention, first, as a method used in the conventional reticle alignment device, a very complicated alignment system such as a microscope, an illumination source for alignment, a monitor, and the like were essential, but the new reticle alignment device proposed in the present invention is commercially available. By using the sensor, the device can be configured relatively simply, and in the conventional reticle alignment device, unlike the method of using independent sensors for horizontal and vertical alignment, respectively, a capacitive sensor is used. Therefore, the reticle is aligned in the horizontal and vertical directions at the same time, thereby reducing the space for the reticle alignment device.

Secondly, in terms of alignment accuracy of reticle, the resolution of currently available capacitive sensor is usually 0.1μm or less, so more accurate positioning accuracy can be obtained than the conventional method, and the position information of the reticle is measured by measuring two alignment marks on the reticle. In addition, the amount of rotation of the reticle can be extracted simultaneously.

Claims (3)

A reticle alignment apparatus using a capacitive sensor, comprising: a first process of facing a reticle (301) with a capacitive sensor (305) below a reticle alignment mark (306); A second process of determining a position in the vertical direction by a voltage difference according to a relative distance between the reticle 301 and the capacitance sensor 305; And a third process of correcting a position error of the reticle 301 through the vertical stage 203. Reticle horizontal / vertical alignment method using a capacitive sensor. The method of claim 1, When the reticle horizontal stage 302 is scanned in the planar direction after the first process, the chrome surface 306 and the chromium-free region 307 of the reticle alignment mark 306 pass through the capacitive sensor 305. And detecting a voltage change in a pulse form output through the capacitive sensor output circuit and matching the position of the reticle 301 with the position of the horizontal stage 303 to detect the horizontal alignment position of the reticle 301. Horizontal / vertical alignment method using capacitive sensor. The method according to claim 1 or 2, Using a capacitive sensor characterized in that the alignment of the reticle in the horizontal / vertical direction using a single capacitive sensor 305 without using each of the independent sensors for the alignment in the reticle horizontal / vertical direction Reticle horizontal / vertical alignment method.