KR19990012415A - Adhesion Reinforcement Photoresist Composition - Google Patents
Adhesion Reinforcement Photoresist Composition Download PDFInfo
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- KR19990012415A KR19990012415A KR1019970035805A KR19970035805A KR19990012415A KR 19990012415 A KR19990012415 A KR 19990012415A KR 1019970035805 A KR1019970035805 A KR 1019970035805A KR 19970035805 A KR19970035805 A KR 19970035805A KR 19990012415 A KR19990012415 A KR 19990012415A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
- H01J9/22—Applying luminescent coatings
- H01J9/227—Applying luminescent coatings with luminescent material discontinuously arranged, e.g. in dots or lines
- H01J9/2278—Application of light absorbing material, e.g. between the luminescent areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2329/00—Electron emission display panels, e.g. field emission display panels
- H01J2329/18—Luminescent screens
- H01J2329/32—Means associated with discontinuous arrangements of the luminescent material
- H01J2329/323—Black matrix
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
- H01J29/10—Screens on or from which an image or pattern is formed, picked up, converted or stored
- H01J29/18—Luminescent screens
- H01J29/30—Luminescent screens with luminescent material discontinuously arranged, e.g. in dots, in lines
- H01J29/32—Luminescent screens with luminescent material discontinuously arranged, e.g. in dots, in lines with adjacent dots or lines of different luminescent material, e.g. for colour television
- H01J29/327—Black matrix materials
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Abstract
고분자 사슬에 비닐실란을 삽입시켜 합성한 변형 아크릴아미드와 디아세톤아크릴아미드의 공중합체를 음극선관의 내면의 막을 형성할 때에 사용하는 포토레지스트 조성물의 성분 중 고분자 수지로 사용함으로써 유리 패널에 대한 접착력을 향상시킴과 동시에 접착력 보강제를 소량만 사용하거나 전혀 사용하지 않고도 블랙매트릭스막의 형성이 가능하게 되었다.A copolymer of modified acrylamide and diacetone acrylamide synthesized by inserting vinyl silane into the polymer chain is used as the polymer resin among the components of the photoresist composition used when forming the inner film of the cathode ray tube, thereby adhering the adhesion to the glass panel. At the same time, it is possible to form a black matrix film without using a small amount of adhesive reinforcing agent or at all.
Description
[산업상 이용 분야][Industrial use]
본 발명은 포토레지스트 조성물에 관한 것으로서, 더욱 상세하게는 음극선관의 블랙 매트릭스막용으로 사용할 수 있는 브라운관 내면과의 접착력이 보강된 포토레지스트 조성물에 관한 것이다.The present invention relates to a photoresist composition, and more particularly, to a photoresist composition having enhanced adhesion to an inner surface of a CRT that can be used for a black matrix film of a cathode ray tube.
[종래 기술][Prior art]
음극선관(Cathode Ray Tube: CRT)의 형광면은 전자빔의 에너지를 광에너지로 변환시키는 곳으로서, 전자가 관찰자의 반대쪽에서 패널에 형성된 형광면의 형광체에 충돌함으로써 발광된다. 음극선관의 형광면의 제조공정은 다음과 같다. 우선 세정을 끝낸 패널 내면에 포토레지스트를 도포하고 노광한 후에 현상, 흑연(graphite) 도포, 식각(etching)의 공정을 거쳐 흑연 스트립(stripe)을 형성하여 블랙매트릭스를 형성한다. 블랙매트릭스를 형성한 후에 블랙매트릭스 사이로 형광체 층을 도포하고, 유기 피막을 형성하는 필르밍(firming)을 행하고 나서 알루미늄 증착(deposition)으로 알루미늄 막을 형성한다. 열처리를 행하여 형광면에 남아 있는 유기물질을 분해하여 제거한다. 여기서 형광면을 형성하는 과정은 주로 슬러리(slurry)법이 사용된다. 형광체 슬러리는 폴리비닐알코올(polyvinylalcohol: PVA)과 중크롬산 나트륨(sodium dichromate: SDC) 또는 중크롬산암모늄(ammonium dichromate: ADC)의 용액에 형광체를 현탁시켜 사용하는 것이 일반적이며, 이 밖에도 폴리비닐알코올 및 디아조(diazo) 화합물의 혼합용액을 사용하거나 폴리비닐피롤리돈(polyvinyl pyrrolidone: PVP) 및 디아조 화합물의 혼합용액을 사용하고 있다.The fluorescent surface of a cathode ray tube (CRT) is a place for converting the energy of an electron beam into light energy, and the electrons are emitted by colliding with the phosphor of the fluorescent surface formed on the panel on the opposite side of the observer. The manufacturing process of the fluorescent surface of a cathode ray tube is as follows. First, a photoresist is applied to the inner surface of the cleaned panel and exposed, followed by development, graphite coating, and etching to form a graphite strip to form a black matrix. After forming the black matrix, a phosphor layer is applied between the black matrices, a filming is performed to form an organic film, and then an aluminum film is formed by aluminum deposition. Heat treatment is performed to decompose and remove the organic substances remaining on the fluorescent surface. The process of forming the fluorescent surface is mainly a slurry (slurry) method is used. Phosphor slurry is generally used by suspending the phosphor in a solution of polyvinylalcohol (PVA) and sodium dichromate (SDC) or ammonium dichromate (ADC), in addition to polyvinyl alcohol and diazo (diazo) A mixed solution of a compound or a mixed solution of polyvinyl pyrrolidone (PVP) and a diazo compound is used.
상기한 형광체 슬러리를 노즐을 통해 패널 내면에 회전 도포하고 적외선 히터에서 건조한 후 새도우 마스크(shadow mask)를 장착하여 패널 내면에 형성된 감광성 막을 자외선으로 감광하여 경화되게 한 후, 물로 현상하여 형광체 패턴(pattern)을 형성한다. 이와 같은 과정을 적색, 녹색 및 청색(R.G.B) 형광체로 반복하여 3색의 형광체 패턴을 형성한다.The phosphor slurry is applied to the inner surface of the panel through a nozzle, dried in an infrared heater, and then mounted with a shadow mask to cure the photosensitive film formed on the inner surface of the panel with ultraviolet rays, and then developed with water to develop a phosphor pattern. ). This process is repeated with red, green and blue (R.G.B) phosphors to form three phosphor patterns.
한편, 미국특허 제3,917,794호 및 미국특허 제4,086,090호에서는 상반측 불궤특성을 갖는 포토레지스트 조성물을 이용하여 패턴을 형성하는 방법으로서, 폴리비닐피롤리돈, 비닐피롤리돈의 공중합체 또는 아크릴아미드와 디아세톤아크릴아미드의 공중합체 등의 수용성 고분자, 수용성 비스아지드를 함유한 포토레지스트 조성물이 개시되어 있다. 상기에서 수용성 비스아지드 화합물은 4,4'-디아지드벤잘아세토페논-2-설포네이트(4,4'-diazidobenzalacetophenone-2-sulfonate), 4,4'-디아지도스틸벤-2,2'-디설포네이트(4,4'-diazidostilbene-2,2'-disulphonate), 4,4'-디아지도스틸벤-γ-카르복실산(4,4'-diazidostilbene-γ-carboxylic acid)이 사용되며, 접착력 보강제로는 수용성 알콕시실란, 예를 들면 비닐트리스(β-메톡시에톡시)실란(vinyltris (β-methoxyethoxy)silane), N-β(아미노에틸)-아미노프로필메틸-디메톡시실란(N-β(aminoethyl)-aminopropylmethyl-dimethoxysilane) 및 N-β(아미노에틸)γ-아미노프로필트리메톡시실란(N-β(aminoethyl)γ-aminopropyltrimethoxysilane)이 개시되어 있다.Meanwhile, US Pat. No. 3,917,794 and US Pat. No. 4,086,090 form a pattern using a photoresist composition having upper half non-uniformity, and include polyvinylpyrrolidone, a copolymer of vinylpyrrolidone, or acrylamide. A photoresist composition containing a water-soluble polymer such as a copolymer of diacetone acrylamide and a water-soluble bisazide is disclosed. The water-soluble bisazide compound in the above is 4,4'-diazidebenzalacetophenone-2-sulfonate (4,4'-diazidobenzalacetophenone-2-sulfonate), 4,4'-diazidostilben-2,2 ' Used by disulfonates (4,4'-diazidostilbene-2,2'-disulphonate), 4,4'-diazidostilbene-γ-carboxylic acid As the adhesion enhancer, a water-soluble alkoxysilane such as vinyltris (β-methoxyethoxy) silane, N-β (aminoethyl) -aminopropylmethyl-dimethoxysilane ( N-β (aminoethyl) -aminopropylmethyl-dimethoxysilane and N-β (aminoethyl) γ-aminopropyltrimethoxysilane (N-β (aminoethyl) γ-aminopropyltrimethoxysilane) are disclosed.
주로 음극선관 내면의 막인 블랙 매트릭스 및 형광면의 형성시 수용성 고분자로 사용되는 아크릴아미드와 아세톤아크릴아미드 공중합체는 상반측 불궤특성(reciprocity-law failure)을 가지고 있는 고분자로서 음극선관 내면의 도트 형성시 근접한 도트가 겹치지 않는 범위 내에서 최대 크기의 도트를 형성시켜 전자빔의 랜딩 허용(landing allowance)을 높일 수 있고, 또한 노광 후 암반응에 의해서 교차결합 범위(crosslinkage region)가 증가되는 반응이 일어나지 않아서 일정한 크기의 도트가 형성되게 한다.Acrylamide and acetoneacrylamide copolymers, which are mainly used as water-soluble polymers in the formation of the black matrix and the fluorescent surface, which are inner films of cathode ray tubes, are polymers having reciprocity-law failure in the upper half. It is possible to increase the landing allowance of the electron beam by forming a dot of the maximum size within the range where the dots do not overlap, and also to increase the crosslinkage region by the dark reaction after exposure, so that the reaction of the constant size does not occur. Allow dots to form.
그리하여 기존의 블랙 매트릭스용 포토레지스트 조성물은 수용성 고분자인 폴리비닐피롤리돈 또는 아크릴아미드와 디아세톤아크릴아미드의 공중합체와 비스아지드(bisazide)계 감광제인 DAS(4,4-diazidostilbene-2,2-disulfonic acid), 접착력 보강제인 실란(silane)계 화합물 N-아미노에틸-3-아미노프로필-트리메톡시실란(N-aminoethyl-3-aminopropyl-trimethoxysilane), 계면활성제 등으로 이루어져 있다.Thus, the conventional photoresist composition for black matrix is polyvinylpyrrolidone, which is a water-soluble polymer, or a copolymer of acrylamide and diacetone acrylamide, and DAS (4,4-diazidostilbene-2,2), which is a bisazide-based photosensitive agent. -disulfonic acid), a silane compound N-aminoethyl-3-aminopropyl-trimethoxysilane, which is an adhesion enhancer, and a surfactant.
그런데, 상기의 조성물 성분 중에서 접착력 보강을 위해 첨가하는 실란계 화합물 N-아미노에틸-3-아미노프로필-트리메톡시실란은 다른 첨가제와의 반응성이 있어 첨가제 선정시 제약이 따르며 염기성에서 안정한 물질이므로 전체 포토레지스트 조성액을 암모니아수 등으로 pH 7∼10정도로 조절해 주어야 하므로 포토레지스트 용액 제조시 많은 불편이 따르며 작업성이 떨어진다. 또한 고분자 대비 5∼15% 정도 첨가되므로 양을 무시할 수 없고 감광제를 제외하고 블랙매트릭스막용 감광성 수지 조성물의 성분들 중에서 ㎏당 단가도 제일 비싸다는 문제점을 가지고 있다.However, the silane compound N-aminoethyl-3-aminopropyl-trimethoxysilane added in the above composition component for reinforcing adhesion is reactive with other additives, so it is restricted in selecting additives and is stable in basicity. Since the photoresist composition solution should be adjusted to pH 7-10 with ammonia water or the like, a lot of inconveniences occur when manufacturing the photoresist solution and workability is poor. In addition, since the amount of about 5 to 15% of the polymer is added, the amount cannot be ignored and the unit cost per kg among the components of the photosensitive resin composition for the black matrix film except for the photosensitive agent is the most expensive.
상기와 같은 접착력 보강제의 문제점을 해결하기 위하여 미국특허 제4,491,629호에서는 수용성 접착력 보강재로서 하기의 화학식 2와 같은 폴리아미노실란을 사용하고 있다.In order to solve the above problems of the adhesion reinforcing agent, US Pat. No. 4,491,629 uses a polyaminosilane such as the following formula (2) as a water-soluble adhesion reinforcing material.
[화학식 2][Formula 2]
H2N(CH2CH2NH)nCH2CH2CH2Si(OR')3 H 2 N (CH 2 CH 2 NH) n CH 2 CH 2 CH 2 Si (OR ') 3
상기 화학식 2에서 R'는 메틸기 또는 에틸기이고 2 내지 10의 정수이다.In Formula 2, R 'is a methyl group or an ethyl group and is an integer of 2 to 10.
이 접착력 보강제를 포함하는 포토레지스트 조성물은 유리 패널에 대한 높은 접착력, 고민감성, 높은 해상도를 갖고 내부식성 포토레지스트막을 형성할 수 있으며 공해오염의 우려가 없는 장점을 가지고 있다.The photoresist composition including the adhesion reinforcing agent has a high adhesive strength to the glass panel, high sensitivity, high resolution and can form a corrosion resistant photoresist film, and has the advantage that there is no fear of pollution.
본 발명은 상기와 같은 종래 기술의 문제점을 해결하기 위한 것으로서, 본 발명의 목적은 첫째 다른 첨가물과의 반응성이 있어 첨가제 선정이 어렵고 pH 조절로 인하여 용액의 제조시 작업성이 떨어지며 단가가 비싼 실란계 접착력 보강용 화합물의 단점을 해결하고, 둘째, 동시에 아크릴아미드와 아세톤아크릴아미드 공중합체의 상반측 불궤특성의 장점을 살리며, 셋째, 고분자 자체의 유리 패널에 대한 접착력을 보강한 포토레지스트 조성물을 제공하기 위한 것이다.The present invention is to solve the problems of the prior art as described above, the object of the present invention is the first reactivity with other additives is difficult to select additives and the workability during the preparation of the solution due to the pH control, the silane system is expensive and expensive To solve the disadvantages of the compound for reinforcing adhesion, and second, at the same time to take advantage of the upper half non-deformation characteristics of the acrylamide and acetone acrylamide copolymer, and third, to provide a photoresist composition reinforced with adhesion of the polymer itself to the glass panel It is for.
본 발명에서는 수용성 고분자로 변형된 아크릴아미드와 디아세톤아크릴아미드의 공중합체를 사용함으로써 유리에 대한 접착력을 높일 수 있었고, 접착력 보강제를 소량만 사용하거나 또는 사용하지 않아도 블랙매트릭스막 형성이 가능하게 되었다.In the present invention, by using a copolymer of acrylamide and diacetone acrylamide modified with a water-soluble polymer, adhesion to glass can be enhanced, and a black matrix film can be formed without using or using a small amount of an adhesion enhancer.
본 발명에서는 고분자 합성시 비닐 실란 사슬을 삽입시켜 고분자 자체의 접착력을 높임으로써 실란계 물질인 N-아미노에틸-3-아미노프로필-트리메톡시실란을 따로 첨가하지 않아도 된다.In the present invention, it is not necessary to separately add N-aminoethyl-3-aminopropyl-trimethoxysilane, which is a silane material, by inserting a vinyl silane chain to increase the adhesion of the polymer itself when the polymer is synthesized.
[과제를 해결하기 위한 수단][Means for solving the problem]
상기와 같은 본 발명의 목적을 달성하기 위하여, 본 발명은 하기 화학식 1의 수용성 고분자와 수용성 감광제와 계면활성제와 순수를 포함하는 접착력 보강 포토레지스트 조성물을 제공한다.In order to achieve the object of the present invention as described above, the present invention provides an adhesion reinforcing photoresist composition comprising a water-soluble polymer of the general formula (1), a water-soluble photosensitive agent, a surfactant and a pure water.
[화학식 1][Formula 1]
상기 화학식 1에서 m:n=3.5:1이고, 상기 R은 메톡시기, 에톡시기, 메틸기 및 2-메톡시에톡시기로 이루어진 군에서 선택된다.In Formula 1, m: n = 3.5: 1, and R is selected from the group consisting of a methoxy group, an ethoxy group, a methyl group, and a 2-methoxyethoxy group.
상기한 포토레지스트 조성물 중 수용성 고분자로서 폴리비닐알코올, 폴리비닐피롤리돈 및 아크릴아미드와 디아세톤아크릴아미드 공중합체로 이루어진 군에서 선택된 하나 이상의 화합물을 상기 화학식 1의 수용성 고분자와 혼합하여 사용할 수도 있다.As the water-soluble polymer in the photoresist composition, one or more compounds selected from the group consisting of polyvinyl alcohol, polyvinylpyrrolidone, acrylamide and diacetone acrylamide copolymer may be used in combination with the water-soluble polymer of Chemical Formula 1.
상기한 수용성 고분자는 전체 조성물에 대비하여 0.5∼50중량%인 것이 바람직하며 1∼5중량%인 것이 더욱 바람직하다. 수용성 고분자의 함량이 전체 조성물에 대비하여 0.5중량% 미만일 때에는 저점도이므로 형광막을 형성할 수 없으며, 50중량% 초과일 때에는 고점도이므로 형광막을 형성할 수 없다.The water-soluble polymer is preferably 0.5 to 50% by weight and more preferably 1 to 5% by weight relative to the total composition. When the content of the water-soluble polymer is less than 0.5% by weight relative to the total composition, the fluorescent film cannot be formed because it is low viscosity, and when it is more than 50% by weight, the fluorescent film cannot be formed.
본 발명에 의한 포토레지스트 조성물의 또 하나의 성분인 상기 수용성 감광제는 비스아지드계 수용성 감광제인 것이 바람직하다.It is preferable that the said water-soluble photosensitive agent which is another component of the photoresist composition which concerns on this invention is a bis azide type water-soluble photosensitive agent.
상기한 수용성 감광제는 상기 고분자 고형분에 대비하여 0.5∼50중량%인 것이 바람직하며 2∼10중량%인 것이 더욱 바람직하다. 수용성 감광제의 함량이 고분자 고형분에 대비하여 0.5중량% 미만일 때에는 감도가 너무 낮으며, 50중량% 초과일 때에는 감도가 너무 높아서 블랙매트릭스막의 폭을 일정하게 조절할 수 없다.The water-soluble photosensitizer is preferably 0.5 to 50% by weight, more preferably 2 to 10% by weight relative to the polymer solid content. When the content of the water-soluble photosensitive agent is less than 0.5% by weight relative to the polymer solid content, the sensitivity is too low, and when the content of the water-soluble photosensitive agent is more than 50% by weight, the width of the black matrix film cannot be constantly adjusted.
또한 상기 수용성 감광제는 비스아지드(bisazide)계 수용성 감광제인 것이 바람직하다. 비스아지드계 수용성 감광제로서 DAS를 사용할 수 있다.In addition, the water-soluble photosensitive agent is preferably a bisazide-based water-soluble photosensitive agent. DAS can be used as a bisazide type water soluble photosensitizer.
또한 상기한 계면활성제는 에멀겐(emulgen) 또는 폴리옥시에틸렌 소르비탄모노 라우레이트(polyoxyethylene sorbitanmono laurate: SLS)인 것이 바람직하다.In addition, the surfactant is preferably an emulgen or polyoxyethylene sorbitan mono laurate (SLS).
수용성 고분자인 아크릴아미드와 아세톤아크릴아미드 공중합체 합성시 단량체에 비닐계 실란을 첨가하여 중합하면 접착력이 강화된 고분자를 만들어 낼 수 있고 이렇게 합성한 변형 아크릴아미드와 아세톤아크릴아미드 공중합체와 아지드계 감광제를 사용해서 제조한 포토레지스트 조성물로 브라운관 내면과의 접착력이 강화된 블랙매스릭스막을 형성시킨다.In the synthesis of the water-soluble polymer acrylamide and acetone acrylamide copolymer, polymerization of the monomer by adding vinyl silane to the monomer can produce a polymer having enhanced adhesion. Thus, the modified acrylamide and acetone acrylamide copolymer and azide-based photosensitive agent are synthesized. The photoresist composition prepared by using to form a black matrix film with enhanced adhesion to the inner surface of the CRT.
다음은 본 발명의 이해를 돕기 위하여 바람직한 실시예를 제시한다. 그러나 하기의 실시예들은 본 발명을 보다 쉽게 이해하기 위하여 제공되는 것일 뿐 본 발명이 하기의 실시예에 한정되는 것은 아니다.The following presents a preferred embodiment to aid the understanding of the present invention. However, the following examples are merely provided to more easily understand the present invention, and the present invention is not limited to the following examples.
[실시예]EXAMPLE
실시예Example
아크릴아미드와 디아세톤아크릴아미드 공중합체 36g, DAS(4,4-diazidostilbene-2,2-disulfonic acid) 14.4g, 계면활성제 LT221 0.72g 및 순수 48.88g를 혼합하여 포토레지스트 조성물을 제조하였다. 상기에서 제조한 포토레지스트 조성물을 세정한 패널 상부에 도포하고 건조시켰다. 그 후에 30∼45초동안 초고압수은등을 이용하여 노광시키고 저압현상한 후 건조시켰다. 그 위에 흑연을 도포 및 건조하고 에칭액을 도포한 후 고압현상하고 건조시켜 블랙매트릭스막을 형성하였다.A photoresist composition was prepared by mixing 36 g of acrylamide and diacetone acrylamide copolymer, 14.4 g of DAS (4,4-diazidostilbene-2,2-disulfonic acid), 0.72 g of surfactant LT221, and 48.88 g of pure water. The photoresist composition prepared above was applied to the cleaned panel and dried. Thereafter, the resultant was exposed to light using an ultrahigh pressure mercury lamp for 30 to 45 seconds, developed under low pressure, and dried. Graphite was applied and dried thereon, an etchant was applied, followed by high pressure development and drying to form a black matrix film.
비교예Comparative example
상기 실시예에서 변형 아크릴아미드와 디아세톤아크릴아미드 공중합체 대신에 기존의 아크릴아미드와 디아세톤아크릴아미드 공중합체를 사용한 것을 제외하고는 상기 실시예와 동일하게 실시하여 블랙매트릭스막을 형성하였다.Except for using the modified acrylamide and diacetone acrylamide copolymer in the above embodiment except that the conventional acrylamide and diacetone acrylamide copolymer was used in the same manner as in the above embodiment to form a black matrix film.
상기의 실시예 및 비교예에서 제조한 블랙매트릭스막을 현미경을 이용하여 육안으로 관찰한 결과 유리패널과 강한 접착성을 나타내었다.The black matrix film prepared in Examples and Comparative Examples was visually observed using a microscope and showed strong adhesion with the glass panel.
블랙매트릭스막용 포토레지스트 조성물에 포함되는 성분 중에서 접착력 보강제인 N-아미노에틸-3-아미노프로필-트리메톡시실란을 소량 사용하거나 전혀 사용하지 않아도 됨에 따라 N-아미노에틸-3-아미노프로필-트리메톡시실란으로 인한 문제점이 해결된다. N-아미노에틸-3-아미노프로필-트리메톡시실란과 다른 첨가제와의 반응성의 문제가 해결됨으로써 첨가제의 설정폭이 넓어지고 원가절감에도 기여하며 pH를 조절하지 않아도 됨으로 작업이 용이해진다. 또한 유리패널에 대한 접착력이 더욱 향상된다.N-aminoethyl-3-aminopropyl-trimeth may be used as a small amount or no use of N-aminoethyl-3-aminopropyl-trimethoxysilane, which is an adhesion enhancer, among the components included in the photoresist composition for the black matrix film. The problem due to oxysilane is solved. The problem of reactivity between N-aminoethyl-3-aminopropyl-trimethoxysilane and other additives is solved, which increases the setting range of the additive, contributes to cost reduction, and facilitates operation by eliminating the need for pH adjustment. In addition, the adhesion to the glass panel is further improved.
Claims (9)
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| KR100408201B1 (en) * | 2000-04-19 | 2003-12-01 | 일동화학 주식회사 | Watersoluble photoresistor polymer having azido functional group at its side chain and preparation method thereof |
| US6699951B2 (en) | 2001-04-03 | 2004-03-02 | Samsung Sdi Co., Ltd. | Monomer and polymer for photoresist, photoresist composition, and phosphor layer composition for color cathode ray tube |
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| JPS5660431A (en) * | 1979-10-24 | 1981-05-25 | Hitachi Ltd | Photosensitive composition and pattern forming method |
| KR840001601B1 (en) * | 1980-09-11 | 1984-10-11 | 가부시기가이샤 히다찌세이사구쇼 | Photosensitive composition |
| JP2628692B2 (en) * | 1988-05-31 | 1997-07-09 | 株式会社日立製作所 | Pattern forming method and color cathode ray tube manufacturing method |
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| KR100408201B1 (en) * | 2000-04-19 | 2003-12-01 | 일동화학 주식회사 | Watersoluble photoresistor polymer having azido functional group at its side chain and preparation method thereof |
| US6699951B2 (en) | 2001-04-03 | 2004-03-02 | Samsung Sdi Co., Ltd. | Monomer and polymer for photoresist, photoresist composition, and phosphor layer composition for color cathode ray tube |
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