KR19990012401A - Wafer fixing device and manufacturing method - Google Patents

Abstract

The present invention discloses a wafer holding device and a method of manufacturing the same. The present invention includes a cylinder tube having a thickness thicker than the thickness of the cylinder wall and having a predetermined length in the longitudinal direction of the cylinder in the inner wall of the cylinder to be fastened to the motor, where one screw of the tube is fastened by a fastening means. The through hole is provided so that it can be. The cylinder tube may be a continuum along a circumference of the inside of the cylinder wall and may be a discontinuity. Therefore, when the screw is fastened to the groove, since the portion surrounding the screw is wide, it is possible to securely fasten the cylinder and the motor. As a result, during the movement of the motor and the cylinder to minimize the rattling of the two parts at the fastening portion to minimize the micro-change of the disk indirectly coupled to the cylinder can be broken or desired area of the wafer loaded on the disk It is possible to prevent the implantation of ions away from the. In addition, it is possible to extend the life of the motor by minimizing the shock transmitted to the motor by the rattling of the fastening portion, it is also possible to minimize the thread wear of the through hole.

Description

Wafer fixing device and manufacturing method

1. Field of Invention

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer angle fixing device and a method of manufacturing the same, and more particularly, to a wafer angle fixing device used in an ion implantation process and a manufacturing method thereof.

2. Description of related technology

Background Art With the high integration of semiconductor devices, active regions, which are areas in which semiconductor devices can be formed, are rapidly decreasing in wafers. As described above, since a plurality of semiconductor devices are formed in the narrow active region, the region where the impurity layer may be formed in the wafer is further narrowed. Therefore, the ion implantation process for forming the impurity layer is more important. In order to inject impurities having a desired depth and density into a desired region in an ion implantation process, it is necessary to accurately maintain a predetermined angle between the ion implantation apparatus and the wafer. Otherwise, the impurity to be injected may be injected into other regions or adjacent semiconductor elements to damage the wafer or the semiconductor device.

In general, in the ion implantation process, the angle of the wafer is first adjusted to be perpendicular to the ion beam and the wafer, and then the ion implantation process is performed at a desired angle. In this case, when the initial reference angle is distorted, even if the wafer is set to the desired angle, the angle into which the actual ion beam is injected is changed. Therefore, it is necessary to accurately set the initial angle set between the wafer and the ion beam. This is an initial angle setting problem between the support for supporting the wafer and the ion beam, which means that the variation in the wafer support must be small until the ion implantation process is completed.

Hereinafter, each wafer fixing device according to the prior art will be described in detail with reference to the accompanying drawings.

1 and 2 are a plan view and a cross-sectional view, respectively, of each wafer fixing device according to the prior art.

Referring to Fig. 1, each wafer fixing device according to the prior art has a cylinder 10 having a wall thickness of about 2 mm or less, and a piston 12 is provided in the cylinder 10. The piston 12 serves to rotate a disk (not shown) on which the wafer is loaded within a predetermined angle range. To this end, a motor (not shown) is fastened to the piston 12. The thin part 12a of the piston 12 is a part which is engaged with a motor. The motor fastened to the piston 12 is fixed to the cylinder 10 by using a screw fastened to a through hole (14 of FIG. 2) passing through the cylinder 10. The piston 12 and the disk are not directly connected, but are indirectly connected through a shaft (not shown). The cylinder 10 thus serves as a support for the piston 12.

Referring to FIG. 2, it can be seen how long the cylinder 10 and the piston 12 and the peak 12a of the piston occupy the entire length of the piston 12. As described above, it can be seen that the piston 12 is formed of a thick portion and a thin peak portion 12a in FIG. One through hole 14 is provided at a portion of the cylinder 10 to which the motor is fastened. This through hole 14 is a part to which a screw is fastened as a means for fastening the motor by fastening the motor with the cylinder 10.

In order to move the disk in the ion implantation process, the part connected to the disk is subjected to a heavy load. This is due to the weight of the disk and the frequent movement of the disk, large and small. Therefore, it is preferable that the motor, the piston, the shaft, etc. are firmly fastened to each other. By the way, in the conventional wafer fixing device, the through hole is formed in the cylinder whose wall thickness is 2 mm or less, and the cylinder and the motor are fixed by the screw which fits into this through hole. Therefore, when the disc is driven because the support base is not wide enough for the screw to be supported from the force received from the vertical direction of the screw, the screw cannot be fixed against the fastening point of the cylinder and the motor, that is, the dynamic load applied to the screw. There is a slight rattling. This rattling causes the through-holes to be loosened and the threads engraved on the through-holes to wear out. In addition, a minute impact is applied to both the motor and the cylinder. Even if the impact is small, if the number of impacts is increased frequently, both sides of the motor or the cylinder will be overwhelmed. Therefore, the life of the motor may be shortened, and in the case of the cylinder, the connection between the screw and the screw may be damaged, and the connection between the shaft and the shaft connecting the cylinder and the disk may be excessively applied. In particular, rattling of the cylinder and motor fastenings is transmitted to the disk through the shaft and the wafer angle set for the ion beam is changed so that ion implantation occurs at a position away from the desired area.

Therefore, the technical problem to be achieved by the present invention is to solve the problems described in the above-described prior art, and the tilt angle of the wafer is changed during the ion implantation process by minimizing the rattling of the fastening point by widening the support base of the screw. It is to provide an angle fixing device for each wafer that can be prevented.

In addition, another object of the present invention is to provide a method for manufacturing the respective wafer fixing device.

1 is a plan view of a wafer holding device according to the prior art.

FIG. 2 is a cross-sectional view of FIG. 1 taken in a 2-2 'direction.

3 is a plan view of each wafer fixing device according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view of FIG. 3 taken in the 4-4 'direction.

5 is a plan view of each wafer fixing device according to a second embodiment of the present invention.

6 is a block diagram showing a method for manufacturing each wafer fixing device according to an embodiment of the present invention.

Explanation of Signs of Major Parts of Drawings

40: Cylinder. 42: Cylinder tube.

44: Piston. 46: Through hole.

52, 54: first and second cylinder pieces.

t: Through hole depth. t1, t2: cylinder type tube and cylinder wall thickness.

In order to achieve the above technical problem, the wafer angle fixing device according to the present invention is a wafer angle fixing comprising a disk on which the wafer is placed, a piston connected to the disk, a cylinder for supporting the piston and a motor for driving the piston in the cylinder. The apparatus is characterized in that a through hole having a depth at least deeper than the thickness of the cylinder wall is provided inside the cylinder wall at the portion where the piston and the motor are engaged.

According to an embodiment of the invention, the through hole is provided in a cylinder tube thicker than the thickness of the cylinder wall and having a predetermined length in the longitudinal direction of the cylinder.

In addition, according to an embodiment of the invention, the thickness of the cylinder tube is at least 9.5 mm.

According to an embodiment of the present invention, a plurality of cylinder pieces thicker than the thickness of the cylinder wall are symmetrically provided inside the cylinder wall of the portion where the piston and the motor are fastened, and the through hole is provided on either side of the cylinder piece. It is.

According to an embodiment of the present invention, the thickness of the cylinder piece is preferably the same as the thickness of the cylinder tube, but may be thick or thin.

According to an embodiment of the present invention, the cylinder piece and the cylinder tube are preferably made of the same material, but may be made of different materials.

In order to achieve the above another technical problem, the manufacturing method of each wafer fixing device according to the present invention includes a disk on which a wafer is placed, a piston connected to the disk, a cylinder supporting the piston, and a motor driving the piston in the cylinder. In each wafer fixing device,

A structure is formed inside the cylinder wall that is at least thicker than the thickness of the cylinder wall and has a symmetry, and then forms a hole through the cylinder and the structure.

According to an embodiment of the present invention, a structure such as a cylinder tube or cylinder piece having a predetermined length in the longitudinal direction of the cylinder is formed inside the cylinder wall.

The present invention includes a cylinder tube having a thickness thicker than the thickness of the cylinder wall and having a predetermined length in the longitudinal direction of the cylinder in the inner wall of the cylinder to be fastened to the motor, where one screw of the tube is fastened by a fastening means. The through hole is provided so that it can be. The cylinder tube may be a continuum along a circumference of the inside of the cylinder wall and may be a discontinuity. Therefore, when the screw is fastened to the groove, since the portion surrounding the screw is wide, it is possible to securely fasten the cylinder and the motor. As a result, during the movement of the motor and the cylinder to minimize the rattling of the two parts at the fastening portion to minimize the micro-change of the disk indirectly coupled to the cylinder can be broken or desired area of the wafer loaded on the disk It is possible to prevent the implantation of ions away from the. In addition, it is possible to extend the life of the motor by minimizing the shock transmitted to the motor by the rattling of the fastening portion, it is also possible to minimize the thread wear of the through hole.

Hereinafter, each wafer fixing apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

3 and 4 are a plan view and a cross-sectional view of each wafer holding device according to the first embodiment of the present invention, Figure 5 is a plan view of each wafer holding device according to a second embodiment of the present invention. 6 is a block diagram showing a manufacturing method of each wafer fixing device according to an embodiment of the present invention.

3 is a plan view showing a part of each wafer fixing device. Referring to this, a cylinder provided between a wafer angle holding device according to an embodiment of the present invention, in particular, a motor (not shown) of the wafer angle holding device in an ion implantation process and a disk (not shown) loaded with a wafer ( The center of the 40 is provided with a piston 44 is fastened to the motor. The motor is inserted into the cylinder 40 and fastened to the fastening portion of the piston 44. The motor itself is fastened and fixed with the cylinder 40 wall. The portion of the piston 44 engaged with the motor is thinner than the rest of the piston. A cylindrical tube 42 is provided inside the cylinder wall between the portion of the piston 44 that engages the motor and the cylinder 40. The thickness t1 of the cylindrical tube 42 is thicker than the wall thickness t2 of the cylinder 40. However, since the space enough to insert the motor in the cylinder 40 should be prepared, the thickness t1 of the cylinder tube 42 is preferably determined in consideration of this point. Where the cylinder 40 is fastened to the motor itself, a through hole 46 into which a screw (not shown) for fastening the motor itself to the cylinder 40 may be inserted. Penetrates the cylinder tube 42. Therefore, the depth t of the through hole 46 is equal to the sum of the cylinder wall thickness t2 and the thickness t1 of the cylinder tube 42.

In the first embodiment of the present invention, the thickness t2 of the wall of the cylinder 40 is about 1.5 mm, and the thickness t1 of the cylinder tube 42 is about 9 mm. Therefore, the depth t of the through hole 46 is about 10.5 mm. As such, the depth of the through-hole 46 is more than 10mm is about 10.5mm of the length of the screw inserted therein is wrapped by the cylinder 40 and the cylinder tube 42, the support base is widened Therefore, the screw can be further stabilized against external fluctuation compared to the case in which the cylinder 40 is wrapped only. This means that the cylinder 40 and the motor itself can be firmly fastened.

There may be a plurality of through holes 46 penetrating the cylinder tube 42 and the cylinder 40. In this case, the through hole 46 is preferably present symmetrically.

FIG. 4 is a cross-sectional view of FIG. 3 taken in the 4-4 'direction. Referring to FIG. 4, it can be seen that the cross-sectional shape of the piston 44 and the part engaged with the motor of the piston 44 are thinner than the other parts, which were not seen in FIG. 3. And since the longitudinal direction of the cylinder 40 can be seen, the substance of the cylinder 40 can be seen more clearly. In addition, it can be seen that the cylinder tube 42 is extended to some extent in the longitudinal direction of the cylinder 40, the through-hole 46 is the cylinder tube at the midpoint of the length of the cylinder tube 42 It turns out that it is formed perpendicular to the surface of (42). In addition, it is possible to grasp the relative position of the portion of the piston 44 with which the motor is engaged.

Referring to Figure 5 will be described in detail each wafer fixing device according to a second embodiment of the present invention. Hereinafter, the same reference numerals as the reference numbers cited in the first embodiment mean the same elements and the same elements as the elements constituting each wafer fixing device according to the first embodiment.

Specifically, other components of each wafer fixing device according to the second embodiment of the present invention are the same as the first embodiment, but the shape of the structure provided inside the wall of the cylinder 40 is different. Specifically, in the first embodiment the structure is a continuum along the inside of the wall of the cylinder 40 as the cylinder tube 42 as shown in FIGS. 3 and 4, but in the second embodiment the structure The structure is not a continuum but a discontinuity along the inside of the wall of the cylinder 40. That is, the first cylinder piece 52 having, on one side of the inside of the wall of the cylinder 40, the same thickness as the cylinder tube 42 described in the first embodiment and the same length in the longitudinal direction of the cylinder 40. ) And a wall of the opposed cylinder 40 is provided with a second cylinder piece 54 having the same dimensions as the first cylinder piece 52. Preferably, the first and second cylinder pieces 52, 54 are made of the same material. Although the first and second cylinder pieces 52 and 54 have the same specifications as the cylinder tube 42 of the first embodiment, the thickness or length of the first and second cylinder pieces 52 and 54 is equal to the above. It may be different from that of the cylinder tube 42. For example, the thickness of the first and second cylinder pieces 52, 54 may be somewhat thicker or thinner than the thickness of the cylinder tube 42 of the first embodiment within an acceptable range. In addition, the length of the first and second cylinder pieces 52 and 54 in the longitudinal direction of the cylinder 40 may be longer or shorter than the cylinder tube 42. The material of the first and second cylinder pieces 52 and 54 is preferably the same as the material of the cylinder tube 42, but may be different.

In FIG. 5, the first cylinder piece 52 is provided with a through hole 46 penetrating the cylinder 40. However, the through hole 46 may be provided not only in the second cylinder piece 54 but also in both the first and second cylinder pieces 52 and 54. Although the first and second cylinder pieces 52 and 54 are provided on the wall of the cylinder 40, more cylinder pieces, for example, third and fourth cylinder pieces may be further provided symmetrically. In addition, the through hole 46 may be provided in all of the cylinder pieces.

Hereinafter, with reference to FIG. 6, the manufacturing method of each wafer fixing apparatus by the Example of this invention is demonstrated in detail. In particular, a structure having a thickness at least thicker than the wall of the cylinder is symmetrically formed 60 inside the cylinder wall. The structure is welded and fixed to the cylinder wall. Referring to FIG. 3 as the structure, a cylinder tube 42 having a predetermined length in the longitudinal direction of the cylinder 40 is formed inside the wall of the cylinder 40. The cylinder tube 42 is formed to be at least thicker than the thickness of the cylinder 40 wall, for example at least 9 mm thick. 5, a plurality of cylinder pieces having a predetermined length in the longitudinal direction of the cylinder 40 as the structure and having a symmetry at least thicker than the thickness of the cylinder wall, for example, the first and second cylinder pieces ( 52, 54). More cylinder pieces may be formed on the wall of the cylinder 40 in addition to the two cylinder pieces 52 and 54 without losing symmetry. The first and second cylinder pieces 52 and 54 are preferably formed to have the same thickness as the cylinder tube (42 in FIG. 3), but may be formed to have different thicknesses. That is, the cylinder tube 42 may be formed thicker or thinner than the first and second cylinder pieces 52, 54. However, it is preferable that both the first and second cylinder pieces 52 and 54 have the same thickness. Only when the screw is fastened to both the first and second cylinder pieces 52, 54, the base for supporting the screw is the same so that the force received by the screw at the fastening point of the cylinder and the motor is equal.

In addition, the cylinder tube 42 and the first and second cylinder pieces 52, 54 are preferably all formed of the same material, but may be formed of different materials. However, as in the case of thickness, it is preferable that the first and second cylinder pieces 52, 54 are all formed of the same material. Otherwise, either cylinder piece may be weakened even when the same force is applied to the first and second cylinder pieces 52, 54 at the fastening point of the cylinder and the motor.

Subsequent to the formation of the structure, the through hole 46 so that the screw can be fastened to the formed cylinder tube 42 and the cylinder 40 or the first and second cylinder pieces 52 and 54 and the cylinder 40. (62). 3 and 5, one through-hole 46 is formed in each of the cylinder tube 42 and the first cylinder piece 52, but a plurality of through-holes are formed in the cylinder tube 42. Can be formed symmetrically and the through-hole can also be formed in the second cylinder piece (54). In FIG. 5, in the case where the cylinder piece is further formed inside the wall of the cylinder 40, the through hole may be formed for each cylinder piece to be formed. The depth of the through hole formed in the cylinder tube 42 and the first and second cylinder pieces 52, 54 is the thickness of the cylinder tube 42 or the first and second cylinder pieces 52, 54. Become thinner or deeper depending on its thickness. If necessary, the diameter of the through hole may be made larger or smaller. Thereafter, the piston driving motor is inserted into the cylinder and the screw is fastened to the through hole to fasten the motor to the structure and the cylinder wall.

As described above, each wafer fixing device according to the present invention is provided with a cylinder tube having a predetermined thickness in the longitudinal direction of the cylinder, the thickness of which is thicker than the thickness of the cylinder wall inside the wall of the cylinder to be fastened with the motor; And one place of the tube is provided with a screw groove so that the screw can be fastened by the fastening means. The cylinder tube may be a continuum along a circumference of the inside of the cylinder wall and may be a discontinuity. Therefore, when the screw is fastened to the groove, since the portion surrounding the screw is wide, it is possible to securely fasten the cylinder and the motor. As a result, during the movement of the motor and the cylinder to minimize the rattling of the two parts at the fastening portion to minimize the micro-change of the disk indirectly engaged with the cylinder to prevent the breaking of the wafer loaded on the disk Accurate tilt angles can be maintained. In addition, the life of the motor may be extended by minimizing the shock transmitted to the motor by the rattling of the fastening portion, and the wear of the screw groove of the screw groove may be prevented.

The present invention is not limited to the above embodiments, and it is apparent that many modifications can be made by those skilled in the art within the technical spirit of the present invention.

Claims (16)

In each wafer holding device having a disk on which a wafer is placed, a piston connected to the disk, a cylinder including the piston, and a motor for driving the piston in the cylinder, And a through hole having a depth at least deeper than the thickness of the cylinder wall in the cylinder wall of the portion where the piston and the motor are engaged. 2. A wafer holding device as set forth in claim 1, wherein said through hole is provided in a cylinder tube thicker than the thickness of said cylinder wall and having a predetermined length in the longitudinal direction of said cylinder. 3. The device of claim 2, wherein a thickness of said cylinder tube and said cylinder wall is at least 10.5 mm. The wafer wafer fixing device according to claim 2, wherein the cylinder tube is provided with at least one through hole. 5. The cylinder according to claim 4, wherein a plurality of cylinder pieces thicker than the thickness of the cylinder wall are symmetrically provided inside the cylinder wall at the portion where the piston and the motor are engaged, and at least one of the cylinder pieces has the through hole. Wafer angle holding device characterized in that. 6. The wafer angle holding device according to claim 5, wherein a thickness of the cylinder piece is thicker than a thickness of the cylinder tube. The wafer angle fixing device according to claim 5, wherein the thickness of the cylinder piece is thinner than the thickness of the cylinder tube. 8. The wafer angle holding device according to claim 7, wherein the cylinder piece and the cylinder tube are made of the same material. 8. The wafer angle holding device according to claim 7, wherein the cylinder piece and the cylinder tube are made of different materials. 6. The wafer angle fixing device according to claim 5, wherein the plurality of cylinder pieces are first and second cylinder pieces facing each other. In each wafer holding device having a disk on which a wafer is placed, a piston connected to the disk, a cylinder including the piston, and a motor for driving the piston in the cylinder, Forming a structure inside the cylinder wall that is at least thicker and thicker than the thickness of the cylinder wall; And Forming a hole penetrating the cylinder and the structure. 12. The device of claim 11, wherein a cylinder tube having a predetermined length in the longitudinal direction of the cylinder is formed inside the cylinder wall, and a hole penetrating the cylinder and the cylinder tube is formed. Manufacturing method. 13. The wafer according to claim 12, wherein a plurality of cylinder pieces having a predetermined length in the longitudinal direction of the cylinder are symmetrically formed in the cylinder wall and holes are formed through the cylinder piece and the cylinder. Method of manufacturing each fixing device. The method of claim 13, wherein the cylinder tube or the cylinder piece is formed by welding the inner side of the cylinder wall. 15. The method of claim 14, wherein the cylinder tube and the cylinder piece are formed with the same or different thicknesses. 15. The method of claim 14, wherein the cylinder tube and the cylinder piece are formed of the same or different materials from each other.